Marketing EDA

Super Computing 2022
2022-11-13 08:00 - 2022-11-18 17:00 (America/Chicago) | Kay Bailey Hutchison Convention Center, 650 S Griffin Street, Dallas, TX, United States
Come see your friends and colleagues, explore incredible learning experiences in HPC, and walk the exhibit floor! There are several registration options available. Choose the one that’s right for you. We look forward to seeing you in Dallas or via the Digital Experience.
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Semicon Europa
2022-11-15 08:00 - 2022-11-18 17:00 (Europe/Berlin) | Messe Munchen, Messegelände, Munich, 81823, Germany
SEMICON Europa 2022 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.
– Top-notch Keynotes
– Market Trends
– Exhibition
– Networking
– Advanced Packaging Forum / Fab Management Forum
– ITF Beyond 5G -powered by imec
– Smart Manufacturing / Mobility / MedTech
– Workforce Development and many more!
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The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
2022-11-16 09:00 - 10:00 (America/Los_Angeles)
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges.
Join us on Wednesday, November 16 at 9:00 a.m. PST for an informative webinar on The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
Hear 3 unique perspectives on this growing market:

Stefan Chitoraga, Technology and Market Analyst at Yole Développement will present the latest market insights on the adoption of chiplets and heterogeneous integration and will address what is driving advanced packaging toward 2.5D and 3D solutions.
Igor Elkanovich, CTO at Global Unichip Corp. (GUC) will discuss the GUC GLink™ chiplet interconnect, including its architecture and roadmap; HBM3 memory interfaces; and will also highlight some of the 2.5D and 3D packaging challenges.
Nir Sever, Senior Director of Business Development at proteanTecs will reveal silicon results from a GUC GLink chip, which used D2D interconnect monitoring for comprehensive visibility and parametric lane grading.

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ASIP University Day 2022
2022-11-16 09:00 - 14:00 (America/New_York)
Application-specific instruction set processors (ASIPs) have established themselves as an important implementation option for modern SoCs, i.e. when standard processor IP cannot meet challenging application-specific requirements, and fixed hardware is not flexible enough. Synopsys’ ASIP Designer is the market leading tool for ASIP design, verification and programming, and is used by leading companies around the globe with hundreds of successful projects to date.
Please join us at the ASIP University Day virtual event on Wednesday, November 16, 2022. In this informal forum you will be able to exchange ideas, build up networks and gain first-hand insight about ASIP Designer directly from your peers.

Synopsys will share its insight into market trends, and provide a technical update on ASIP Designer along with reference examples. In addition, several university partners will present results from their ASIP Design projects.
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