BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20220313T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20221106T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20230312T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20231105T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20240310T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20241103T060000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 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END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Phoenix BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0700 TZNAME:MST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Karachi BEGIN:STANDARD TZOFFSETFROM:+0500 TZOFFSETTO:+0500 TZNAME:PKT DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/New_York:20230531T083000 DTEND;TZID=America/New_York:20230531T170000 DTSTAMP:20230530T203817Z CREATED:20230530T203817Z LAST-MODIFIED:20230530T203817Z UID:6438-1685521800-1685552400@marketingeda.com SUMMARY:STAC Summit DESCRIPTION:STAC Summits bring together CTOs and other industry leaders responsible for solution architecture\, infrastructure engineering\, application development\, machine learning/deep learning engineering\, data engineering\, and operational intelligence to discuss important technical challenges in trading and investment. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/stac-summit/ LOCATION:New York Marriott Marquis\, 1535 Broadway\, New York City\, NY\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/STAC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230522T080000 DTEND;TZID=America/Los_Angeles:20230524T170000 DTSTAMP:20230331T185032Z CREATED:20230331T184530Z LAST-MODIFIED:20230331T185032Z UID:6216-1684742400-1684947600@marketingeda.com SUMMARY:Embedded Vision Summit 2023 DESCRIPTION:The Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems\, cloud solutions and mobile applications. \n\n\nWhy attend? It’s a First-Rate Program with Powerful Insights into Practical Perceptual AI.\n\n\n\n\n\nJoin us for four days of learning—from tutorials to deep-dive days\, covering the latest technical insights\, business trends and vision technologies—all with a focus on practical\, deployable computer vision and visual/perceptual AI. The Summit connects the theories from great academic conferences\, like CVPR\, to the concrete needs of innovators building real-world products. \n\n\n\n\n\n4 Reasons the Embedded Vision Summit is Different from Other Conferences\n\n\n\n\n\n\nThe Summit is by innovators\, for innovators.\n\n\nWe have a relentless focus on practical information for people incorporating vision and AI into products to solve real-world problems.\n\n\nWe’ve been doing this for 12 years.\n\n\nA whopping 99% of our attendees would recommend the Summit to a colleague.\n\n\n\n\n\n\nLearn\n\n\n\n\n\nIn order to deliver real-world insights and know-how into the most current topics in the industry to our attendees\, we have packed the program with learning opportunities\, including: \nSpeakers and Sessions: Learn from the best and listen to over 100 expert speakers who actively work in the industry present on the latest applications\, techniques\, technologies and opportunities in computer vision and visual AI. \n\n\nSee\n\n\n\n\n\n100+ Exhibitors and Hundreds of Demos: Visit the exhibitors on the exhibit floor and see their latest technologies that enable perception—processors\, algorithms\, software\, sensors\, developer tools\, services and more! You’ll get to see technology in action by watching cool demos from building-block component suppliers to learn about new and existing solutions to your business and engineering challenges. \nEnabling Technologies Track: If you’re a product developer\, engineer or business leader looking for real-world\, commercial technologies that will help you add visual intelligence and AI to your new products\, you’ll want to attend this track’s sessions. You can see things\, like: \n\nProcessors and tools for deep-learning-based object recognition.\nOptimized software components for low-cost\, energy-efficient\, real-time vision.\nFrameworks and services for faster product development.\n\n\n\nConnect\n\n\n\n\n\nBuilding valuable business connections is crucial. At the Summit you can connect with engineers\, marketers\, executives—they’re all here! Here’s how: \n\nQ&A Sessions: Join in on post-talk Q&A sessions and have your important questions answered directly by the expert speakers.\nMeet the Exhibitors and Sponsors: Connect with key engineers and technologists from top computer vision building-block suppliers to learn about their latest processors\, software\, development tools and more.\nMingle at the Technology Exhibits Reception. The evening of Tuesday\, May 23\, enjoy great food and refreshing beverages while meeting new folks and seeing awesome tech demos at our Exhibits Reception!\nNetwork at the 3rd annual Women In Vision Reception sponsored by Perceive.\n\n\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/embedded-vision-summit-2023/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Embedded-Vision-Summit-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230521T080000 DTEND;TZID=America/Los_Angeles:20230525T170000 DTSTAMP:20230122T013506Z CREATED:20230122T013506Z LAST-MODIFIED:20230122T013506Z UID:5867-1684656000-1685034000@marketingeda.com SUMMARY:ISCAS 2023 DESCRIPTION:The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premiere forum for researchers in the active fields of theory\, design and implementation of circuits and systems. \nKeynote Speakers\n\nDr. Margaret Martonosi\n\n\n\nMargaret Martonosi is the US National Science Foundation’s (NSF) Assistant Director for Computer and information Science and Engineering (CISE). With an annual budget of more than $1B\, the CISE directorate at NSF has the mission to uphold the Nation’s leadership in scientific discovery and engineering innovation through its support of fundamental research and education in computer and information science and engineering as well as transformative advances in research cyberinfrastructure. While at NSF\, Dr. Martonosi is on leave from Princeton University where she is the Hugh Trumbull Adams ’35 Professor of Computer Science. \n\nStuart Russell\n\n\n\ntuart Russell is a Professor of Computer Science at the University of California at Berkeley\, holder of the Smith-Zadeh Chair in Engineering\, and Director of the Center for Human-Compatible AI. He is a recipient of the IJCAI Computers and Thought Award and Research Excellence Award and held the Chaire Blaise Pascal in Paris. In 2021 he received the OBE from Her Majesty Queen Elizabeth and gave the Reith Lectures. He is an Honorary Fellow of Wadham College\, Oxford\, an Andrew Carnegie Fellow\, and a Fellow of the American Association for Artificial Intelligence\, the Association for Computing Machinery\, and the American Association for the Advancement of Science. His book “Artificial Intelligence: A Modern Approach” (with Peter Norvig) is the standard text in AI\, used in 1500 universities in 135 countries. His research covers a wide range of topics in artificial intelligence\, with a current emphasis on the long-term future of artificial intelligence and its relation to humanity. He has developed a new global seismic monitoring system for the nuclear-test-ban treaty and is currently working to ban lethal autonomous weapons. \n\nYoky Matsuoka\n\n\n\nYoky Matsuoka is the Founder & CEO of Yohana\, an independently led subsidiary of Panasonic focused on building consumer technology products and services to help people live healthier and happier lives. As an accomplished executive and technologist\, Matsuoka brings more than two decades of leadership experience to her role where she also leads global innovation and serves as the Managing Executive Officer of Panasonic Corporation. \n\nDongjin (DJ) Seo\n\n\n\nDongjin (DJ) Seo is co-founder and VP of Brain Interfaces at Neuralink\, where he leads the team responsible for everything (electrodes\, materials\, electronics\, firmware\, packaging\, manufacturing\, algorithms\, and more) in the brain implant. DJ received his PhD from UC Berkeley in 2016 for his work on ultrasonic wireless neural implant technology called neural dust and BS in EE at Caltech in 2011 where he designed ICs and antennas for next-gen wireless communication and imaging systems. He also held several internships building high-performance and low-power circuits for sensor networks. For his work\, DJ was named one of MIT Technology Review’s Innovators Under 35 in 2020. \n\nDr. Thomas Anderson\n\n\n\nDr. Andersen heads the Artificial Intelligence and Silicon Innovation group at Synopsys\, where he focuses on developing new technologies in the AI\, ML and advanced technology space to automate the future of chip design. \nLieven Vandersypen\nProf. Dr. ir Lieven Vandersypen is Antoni van Leeuwenhoek professor in Quantum Nanoscience at Delft University of Technology and Scientific Director of QuTech\, an advanced research center for Quantum Computing and Quantum Internet. He received a MSc in Mechanical Engineering from KU Leuven\, and a MSc/PhD in Electrical Engineering from Stanford University for the first experiments in quantum computing. \n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/iscas-2023/ LOCATION:Monterey\, CA\, Monterey\, CA\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISCAS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230516T080000 DTEND;TZID=Europe/Brussels:20230517T170000 DTSTAMP:20230414T161617Z CREATED:20230414T161617Z LAST-MODIFIED:20230414T161617Z UID:6275-1684224000-1684342800@marketingeda.com SUMMARY:ITF World 2023 DESCRIPTION:Imec’s flagship event on semiconductor advances & deep-tech solutions\n\n\nformerly known as Future Summits.\n\n\n\n\nSemiconductors have become increasingly instrumental – and often even dominant – for the future of industries and application domains worldwide. \nFor many decades\, imec has played a major role in the global semiconductor industry. Our expertise and partnerships now also progress Chips Act initiatives around the globe. \nITF World aims to bring together all the different players. \n\nITF World features: \n\nA program clearly centered around semiconductor technologies & system scaling\nAn important focus on deep-tech venturing\, featuring inspiring cases\nInsights that highlight imec’s role & activities to progress Chips Act initiatives worldwide\n\nIn conjunction with ITF World\, we also organize ITF Flanders\, a dedicated event for Flemish companies and stakeholders. \nThis one-of-a-kind experience is marked by: \n\nKeynotes by world-renowned tech experts and industry leaders\nDemos showcasing state-of-the-art technologies and innovative solutions in a wide array of application domains\nExchange with key players from the global semiconductor and deep-tech scenes and innovators from various application domains\nAn onsite networking dinner\n\nITF World welcomes 2\,000 attendees from around the globe – ranging from industry experts and business leaders to policy makers\, futurists\, technology gurus\, entrepreneurs from start-ups to scale-ups\, analysts and investors. \n\n\n\n\n\n\nITF World is a 1.5-day event taking place at the majestic Flanders Meeting & Convention Center in the heart of Antwerp\, Belgium. Our event is widely valued for its dynamic and vibrant atmosphere. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nExtend your experience with a half-day participation in ITF Flanders if you’re interested in: \n\nThe role of nano & digital technologies to accelerate Flemish economy and society\nDedicated tracks on Health\, Energy\, Mobility\, and Sustainable industries\nNetworking with policy makers & entrepreneurs from Belgium’s strong economic region\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/itf-world-2023/ LOCATION:Flanders Meeting & Convention Center Antwerp\, Antwerp\, Belgium CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITF-World-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230509T080000 DTEND;TZID=America/Los_Angeles:20230510T170000 DTSTAMP:20230313T174913Z CREATED:20230313T174913Z LAST-MODIFIED:20230313T174913Z UID:6108-1683619200-1683738000@marketingeda.com SUMMARY:Advantest VOICE DESCRIPTION:VOICE is a developer conference\, created by test engineers for test engineers.\n\n\n\n\n\n\n\n\nEach year\, the VOICE Developer Conference unites semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs)\, foundries\, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements\, express new ideas\, share best practices and network with one another. \nAdvantest’s annual VOICE Developer Conference is the leading premier forum for the growing international community of users and strategic partners involved with Advantest’s V93000 and T2000 SoC test platforms as well as Advantest memory testers\, handlers and test cell solutions\, product engineering\, and test technology. \nVOICE promises a collaboration of minds and ample opportunities for peer networking. Join us at VOICE for a dynamic and memorable conference experience! \nAttendees gain valuable insights into the newest test solutions and best practices\, forge long-lasting relationships\, learn about the latest and upcoming equipment and technology from Advantest\, and much more through VOICE’s technical information-rich agenda\, which includes: \n\nKeynote speakers\nTechnical paper presentations\nPartners’ Expo\nTechnology Kiosk Showcases\nNetworking\nWorkshop Day\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/advantest-voice/ LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Advantest-VOICE-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Jerusalem:20230508T080000 DTEND;TZID=Asia/Jerusalem:20230509T170000 DTSTAMP:20230331T183459Z CREATED:20230331T183459Z LAST-MODIFIED:20230331T183459Z UID:6212-1683532800-1683651600@marketingeda.com SUMMARY:ChipEx 2023 DESCRIPTION:The major annual event of the Israeli semiconductor industry \nChipEx2023\, the largest annual event of the Israeli semiconductor industry\, will be held on May 9\, 2023 in Tel Aviv\, Israel. ChipEx2023 showcases companies including manufacturers\, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world’s leading experts address the industry’s most relevant issues. \nThe event is produced by ASG Ltd. in cooperation with SIA\, Semiconductor Industry Association and with Semi\, the largest global industry association. \nThe goal of ChipEx2023 is to update all professionals involved with the Israeli semiconductor industry with the latest technological innovations and future directions of the industry. \nChipEx2023 target audience are all people involved with the semiconductor industry including engineers\, R&D managers\, industry experts\, senior executives in microelectronics related companies\, multinational design centers\, consultants\, venture capital managers as well as electrical/electronic/computer science students & professors from the various universities around Israel. \nChipEx2023 consists of three main parts: \nVendors’ Exhibition \nThe ChipEx exhibition includes booths in various sizes for presentations and demonstrations of new design and development tools. This year\, the ChipEx2023 exhibition will take place on May 9\, 2023 at the Tel-Aviv Expo Center and will include industry vendors\, service providers\, and manufacturers of electronic design tools\, components and manufacturing equipment from Israel and around the globe. These exhibitors will exhibit and update the visitors with the latest developments in tools and services for the semiconductor industry. \nTechnical Seminar \nTechnical lectures given by industry experts\, senior executives from the semiconductor industry\, vendors\, and university professors. The format of the sessions intends to cultivate and promote an instructive and productive interchange of ideas and solutions among industry developers and designers. The lectures are divided to various tracks in separate halls and address the major topics related to the microelectronics industry. This year\, the ChipEx2023 technical seminar will take place on May 9\, 2023 at the Tel-Aviv Expo Center. \n  \nChipEx2023 Executive Summit \n  \nThe opening session of ChipEx2023 will take place on May 8\, 2023 at Hilton Hotel Tel-aviv and will include top industry figures and will act as the Executive summit of ChipEx2023 targeting Industry leaders and top executives from Israel and around the globe. \n  \nChipEx2023 is a great opportunity for any industry vendor or service provider to meet its target audience as well as interact with the decision makers in the various Israeli semiconductor companies. \n  \nWe invite you to take part in ChipEx2023 as an exhibitor\, a speaker and/or as a sponsor. \n  \nFor more details please contact us at:\nPhone: +972-9-7454007\nFax: +972-9-7748858\ninfo@chiportal.co.il\nwww.chipex.co.il \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chipex-2023/ LOCATION:Hilton Hotel Tel-aviv\, HaYarkon St 205\, Tel aviv\, Israel CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ChipEx-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230501T080000 DTEND;TZID=America/Los_Angeles:20230504T170000 DTSTAMP:20230419T164215Z CREATED:20230419T163913Z LAST-MODIFIED:20230419T164215Z UID:6300-1682928000-1683219600@marketingeda.com SUMMARY:IEEE International Symposium on Hardware Oriented Security and Trust (HOST) DESCRIPTION:IEEE International Symposium on Hardware Oriented Security and Trust (HOST) is the premier symposium that facilitates the rapid growth of hardware-based security research and development. Since 2008\, HOST has served as the globally recognized event for researchers and practitioners to advance knowledge and technologies related to hardware security and assurance. \nRapid proliferation of computing and communication systems with increasing computational power and connectivity into every sphere of modern life has brought security to the forefront of system design\, test\, and validation processes. The emergence of new application spaces for these systems in the internet-of-things (IoT) regime is creating new attack surfaces as well as new requirements for secure and trusted system operation. Additionally\, the design\, manufacturing and the distribution of microchip\, PCB\, as well as other electronic components are becoming more sophisticated and globally distributed with a number of potential security vulnerabilities. Therefore\, hardware plays an increasingly important and integral role in system security with many emerging system and application vulnerabilities and defense mechanisms relating to hardware. IEEE International Symposium on Hardware Oriented Security and Trust (HOST) aims to facilitate the rapid growth of hardware-based security research and development. HOST highlights new results in the area of hardware and system security. Relevant research topics include techniques\, tools\, design/test methods\, architectures\, circuits\, and applications of secure hardware. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-international-symposium-on-hardware-oriented-security-and-trust-host/ LOCATION:The DoubleTree by Hilton\, 2050 Gateway Place\, San Jose\, CA\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/HOST-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230426T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20230105T171520Z CREATED:20230105T171520Z LAST-MODIFIED:20230105T171520Z UID:5833-1682496000-1682528400@marketingeda.com SUMMARY:IP SoC Silicon Valley 23 DESCRIPTION:D&R IP-SoC Silicon Valley 2023 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. \nIP-SoC providers\, the seed of innovation in Electronic Industry\, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry. \nIP consumers can view at a glance the latest Technology trends and exciting Innovative IP/SoC products. Through a global view\, Electronic systems leaders may identify disruptive innovation leading to new market segment growth. \nPhysical meeting between vendors and consumers is the unique and non replaceable vehicle to engage business discussions between vendors and clients. Nevertheless this event will also be “replicated” on line after the event aiming at triggering more business opportunities. Posting their talk and recording their presentations on easily accessible platforms will extend innovation sharing among the worldwide IP-SoC Community. \nAny question? Please contact us \nImportant Dates \n\nSubmission Deadline : March 1st 2023\nSlides and presentation records available on April 1st 2023\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ip-soc-silicon-valley-23/ LOCATION:Computer History Museum\, 1401 N. Shoreline Blvd\, Mountain View\, CA\, 94043\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IP-SoC-Silicon-Valley-23.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230424T080000 DTEND;TZID=America/Los_Angeles:20230427T170000 DTSTAMP:20230419T162907Z CREATED:20230419T162847Z LAST-MODIFIED:20230419T162907Z UID:6295-1682323200-1682614800@marketingeda.com SUMMARY:RSAConference 2023 DESCRIPTION:Where the World Talks Security™ \nDon’t miss the opportunity to take your knowledge and skills to the next level at RSAC 2023. Not sure if the complete Conference experience will work with your schedule and budget? We offer several pass options—including an On Demand Pass. But hurry\, our final discount ends Friday\, April 21! \nIn the cybersecurity industry\, no one goes it alone. Instead\, we build on each other’s diverse knowledge to create the next breakthrough—exchanging ideas\, sharing our success stories\, and bravely examining our failures. \nRSA Conference 2023. Stronger Together. \nConnect with Transformative Solutions\nThis year\, it will be easier than ever to find the products and solutions you’re interested in at RSAC 2023. Explore the Expo in person or visit RSAC Marketplace online—or both! Either way\, you’ll be able to connect with hundreds of industry vendors\, meet with their product experts\, discuss your challenges\, and demo the latest solutions. \nYou can visit RSAC Marketplace now to start finding the solutions you need. You can also use it to help you build a list of vendors you want to explore in the Expo during RSAC 2023. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/rsaconference-2023/ LOCATION:Moscone Center\, 747 Howard Street\, San Francisco\, CA\, 94103\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/RSAC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230424T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20230417T201251Z CREATED:20230417T201251Z LAST-MODIFIED:20230417T201251Z UID:6282-1682323200-1682528400@marketingeda.com SUMMARY:41st IEEE VLSI Test Symposium 2023 DESCRIPTION:The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test\, validation\, yield\, reliability\, and security of microelectronic circuits and systems.\n\nThe symposium will take place on April 24-26\, 2023\, at the Hyatt Regency Mission Bay Spa & Marina\, 1441 Quivira Road\, San Diego\, CA\, USA.\nThe program includes keynotes\, scientific paper presentations\, short industrial application paper presentations\, special sessions\, and Innovative Practices sessions. \nYou are invited to participate and submit your contributions to VTS’23. The areas of interest include (but are not limited to) the following topics: \n\n\n\n\n\nAnalog\, Mixed-Signal\, RF Test\nATPG & Compression\nSilicon Debug\nAutomotive Test & Safety\nBuilt-In Self-Test (BIST)\nDefect & Current Based Test\nDefect & Fault Tolerance\nDelay & Performance Test\nDesign for Testability\, Yield or Reliability\nPre-silicon Design Verification & Validation\nPost-silicon Validation\nEmbedded System & Board Test\nEmbedded Test Methods\nEmerging Technologies Test and Reliability\nFPGA Test\nFault Modeling and Simulation\nHardware Security\n\n\n\n\nLow-Power IC Test\nMachine Learning in Test\,Yield and Reliability\nMicrosystems/MEMS/Sensors Test\nMemory Test and Repair\nOn-Line Test & Error Correction\nPower & Thermal Issues in Test\nSystem-on-Chip (SOC) Test\nTest & Reliability of Biomedical Devices\nTest & Reliability of High-Speed I/O\nTest & Reliability of Machine Learning Systems\nTest Quality & Reliability\nTest Standards & Economics\nTest Resource Partitioning\nTransient & Soft Errors\n2.5D\, 3D & SiP Test\nYield Optimization\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/41st-ieee-vlsi-test-symposium-2023/ LOCATION:Hyatt Regency Mission Bay Spa & Marina\, 1441 Quivira Road\, San Diego\, CA\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/2023-IEEE-VTS.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230424T080000 DTEND;TZID=America/Los_Angeles:20230424T170000 DTSTAMP:20230310T173922Z CREATED:20230310T173845Z LAST-MODIFIED:20230310T173922Z UID:6097-1682323200-1682355600@marketingeda.com SUMMARY:D&R IP-SoC Silicon Valley 2023 DESCRIPTION:Where : Hyatt Regency Santa Clara\n5101 Great America Parkway\, Santa Clara\, CA \nD&R IP-SoC Silicon Valley 2023 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. \nIP-SoC providers\, the seed of innovation in Electronic Industry\, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry. \nIP consumers can view at a glance the latest Technology trends and exciting Innovative IP/SoC products. Through a global view\, Electronic systems leaders may identify disruptive innovation leading to new market segment growth. \nAny question? Please contact us \nTentative list of first Contributions\, more to come… \nKeynote talk \n\nWelcome to D&R IP SOC community \, Gabrièle Saucier\, D&R\nAccelerating Innovation with Open Hardware \, Gordon Harling\, CMC Microsystems\n\nAnalog IP \n\nIntegrating RF PLLs into Complex SoC to support 5G and WiFi Radios \, Julian Jenkins\, Perceptia Devices Australia Pty Ltd\nPinless Clocking and Sensing \, Rounak Lokare\, Analog Bits Inc.\nAnalog lP Subsystems \, Graham Wood\, Agile Analog\n\nMemory IP \n\nLow Power Memory Solution for AIoT and Edge applications \, Bhavana Chaurasia\, Synopsys Inc.\n\nChiplet and Multi Die SoC System \n\nA Scalable\, Configurable\, Resilient Network-on-chip (NoC) for your complex SoC and Chiplet-based Systems \, Parag Bhatt\, Signature IP Corporation\nThe Future of UCIe for Multi-Die Systems \, Manuel Mota\, Synopsys\, Inc.\nHow to navigate today chiplet based design – Comprehensive toolset for an open ecosystem \, Letizia Giuliano\, AlphaWave SEMI\nA proven silicon project management platform for complex SoCs and Chiplet based systems \, Purna Mohanty\, Marquee Semiconductor\, Inc.\nIP Management Best Practices for Chiplet-Based SoCs \, Simon Butler\, Perforce Software\n\nLife cycle management \n\nEssential IP for the Enablement of Silicon Lifecycle Management \, Ash Patel\, Synopsys Inc.\nNext Generation Hardware based Cyber Security solution using advanced Embedded Analytics monitoring technology \, Lee Harrison\, Siemens Digital Industries Software\n\nInterface IP \n\nThe Future of USB Connectivity of FPGAs in Alternative Applications\, Products\, and Markets \, David Grugett\, GOWIN Semiconductor\nPAM4 PCIe — Gen6 and beyond — enabling the next gen of AI/ML \, David Kulansky\, AlphaWave SEMI\n\nProcessor IP \n\nThe Lost Art of Processor Verification \, Larry Lapides\, Imperas Software\nTWS Applications with RISC-V and HiFi DSP \, Casey Ng\, Cadence Design Systems\, Inc.\n\nArtificial Intelligence SoC \n\nFast\, accurate and adaptable AI at low power\, low cost \, Cheng Wang\, Flex Logix Technologies\, Inc.\nAdvancement in Multimedia interfaces servicing Edge AI markets \, Hezi Saar\, Synopsys\, Inc.\nAI ISP AI-ISP: Adding Real-Time AI Functionality to Image Signal Processing with Reduced Memory Footprint and Processing Latency \, Mankit LO\, VeriSilicon Inc.\n\nAutomotive IP and space application \n\nNew Horizontal Markets\, Reap Benefits from Greater Avenues\, using Controller Area Networks \, Avi Zakai\, Digital Core Design\nSpace Applications – IP Core Challenges and Opportunities \, Chinh Le\, Lewiz Communications Inc.\n\nSecurity Solutions \n\nHow to Secure Devices and Digital Assets with the Correct Root of Trust Solution \, Bart Stevens\, Rambus\, Inc.\nAccelerating the Way Toward a Quantum-Safe Future \, Dana Neustadter\, Synopsys\, Inc.\nEliminate CyberSecurity Threats\, from Product Designs\, at the Silicon Level with Post-Quantum Cryptographic Systems \, Alex Angelou\, Digital Core Design\nSecuring System-in-Package with PUF Technology \, Pim Tuyls\, Intrinsic ID\n\nEthernet IP and Networking \n\n5G drives exponential need in processing enabled by ASICs and IP ecosystem \, Keith Hawkins\, Ericsson\nDeterministic transmission of time critical information with TSN Ethernet (Time Sensitive Network \, Flemming Kongsfelt\, Comcores ApS\nDriving the Future of High-Performance Computing through 224G Ethernet IP \, Manmeet Walia\, Synopsys\, Inc.\n\nAnd more to come… \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dr-ip-soc-silicon-valley-2023/ LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IP-SoC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230423T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20221121T190016Z CREATED:20221121T190016Z LAST-MODIFIED:20221121T190016Z UID:5423-1682236800-1682528400@marketingeda.com SUMMARY:CICC 2023 DESCRIPTION:Sponsored by IEEE and SSCS\, the IEEE Custom Integrated Circuits Conference – CICC –  is a premier conference devoted to IC development. The conference program is a blend of oral presentations\, exhibits\, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design problems\, improve circuit design techniques\, get exposure to new technology areas\, and network with peers\, authors and industry experts. \nThere are 3 days of Technical Sessions that include lecture presentations addressing state of the art developments in integrated circuit design. The Educational Sessions are a full day of tutorials instructed by recognized invited speakers. The Panels\, and Forums are presented throughout the conference to enrich the learning experience of the attendees. The Panel Discussions and Forums are presented by leaders from the IC industry. CICC includes an Exhibits Hall that is open in the evenings where Semiconductor manufacturers\, software tool suppliers\, silicon IP providers\, design-service houses\, and technical book publishers offer displays and demonstrations of their products. CICC is sponsored by the IEEE Solid-State Circuits Society and technically co-sponsored by the IEEE Electron Devices Society. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cicc-2023/ CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CICC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230418T080000 DTEND;TZID=Europe/Brussels:20230419T170000 DTSTAMP:20230413T200803Z CREATED:20230413T200803Z LAST-MODIFIED:20230413T200803Z UID:6269-1681804800-1681923600@marketingeda.com SUMMARY:CS International Conference DESCRIPTION:he 13th CS International conference builds on the strengths of its predecessors\, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon\, New Vectors for the VCSEL\, and Ultra-wide Bandgap Devices. \nDelegates attending these sessions will gain insight into device technology\, find out about the current status and the roadmap for the compound semiconductor industry\, and discover the latest advances in tools and processes that will drive up fab yields and throughputs. \nAttendees at this two-day conference will also get the opportunity to meet many other key players within the community. \nCS International is part of AngelTech\, which delivers a portfolio of insightful\, informative\, highly valued chip-level conferences. Bringing together 3 conferences\, 700+ delegates\, 80+ exhibitors\, 120+ presentations and numerous networking opportunities\, AngelTech is the number one global event covering compound semiconductor\, photonic integrated circuit and sensor technologies. With a strong over-lap between the three conferences\, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cs-international-conference/ LOCATION:Sheraton Brussels Airport Hotel\, Brussels\, Belgium CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CS-International-Conference-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20230417T080000 DTEND;TZID=Europe/Berlin:20230421T170000 DTSTAMP:20230412T164710Z CREATED:20230412T164625Z LAST-MODIFIED:20230412T164710Z UID:6261-1681718400-1682096400@marketingeda.com SUMMARY:Hannover Messe 2023 DESCRIPTION:Exhibitors & Products\nConference Program\nNetworking \n\nAI & Machine Learning\nCarbon-neutral production\nEnergy Management\nHydrogen & Fuel Cells\nIndustry 4.0\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/hannover-messe-2023/ LOCATION:Hannover Expo-Plaza\, Hannover\, Germany CATEGORIES:Conference,IoT ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Hannover-Messe-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230417T080000 DTEND;TZID=Europe/Brussels:20230419T170000 DTSTAMP:20230302T002957Z CREATED:20221215T174738Z LAST-MODIFIED:20230302T002957Z UID:5525-1681718400-1681923600@marketingeda.com SUMMARY:DATE 2023 DESCRIPTION:The DATE conference is the main European event bringing together designers and design automation users\, researchers and vendors as well as specialists in the hardware and software design\, test and manufacturing of electronic circuits and systems. DATE puts a strong emphasis on both technology and systems\, covering ICs/SoCs\, reconfigurable hardware and embedded systems as well as embedded software. \nThe three-day event consists of a conference with regular papers\, late breaking results papers and extended abstracts\, complemented by timely keynotes\, special days\, focus sessions\, embedded tutorials\, half-day workshops and multi-partner project sessions. The event will also host the Young People Programme and newly introduced unplugged sessions fostering the networking and the exchange of information on relevant issues\, recent research outcomes and career opportunities. \nDATE 2023 is the 26th edition of an event that has always been the place for researchers\, young professionals and industrial partners to meet\, present their research and discuss the current development and next trends\, with high emphasis on social interaction. \nFor its 2023 edition\, DATE presents itself in a renewed format: After three years of online editions due to COVID-19\, DATE 2023 focusses on interaction as well as reinforcing and rebuilding links in the community. Accordingly\, we employ some substantial changes to the established format intending for significant added value for in-person participation: Rather than spreading the attendance throughout an entire week\, we condense DATE to three days – and make them count! Furthermore\, the vast majority of regular papers will be presented in a renewed format of technical sessions focussing on live interactions (in addition to the common full-length presentations available before\, during and after the conference by video). By this\, we make sure that the community can actually do what conferences are for: meeting\, discussing and exchanging. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/date-2023/ LOCATION:Flanders Meeting & Convention Center Antwerp\, Antwerp\, Belgium CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DATE-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230405T080000 DTEND;TZID=America/Los_Angeles:20230407T170000 DTSTAMP:20230213T214028Z CREATED:20230213T214028Z LAST-MODIFIED:20230213T214028Z UID:5960-1680681600-1680886800@marketingeda.com SUMMARY:ISQED 2023 DESCRIPTION:The 24th International Symposium on Quality Electronic Design (ISQED’23) is the premier interdisciplinary and multidisciplinary Electronic Design conference—bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools\, integrated circuit technologies\, semiconductor technology\,packaging\, assembly & test to achieve total design quality. ISQED 2023 will held with the technical sponsorship of IEEE CASS\, IEEE EDS\, and in-cooperation with ACM/SigDA. Conference proceedings & Papers will be published in IEEE Xplore digital library and indexed by Scopus. \nThis important three day event will be packed full of tutorials and in-depth sessions. The program will also feature the following: \n\nEmbedded information-packed tutorials\nKeynotes by major industry & academia leaders and experts\nNear 100 papers highlighting the latest trends in electronic circuit and system design & automation\, test\, verification\, and semiconductor technologies\nInteract & network with the Experts and industry movers and shakers\n\n\nTechnical Sponsors\n\n\n \nIn-Cooperation With\n \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isqed-2023/ LOCATION:Seven Hills Conference Center\, 800 Font Blvd\, San Francisco\, CA\, 94132\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/ISQED-2023-2.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230331T080000 DTEND;TZID=America/Los_Angeles:20230402T170000 DTSTAMP:20230222T174957Z CREATED:20230122T015307Z LAST-MODIFIED:20230222T174957Z UID:5871-1680249600-1680454800@marketingeda.com SUMMARY:Latch-Up 2023 DESCRIPTION:The FOSSi Foundation is proud to announce Latch-Up\, a conference dedicated to free and open source silicon to be held over the weekend of Friday\, March 31 to Sunday\, April 2\, 2023 in Santa Barbara\, California\, USA. \nLatch-Up is a weekend of presentations and networking for the open source digital design community\, much like its European sister conference ORConf. \nSo save the date\, register to attend\, and we encourage you to submit a presentation or proposal if you have a project or idea on the topic to share! \n  \nQuestions? Ping the organizers via @LatchUpConf or email. \nPrevious Latch-Ups: 2019 Portland \nSubmit a talk\n\nWe encourage anybody involved in the open source semiconductor engineering space to come along and share your work or experience. Presentations slots as short as 3 minute lightning-talks and up to 30 minute talks including Q and A are available. \nSo if you’ve designed\, worked on or even just used open source IP cores and/or management systems\, verification IP\, build flows\, SoCs\, simulators\, synthesis tools\, FPGA and ASIC implementation tools\, languages and DSLs\, compilers\, or anything related we’d love to have you join us to share your experience. \nPresentations are submitted through the registration process and we will let you know if your presentation was accepted. \nRegistration\n\nAttendance of Latch-Up is free. To help us organizing the event\, you are required to register using the button below or via the EventBrite link. \nProfessional Tickets\nAttendees who are joining us at Latch-Up on behalf of their company and/or can claim the conference as professional training expense are encouraged to purchase a professional ticket. These ticket sales help us provide all that we do at Latch-Up and keep the event accessible to all members of the community. Professional ticket holders are able to get their company name printed on their name badge and receive a special treat. You can buy professional tickets using the button below or via the EventBrite link. \nWe ask all Latch-Up participants to adhere to the the FOSSi Foundation code of conduct throughout the event. \nSponsorship and Volunteering at Latch-Up\n\nLatch-Up is free to attend\, but we aim to provide catering and the like during the event. Latch-Up is also a great way to get your company or brand in front of lots of engineers and hackers on the day\, and thousands more through recordings of the event. So please get in touch if you’d like to explore sponsorship opportunities. \nLatch-Up is organized by volunteers on behalf of the FOSSi Foundation. We are currently looking for more people to help out with arrangements and putting on the event\, so please do email us if you would like to volunteer for during the event with setup\, AV\, or even just local knowledge so we can plan the weekend better. \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/latch-up-2023/ LOCATION:University of California\, Santa Barbara\, Santa Barbara\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Latch-Up-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230326T080000 DTEND;TZID=America/Los_Angeles:20230330T170000 DTSTAMP:20230228T192951Z CREATED:20230216T174553Z LAST-MODIFIED:20230228T192951Z UID:5995-1679817600-1680195600@marketingeda.com SUMMARY:IRPS 2023 DESCRIPTION:For 60 years\, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States\, Europe\, Asia\, and all other parts of the world… \n\nIRPS 2023 will be presented as an in-person conference\, with a virtual component available.\nThe IRPS 2022 virtual conference content will remain available to registered attendees through April 30th\, 2023 via the Underline platform.\nWe are happy to announce that once again the International Electrostatic Discharge Workshop (IEW) will be co-locating with IRPS this year. Their submission deadline is January 23\, 2023. For further details\, including the Call for Posters\, please visit their webpage here.\n\nKeynotes\n\n\nAnn Kelleher\, EVP and GM of Technology Development\, Intel \n\n\n\n\nGary Hicok\, Senior Vice President\, NVIDIA \n\n\nMark Fuselier\, SVP\, Technology & Product Engineering\, AMD \n\n\nRohit Vidwans\, EVP and Chief Engineering & Manufacturing Officer\, Ampere \n\n\n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/irps-2023/ LOCATION:Hyatt Regency Monterey\, 1 Old Golf Course Rd\, Monterey\, CA\, 93940\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IRPS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20230321T080000 DTEND;TZID=Europe/Berlin:20230323T170000 DTSTAMP:20230228T001650Z CREATED:20230228T001650Z LAST-MODIFIED:20230228T001650Z UID:6027-1679385600-1679590800@marketingeda.com SUMMARY:Automotive Ethernet Congress DESCRIPTION:The ninth Automotive Ethernet Congress to be held on March 21 – 23\, 2023 at the Hilton Munich Airport will look to address the following questions: Does the selected transmission technology support the transformation of the E/E architecture from hardware-based to software-centric? Does it offer the necessary flexibility and self-learning capability to be able to continuously implement new functions? Automotive Ethernet\, which supports service-oriented architectures\, embodies all these features. \nHere\, current\, and future technology and product developments will be the focus of the conference program\, exhibition\, and associated workshops. The Congress will offer you the opportunity to share and discuss new ideas around the implementation and use of Ethernet in the vehicle and in your own projects. \nAGENDA\n21 March 2023 – TSN Training\n22 March 2023 – Presentations\, Exhibition and Get together\n23 March 2023 – Presentations and Exhibition \n\nFollow us on social media #automotiveethernetcongress \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/automotive-ethernet-congress-2/ LOCATION:Hilton Munich Airport\, Terminalstraße Mitte 20\, 85356 München-Flughafen\, Munich\, Germany CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Automotive-Ethernet-Congress-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230320T080000 DTEND;TZID=America/Los_Angeles:20230323T170000 DTSTAMP:20230307T044258Z CREATED:20230307T044258Z LAST-MODIFIED:20230307T044258Z UID:6073-1679299200-1679590800@marketingeda.com SUMMARY:GOMACTech 2023 DESCRIPTION:GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \n\nDear 2023 Attendees: \nThis year’s conference is titled “Microelectronics – the Engine to Keep the US Moving Forward\,” and our robust technical program supports this theme with topics including Advanced Silicon-Based RF\, Alternative Computing Paradigms\, Counterfeit Detection and Avoidance\, GaN Power Electronics\, and much\, much more. \nThe conference kicks off on Monday\, 20 March\, with our annual Trusted Suppliers Industry Day\, created with the objective of promoting discussion among members of industry and government agencies that represent the interests of integrated-circuit and electronics producers who serve defense and aerospace applications. We have seen tremendous change since last year’s Industry Day\, not only with the enactment and funding of the CHIPS and Science Act but also with the increasing uncertainty regarding China’s intentions with Taiwan. To provide insight into these issues\, Dr. Tai Ming Cheung\, recipient of multiple DoD Minerva Research Initiative awards and director of the University of California Institute on Global Conflict and Cooperation (IGCC)\, is scheduled to deliver the keynote address on the emergence of the Chinese techno-security state. Monday also features four workshops/tutorials: Advanced GaN Modeling\, JFAC Hardware Assurance\, GEEGAH Fab Capabilities & PDK for Acoustoelectric Devices\, and AKOUSTIS Fab Capabilities & PDK for AIN/ScAIN. \nOur Monday programming will conclude with a reception on the resort’s Flamingo Lawn\, which is open to all registered attendees. Please join us! \nGOMACTech-23 formally opens on Tuesday\, 21 March\, with an outstanding morning Plenary Session that includes the keynote address “3DHI and the Coming Inflection Point in Microelectronics Manufacture” by Dr. Mark Rosker\, director of DARPA’s Microsystems Technology Office. Rosker will be followed by Ezra Hall\, senior director of Global Aerospace and Defense Business at GlobalFoundries\, whose talk is titled “Aligning Defense Microelectronics Technologies with Industry Needs: Fueling U.S. Success.” \nThe keynotes will be followed by the Jack S. Kilby Lecture Series\, with presentations from Dr. Waleed Khalil\, professor of electrical and computer engineering at Ohio State University and the ElectroScience Lab\, who will speak on “Analog Hardware Security: What We Don’t Know Will Hurt Us\,” and Krystal Puga\, Lunar Mission Architect for the Space Systems Sector at Northrop Grumman Corp.\, with the presentation\, “James Webb Space Telescope Development and Latest Discoveries.” \nThis year\, we are also hosting three panel discussions: “Chips and Science Act Impact to DoD\,” on Monday\, 20 March; “Perspectives on Computational Methods for Radiation Hardness Qualification;” on Wednesday\, 22 March; and “Sifting Through the Chaos: Are Best Practices Achievable?” on Thursday\, 23 March. \nThe plenary\, technical\, and topical sessions are the major venues for information exchange at the conference. Other opportunities for technical interaction are provided by the exhibits program\, which includes major IC manufacturers and commercial vendors of devices\, equipment\, systems\, and services for nearly every facet of the electronics business. The exhibition opens on Tuesday\, 21 March\, at noon\, and runs through Wednesday\, 22 March\, at 4:00 pm. On Tuesday evening\, all attendees can network in a relaxing atmosphere during the Exhibitors’ Reception. \nWednesday evening features the Evening Social\, held this year at the San Diego Zoo\, one of the country’s premier zoos. A buffet-style dinner will be included\, and we will have the opportunity to meet some of the animals “up close and personal.” This is a ticketed event with an attendance cap\, so if you’re planning on attending\, buy your ticket before Wednesday. \nOn Thursday morning\, 23 March\, a poster session that includes our annual student poster competition will take place. \nGOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and to provide a forum for government reviews. \nThe GOMACTech Conference is an Unclassified\, Export-Controlled event that requires participants to be U.S. Citizens or legal U.S. Permanent Residents. All registrants must provide proof of U.S. Citizenship or Permanent Resident status prior to being permitted entry into the conference. Additionally\, a signed Non-Disclosure Statement will be required. \nGOMACTech-23 provides a forum for discussing and demonstrating advanced microelectronics and microsystems that can provide the means to develop confidence in transformational\, leap-ahead technologies\, and capabilities. GOMACTech is the premier forum for reporting on government-funded microcircuit research and other research efforts that focus on the technology needs of government systems. \nThis year’s technical program is a result of the hard work and enthusiasm of the GOMACTech-23 Technical Program Committee. The committee members discussed and collaborated on the topics and presentations. The quality of the conference reflects this comprehensive team effort. We hope that you find GOMACTech-23 an enlightening\, rewarding\, and enjoyable experience. Thank you for your active participation. \n  \n\n\n\nDr. Morgan Thoma\nU.S. Army Research Laboratory\nDefense Microelectronics CFT\nGeneral Chair\nLuciano Boglione\nNaval Research Laboratory\nTechnical Program Chair\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gomactech-2023/ LOCATION:Town and Country San Diego Hotel\, 500 Hotel Circle North\, San Diego\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GOMACTech-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230314T080000 DTEND;TZID=America/Los_Angeles:20230316T170000 DTSTAMP:20230313T200643Z CREATED:20230124T193702Z LAST-MODIFIED:20230313T200643Z UID:5880-1678780800-1678986000@marketingeda.com SUMMARY:Embedded World DESCRIPTION:The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community\, including leading experts\, key players and industry associations. It offers unprecedented insight into the world of embedded systems\, from components and modules to operating systems\, hardware and software design\, M2M communication\, services\, and various issues related to complex system design. \nIts expertise and sharp focus on technologies\, processes and future-oriented products make it unparalleled in international comparisons – and THE must-attend event for developers\, system architects\, product managers and technical management. \nMain topics in 2023\n\nembedded: A variety of technological challenges shape the modern design concepts of complex embedded systems – from sensors to the cloud\, from hardware to software to tools – smart\, intelligent\, efficient\, safe\, reliable\, interoperable…\n\n\nresponsible: Evermore embedded systems are being used in function-critical applications such as medical technology\, mobility and industrial automation. The industry meets these challenges with adaptive\, autonomous and intelligent systems that safely and reliably carry out critical tasks. Many questions ranging from responsibility by design to formal verification methods and ethical issues must be answered.\nsustainable: Embedded systems are central\, basic elements for many efficient and sustainable applications. Embedded systems themselves must also be sustainable over the entire life cycle -from design and manufacturing to operation and updateability\, refurbishment\, decommissioning and disposal.\n\nSpecialty areas at the trade fair and conferences focus on current megatrends\, such as embedded vision\, safety & security\, M2M communication\, IP & IC design and embedded intelligence. \nThe embedded world Exhibition&Conference facilitates direct interaction with a large number of experts and qualified suppliers from all over the world. Whether at specialist forums\, expert panels\, the embedded world Conference or electronic displays Conference\, experts from the embedded community meet at eye-level to jointly develop ideas and concepts for the future.  The embedded world Exhibition&Conference is essential for anyone who wants to stay on top of core topics and industry trends! \nTake advantage of the opportunity to expand your knowledge and make new\, international business contacts! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/embedded-world/ LOCATION:NürnbergMesse\, Messezentrum 1\, Nurnberg\, Germany CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ew-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Phoenix:20230313T080000 DTEND;TZID=America/Phoenix:20230316T170000 DTSTAMP:20230307T194359Z CREATED:20230307T194359Z LAST-MODIFIED:20230307T194359Z UID:6087-1678694400-1678986000@marketingeda.com SUMMARY:19th International Conference & Exhibition on Device Packaging DESCRIPTION:The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills\, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16\, 2023\, at the WeKoPa Conference Center. This esteemed event brings together industry engineers\, researchers and top experts participating in a multi-faceted technical program and unique networking events. \nFull Conference registrations include:  (excludes exhibit only\, pdc only\, or visitor pass registration types) \n\n3-track program with 80+ speakers\nPoster presentations\n4 keynote speakers from Qualcomm\, Samsung\, General Motors\, and Lightmatter\nPanels covering both business and social value topics\nGBC Business plenary session: Building the Ecosystem: Transitioning from Research to Manufacturing\nSold-out exhibit hall with 66 booths\nNetworking opportunities: welcome reception\, exhibit hall reception\, poster session happy hour\, and group lunches\nPost-conference golf scramble and guided hike fund raisers\n\nFirst day add-ons: 12 Professional Development Courses\, a great learning opportunity for those new to the industry or looking to enhance their skills and knowledge. \nIn 2022\, DPC was held in person with more than 500 participants\, despite continued pandemic restrictions at that time. Given the strength of the technical program and exhibition this year\, it is anticipated that the 2023 DPC will welcome a record number of participants! \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/19th-international-conference-exhibition-on-device-packaging/ LOCATION:We-Ko-Pa Resort & Conference Center\, 10438 Wekopa Way\, Fort McDowell\, AZ\, 85264\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Device-Packaging-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230313T080000 DTEND;TZID=America/Los_Angeles:20230316T170000 DTSTAMP:20230215T013724Z CREATED:20230215T013724Z LAST-MODIFIED:20230215T013724Z UID:5973-1678694400-1678986000@marketingeda.com SUMMARY:19th Annual Device Packaging Conference (DPC 2023) DESCRIPTION:The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills\, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16\, 2023\, at the WeKoPa Conference Center. This esteemed event brings together industry engineers\, researchers and top experts participating in a multi-faceted technical program and unique networking events. \nFull Conference registrations include:  (excludes exhibit only\, pdc only\, or visitor pass registration types) \n\n3-track program with 80+ speakers\nPoster presentations\n4 keynote speakers from Qualcomm\, Samsung\, General Motors\, and Lightmatter\nPanels covering both business and social value topics\nGBC Business plenary session: Building the Ecosystem: Transitioning from Research to Manufacturing\nSold-out exhibit hall with 66 booths\nNetworking opportunities: welcome reception\, exhibit hall reception\, poster session happy hour\, and group lunches\nPost-conference golf scramble and guided hike fund raisers\n\nFirst day add-ons: 12 Professional Development Courses\, a great learning opportunity for those new to the industry or looking to enhance their skills and knowledge. \nIn 2022\, DPC was held in person with more than 500 participants\, despite continued pandemic restrictions at that time. Given the strength of the technical program and exhibition this year\, it is anticipated that the 2023 DPC will welcome a record number of participants! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/19th-annual-device-packaging-conference-dpc-2023/ LOCATION:WeKoPa Conference Center\, 10438 WeKoPa Way\, Fort McDowell\, AZ\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IMAPS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Karachi:20230311T080000 DTEND;TZID=Asia/Karachi:20230311T180000 DTSTAMP:20230307T183152Z CREATED:20230307T183152Z LAST-MODIFIED:20230307T183152Z UID:6082-1678521600-1678557600@marketingeda.com SUMMARY:MumbaiFOSS DESCRIPTION:MumbaiFOSS is a conference which aims to bring software developers\, communities\, policy makers and enthusiasts together\, so we can learn and inspire each other. This event is happening in collaboration with FOSSEE\, IIT Bombay. \nAgenda for MumbaiFOSS\n\nFOSS Product Showcase\nDeep Dive of Issues and Trends in Open Source\nInteract with the larger FOSS Community in India\nSustaining FOSS\nFOSS Policy\n\nAbout FOSS United Foundation\nFOSS United is a non-profit foundation that aims at promoting and strengthening the Free and Open Source Software ecosystem in India. \nFor queries or suggestions\, mail to mumbai@fossunited.org \nWant to Sponsor MumbaiFOSS?\nTo Sponsors MumbaiFOSS\, check out this deck. \nProposed by: Sumanto Kar and Nagesh Karmali \neSim developed by FOSSEE\n\nI would be talking about the open-source software eSim developed by FOSSEE\, IIT Bombay. It is an Electronic Design Automation(EDA) tool capable of mixed-signal simulation. I would be talking about the features and benefits of using this tool. I will also be talking about the activities under the eSim. \n\nSource code/Reference: https://esim.fossee.in/ \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/mumbaifoss/ LOCATION:IIT Bombay\, Powaj\, Maharashtra\, Bombay\, India CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/MumbaiFOSS.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230227T080000 DTEND;TZID=America/Los_Angeles:20230302T170000 DTSTAMP:20230228T000703Z CREATED:20230227T175620Z LAST-MODIFIED:20230228T000703Z UID:6024-1677484800-1677776400@marketingeda.com SUMMARY:Mobile World Conference\, MWC 2023 DESCRIPTION:MWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator\, device manufacturer\, technology provider\, vendor\, content owner\, or are simply interested in the future of tech\, you need to be here. \nWhy? Because it’s the one time of year where everyone who’s anyone comes together under one roof. Tens of thousands of senior executives from the top global companies\, international governments and trailblazing tech businesses converge at MWC Barcelona to make decisions. \n  \n\nThought leaders become change-makers\nNew ideas turn into business deals\nAnd networking means remarkable connections\n\nIt’s the place to find out where the industry\, your business and your career are headed. Miss out on MWC Barcelona\, miss out on the next 12 months. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/mobile-world-conference-mwc-2023/ LOCATION:Fira Gran Via\, 08038\, Barcelona\, Spain CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/MWC-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230227T080000 DTEND;TZID=America/Los_Angeles:20230302T170000 DTSTAMP:20230208T183552Z CREATED:20220720T162103Z LAST-MODIFIED:20230208T183552Z UID:4939-1677484800-1677776400@marketingeda.com SUMMARY:DVCon U.S. 2023 DESCRIPTION:The 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.)\, sponsored by Accellera Systems Initiative\, announces its call for extended abstract proposals. The submission site for extended abstracts will be open from July 11 through August 8\, 2022. DVCon U.S. 2023 will be held February 27-March 2\, 2023\, at the Doubletree Hotel in San Jose\, California. \nThe 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.)\, sponsored by Accellera Systems Initiative\, announced today that Dirk Didascalou\, Chief Technology Officer\, Siemens Digital Industries\, will be the keynote speaker for this year’s conference. \nMr. Didascalou will present\, “What Do Farming\, Steel\, and Space Have in Common?” on Tuesday\, February 28 from 1:30-2:30pm in the Oak/Fir Ballroom. With examples from Space Perspective\, 80 Acres Farms and others\, Mr. Didascalou will discuss how the new wave of digitalization is driving huge transformations and can be an inspiration for every industry. \n\nMore conference highlights: \n\n\nAccellera-sponsored lunch on Monday\, February 27 featuring Bob Smith\, Executive Director\, SEMI ESD Alliance\, presenting “The CHIPS Act and Its Impact on the Design & Verification Markets.”\n\n\nPoster Ninja Warrior session on Wednesday\, March 1 includes four posters battling it out for top honors. Posters will be judged on a variety of factors\, including audience reaction.\nTwo panels will be offered on Wednesday\, March 1:\n\n“Systems are Evolving. Is Verification Keeping Up?” will be moderated by Bernard Murphy\, SemiWiki. Panelists will discuss areas where they would like to see breakthroughs and ideas and research that they would like to see explored further.\n“AI-ML Algorithms are Transforming Verification: Separating Hype from Reality\,” will focus on the state of the art of design verification environments that power the new generation of advanced processors. Panelists will discuss systems which could potentially change the semiconductor landscape.\n\n\nAccellera-sponsored lunch on Wednesday\, March 1 “RISC-V Everywhere\,” presented by Mark Himelstein\, CTO RISC-V International.\n\nIn addition to the two panels and keynote\, including the Accellera-sponsored sessions\, there will be 41 paper presentations\, 17 poster sessions\, four tutorials and 16 workshops throughout the four-day program. \nRegistration is open. Registration for the keynote\, panels and exhibits is free. \n\nFor the latest updates regarding the conference and expo\, please visit the website. \n\nAbout DVCon \nDVCon is the premier conference for discussion of the functional design and verification of electronic systems. DVCon is sponsored by Accellera Systems Initiative\, an independent\, not-for-profit organization dedicated to creating design and verification standards required by systems\, semiconductor\, intellectual property (IP) and electronic design automation (EDA) companies. For more information about Accellera\, please visit www.accellera.org. For more information about DVCon U.S.\, please visit here. Follow DVCon on Facebook\, LinkedIn or @dvcon_us on Twitter or to comment\, please use #dvcon_us. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-u-s-2023/ LOCATION:DoubleTree Hotel\, 2050 Gateway Place\, San Jose\, CA\, 95110\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/DVCon-2023.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230219T080000 DTEND;TZID=America/Los_Angeles:20230223T170000 DTSTAMP:20221128T190714Z CREATED:20221128T190714Z LAST-MODIFIED:20221128T190714Z UID:5472-1676793600-1677171600@marketingeda.com SUMMARY:ISSCC 2023 DESCRIPTION:ISSCC 2023 is planned as a fully in-person event. On-demand access to ISSCC papers and educational material will be possible for people who cannot travel to San Francisco\, but the conference will be optimized for an in-person experience. We keep monitoring the COVID-19 pandemic and we will promptly inform you should any change in our program be needed. Looking forward to seeing you again in San Francisco! \nEugenio Cantatore – Conference Chair \nPiet Wambacq – Program Committee Chair \n\n\n2023 Plenary Sessions\n\n\n\n\n\n\nInnovation for the Next Decade of High-Performance Computing \nLisa Su\, Chair and Chief Executive Officer\, AMD\, Austin\, Texas \nShape the World with Mixed-Signal Integrated Circuits – Past\, Present\, and Future \nAkira Matsuzawa\, Professor Emeritus of Tokyo Institute of Technology and CEO of Tech Idea\, Kawasaki\, Japan \nEU Chips Act drives pan-European full-stack innovation partnerships \nJo De Boeck\, Executive Vice President and Chief Strategy Officer\, imec and KU Leuven\, Leuven\, Belgium \n5G drives exponential increase in processing needs across all industries \nErik Ekudden\, Senior Vice President\, Chief Technology Officer\, Ericsson\, Kista\, Sweden \n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isscc-2023/ LOCATION:Marriott Marquis\, 780 Mission Street\, San Francisco\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISSCC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230131T080000 DTEND;TZID=America/Los_Angeles:20230202T170000 DTSTAMP:20221228T190236Z CREATED:20221228T190236Z LAST-MODIFIED:20221228T190236Z UID:5820-1675152000-1675357200@marketingeda.com SUMMARY:DesignCon 2023 DESCRIPTION:DesignCon is the premier high-speed communications and system design conference and exposition\, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. \nThree days of education\, exhibits\, and networking – technical paper sessions\, tutorials\, industry panels\, product demos\, expo hall and social functions. \nJoin fellow engineers at DesignCon and cover all aspects of electronic design. \nAttend the expertly curated\, 14-track conference created by engineers for engineers\, browse exhibits with hundreds of new products and technologies\, and network with high-caliber industry professionals over the three-day event. \nDesignCon’s “Engineer of the Year” Award is given out each year during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip\, board\, or system level. \nThe award winner is selected based on his or her leadership\, creativity\, and out-of-the-box thinking brought to design/test of chips\, boards\, or systems\, with particular attention paid to areas of signal and power integrity. Nominations for the 2023 Engineer of the Year Award are now open. Please submit your nomination/s for this prestigious award before December 20\, 2022. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/designcon-2023/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DesignCon-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230124T080000 DTEND;TZID=America/Los_Angeles:20230126T170000 DTSTAMP:20230119T004257Z CREATED:20221004T200927Z LAST-MODIFIED:20230119T004257Z UID:5258-1674547200-1674752400@marketingeda.com SUMMARY:Chiplet Summit DESCRIPTION:The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. \nThey’ll get the scoop on ways to make their chiplets run faster\, scale better\, use less power\, and be more flexible. \nThis unique event gives attendees a place to network with peers\, ask questions of the experts\, and talk to vendors offering a wide variety of products and services. \n“Chiplets are expected to return to the two-year doubling cycle that has been the cornerstone economics of the semiconductor business since 1965.”\n– John Blyler\, Design News\, September 2021 \nThought-Provoking Panels Where Attendees Can Ask Questions of Leading Experts: \n\nChoosing the Right Architecture for Your Application\nNext Great Breakthrough in Chiplets\nBest Development Platform for Chiplets\nBest Interface for Chiplets\nWhat Standards Are Needed?\nOptimizing Chiplets\n\n  \nATTENDEES \nEngineers and managers who are looking for ways to help meet performance challenges\, handle the move to smaller dimensions\, provide the modularity and scalability today’s chips require\, and develop solutions focused on the latest applications and interfaces.  Designers of enterprise networks\, telecom systems\, high-performance computing\, financial systems\, IoT\, and mil/aero applications all know that chiplets will play a big role in their future. \nBACKGROUND \nChiplets improve chip yields and costs\, but still provide the performance of a large monolithic chip.  Designers can mix-and-match chiplets\, use the process technologies best suited to particular functions\, take advantage of chiplet IP\, simplify moves to new process nodes\,  and avoid wafer waste and manufacturing defects.  Chiplets are the key to producing the extremely high-density\, high-performance chips required for today’s networking\, storage\, AI/ML\, analytics\, media processing\, HPC\, and virtual reality applications. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chiplet-summit/ LOCATION:DoubleTree Hotel\, 2050 Gateway Place\, San Jose\, CA\, 95110\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Chiplet-Summit-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20230116T080000 DTEND;TZID=Asia/Tokyo:20230119T170000 DTSTAMP:20230104T174652Z CREATED:20230104T174652Z LAST-MODIFIED:20230104T174652Z UID:5828-1673856000-1674147600@marketingeda.com SUMMARY:ASP-DAC 2023 DESCRIPTION:ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2023 is 28th conference. ASP-DAC 2023 offers you an ideal opportunity to touch the recent technologies and the future directions on the LSI design and design automation areas by technical papers and tutorials. ASP-DAC also holds Designers’ Forum to make presentations about the latest designs for designers. Please do not miss ASP-DAC 2023. \n\nDate: Jan. 16-19\, 2023\nPlace: Tokyo Odaiba Miraikan\, Japan\nGeneral Chair: Atsushi Takahashi (Tokyo Institute of Technology\, Japan)\nTechnical Program Chair: Gi-Joon Nam (IBM Research\, USA)\nDesign Contest Co-Chairs: Mahfuzul Islam (Kyoto University\, Japan)\, Akira Tsuchiya (The University of Shiga Prefecture\, Japan)\n\nThe format of the conference is hybrid but mainly in-person for speakers. All speakers are expected to attend ASP-DAC 2023 physically unless a speaker has some inevitable reasons such as medical reasons and government orders.\nRestrictions on new entry into Japan due to COVID-19 have been relaxed since October 11\, 2022. Please check the following announcement from the Ministry of Foreign Affairs of Japan.\nhttps://www.mofa.go.jp/j_info/visit/visa/index.html \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/asp-dac-2023/ LOCATION:Tokyo Odaiba Miraikan\, 2 Chome-3-6 Aomi\, Tokyo\, Koto CIty\, 135-0064\, Japan CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ASP-DAC-2023.jpg END:VEVENT END:VCALENDAR