BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Berlin BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20210314T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20211107T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Phoenix BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0700 TZNAME:MST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Karachi BEGIN:STANDARD TZOFFSETFROM:+0500 TZOFFSETTO:+0500 TZNAME:PKT DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Paris BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Hong_Kong BEGIN:STANDARD TZOFFSETFROM:+0800 TZOFFSETTO:+0800 TZNAME:HKT DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230418T080000 DTEND;TZID=Europe/Brussels:20230419T170000 DTSTAMP:20230413T200803Z CREATED:20230413T200803Z LAST-MODIFIED:20230413T200803Z UID:6269-1681804800-1681923600@marketingeda.com SUMMARY:CS International Conference DESCRIPTION:he 13th CS International conference builds on the strengths of its predecessors\, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon\, New Vectors for the VCSEL\, and Ultra-wide Bandgap Devices. \nDelegates attending these sessions will gain insight into device technology\, find out about the current status and the roadmap for the compound semiconductor industry\, and discover the latest advances in tools and processes that will drive up fab yields and throughputs. \nAttendees at this two-day conference will also get the opportunity to meet many other key players within the community. \nCS International is part of AngelTech\, which delivers a portfolio of insightful\, informative\, highly valued chip-level conferences. Bringing together 3 conferences\, 700+ delegates\, 80+ exhibitors\, 120+ presentations and numerous networking opportunities\, AngelTech is the number one global event covering compound semiconductor\, photonic integrated circuit and sensor technologies. With a strong over-lap between the three conferences\, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cs-international-conference/ LOCATION:Sheraton Brussels Airport Hotel\, Brussels\, Belgium CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CS-International-Conference-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20230417T080000 DTEND;TZID=Europe/Berlin:20230421T170000 DTSTAMP:20230412T164710Z CREATED:20230412T164625Z LAST-MODIFIED:20230412T164710Z UID:6261-1681718400-1682096400@marketingeda.com SUMMARY:Hannover Messe 2023 DESCRIPTION:Exhibitors & Products\nConference Program\nNetworking \n\nAI & Machine Learning\nCarbon-neutral production\nEnergy Management\nHydrogen & Fuel Cells\nIndustry 4.0\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/hannover-messe-2023/ LOCATION:Hannover Expo-Plaza\, Hannover\, Germany CATEGORIES:Conference,IoT ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Hannover-Messe-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230417T080000 DTEND;TZID=Europe/Brussels:20230419T170000 DTSTAMP:20230302T002957Z CREATED:20221215T174738Z LAST-MODIFIED:20230302T002957Z UID:5525-1681718400-1681923600@marketingeda.com SUMMARY:DATE 2023 DESCRIPTION:The DATE conference is the main European event bringing together designers and design automation users\, researchers and vendors as well as specialists in the hardware and software design\, test and manufacturing of electronic circuits and systems. DATE puts a strong emphasis on both technology and systems\, covering ICs/SoCs\, reconfigurable hardware and embedded systems as well as embedded software. \nThe three-day event consists of a conference with regular papers\, late breaking results papers and extended abstracts\, complemented by timely keynotes\, special days\, focus sessions\, embedded tutorials\, half-day workshops and multi-partner project sessions. The event will also host the Young People Programme and newly introduced unplugged sessions fostering the networking and the exchange of information on relevant issues\, recent research outcomes and career opportunities. \nDATE 2023 is the 26th edition of an event that has always been the place for researchers\, young professionals and industrial partners to meet\, present their research and discuss the current development and next trends\, with high emphasis on social interaction. \nFor its 2023 edition\, DATE presents itself in a renewed format: After three years of online editions due to COVID-19\, DATE 2023 focusses on interaction as well as reinforcing and rebuilding links in the community. Accordingly\, we employ some substantial changes to the established format intending for significant added value for in-person participation: Rather than spreading the attendance throughout an entire week\, we condense DATE to three days – and make them count! Furthermore\, the vast majority of regular papers will be presented in a renewed format of technical sessions focussing on live interactions (in addition to the common full-length presentations available before\, during and after the conference by video). By this\, we make sure that the community can actually do what conferences are for: meeting\, discussing and exchanging. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/date-2023/ LOCATION:Flanders Meeting & Convention Center Antwerp\, Antwerp\, Belgium CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DATE-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230405T080000 DTEND;TZID=America/Los_Angeles:20230407T170000 DTSTAMP:20230213T214028Z CREATED:20230213T214028Z LAST-MODIFIED:20230213T214028Z UID:5960-1680681600-1680886800@marketingeda.com SUMMARY:ISQED 2023 DESCRIPTION:The 24th International Symposium on Quality Electronic Design (ISQED’23) is the premier interdisciplinary and multidisciplinary Electronic Design conference—bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools\, integrated circuit technologies\, semiconductor technology\,packaging\, assembly & test to achieve total design quality. ISQED 2023 will held with the technical sponsorship of IEEE CASS\, IEEE EDS\, and in-cooperation with ACM/SigDA. Conference proceedings & Papers will be published in IEEE Xplore digital library and indexed by Scopus. \nThis important three day event will be packed full of tutorials and in-depth sessions. The program will also feature the following: \n\nEmbedded information-packed tutorials\nKeynotes by major industry & academia leaders and experts\nNear 100 papers highlighting the latest trends in electronic circuit and system design & automation\, test\, verification\, and semiconductor technologies\nInteract & network with the Experts and industry movers and shakers\n\n\nTechnical Sponsors\n\n\n \nIn-Cooperation With\n \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isqed-2023/ LOCATION:Seven Hills Conference Center\, 800 Font Blvd\, San Francisco\, CA\, 94132\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/ISQED-2023-2.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230331T080000 DTEND;TZID=America/Los_Angeles:20230402T170000 DTSTAMP:20230222T174957Z CREATED:20230122T015307Z LAST-MODIFIED:20230222T174957Z UID:5871-1680249600-1680454800@marketingeda.com SUMMARY:Latch-Up 2023 DESCRIPTION:The FOSSi Foundation is proud to announce Latch-Up\, a conference dedicated to free and open source silicon to be held over the weekend of Friday\, March 31 to Sunday\, April 2\, 2023 in Santa Barbara\, California\, USA. \nLatch-Up is a weekend of presentations and networking for the open source digital design community\, much like its European sister conference ORConf. \nSo save the date\, register to attend\, and we encourage you to submit a presentation or proposal if you have a project or idea on the topic to share! \n  \nQuestions? Ping the organizers via @LatchUpConf or email. \nPrevious Latch-Ups: 2019 Portland \nSubmit a talk\n\nWe encourage anybody involved in the open source semiconductor engineering space to come along and share your work or experience. Presentations slots as short as 3 minute lightning-talks and up to 30 minute talks including Q and A are available. \nSo if you’ve designed\, worked on or even just used open source IP cores and/or management systems\, verification IP\, build flows\, SoCs\, simulators\, synthesis tools\, FPGA and ASIC implementation tools\, languages and DSLs\, compilers\, or anything related we’d love to have you join us to share your experience. \nPresentations are submitted through the registration process and we will let you know if your presentation was accepted. \nRegistration\n\nAttendance of Latch-Up is free. To help us organizing the event\, you are required to register using the button below or via the EventBrite link. \nProfessional Tickets\nAttendees who are joining us at Latch-Up on behalf of their company and/or can claim the conference as professional training expense are encouraged to purchase a professional ticket. These ticket sales help us provide all that we do at Latch-Up and keep the event accessible to all members of the community. Professional ticket holders are able to get their company name printed on their name badge and receive a special treat. You can buy professional tickets using the button below or via the EventBrite link. \nWe ask all Latch-Up participants to adhere to the the FOSSi Foundation code of conduct throughout the event. \nSponsorship and Volunteering at Latch-Up\n\nLatch-Up is free to attend\, but we aim to provide catering and the like during the event. Latch-Up is also a great way to get your company or brand in front of lots of engineers and hackers on the day\, and thousands more through recordings of the event. So please get in touch if you’d like to explore sponsorship opportunities. \nLatch-Up is organized by volunteers on behalf of the FOSSi Foundation. We are currently looking for more people to help out with arrangements and putting on the event\, so please do email us if you would like to volunteer for during the event with setup\, AV\, or even just local knowledge so we can plan the weekend better. \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/latch-up-2023/ LOCATION:University of California\, Santa Barbara\, Santa Barbara\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Latch-Up-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230326T080000 DTEND;TZID=America/Los_Angeles:20230330T170000 DTSTAMP:20230228T192951Z CREATED:20230216T174553Z LAST-MODIFIED:20230228T192951Z UID:5995-1679817600-1680195600@marketingeda.com SUMMARY:IRPS 2023 DESCRIPTION:For 60 years\, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States\, Europe\, Asia\, and all other parts of the world… \n\nIRPS 2023 will be presented as an in-person conference\, with a virtual component available.\nThe IRPS 2022 virtual conference content will remain available to registered attendees through April 30th\, 2023 via the Underline platform.\nWe are happy to announce that once again the International Electrostatic Discharge Workshop (IEW) will be co-locating with IRPS this year. Their submission deadline is January 23\, 2023. For further details\, including the Call for Posters\, please visit their webpage here.\n\nKeynotes\n\n\nAnn Kelleher\, EVP and GM of Technology Development\, Intel \n\n\n\n\nGary Hicok\, Senior Vice President\, NVIDIA \n\n\nMark Fuselier\, SVP\, Technology & Product Engineering\, AMD \n\n\nRohit Vidwans\, EVP and Chief Engineering & Manufacturing Officer\, Ampere \n\n\n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/irps-2023/ LOCATION:Hyatt Regency Monterey\, 1 Old Golf Course Rd\, Monterey\, CA\, 93940\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IRPS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20230321T080000 DTEND;TZID=Europe/Berlin:20230323T170000 DTSTAMP:20230228T001650Z CREATED:20230228T001650Z LAST-MODIFIED:20230228T001650Z UID:6027-1679385600-1679590800@marketingeda.com SUMMARY:Automotive Ethernet Congress DESCRIPTION:The ninth Automotive Ethernet Congress to be held on March 21 – 23\, 2023 at the Hilton Munich Airport will look to address the following questions: Does the selected transmission technology support the transformation of the E/E architecture from hardware-based to software-centric? Does it offer the necessary flexibility and self-learning capability to be able to continuously implement new functions? Automotive Ethernet\, which supports service-oriented architectures\, embodies all these features. \nHere\, current\, and future technology and product developments will be the focus of the conference program\, exhibition\, and associated workshops. The Congress will offer you the opportunity to share and discuss new ideas around the implementation and use of Ethernet in the vehicle and in your own projects. \nAGENDA\n21 March 2023 – TSN Training\n22 March 2023 – Presentations\, Exhibition and Get together\n23 March 2023 – Presentations and Exhibition \n\nFollow us on social media #automotiveethernetcongress \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/automotive-ethernet-congress-2/ LOCATION:Hilton Munich Airport\, Terminalstraße Mitte 20\, 85356 München-Flughafen\, Munich\, Germany CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Automotive-Ethernet-Congress-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230320T080000 DTEND;TZID=America/Los_Angeles:20230323T170000 DTSTAMP:20230307T044258Z CREATED:20230307T044258Z LAST-MODIFIED:20230307T044258Z UID:6073-1679299200-1679590800@marketingeda.com SUMMARY:GOMACTech 2023 DESCRIPTION:GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \n\nDear 2023 Attendees: \nThis year’s conference is titled “Microelectronics – the Engine to Keep the US Moving Forward\,” and our robust technical program supports this theme with topics including Advanced Silicon-Based RF\, Alternative Computing Paradigms\, Counterfeit Detection and Avoidance\, GaN Power Electronics\, and much\, much more. \nThe conference kicks off on Monday\, 20 March\, with our annual Trusted Suppliers Industry Day\, created with the objective of promoting discussion among members of industry and government agencies that represent the interests of integrated-circuit and electronics producers who serve defense and aerospace applications. We have seen tremendous change since last year’s Industry Day\, not only with the enactment and funding of the CHIPS and Science Act but also with the increasing uncertainty regarding China’s intentions with Taiwan. To provide insight into these issues\, Dr. Tai Ming Cheung\, recipient of multiple DoD Minerva Research Initiative awards and director of the University of California Institute on Global Conflict and Cooperation (IGCC)\, is scheduled to deliver the keynote address on the emergence of the Chinese techno-security state. Monday also features four workshops/tutorials: Advanced GaN Modeling\, JFAC Hardware Assurance\, GEEGAH Fab Capabilities & PDK for Acoustoelectric Devices\, and AKOUSTIS Fab Capabilities & PDK for AIN/ScAIN. \nOur Monday programming will conclude with a reception on the resort’s Flamingo Lawn\, which is open to all registered attendees. Please join us! \nGOMACTech-23 formally opens on Tuesday\, 21 March\, with an outstanding morning Plenary Session that includes the keynote address “3DHI and the Coming Inflection Point in Microelectronics Manufacture” by Dr. Mark Rosker\, director of DARPA’s Microsystems Technology Office. Rosker will be followed by Ezra Hall\, senior director of Global Aerospace and Defense Business at GlobalFoundries\, whose talk is titled “Aligning Defense Microelectronics Technologies with Industry Needs: Fueling U.S. Success.” \nThe keynotes will be followed by the Jack S. Kilby Lecture Series\, with presentations from Dr. Waleed Khalil\, professor of electrical and computer engineering at Ohio State University and the ElectroScience Lab\, who will speak on “Analog Hardware Security: What We Don’t Know Will Hurt Us\,” and Krystal Puga\, Lunar Mission Architect for the Space Systems Sector at Northrop Grumman Corp.\, with the presentation\, “James Webb Space Telescope Development and Latest Discoveries.” \nThis year\, we are also hosting three panel discussions: “Chips and Science Act Impact to DoD\,” on Monday\, 20 March; “Perspectives on Computational Methods for Radiation Hardness Qualification;” on Wednesday\, 22 March; and “Sifting Through the Chaos: Are Best Practices Achievable?” on Thursday\, 23 March. \nThe plenary\, technical\, and topical sessions are the major venues for information exchange at the conference. Other opportunities for technical interaction are provided by the exhibits program\, which includes major IC manufacturers and commercial vendors of devices\, equipment\, systems\, and services for nearly every facet of the electronics business. The exhibition opens on Tuesday\, 21 March\, at noon\, and runs through Wednesday\, 22 March\, at 4:00 pm. On Tuesday evening\, all attendees can network in a relaxing atmosphere during the Exhibitors’ Reception. \nWednesday evening features the Evening Social\, held this year at the San Diego Zoo\, one of the country’s premier zoos. A buffet-style dinner will be included\, and we will have the opportunity to meet some of the animals “up close and personal.” This is a ticketed event with an attendance cap\, so if you’re planning on attending\, buy your ticket before Wednesday. \nOn Thursday morning\, 23 March\, a poster session that includes our annual student poster competition will take place. \nGOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and to provide a forum for government reviews. \nThe GOMACTech Conference is an Unclassified\, Export-Controlled event that requires participants to be U.S. Citizens or legal U.S. Permanent Residents. All registrants must provide proof of U.S. Citizenship or Permanent Resident status prior to being permitted entry into the conference. Additionally\, a signed Non-Disclosure Statement will be required. \nGOMACTech-23 provides a forum for discussing and demonstrating advanced microelectronics and microsystems that can provide the means to develop confidence in transformational\, leap-ahead technologies\, and capabilities. GOMACTech is the premier forum for reporting on government-funded microcircuit research and other research efforts that focus on the technology needs of government systems. \nThis year’s technical program is a result of the hard work and enthusiasm of the GOMACTech-23 Technical Program Committee. The committee members discussed and collaborated on the topics and presentations. The quality of the conference reflects this comprehensive team effort. We hope that you find GOMACTech-23 an enlightening\, rewarding\, and enjoyable experience. Thank you for your active participation. \n  \n\n\n\nDr. Morgan Thoma\nU.S. Army Research Laboratory\nDefense Microelectronics CFT\nGeneral Chair\nLuciano Boglione\nNaval Research Laboratory\nTechnical Program Chair\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gomactech-2023/ LOCATION:Town and Country San Diego Hotel\, 500 Hotel Circle North\, San Diego\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GOMACTech-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230314T080000 DTEND;TZID=America/Los_Angeles:20230316T170000 DTSTAMP:20230313T200643Z CREATED:20230124T193702Z LAST-MODIFIED:20230313T200643Z UID:5880-1678780800-1678986000@marketingeda.com SUMMARY:Embedded World DESCRIPTION:The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community\, including leading experts\, key players and industry associations. It offers unprecedented insight into the world of embedded systems\, from components and modules to operating systems\, hardware and software design\, M2M communication\, services\, and various issues related to complex system design. \nIts expertise and sharp focus on technologies\, processes and future-oriented products make it unparalleled in international comparisons – and THE must-attend event for developers\, system architects\, product managers and technical management. \nMain topics in 2023\n\nembedded: A variety of technological challenges shape the modern design concepts of complex embedded systems – from sensors to the cloud\, from hardware to software to tools – smart\, intelligent\, efficient\, safe\, reliable\, interoperable…\n\n\nresponsible: Evermore embedded systems are being used in function-critical applications such as medical technology\, mobility and industrial automation. The industry meets these challenges with adaptive\, autonomous and intelligent systems that safely and reliably carry out critical tasks. Many questions ranging from responsibility by design to formal verification methods and ethical issues must be answered.\nsustainable: Embedded systems are central\, basic elements for many efficient and sustainable applications. Embedded systems themselves must also be sustainable over the entire life cycle -from design and manufacturing to operation and updateability\, refurbishment\, decommissioning and disposal.\n\nSpecialty areas at the trade fair and conferences focus on current megatrends\, such as embedded vision\, safety & security\, M2M communication\, IP & IC design and embedded intelligence. \nThe embedded world Exhibition&Conference facilitates direct interaction with a large number of experts and qualified suppliers from all over the world. Whether at specialist forums\, expert panels\, the embedded world Conference or electronic displays Conference\, experts from the embedded community meet at eye-level to jointly develop ideas and concepts for the future.  The embedded world Exhibition&Conference is essential for anyone who wants to stay on top of core topics and industry trends! \nTake advantage of the opportunity to expand your knowledge and make new\, international business contacts! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/embedded-world/ LOCATION:NürnbergMesse\, Messezentrum 1\, Nurnberg\, Germany CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ew-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Phoenix:20230313T080000 DTEND;TZID=America/Phoenix:20230316T170000 DTSTAMP:20230307T194359Z CREATED:20230307T194359Z LAST-MODIFIED:20230307T194359Z UID:6087-1678694400-1678986000@marketingeda.com SUMMARY:19th International Conference & Exhibition on Device Packaging DESCRIPTION:The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills\, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16\, 2023\, at the WeKoPa Conference Center. This esteemed event brings together industry engineers\, researchers and top experts participating in a multi-faceted technical program and unique networking events. \nFull Conference registrations include:  (excludes exhibit only\, pdc only\, or visitor pass registration types) \n\n3-track program with 80+ speakers\nPoster presentations\n4 keynote speakers from Qualcomm\, Samsung\, General Motors\, and Lightmatter\nPanels covering both business and social value topics\nGBC Business plenary session: Building the Ecosystem: Transitioning from Research to Manufacturing\nSold-out exhibit hall with 66 booths\nNetworking opportunities: welcome reception\, exhibit hall reception\, poster session happy hour\, and group lunches\nPost-conference golf scramble and guided hike fund raisers\n\nFirst day add-ons: 12 Professional Development Courses\, a great learning opportunity for those new to the industry or looking to enhance their skills and knowledge. \nIn 2022\, DPC was held in person with more than 500 participants\, despite continued pandemic restrictions at that time. Given the strength of the technical program and exhibition this year\, it is anticipated that the 2023 DPC will welcome a record number of participants! \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/19th-international-conference-exhibition-on-device-packaging/ LOCATION:We-Ko-Pa Resort & Conference Center\, 10438 Wekopa Way\, Fort McDowell\, AZ\, 85264\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Device-Packaging-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230313T080000 DTEND;TZID=America/Los_Angeles:20230316T170000 DTSTAMP:20230215T013724Z CREATED:20230215T013724Z LAST-MODIFIED:20230215T013724Z UID:5973-1678694400-1678986000@marketingeda.com SUMMARY:19th Annual Device Packaging Conference (DPC 2023) DESCRIPTION:The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills\, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16\, 2023\, at the WeKoPa Conference Center. This esteemed event brings together industry engineers\, researchers and top experts participating in a multi-faceted technical program and unique networking events. \nFull Conference registrations include:  (excludes exhibit only\, pdc only\, or visitor pass registration types) \n\n3-track program with 80+ speakers\nPoster presentations\n4 keynote speakers from Qualcomm\, Samsung\, General Motors\, and Lightmatter\nPanels covering both business and social value topics\nGBC Business plenary session: Building the Ecosystem: Transitioning from Research to Manufacturing\nSold-out exhibit hall with 66 booths\nNetworking opportunities: welcome reception\, exhibit hall reception\, poster session happy hour\, and group lunches\nPost-conference golf scramble and guided hike fund raisers\n\nFirst day add-ons: 12 Professional Development Courses\, a great learning opportunity for those new to the industry or looking to enhance their skills and knowledge. \nIn 2022\, DPC was held in person with more than 500 participants\, despite continued pandemic restrictions at that time. Given the strength of the technical program and exhibition this year\, it is anticipated that the 2023 DPC will welcome a record number of participants! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/19th-annual-device-packaging-conference-dpc-2023/ LOCATION:WeKoPa Conference Center\, 10438 WeKoPa Way\, Fort McDowell\, AZ\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IMAPS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Karachi:20230311T080000 DTEND;TZID=Asia/Karachi:20230311T180000 DTSTAMP:20230307T183152Z CREATED:20230307T183152Z LAST-MODIFIED:20230307T183152Z UID:6082-1678521600-1678557600@marketingeda.com SUMMARY:MumbaiFOSS DESCRIPTION:MumbaiFOSS is a conference which aims to bring software developers\, communities\, policy makers and enthusiasts together\, so we can learn and inspire each other. This event is happening in collaboration with FOSSEE\, IIT Bombay. \nAgenda for MumbaiFOSS\n\nFOSS Product Showcase\nDeep Dive of Issues and Trends in Open Source\nInteract with the larger FOSS Community in India\nSustaining FOSS\nFOSS Policy\n\nAbout FOSS United Foundation\nFOSS United is a non-profit foundation that aims at promoting and strengthening the Free and Open Source Software ecosystem in India. \nFor queries or suggestions\, mail to mumbai@fossunited.org \nWant to Sponsor MumbaiFOSS?\nTo Sponsors MumbaiFOSS\, check out this deck. \nProposed by: Sumanto Kar and Nagesh Karmali \neSim developed by FOSSEE\n\nI would be talking about the open-source software eSim developed by FOSSEE\, IIT Bombay. It is an Electronic Design Automation(EDA) tool capable of mixed-signal simulation. I would be talking about the features and benefits of using this tool. I will also be talking about the activities under the eSim. \n\nSource code/Reference: https://esim.fossee.in/ \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/mumbaifoss/ LOCATION:IIT Bombay\, Powaj\, Maharashtra\, Bombay\, India CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/MumbaiFOSS.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230227T080000 DTEND;TZID=America/Los_Angeles:20230302T170000 DTSTAMP:20230228T000703Z CREATED:20230227T175620Z LAST-MODIFIED:20230228T000703Z UID:6024-1677484800-1677776400@marketingeda.com SUMMARY:Mobile World Conference\, MWC 2023 DESCRIPTION:MWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator\, device manufacturer\, technology provider\, vendor\, content owner\, or are simply interested in the future of tech\, you need to be here. \nWhy? Because it’s the one time of year where everyone who’s anyone comes together under one roof. Tens of thousands of senior executives from the top global companies\, international governments and trailblazing tech businesses converge at MWC Barcelona to make decisions. \n  \n\nThought leaders become change-makers\nNew ideas turn into business deals\nAnd networking means remarkable connections\n\nIt’s the place to find out where the industry\, your business and your career are headed. Miss out on MWC Barcelona\, miss out on the next 12 months. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/mobile-world-conference-mwc-2023/ LOCATION:Fira Gran Via\, 08038\, Barcelona\, Spain CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/MWC-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230227T080000 DTEND;TZID=America/Los_Angeles:20230302T170000 DTSTAMP:20230208T183552Z CREATED:20220720T162103Z LAST-MODIFIED:20230208T183552Z UID:4939-1677484800-1677776400@marketingeda.com SUMMARY:DVCon U.S. 2023 DESCRIPTION:The 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.)\, sponsored by Accellera Systems Initiative\, announces its call for extended abstract proposals. The submission site for extended abstracts will be open from July 11 through August 8\, 2022. DVCon U.S. 2023 will be held February 27-March 2\, 2023\, at the Doubletree Hotel in San Jose\, California. \nThe 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.)\, sponsored by Accellera Systems Initiative\, announced today that Dirk Didascalou\, Chief Technology Officer\, Siemens Digital Industries\, will be the keynote speaker for this year’s conference. \nMr. Didascalou will present\, “What Do Farming\, Steel\, and Space Have in Common?” on Tuesday\, February 28 from 1:30-2:30pm in the Oak/Fir Ballroom. With examples from Space Perspective\, 80 Acres Farms and others\, Mr. Didascalou will discuss how the new wave of digitalization is driving huge transformations and can be an inspiration for every industry. \n\nMore conference highlights: \n\n\nAccellera-sponsored lunch on Monday\, February 27 featuring Bob Smith\, Executive Director\, SEMI ESD Alliance\, presenting “The CHIPS Act and Its Impact on the Design & Verification Markets.”\n\n\nPoster Ninja Warrior session on Wednesday\, March 1 includes four posters battling it out for top honors. Posters will be judged on a variety of factors\, including audience reaction.\nTwo panels will be offered on Wednesday\, March 1:\n\n“Systems are Evolving. Is Verification Keeping Up?” will be moderated by Bernard Murphy\, SemiWiki. Panelists will discuss areas where they would like to see breakthroughs and ideas and research that they would like to see explored further.\n“AI-ML Algorithms are Transforming Verification: Separating Hype from Reality\,” will focus on the state of the art of design verification environments that power the new generation of advanced processors. Panelists will discuss systems which could potentially change the semiconductor landscape.\n\n\nAccellera-sponsored lunch on Wednesday\, March 1 “RISC-V Everywhere\,” presented by Mark Himelstein\, CTO RISC-V International.\n\nIn addition to the two panels and keynote\, including the Accellera-sponsored sessions\, there will be 41 paper presentations\, 17 poster sessions\, four tutorials and 16 workshops throughout the four-day program. \nRegistration is open. Registration for the keynote\, panels and exhibits is free. \n\nFor the latest updates regarding the conference and expo\, please visit the website. \n\nAbout DVCon \nDVCon is the premier conference for discussion of the functional design and verification of electronic systems. DVCon is sponsored by Accellera Systems Initiative\, an independent\, not-for-profit organization dedicated to creating design and verification standards required by systems\, semiconductor\, intellectual property (IP) and electronic design automation (EDA) companies. For more information about Accellera\, please visit www.accellera.org. For more information about DVCon U.S.\, please visit here. Follow DVCon on Facebook\, LinkedIn or @dvcon_us on Twitter or to comment\, please use #dvcon_us. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-u-s-2023/ LOCATION:DoubleTree Hotel\, 2050 Gateway Place\, San Jose\, CA\, 95110\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/DVCon-2023.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230219T080000 DTEND;TZID=America/Los_Angeles:20230223T170000 DTSTAMP:20221128T190714Z CREATED:20221128T190714Z LAST-MODIFIED:20221128T190714Z UID:5472-1676793600-1677171600@marketingeda.com SUMMARY:ISSCC 2023 DESCRIPTION:ISSCC 2023 is planned as a fully in-person event. On-demand access to ISSCC papers and educational material will be possible for people who cannot travel to San Francisco\, but the conference will be optimized for an in-person experience. We keep monitoring the COVID-19 pandemic and we will promptly inform you should any change in our program be needed. Looking forward to seeing you again in San Francisco! \nEugenio Cantatore – Conference Chair \nPiet Wambacq – Program Committee Chair \n\n\n2023 Plenary Sessions\n\n\n\n\n\n\nInnovation for the Next Decade of High-Performance Computing \nLisa Su\, Chair and Chief Executive Officer\, AMD\, Austin\, Texas \nShape the World with Mixed-Signal Integrated Circuits – Past\, Present\, and Future \nAkira Matsuzawa\, Professor Emeritus of Tokyo Institute of Technology and CEO of Tech Idea\, Kawasaki\, Japan \nEU Chips Act drives pan-European full-stack innovation partnerships \nJo De Boeck\, Executive Vice President and Chief Strategy Officer\, imec and KU Leuven\, Leuven\, Belgium \n5G drives exponential increase in processing needs across all industries \nErik Ekudden\, Senior Vice President\, Chief Technology Officer\, Ericsson\, Kista\, Sweden \n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isscc-2023/ LOCATION:Marriott Marquis\, 780 Mission Street\, San Francisco\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISSCC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230131T080000 DTEND;TZID=America/Los_Angeles:20230202T170000 DTSTAMP:20221228T190236Z CREATED:20221228T190236Z LAST-MODIFIED:20221228T190236Z UID:5820-1675152000-1675357200@marketingeda.com SUMMARY:DesignCon 2023 DESCRIPTION:DesignCon is the premier high-speed communications and system design conference and exposition\, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. \nThree days of education\, exhibits\, and networking – technical paper sessions\, tutorials\, industry panels\, product demos\, expo hall and social functions. \nJoin fellow engineers at DesignCon and cover all aspects of electronic design. \nAttend the expertly curated\, 14-track conference created by engineers for engineers\, browse exhibits with hundreds of new products and technologies\, and network with high-caliber industry professionals over the three-day event. \nDesignCon’s “Engineer of the Year” Award is given out each year during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip\, board\, or system level. \nThe award winner is selected based on his or her leadership\, creativity\, and out-of-the-box thinking brought to design/test of chips\, boards\, or systems\, with particular attention paid to areas of signal and power integrity. Nominations for the 2023 Engineer of the Year Award are now open. Please submit your nomination/s for this prestigious award before December 20\, 2022. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/designcon-2023/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DesignCon-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230124T080000 DTEND;TZID=America/Los_Angeles:20230126T170000 DTSTAMP:20230119T004257Z CREATED:20221004T200927Z LAST-MODIFIED:20230119T004257Z UID:5258-1674547200-1674752400@marketingeda.com SUMMARY:Chiplet Summit DESCRIPTION:The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. \nThey’ll get the scoop on ways to make their chiplets run faster\, scale better\, use less power\, and be more flexible. \nThis unique event gives attendees a place to network with peers\, ask questions of the experts\, and talk to vendors offering a wide variety of products and services. \n“Chiplets are expected to return to the two-year doubling cycle that has been the cornerstone economics of the semiconductor business since 1965.”\n– John Blyler\, Design News\, September 2021 \nThought-Provoking Panels Where Attendees Can Ask Questions of Leading Experts: \n\nChoosing the Right Architecture for Your Application\nNext Great Breakthrough in Chiplets\nBest Development Platform for Chiplets\nBest Interface for Chiplets\nWhat Standards Are Needed?\nOptimizing Chiplets\n\n  \nATTENDEES \nEngineers and managers who are looking for ways to help meet performance challenges\, handle the move to smaller dimensions\, provide the modularity and scalability today’s chips require\, and develop solutions focused on the latest applications and interfaces.  Designers of enterprise networks\, telecom systems\, high-performance computing\, financial systems\, IoT\, and mil/aero applications all know that chiplets will play a big role in their future. \nBACKGROUND \nChiplets improve chip yields and costs\, but still provide the performance of a large monolithic chip.  Designers can mix-and-match chiplets\, use the process technologies best suited to particular functions\, take advantage of chiplet IP\, simplify moves to new process nodes\,  and avoid wafer waste and manufacturing defects.  Chiplets are the key to producing the extremely high-density\, high-performance chips required for today’s networking\, storage\, AI/ML\, analytics\, media processing\, HPC\, and virtual reality applications. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chiplet-summit/ LOCATION:DoubleTree Hotel\, 2050 Gateway Place\, San Jose\, CA\, 95110\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Chiplet-Summit-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20230116T080000 DTEND;TZID=Asia/Tokyo:20230119T170000 DTSTAMP:20230104T174652Z CREATED:20230104T174652Z LAST-MODIFIED:20230104T174652Z UID:5828-1673856000-1674147600@marketingeda.com SUMMARY:ASP-DAC 2023 DESCRIPTION:ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2023 is 28th conference. ASP-DAC 2023 offers you an ideal opportunity to touch the recent technologies and the future directions on the LSI design and design automation areas by technical papers and tutorials. ASP-DAC also holds Designers’ Forum to make presentations about the latest designs for designers. Please do not miss ASP-DAC 2023. \n\nDate: Jan. 16-19\, 2023\nPlace: Tokyo Odaiba Miraikan\, Japan\nGeneral Chair: Atsushi Takahashi (Tokyo Institute of Technology\, Japan)\nTechnical Program Chair: Gi-Joon Nam (IBM Research\, USA)\nDesign Contest Co-Chairs: Mahfuzul Islam (Kyoto University\, Japan)\, Akira Tsuchiya (The University of Shiga Prefecture\, Japan)\n\nThe format of the conference is hybrid but mainly in-person for speakers. All speakers are expected to attend ASP-DAC 2023 physically unless a speaker has some inevitable reasons such as medical reasons and government orders.\nRestrictions on new entry into Japan due to COVID-19 have been relaxed since October 11\, 2022. Please check the following announcement from the Ministry of Foreign Affairs of Japan.\nhttps://www.mofa.go.jp/j_info/visit/visa/index.html \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/asp-dac-2023/ LOCATION:Tokyo Odaiba Miraikan\, 2 Chome-3-6 Aomi\, Tokyo\, Koto CIty\, 135-0064\, Japan CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ASP-DAC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20230116T080000 DTEND;TZID=Europe/Paris:20230118T170000 DTSTAMP:20230113T205251Z CREATED:20230113T205251Z LAST-MODIFIED:20230113T205251Z UID:5845-1673856000-1674061200@marketingeda.com SUMMARY:HiPEAC DESCRIPTION:The HiPEAC conference is the premier European forum for experts in computer architecture\, programming models\, compilers and operating systems for general-purpose\, embedded and cyber-physical systems. Areas of focus and integration include safety-critical dependencies\, cybersecurity\, energy efficiency and machine learning. \nThe HiPEAC 2023 conference will take place in Toulouse\, France. Associated workshops\, tutorials\, special sessions\, several large poster session and an industrial exhibition will run in parallel with the conference. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/hipeac/ LOCATION:Pierre Baudis Convention Centre\, 11 esplanade Compans Caffarelli\, Toulouse\, France CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/HiPEAC.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Karachi:20230108T080000 DTEND;TZID=Asia/Karachi:20230112T170000 DTSTAMP:20221122T174938Z CREATED:20221122T174938Z LAST-MODIFIED:20221122T174938Z UID:5464-1673164800-1673542800@marketingeda.com SUMMARY:VLSID 2023 DESCRIPTION:International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems\, is attended by over 2000 engineers\, students & faculty\, industry\, academia\, researchers\, bureaucrats and government bodies. \nSemiconductors are the intangible backbone of every industry across the globe. Silicon took the lion’s share over the past decades and remained the primary enabler for digitization of the world. With scaling reaching its fundamental limits\, it is time to look at addressing technological challenges at higher levels of abstraction in CMOS based design and at the same time\, look beyond Silicon for further performance enhancement. \nVLSID 2023 – the first physical conference post pandemic\, acts a platform for industry and academia alike to discuss\, deliberate and explore into the frontiers of semiconductor eco-system that could eventually enable disruptive technologies for global digitalization \nVLSID 2023 will be hosted in the best stand-alone convention center\, HICC Hyderabad. The city is home to some of the best universities\, top global companies in research and manufacturing\, strong defense sector and thriving start-ups. Hyderabad has a rich culture with numerous historic places to visit and world famous Hyderabad Biryani to cherish. We look forward to hosting and giving you the best experience at the conference. We encourage your participation to the conference and call you to be part of the exciting know-how’s of the industry and spend quality time exploring Hyderabad. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/vlsid-2023/ LOCATION:Hyderabad International Convention Cente\, Hyderabad\, Telangana\, India CATEGORIES:Conference,EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/VLSID-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230105T080000 DTEND;TZID=America/Los_Angeles:20230108T170000 DTSTAMP:20221129T173505Z CREATED:20221027T192513Z LAST-MODIFIED:20221129T173505Z UID:5345-1672905600-1673197200@marketingeda.com SUMMARY:CES 2023 DESCRIPTION:CES® is the most influential tech event in the world — the proving ground for breakthrough technologies and global innovators. \nThis is where the world’s biggest brands do business and meet new partners\, and the sharpest innovators hit the stage. Owned and produced by the Consumer Technology Association (CTA)®\, CES features every aspect of the tech sector. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ces-2023/ LOCATION:Las Vegas Covention and World Trade Center\, 3150 Paradise Rd\, Las Vegas\, NV\, 89109\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ces-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Hong_Kong:20221226T080000 DTEND;TZID=Asia/Hong_Kong:20221227T170000 DTSTAMP:20221220T184858Z CREATED:20221220T184858Z LAST-MODIFIED:20221220T184858Z UID:5582-1672041600-1672160400@marketingeda.com SUMMARY:CSIA-ICCAD 2022 DESCRIPTION:As a strategic\, basic and leading industry in national economic and social development\, integrated circuit(IC) industry is an important support for cultivating strategic emerging industries and developing information economy\, and plays an important role in the core of information technology field.  Promoting the healthy development of IC industry is the only way to realize the autonomous control of core technology.  With the independent innovation and development of China’s IC industry\, its market scale and enterprise competitiveness continue to improve\, China has become the world’s largest and fastest growing IC market.  At present\, the global IC industry has entered a major period of transformation and reform. As the industry leader and an important link of technology and product innovation\, the IC design industry bears an important responsibility in the development of the industry\, and is also the key to achieve independent control of the semiconductor industry. \nDuring the development of China’s IC design industry\, CSIA – ICCAD Annual Conference has played an important role in promoting industry cluster\, linking industrial resources\, and keeping abreast of industry trends. Over the years\, the theme of the Annual Conference has been combined with the actual development of the electronic information industry in the host city of the conference. The Conference has promoted the simultaneous development of the related industries in the host cities and the national IC industry. Therefore\, the “CSIA – ICCAD 2022 Annual Conference & Guangzhou IC Industry Innovation and Development Summit (ICCAD 2022)” is planned to be held in Guangzhou from November 9 to 10\, 2022. \nThe theme of this year’s conference is “Bay Area has you\, core to the future”. The Conference will discuss the opportunities and challenges faced by the IC industry\, especially the IC design industry\, and enhance the innovation capability and the integration capability of China’s IC industry chain to meet market demands and improve international competitiveness. The conference will create a platform for communication and cooperation for enterprises in all aspects of the IC industry chain\, and a platform for communication and cooperation in technology\, market\, application\, investment and other fields for IC design enterprises. \nThe related matters of this annual conference are hereby notified as follows: \n\nGuidanced by:\n\n  Industry and Information Technology Department of Guangdong \nThe People’s Government of Guangzhou Municipality \nChina Semiconductor Industry Association \n\nHosted by:\n\nChina Semiconductor Industry Association IC Design Branch (CSIA – ICCAD) \nNational S&T Major Project(NMP) 01 General Expert Group \nChina Integrated Circuit Design Innovative Alliance \nIII. Supported by: \n     The People’s Government of Guangzhou Huangpu District \nGuangzhou Municipal Industry and Information Technology Bureau \n\nOrganizedby:\n\n     Guangzhou Huangpu District Industry and Information Bureau \nGuangdong Integrated Circuit Industry Association \nShanghai Xinmei Conference Service Co.\, Ltd. \nShanghai Yaxun Shangwu Zixun Co.\, Ltd. \nV.Co-organized by: \nChina Institute of Communications-ASIC Committee \nChina Integrated Circuit(CIC) \nVI.Registration Date: November 8\, 2022 (Tuesday) \nConference Date: November 9-10\, 2022 \nVII. Registration Location: The Westin Pazhou Guangzhou \n (Address: No. 681\, Fengpuzhong Road\, Haizhu District\, Guangzhou) \nConference Location: Guangzhou PWTC Expo \n (Address: No.1000\, Xingangdong Road\, Haizhu District\, Guangzhou) \nVIII. Conference Content \n\nKeynote Speeches\n\n(1) China IC Design Industry Current Development Situation Report \n(2) Coordinate Science & Technology Resources to Realize Innovation Development Report \n(3) Global IC Technology and Industry Development Trend Report \n\nSeminars\n\nl  IC Design and Innovation Application \nl  IC Design and EDA Software \nl  Foundry and Process Technology \nl  IC Packaging and Testing \nl  IP and IC Design Services \nl  Capital and Entrepreneurship \nl  Guangzhou IC Innovation and Entrepreneurship Forum \n\nChina IC Design Industry Exhibition\nIX. Participants\n\nThe relevant authorities and local leaders\, relevant domestic and foreign experts\, representatives from local bases and industry associations\, IC design companies\, IP service vendors\, EDA vendors\, foundry companies\, packaging testing vendors\, system vendors and venture capital firms at home and abroad\, representatives from IC industries Parks and related media. \n\n Contacts\n\nContact:Shirley Hu \nTel: 18917192814\, E-mail: shirleyhp@cicmag.com \nContact:Yuanyuan Wang \nTel:18600095161\, E-mail: wangyy@csia-iccad.net.cn \n\nThe organizers of the annual conference are required to conscientiously and carefully organize and prepare for the conference and ensure a complete success. \nAnnex: Registration Form \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/csia-iccad-2022/ LOCATION:Xiamen International Convention Center\, 198 Exhibition Road\, Xiamen City\, China CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CSIA-ICCAD-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221215T080000 DTEND;TZID=America/Los_Angeles:20221215T170000 DTSTAMP:20221130T191032Z CREATED:20221130T191032Z LAST-MODIFIED:20221130T191032Z UID:5487-1671091200-1671123600@marketingeda.com SUMMARY:CHIPS Alliance\, Fall Technology Update DESCRIPTION:Join us in-person for our second biannual technology update featuring informative\, technical talks on open source hardware collaborative development\, hosted by Google and including speakers from Microsoft\, Google\, Intel\, Antmicro\, Efabless and others. \nCHIPS’ Thursday event follows the main RISC-V Summit days (Tuesday-Wednesday) to allow easy participation for open source hardware professionals traveling to the Bay Area for the Summit\, and is free to attend (registration required). \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chips-alliance-fall-technology-update/ LOCATION:CA CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CHIPS-Alliance-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20221214T080000 DTEND;TZID=Asia/Tokyo:20221216T170000 DTSTAMP:20221122T173702Z CREATED:20221122T173702Z LAST-MODIFIED:20221122T173702Z UID:5460-1671004800-1671210000@marketingeda.com SUMMARY:SEMICON Japan + Advanced Packaging and Chiplet Summit DESCRIPTION:SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights\, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently\, bringing together top players in the semiconductor packaging and PCB mounting fields \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semicon-japan-advanced-packaging-and-chiplet-summit/ LOCATION:Tokyo Big Sight\, 3 Choe-11-1 Ariake\, Tokyo\, Japan CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMICON-Japan-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221213T080000 DTEND;TZID=America/Los_Angeles:20221214T170000 DTSTAMP:20221202T202132Z CREATED:20220926T163457Z LAST-MODIFIED:20221202T202132Z UID:5232-1670918400-1671037200@marketingeda.com SUMMARY:RISC-V Summit DESCRIPTION:Each day\, thousands of engineers around the world collaborate and contribute to advance the most prolific open\, license and royalty-free computing architecture. They share technical investment and help shape the architecture’s strategic future so everyone may create more rapidly\, enjoy unprecedented design freedom\, and substantially reduce the cost of innovation. Anyone\, anywhere can benefit from the open intellectual property contributed by RISC-V. \nThis December\, the RISC-V community – including the technical\, industry\, domain and special interest groups who define the architecture’s specifications – will be in San Jose\, California for four days of technology breakthroughs\, industry milestones\, tutorials\, and relationship building.  \n\n\n\n\nIt all kicks off with a RISC-V Member Day where technical and industry working groups meet in person\, running alongside a new RISC-V FutureWatch track featuring breaking news of products\, technologies\, ecosystem expansion\, and more.\nThen it’s the centerpiece of the week: Our Summit featuring two days of compelling technical and industry keynotes and conference sessions\, paired with a showfloor of the latest community innovations.\nThe week wraps up with a full day of information-rich tutorials.\n\n\n\n\nThe community-curated content you’ll experience is unparalleled. \nAutomotive. High-performance Computing. Data Centers. ML and AI. Security. Software Stacks. Development Tools. Systems on a Chip. It’s all here. And it’s all new. \nBreak new ground. Define the future. Grow your network. Build your expertise. Meet your heroes. It’s all during RISC-V Summit North America\, this December in San Jose. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/risc-v-summit/ LOCATION:San Jose Convention Center\, 150 W San Carlos Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/RISC-V-Summit.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221212T080000 DTEND;TZID=America/Los_Angeles:20221214T170000 DTSTAMP:20221209T182019Z CREATED:20221209T182019Z LAST-MODIFIED:20221209T182019Z UID:5494-1670832000-1671037200@marketingeda.com SUMMARY:IEEE - Electrical Design of Advanced Packaging and Systems (EDAPS) DESCRIPTION:The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium\, a flagship event in the Asia-Pacific region\, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip\, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling\, design and simulation\, fabrication and characterization. This symposium consists of technical paper presentation\, poster sessions\, industry exhibits\, workshops and tutorials. \nEDAPS is sponsored by the IEEE Electronic Packaging Society. \nEDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop\, to be held during December 12-14 in virtual mode. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-electrical-design-of-advanced-packaging-and-systems-edaps/ LOCATION:CA CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/EDAPS-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221206T080000 DTEND;TZID=Europe/Berlin:20221207T170000 DTSTAMP:20220831T201520Z CREATED:20220330T163331Z LAST-MODIFIED:20220831T201520Z UID:4479-1670313600-1670432400@marketingeda.com SUMMARY:DVCon Europe 2022 DESCRIPTION:The Design and Verification Conference & Exhibition Europe (DVCon Europe) is the premier European technical conference on system\, software\, design\, verification\, validation or integration. It is a place where the latest methodologies and technologies for the industrial use of tools\, languages\, and standards for integrated and embedded systems and products are shared and discussed. \nThe conference covers the application of standards\, methodologies\, and flows for system-level\, hardware and software design\, verification\, validation\, design automation and IP reuse. \nIndustry applications of interest include (but not limited to) automotive\, mobile communication\, aerospace\, healthcare\, chip-cards\, consumer and power electronics. DVCon Europe solicits submissions related to advanced design and verification on special interest areas such as Digital Twin\, Machine Learning\, Internet-of-things\, Functional safety and security\, AI\, ADAS and digitalization. \nDVCon Europe 2022 accepts submissions of papers\, tutorials and panels with highly technical content reflecting real life experiences. \nSystemC Evolution Day 2022\nThe seventh SystemC Evolution Day was a full-day\, technical workshop on the evolution of SystemC standards to advance the SystemC ecosystem. In several in-depth sessions\, selected current and future standardization topics around SystemC were discussed in order to accelerate their progress for inclusion in Accellera/IEEE standards. \nSystemC Evolution Day is intended as a lean\, user-centric\, hands-on forum bringing together experts from the SystemC user community and the Accellera Working Groups to advance SystemC standards. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-europe-2022/ LOCATION:Holiday Inn Munich – City Centre\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:Conference ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/DVCon-Europe-December-6-7-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221205T080000 DTEND;TZID=Europe/Berlin:20221205T203000 DTSTAMP:20221116T201152Z CREATED:20221116T201152Z LAST-MODIFIED:20221116T201152Z UID:5407-1670227200-1670272200@marketingeda.com SUMMARY:The 26262 Club - Technical Conference DESCRIPTION:MEET US AT THE 26262 CLUB TECHNICAL CONFERENCE THIS COMING DECEMBER 5\, 2022\nIn this edition\, the 26262 club continues the discussion on the anticipated third edition and the emerging role of ISO 26262 within the evolving standards ecosystem. We bring on stage key global players from WG8 alongside authors of the most prominent upcoming standards and share must-have insights from the global standardisation community. Goal of the day is to facilitate collaboration and open discussion between different groups and practitioners and present applicable case studies and lessons learnt to take back with you. \nWHO WILL YOU MEET\nThe expert speaker line up includes 20 international experts from the ISO 26262 WGs and international members of Germany\, UK\, France\, Italy\, Austria\, USA – together we welcome experts from WGs of SOTIF\, IEEE\, Accellera\, ISO 21434 among other. Presenting companies include OEMS\, Tier 1s\, Semiconductor and notable solution providers. Meet our expert speaker panel here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/the-26262-club-technical-conference/ LOCATION:Holiday Inn Munich – City Centre\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/The-26262-Club.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221203T080000 DTEND;TZID=America/Los_Angeles:20221207T170000 DTSTAMP:20220726T171440Z CREATED:20220726T171440Z LAST-MODIFIED:20220726T171440Z UID:4962-1670054400-1670432400@marketingeda.com SUMMARY:IEDM DESCRIPTION:EEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology\, design\, manufacturing\, physics\, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology\, advanced memory\, displays\, sensors\, MEMS devices\, novel quantum and nano-scale devices and phenomenology\, optoelectronics\, devices for power and energy harvesting\, high-speed devices\, as well as process technology and device modeling and simulation. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/iedm/ LOCATION:Moscone Center\, 747 Howard Street\, San Francisco\, CA\, 94103\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEDM-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20221130T080000 DTEND;TZID=Europe/Paris:20221201T170000 DTSTAMP:20221026T174926Z CREATED:20221026T174926Z LAST-MODIFIED:20221026T174926Z UID:5338-1669795200-1669914000@marketingeda.com SUMMARY:IP-SoC Conference 2022 DESCRIPTION:IP-SoC 2022 will be the 25th edition of the working conference fully dedicated to IP (Silicon Intellectual Property) and IP based electronic systems. \nThe event is the annual opportunity for IP providers and IP consumers to share information about technology trends\, innovative IP SoC products\, Breaking IP/SoC News\, Market evolution and more. \nThe Grenoble event is a special event as it is also the annual IP Think Tank meeting where high level executives\, market analyzer and technical experts in all the design track from Foundry\, technology\, design methodology\, EDA tools share their vision about the future of the IP concept. It will be the right time to analyze the fast evolution and consolidation in the IP market and IP business. \nAnd over all you cannot miss The wine Tasting Party and special banquet for D&R 25th Anniversary !! \nExhibition tables and “discussion panels” will favor vendor and customer meetings. \nAny question? Please contact us \nTentative Program \nDay 1 – November 30th\, 2022 \nWelcome \n\nAfter 25 years what’s new\, Design And Reuse\nThe processor revolution is brewing – it won’t be like the past 25 years!\, Codasip GmbH\nSustainability of the electronic industry : A major challenge and a mine of innovation\, STMicroelectronics\n\nSOI the “European Green Touch” \n\nCHIPS ACT: How Europe wakes-up\, Soitec\nFDSOI the EU technology for a green transition\, Soitec\nOCEAN12 IP Factory: From Research to Silicon\, Fraunhofer-Gesellschaft\nBEYOND5 – Low power 5G access point\, ASYGN\nBEYOND5 – Car Interior Radar for Advanced Life-Signs Detection\, Silicon Radar GmbH\n\nAutomotive Solution \n\nSecuring next generation semiconductors for Automotive\, Rambus\, Inc.\nCAN ALL – secure & comprehensive solution (not only) for automotive\, Digital Core Design\nAutomotive-Grade IP for Next-Generation Zonal Architectures\, Synopsys\, Inc.\n\nVideo & Imaging & Artificial Intelligence \n\nLeveraging MIPI DSI-2 & MIPI CSI-2 Low-Power Display and Camera FPGA-based Subsystems\, Mixel\, Inc.\nUltra-compact image compression IP core for saving on chip SRAM\, Lemur-Imaging Ltd.\nnearbAI: scalable neural network inference for ASICs in XR devices\, easics NV\n\nRISC-V \n\nRISC-V and Functional Safety\, Andes Technology Corp.\nRISC-V in Space\, CAES Gaisler\nIncreasing commercial adoption of RISC-V\, Cadence Design Systems\, Inc.\nRISC-V processor IP product line\, CloudBEAR\n\nSecurity Solution \n\nSecure your designs with world-class security IP\, Crypto Quantique\nRAID System Based on Reed Solomon Code Galois Field\, Secantec\, Inc.\nPost-Quantum Cryptography: Theory to Accelerated Practice\, Synopsys\, Inc.\nBuilding a Root of Trust with SRAM PUF and tRoot HSM\, Intrinsic ID\nThe importance of security lifecycle management\, Secure-IC\n\nDay 2 – December 1st\, 2022 \nChiplet and Die-to-Die Interface \n\nChiplet and Die-to-Die Interface Interoperability – how to accelerate path to a real Open Ecosystem\, Alphawave IP\, Inc.\nStrength of UCIe for Multi-Die Systems\, Synopsys\, Inc.\n\nLow Power / Low Energy Design \n\nDemocratizing Energy Friendly Ambient Computing\, Dolphin Design\nLowering the power consumption of voice-controlled IoT devices\, Phonemic\n\nMemory and Analog IP \n\nHow Embedded Non-Volatile Memory IP Can be a Differentiator\, Weebit Nano\nAnalog IP\, the way you want it\, Agile Analog\nAll you need is an Electrical Rule Checker !\, Aniah\nFDSOI High speed\, low power hybrid ADC’s for Communications\, AI\, and Automotive applications\, Alphacore\, Inc.\n\nEthernet IP \n\nDeterministic transmission of time critical information with TSN Ethernet (Time Sensitive Network)\, Comcores\nAddressing performance challenges of TCP/IP stack implementations\, CAST\, Inc.\n\nIP based SoC Design \n\nUnified methodology for SoC design assembly including logic\, power and timing constraints\, Defacto Technologies\nTackling ROIC SoC Design Reuse challenges with AMALIA platform\, Thalia Design Automation\nEssential IP for the Enablement of Silicon Lifecycle Management\, Synopsys\, Inc.\nProgrammable logic for ASIC/SoC without pain\, Menta\n\nAnd more to come… \nClick here to register >> \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ip-soc-conference-2022/ LOCATION:Hotel Europole\, 29 rue Pierre-Sémard\, Grenoble\, France CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IP-SOC-2022.jpg END:VEVENT END:VCALENDAR