BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20210314T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20211107T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 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TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Jerusalem BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20210326T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20211030T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20220325T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20221029T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20230324T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20231028T230000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20210314T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20211107T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20220313T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20221106T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20230312T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20231105T070000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Pacific/Honolulu BEGIN:STANDARD TZOFFSETFROM:-1000 TZOFFSETTO:-1000 TZNAME:HST DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Indian/Maldives BEGIN:STANDARD TZOFFSETFROM:+0500 TZOFFSETTO:+0500 TZNAME:+05 DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230227T080000 DTEND;TZID=America/Los_Angeles:20230302T170000 DTSTAMP:20230228T000703Z CREATED:20230227T175620Z LAST-MODIFIED:20230228T000703Z UID:6024-1677484800-1677776400@marketingeda.com SUMMARY:Mobile World Conference\, MWC 2023 DESCRIPTION:MWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator\, device manufacturer\, technology provider\, vendor\, content owner\, or are simply interested in the future of tech\, you need to be here. \nWhy? Because it’s the one time of year where everyone who’s anyone comes together under one roof. Tens of thousands of senior executives from the top global companies\, international governments and trailblazing tech businesses converge at MWC Barcelona to make decisions. \n  \n\nThought leaders become change-makers\nNew ideas turn into business deals\nAnd networking means remarkable connections\n\nIt’s the place to find out where the industry\, your business and your career are headed. Miss out on MWC Barcelona\, miss out on the next 12 months. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/mobile-world-conference-mwc-2023/ LOCATION:Fira Gran Via\, 08038\, Barcelona\, Spain CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/MWC-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230227T080000 DTEND;TZID=America/Los_Angeles:20230302T170000 DTSTAMP:20230208T183552Z CREATED:20220720T162103Z LAST-MODIFIED:20230208T183552Z UID:4939-1677484800-1677776400@marketingeda.com SUMMARY:DVCon U.S. 2023 DESCRIPTION:The 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.)\, sponsored by Accellera Systems Initiative\, announces its call for extended abstract proposals. The submission site for extended abstracts will be open from July 11 through August 8\, 2022. DVCon U.S. 2023 will be held February 27-March 2\, 2023\, at the Doubletree Hotel in San Jose\, California. \nThe 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.)\, sponsored by Accellera Systems Initiative\, announced today that Dirk Didascalou\, Chief Technology Officer\, Siemens Digital Industries\, will be the keynote speaker for this year’s conference. \nMr. Didascalou will present\, “What Do Farming\, Steel\, and Space Have in Common?” on Tuesday\, February 28 from 1:30-2:30pm in the Oak/Fir Ballroom. With examples from Space Perspective\, 80 Acres Farms and others\, Mr. Didascalou will discuss how the new wave of digitalization is driving huge transformations and can be an inspiration for every industry. \n\nMore conference highlights: \n\n\nAccellera-sponsored lunch on Monday\, February 27 featuring Bob Smith\, Executive Director\, SEMI ESD Alliance\, presenting “The CHIPS Act and Its Impact on the Design & Verification Markets.”\n\n\nPoster Ninja Warrior session on Wednesday\, March 1 includes four posters battling it out for top honors. Posters will be judged on a variety of factors\, including audience reaction.\nTwo panels will be offered on Wednesday\, March 1:\n\n“Systems are Evolving. Is Verification Keeping Up?” will be moderated by Bernard Murphy\, SemiWiki. Panelists will discuss areas where they would like to see breakthroughs and ideas and research that they would like to see explored further.\n“AI-ML Algorithms are Transforming Verification: Separating Hype from Reality\,” will focus on the state of the art of design verification environments that power the new generation of advanced processors. Panelists will discuss systems which could potentially change the semiconductor landscape.\n\n\nAccellera-sponsored lunch on Wednesday\, March 1 “RISC-V Everywhere\,” presented by Mark Himelstein\, CTO RISC-V International.\n\nIn addition to the two panels and keynote\, including the Accellera-sponsored sessions\, there will be 41 paper presentations\, 17 poster sessions\, four tutorials and 16 workshops throughout the four-day program. \nRegistration is open. Registration for the keynote\, panels and exhibits is free. \n\nFor the latest updates regarding the conference and expo\, please visit the website. \n\nAbout DVCon \nDVCon is the premier conference for discussion of the functional design and verification of electronic systems. DVCon is sponsored by Accellera Systems Initiative\, an independent\, not-for-profit organization dedicated to creating design and verification standards required by systems\, semiconductor\, intellectual property (IP) and electronic design automation (EDA) companies. For more information about Accellera\, please visit www.accellera.org. For more information about DVCon U.S.\, please visit here. Follow DVCon on Facebook\, LinkedIn or @dvcon_us on Twitter or to comment\, please use #dvcon_us. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-u-s-2023/ LOCATION:DoubleTree Hotel\, 2050 Gateway Place\, San Jose\, CA\, 95110\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/DVCon-2023.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230219T080000 DTEND;TZID=America/Los_Angeles:20230223T170000 DTSTAMP:20221128T190714Z CREATED:20221128T190714Z LAST-MODIFIED:20221128T190714Z UID:5472-1676793600-1677171600@marketingeda.com SUMMARY:ISSCC 2023 DESCRIPTION:ISSCC 2023 is planned as a fully in-person event. On-demand access to ISSCC papers and educational material will be possible for people who cannot travel to San Francisco\, but the conference will be optimized for an in-person experience. We keep monitoring the COVID-19 pandemic and we will promptly inform you should any change in our program be needed. Looking forward to seeing you again in San Francisco! \nEugenio Cantatore – Conference Chair \nPiet Wambacq – Program Committee Chair \n\n\n2023 Plenary Sessions\n\n\n\n\n\n\nInnovation for the Next Decade of High-Performance Computing \nLisa Su\, Chair and Chief Executive Officer\, AMD\, Austin\, Texas \nShape the World with Mixed-Signal Integrated Circuits – Past\, Present\, and Future \nAkira Matsuzawa\, Professor Emeritus of Tokyo Institute of Technology and CEO of Tech Idea\, Kawasaki\, Japan \nEU Chips Act drives pan-European full-stack innovation partnerships \nJo De Boeck\, Executive Vice President and Chief Strategy Officer\, imec and KU Leuven\, Leuven\, Belgium \n5G drives exponential increase in processing needs across all industries \nErik Ekudden\, Senior Vice President\, Chief Technology Officer\, Ericsson\, Kista\, Sweden \n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isscc-2023/ LOCATION:Marriott Marquis\, 780 Mission Street\, San Francisco\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISSCC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230131T080000 DTEND;TZID=America/Los_Angeles:20230202T170000 DTSTAMP:20221228T190236Z CREATED:20221228T190236Z LAST-MODIFIED:20221228T190236Z UID:5820-1675152000-1675357200@marketingeda.com SUMMARY:DesignCon 2023 DESCRIPTION:DesignCon is the premier high-speed communications and system design conference and exposition\, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. \nThree days of education\, exhibits\, and networking – technical paper sessions\, tutorials\, industry panels\, product demos\, expo hall and social functions. \nJoin fellow engineers at DesignCon and cover all aspects of electronic design. \nAttend the expertly curated\, 14-track conference created by engineers for engineers\, browse exhibits with hundreds of new products and technologies\, and network with high-caliber industry professionals over the three-day event. \nDesignCon’s “Engineer of the Year” Award is given out each year during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip\, board\, or system level. \nThe award winner is selected based on his or her leadership\, creativity\, and out-of-the-box thinking brought to design/test of chips\, boards\, or systems\, with particular attention paid to areas of signal and power integrity. Nominations for the 2023 Engineer of the Year Award are now open. Please submit your nomination/s for this prestigious award before December 20\, 2022. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/designcon-2023/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DesignCon-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230124T080000 DTEND;TZID=America/Los_Angeles:20230126T170000 DTSTAMP:20230119T004257Z CREATED:20221004T200927Z LAST-MODIFIED:20230119T004257Z UID:5258-1674547200-1674752400@marketingeda.com SUMMARY:Chiplet Summit DESCRIPTION:The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. \nThey’ll get the scoop on ways to make their chiplets run faster\, scale better\, use less power\, and be more flexible. \nThis unique event gives attendees a place to network with peers\, ask questions of the experts\, and talk to vendors offering a wide variety of products and services. \n“Chiplets are expected to return to the two-year doubling cycle that has been the cornerstone economics of the semiconductor business since 1965.”\n– John Blyler\, Design News\, September 2021 \nThought-Provoking Panels Where Attendees Can Ask Questions of Leading Experts: \n\nChoosing the Right Architecture for Your Application\nNext Great Breakthrough in Chiplets\nBest Development Platform for Chiplets\nBest Interface for Chiplets\nWhat Standards Are Needed?\nOptimizing Chiplets\n\n  \nATTENDEES \nEngineers and managers who are looking for ways to help meet performance challenges\, handle the move to smaller dimensions\, provide the modularity and scalability today’s chips require\, and develop solutions focused on the latest applications and interfaces.  Designers of enterprise networks\, telecom systems\, high-performance computing\, financial systems\, IoT\, and mil/aero applications all know that chiplets will play a big role in their future. \nBACKGROUND \nChiplets improve chip yields and costs\, but still provide the performance of a large monolithic chip.  Designers can mix-and-match chiplets\, use the process technologies best suited to particular functions\, take advantage of chiplet IP\, simplify moves to new process nodes\,  and avoid wafer waste and manufacturing defects.  Chiplets are the key to producing the extremely high-density\, high-performance chips required for today’s networking\, storage\, AI/ML\, analytics\, media processing\, HPC\, and virtual reality applications. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chiplet-summit/ LOCATION:DoubleTree Hotel\, 2050 Gateway Place\, San Jose\, CA\, 95110\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Chiplet-Summit-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20230116T080000 DTEND;TZID=Asia/Tokyo:20230119T170000 DTSTAMP:20230104T174652Z CREATED:20230104T174652Z LAST-MODIFIED:20230104T174652Z UID:5828-1673856000-1674147600@marketingeda.com SUMMARY:ASP-DAC 2023 DESCRIPTION:ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2023 is 28th conference. ASP-DAC 2023 offers you an ideal opportunity to touch the recent technologies and the future directions on the LSI design and design automation areas by technical papers and tutorials. ASP-DAC also holds Designers’ Forum to make presentations about the latest designs for designers. Please do not miss ASP-DAC 2023. \n\nDate: Jan. 16-19\, 2023\nPlace: Tokyo Odaiba Miraikan\, Japan\nGeneral Chair: Atsushi Takahashi (Tokyo Institute of Technology\, Japan)\nTechnical Program Chair: Gi-Joon Nam (IBM Research\, USA)\nDesign Contest Co-Chairs: Mahfuzul Islam (Kyoto University\, Japan)\, Akira Tsuchiya (The University of Shiga Prefecture\, Japan)\n\nThe format of the conference is hybrid but mainly in-person for speakers. All speakers are expected to attend ASP-DAC 2023 physically unless a speaker has some inevitable reasons such as medical reasons and government orders.\nRestrictions on new entry into Japan due to COVID-19 have been relaxed since October 11\, 2022. Please check the following announcement from the Ministry of Foreign Affairs of Japan.\nhttps://www.mofa.go.jp/j_info/visit/visa/index.html \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/asp-dac-2023/ LOCATION:Tokyo Odaiba Miraikan\, 2 Chome-3-6 Aomi\, Tokyo\, Koto CIty\, 135-0064\, Japan CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ASP-DAC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20230116T080000 DTEND;TZID=Europe/Paris:20230118T170000 DTSTAMP:20230113T205251Z CREATED:20230113T205251Z LAST-MODIFIED:20230113T205251Z UID:5845-1673856000-1674061200@marketingeda.com SUMMARY:HiPEAC DESCRIPTION:The HiPEAC conference is the premier European forum for experts in computer architecture\, programming models\, compilers and operating systems for general-purpose\, embedded and cyber-physical systems. Areas of focus and integration include safety-critical dependencies\, cybersecurity\, energy efficiency and machine learning. \nThe HiPEAC 2023 conference will take place in Toulouse\, France. Associated workshops\, tutorials\, special sessions\, several large poster session and an industrial exhibition will run in parallel with the conference. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/hipeac/ LOCATION:Pierre Baudis Convention Centre\, 11 esplanade Compans Caffarelli\, Toulouse\, France CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/HiPEAC.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Karachi:20230108T080000 DTEND;TZID=Asia/Karachi:20230112T170000 DTSTAMP:20221122T174938Z CREATED:20221122T174938Z LAST-MODIFIED:20221122T174938Z UID:5464-1673164800-1673542800@marketingeda.com SUMMARY:VLSID 2023 DESCRIPTION:International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems\, is attended by over 2000 engineers\, students & faculty\, industry\, academia\, researchers\, bureaucrats and government bodies. \nSemiconductors are the intangible backbone of every industry across the globe. Silicon took the lion’s share over the past decades and remained the primary enabler for digitization of the world. With scaling reaching its fundamental limits\, it is time to look at addressing technological challenges at higher levels of abstraction in CMOS based design and at the same time\, look beyond Silicon for further performance enhancement. \nVLSID 2023 – the first physical conference post pandemic\, acts a platform for industry and academia alike to discuss\, deliberate and explore into the frontiers of semiconductor eco-system that could eventually enable disruptive technologies for global digitalization \nVLSID 2023 will be hosted in the best stand-alone convention center\, HICC Hyderabad. The city is home to some of the best universities\, top global companies in research and manufacturing\, strong defense sector and thriving start-ups. Hyderabad has a rich culture with numerous historic places to visit and world famous Hyderabad Biryani to cherish. We look forward to hosting and giving you the best experience at the conference. We encourage your participation to the conference and call you to be part of the exciting know-how’s of the industry and spend quality time exploring Hyderabad. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/vlsid-2023/ LOCATION:Hyderabad International Convention Cente\, Hyderabad\, Telangana\, India CATEGORIES:Conference,EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/VLSID-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230105T080000 DTEND;TZID=America/Los_Angeles:20230108T170000 DTSTAMP:20221129T173505Z CREATED:20221027T192513Z LAST-MODIFIED:20221129T173505Z UID:5345-1672905600-1673197200@marketingeda.com SUMMARY:CES 2023 DESCRIPTION:CES® is the most influential tech event in the world — the proving ground for breakthrough technologies and global innovators. \nThis is where the world’s biggest brands do business and meet new partners\, and the sharpest innovators hit the stage. Owned and produced by the Consumer Technology Association (CTA)®\, CES features every aspect of the tech sector. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ces-2023/ LOCATION:Las Vegas Covention and World Trade Center\, 3150 Paradise Rd\, Las Vegas\, NV\, 89109\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ces-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Hong_Kong:20221226T080000 DTEND;TZID=Asia/Hong_Kong:20221227T170000 DTSTAMP:20221220T184858Z CREATED:20221220T184858Z LAST-MODIFIED:20221220T184858Z UID:5582-1672041600-1672160400@marketingeda.com SUMMARY:CSIA-ICCAD 2022 DESCRIPTION:As a strategic\, basic and leading industry in national economic and social development\, integrated circuit(IC) industry is an important support for cultivating strategic emerging industries and developing information economy\, and plays an important role in the core of information technology field.  Promoting the healthy development of IC industry is the only way to realize the autonomous control of core technology.  With the independent innovation and development of China’s IC industry\, its market scale and enterprise competitiveness continue to improve\, China has become the world’s largest and fastest growing IC market.  At present\, the global IC industry has entered a major period of transformation and reform. As the industry leader and an important link of technology and product innovation\, the IC design industry bears an important responsibility in the development of the industry\, and is also the key to achieve independent control of the semiconductor industry. \nDuring the development of China’s IC design industry\, CSIA – ICCAD Annual Conference has played an important role in promoting industry cluster\, linking industrial resources\, and keeping abreast of industry trends. Over the years\, the theme of the Annual Conference has been combined with the actual development of the electronic information industry in the host city of the conference. The Conference has promoted the simultaneous development of the related industries in the host cities and the national IC industry. Therefore\, the “CSIA – ICCAD 2022 Annual Conference & Guangzhou IC Industry Innovation and Development Summit (ICCAD 2022)” is planned to be held in Guangzhou from November 9 to 10\, 2022. \nThe theme of this year’s conference is “Bay Area has you\, core to the future”. The Conference will discuss the opportunities and challenges faced by the IC industry\, especially the IC design industry\, and enhance the innovation capability and the integration capability of China’s IC industry chain to meet market demands and improve international competitiveness. The conference will create a platform for communication and cooperation for enterprises in all aspects of the IC industry chain\, and a platform for communication and cooperation in technology\, market\, application\, investment and other fields for IC design enterprises. \nThe related matters of this annual conference are hereby notified as follows: \n\nGuidanced by:\n\n  Industry and Information Technology Department of Guangdong \nThe People’s Government of Guangzhou Municipality \nChina Semiconductor Industry Association \n\nHosted by:\n\nChina Semiconductor Industry Association IC Design Branch (CSIA – ICCAD) \nNational S&T Major Project(NMP) 01 General Expert Group \nChina Integrated Circuit Design Innovative Alliance \nIII. Supported by: \n     The People’s Government of Guangzhou Huangpu District \nGuangzhou Municipal Industry and Information Technology Bureau \n\nOrganizedby:\n\n     Guangzhou Huangpu District Industry and Information Bureau \nGuangdong Integrated Circuit Industry Association \nShanghai Xinmei Conference Service Co.\, Ltd. \nShanghai Yaxun Shangwu Zixun Co.\, Ltd. \nV.Co-organized by: \nChina Institute of Communications-ASIC Committee \nChina Integrated Circuit(CIC) \nVI.Registration Date: November 8\, 2022 (Tuesday) \nConference Date: November 9-10\, 2022 \nVII. Registration Location: The Westin Pazhou Guangzhou \n (Address: No. 681\, Fengpuzhong Road\, Haizhu District\, Guangzhou) \nConference Location: Guangzhou PWTC Expo \n (Address: No.1000\, Xingangdong Road\, Haizhu District\, Guangzhou) \nVIII. Conference Content \n\nKeynote Speeches\n\n(1) China IC Design Industry Current Development Situation Report \n(2) Coordinate Science & Technology Resources to Realize Innovation Development Report \n(3) Global IC Technology and Industry Development Trend Report \n\nSeminars\n\nl  IC Design and Innovation Application \nl  IC Design and EDA Software \nl  Foundry and Process Technology \nl  IC Packaging and Testing \nl  IP and IC Design Services \nl  Capital and Entrepreneurship \nl  Guangzhou IC Innovation and Entrepreneurship Forum \n\nChina IC Design Industry Exhibition\nIX. Participants\n\nThe relevant authorities and local leaders\, relevant domestic and foreign experts\, representatives from local bases and industry associations\, IC design companies\, IP service vendors\, EDA vendors\, foundry companies\, packaging testing vendors\, system vendors and venture capital firms at home and abroad\, representatives from IC industries Parks and related media. \n\n Contacts\n\nContact:Shirley Hu \nTel: 18917192814\, E-mail: shirleyhp@cicmag.com \nContact:Yuanyuan Wang \nTel:18600095161\, E-mail: wangyy@csia-iccad.net.cn \n\nThe organizers of the annual conference are required to conscientiously and carefully organize and prepare for the conference and ensure a complete success. \nAnnex: Registration Form \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/csia-iccad-2022/ LOCATION:Xiamen International Convention Center\, 198 Exhibition Road\, Xiamen City\, China CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CSIA-ICCAD-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221215T080000 DTEND;TZID=America/Los_Angeles:20221215T170000 DTSTAMP:20221130T191032Z CREATED:20221130T191032Z LAST-MODIFIED:20221130T191032Z UID:5487-1671091200-1671123600@marketingeda.com SUMMARY:CHIPS Alliance\, Fall Technology Update DESCRIPTION:Join us in-person for our second biannual technology update featuring informative\, technical talks on open source hardware collaborative development\, hosted by Google and including speakers from Microsoft\, Google\, Intel\, Antmicro\, Efabless and others. \nCHIPS’ Thursday event follows the main RISC-V Summit days (Tuesday-Wednesday) to allow easy participation for open source hardware professionals traveling to the Bay Area for the Summit\, and is free to attend (registration required). \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chips-alliance-fall-technology-update/ LOCATION:Koto CIty CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CHIPS-Alliance-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20221214T080000 DTEND;TZID=Asia/Tokyo:20221216T170000 DTSTAMP:20221122T173702Z CREATED:20221122T173702Z LAST-MODIFIED:20221122T173702Z UID:5460-1671004800-1671210000@marketingeda.com SUMMARY:SEMICON Japan + Advanced Packaging and Chiplet Summit DESCRIPTION:SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights\, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently\, bringing together top players in the semiconductor packaging and PCB mounting fields \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semicon-japan-advanced-packaging-and-chiplet-summit/ LOCATION:Tokyo Big Sight\, 3 Choe-11-1 Ariake\, Tokyo\, Japan CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMICON-Japan-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221213T080000 DTEND;TZID=America/Los_Angeles:20221214T170000 DTSTAMP:20221202T202132Z CREATED:20220926T163457Z LAST-MODIFIED:20221202T202132Z UID:5232-1670918400-1671037200@marketingeda.com SUMMARY:RISC-V Summit DESCRIPTION:Each day\, thousands of engineers around the world collaborate and contribute to advance the most prolific open\, license and royalty-free computing architecture. They share technical investment and help shape the architecture’s strategic future so everyone may create more rapidly\, enjoy unprecedented design freedom\, and substantially reduce the cost of innovation. Anyone\, anywhere can benefit from the open intellectual property contributed by RISC-V. \nThis December\, the RISC-V community – including the technical\, industry\, domain and special interest groups who define the architecture’s specifications – will be in San Jose\, California for four days of technology breakthroughs\, industry milestones\, tutorials\, and relationship building.  \n\n\n\n\nIt all kicks off with a RISC-V Member Day where technical and industry working groups meet in person\, running alongside a new RISC-V FutureWatch track featuring breaking news of products\, technologies\, ecosystem expansion\, and more.\nThen it’s the centerpiece of the week: Our Summit featuring two days of compelling technical and industry keynotes and conference sessions\, paired with a showfloor of the latest community innovations.\nThe week wraps up with a full day of information-rich tutorials.\n\n\n\n\nThe community-curated content you’ll experience is unparalleled. \nAutomotive. High-performance Computing. Data Centers. ML and AI. Security. Software Stacks. Development Tools. Systems on a Chip. It’s all here. And it’s all new. \nBreak new ground. Define the future. Grow your network. Build your expertise. Meet your heroes. It’s all during RISC-V Summit North America\, this December in San Jose. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/risc-v-summit/ LOCATION:San Jose Convention Center\, 150 W San Carlos Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/RISC-V-Summit.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221212T080000 DTEND;TZID=America/Los_Angeles:20221214T170000 DTSTAMP:20221209T182019Z CREATED:20221209T182019Z LAST-MODIFIED:20221209T182019Z UID:5494-1670832000-1671037200@marketingeda.com SUMMARY:IEEE - Electrical Design of Advanced Packaging and Systems (EDAPS) DESCRIPTION:The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium\, a flagship event in the Asia-Pacific region\, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip\, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling\, design and simulation\, fabrication and characterization. This symposium consists of technical paper presentation\, poster sessions\, industry exhibits\, workshops and tutorials. \nEDAPS is sponsored by the IEEE Electronic Packaging Society. \nEDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop\, to be held during December 12-14 in virtual mode. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-electrical-design-of-advanced-packaging-and-systems-edaps/ LOCATION:Koto CIty CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/EDAPS-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221206T080000 DTEND;TZID=Europe/Berlin:20221207T170000 DTSTAMP:20220831T201520Z CREATED:20220330T163331Z LAST-MODIFIED:20220831T201520Z UID:4479-1670313600-1670432400@marketingeda.com SUMMARY:DVCon Europe 2022 DESCRIPTION:The Design and Verification Conference & Exhibition Europe (DVCon Europe) is the premier European technical conference on system\, software\, design\, verification\, validation or integration. It is a place where the latest methodologies and technologies for the industrial use of tools\, languages\, and standards for integrated and embedded systems and products are shared and discussed. \nThe conference covers the application of standards\, methodologies\, and flows for system-level\, hardware and software design\, verification\, validation\, design automation and IP reuse. \nIndustry applications of interest include (but not limited to) automotive\, mobile communication\, aerospace\, healthcare\, chip-cards\, consumer and power electronics. DVCon Europe solicits submissions related to advanced design and verification on special interest areas such as Digital Twin\, Machine Learning\, Internet-of-things\, Functional safety and security\, AI\, ADAS and digitalization. \nDVCon Europe 2022 accepts submissions of papers\, tutorials and panels with highly technical content reflecting real life experiences. \nSystemC Evolution Day 2022\nThe seventh SystemC Evolution Day was a full-day\, technical workshop on the evolution of SystemC standards to advance the SystemC ecosystem. In several in-depth sessions\, selected current and future standardization topics around SystemC were discussed in order to accelerate their progress for inclusion in Accellera/IEEE standards. \nSystemC Evolution Day is intended as a lean\, user-centric\, hands-on forum bringing together experts from the SystemC user community and the Accellera Working Groups to advance SystemC standards. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-europe-2022/ LOCATION:Holiday Inn Munich – City Centre\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:Conference ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/DVCon-Europe-December-6-7-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221205T080000 DTEND;TZID=Europe/Berlin:20221205T203000 DTSTAMP:20221116T201152Z CREATED:20221116T201152Z LAST-MODIFIED:20221116T201152Z UID:5407-1670227200-1670272200@marketingeda.com SUMMARY:The 26262 Club - Technical Conference DESCRIPTION:MEET US AT THE 26262 CLUB TECHNICAL CONFERENCE THIS COMING DECEMBER 5\, 2022\nIn this edition\, the 26262 club continues the discussion on the anticipated third edition and the emerging role of ISO 26262 within the evolving standards ecosystem. We bring on stage key global players from WG8 alongside authors of the most prominent upcoming standards and share must-have insights from the global standardisation community. Goal of the day is to facilitate collaboration and open discussion between different groups and practitioners and present applicable case studies and lessons learnt to take back with you. \nWHO WILL YOU MEET\nThe expert speaker line up includes 20 international experts from the ISO 26262 WGs and international members of Germany\, UK\, France\, Italy\, Austria\, USA – together we welcome experts from WGs of SOTIF\, IEEE\, Accellera\, ISO 21434 among other. Presenting companies include OEMS\, Tier 1s\, Semiconductor and notable solution providers. Meet our expert speaker panel here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/the-26262-club-technical-conference/ LOCATION:Holiday Inn Munich – City Centre\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/The-26262-Club.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221203T080000 DTEND;TZID=America/Los_Angeles:20221207T170000 DTSTAMP:20220726T171440Z CREATED:20220726T171440Z LAST-MODIFIED:20220726T171440Z UID:4962-1670054400-1670432400@marketingeda.com SUMMARY:IEDM DESCRIPTION:EEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology\, design\, manufacturing\, physics\, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology\, advanced memory\, displays\, sensors\, MEMS devices\, novel quantum and nano-scale devices and phenomenology\, optoelectronics\, devices for power and energy harvesting\, high-speed devices\, as well as process technology and device modeling and simulation. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/iedm/ LOCATION:Moscone Center\, 747 Howard Street\, San Francisco\, CA\, 94103\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEDM-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20221130T080000 DTEND;TZID=Europe/Paris:20221201T170000 DTSTAMP:20221026T174926Z CREATED:20221026T174926Z LAST-MODIFIED:20221026T174926Z UID:5338-1669795200-1669914000@marketingeda.com SUMMARY:IP-SoC Conference 2022 DESCRIPTION:IP-SoC 2022 will be the 25th edition of the working conference fully dedicated to IP (Silicon Intellectual Property) and IP based electronic systems. \nThe event is the annual opportunity for IP providers and IP consumers to share information about technology trends\, innovative IP SoC products\, Breaking IP/SoC News\, Market evolution and more. \nThe Grenoble event is a special event as it is also the annual IP Think Tank meeting where high level executives\, market analyzer and technical experts in all the design track from Foundry\, technology\, design methodology\, EDA tools share their vision about the future of the IP concept. It will be the right time to analyze the fast evolution and consolidation in the IP market and IP business. \nAnd over all you cannot miss The wine Tasting Party and special banquet for D&R 25th Anniversary !! \nExhibition tables and “discussion panels” will favor vendor and customer meetings. \nAny question? Please contact us \nTentative Program \nDay 1 – November 30th\, 2022 \nWelcome \n\nAfter 25 years what’s new\, Design And Reuse\nThe processor revolution is brewing – it won’t be like the past 25 years!\, Codasip GmbH\nSustainability of the electronic industry : A major challenge and a mine of innovation\, STMicroelectronics\n\nSOI the “European Green Touch” \n\nCHIPS ACT: How Europe wakes-up\, Soitec\nFDSOI the EU technology for a green transition\, Soitec\nOCEAN12 IP Factory: From Research to Silicon\, Fraunhofer-Gesellschaft\nBEYOND5 – Low power 5G access point\, ASYGN\nBEYOND5 – Car Interior Radar for Advanced Life-Signs Detection\, Silicon Radar GmbH\n\nAutomotive Solution \n\nSecuring next generation semiconductors for Automotive\, Rambus\, Inc.\nCAN ALL – secure & comprehensive solution (not only) for automotive\, Digital Core Design\nAutomotive-Grade IP for Next-Generation Zonal Architectures\, Synopsys\, Inc.\n\nVideo & Imaging & Artificial Intelligence \n\nLeveraging MIPI DSI-2 & MIPI CSI-2 Low-Power Display and Camera FPGA-based Subsystems\, Mixel\, Inc.\nUltra-compact image compression IP core for saving on chip SRAM\, Lemur-Imaging Ltd.\nnearbAI: scalable neural network inference for ASICs in XR devices\, easics NV\n\nRISC-V \n\nRISC-V and Functional Safety\, Andes Technology Corp.\nRISC-V in Space\, CAES Gaisler\nIncreasing commercial adoption of RISC-V\, Cadence Design Systems\, Inc.\nRISC-V processor IP product line\, CloudBEAR\n\nSecurity Solution \n\nSecure your designs with world-class security IP\, Crypto Quantique\nRAID System Based on Reed Solomon Code Galois Field\, Secantec\, Inc.\nPost-Quantum Cryptography: Theory to Accelerated Practice\, Synopsys\, Inc.\nBuilding a Root of Trust with SRAM PUF and tRoot HSM\, Intrinsic ID\nThe importance of security lifecycle management\, Secure-IC\n\nDay 2 – December 1st\, 2022 \nChiplet and Die-to-Die Interface \n\nChiplet and Die-to-Die Interface Interoperability – how to accelerate path to a real Open Ecosystem\, Alphawave IP\, Inc.\nStrength of UCIe for Multi-Die Systems\, Synopsys\, Inc.\n\nLow Power / Low Energy Design \n\nDemocratizing Energy Friendly Ambient Computing\, Dolphin Design\nLowering the power consumption of voice-controlled IoT devices\, Phonemic\n\nMemory and Analog IP \n\nHow Embedded Non-Volatile Memory IP Can be a Differentiator\, Weebit Nano\nAnalog IP\, the way you want it\, Agile Analog\nAll you need is an Electrical Rule Checker !\, Aniah\nFDSOI High speed\, low power hybrid ADC’s for Communications\, AI\, and Automotive applications\, Alphacore\, Inc.\n\nEthernet IP \n\nDeterministic transmission of time critical information with TSN Ethernet (Time Sensitive Network)\, Comcores\nAddressing performance challenges of TCP/IP stack implementations\, CAST\, Inc.\n\nIP based SoC Design \n\nUnified methodology for SoC design assembly including logic\, power and timing constraints\, Defacto Technologies\nTackling ROIC SoC Design Reuse challenges with AMALIA platform\, Thalia Design Automation\nEssential IP for the Enablement of Silicon Lifecycle Management\, Synopsys\, Inc.\nProgrammable logic for ASIC/SoC without pain\, Menta\n\nAnd more to come… \nClick here to register >> \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ip-soc-conference-2022/ LOCATION:Hotel Europole\, 29 rue Pierre-Sémard\, Grenoble\, France CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IP-SOC-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Jerusalem:20221129T080000 DTEND;TZID=Asia/Jerusalem:20221129T170000 DTSTAMP:20221107T193748Z CREATED:20221107T193748Z LAST-MODIFIED:20221107T193748Z UID:5383-1669708800-1669741200@marketingeda.com SUMMARY:SEMISRAEL Expo 2022 DESCRIPTION:SemIsrael Expo 2022 is the premier professional semiconductor event in Israel. \nThe event brings together hundreds of Israeli semiconductor professionals from all fields and aspects of the semiconductor industry. \nThe Expo will host some 750 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups\, local R&D offices of multinationals and IDMs\, foundries\, design houses\, labs and universities. \n\nThe event will be hosted at Avenue Convention and Events Center on November 29\, 2022. \nSemIsrael Expo events are produced by SemIsrael – The Israeli Semiconductor Portal. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semisrael-expo-2022/ LOCATION:Avenue Convention Center\, Airport City\, Israel CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMISRAEL-Expo-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221115T080000 DTEND;TZID=Europe/Berlin:20221118T170000 DTSTAMP:20221017T181636Z CREATED:20221017T181636Z LAST-MODIFIED:20221017T181636Z UID:5312-1668499200-1668790800@marketingeda.com SUMMARY:Semicon Europa DESCRIPTION:SEMICON Europa 2022 is co-located with electronica in Munich\, Germany creating the strongest single event for electronics manufacturing in Europe\, and broadening the range of attendees across the electronics chain. \n– Top-notch Keynotes\n– Market Trends\n– Exhibition\n– Networking\n– Advanced Packaging Forum / Fab Management Forum\n– ITF Beyond 5G -powered by imec\n– Smart Manufacturing / Mobility / MedTech\n– Workforce Development and many more! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semicon-europa/ LOCATION:Messe Munchen\, Messegelände\, Munich\, 81823\, Germany CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DB580CC6-16B1-4DBA-A5A3-38C39181F164-e1666030379723.jpeg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Chicago:20221113T080000 DTEND;TZID=America/Chicago:20221118T170000 DTSTAMP:20221102T200714Z CREATED:20221102T200714Z LAST-MODIFIED:20221102T200714Z UID:5362-1668326400-1668790800@marketingeda.com SUMMARY:Super Computing 2022 DESCRIPTION:Come see your friends and colleagues\, explore incredible learning experiences in HPC\, and walk the exhibit floor! There are several registration options available. Choose the one that’s right for you. We look forward to seeing you in Dallas or via the Digital Experience. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/super-computing-2022/ LOCATION:Kay Bailey Hutchison Convention Center\, 650 S Griffin Street\, Dallas\, TX\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SC22.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20221109T080000 DTEND;TZID=Asia/Tokyo:20221110T170000 DTSTAMP:20221101T184321Z CREATED:20221101T184321Z LAST-MODIFIED:20221101T184321Z UID:5358-1667980800-1668099600@marketingeda.com SUMMARY:Ethernet & IP @ Automotive Technology Day DESCRIPTION:Onsite registration may be limited\, register now to be sure to get admission. \n\n\n\n\nThe 2022 IEEE SA Ethernet & IP @ Automotive Technology Day (E&IP@ATD) is the premier venue for automobile manufacturers\, suppliers\, semiconductor vendors\, tool providers\, engineers\, scientists\, educators\, and the media to share ground breaking ideas along with implementation strategies and applications related to Automotive Ethernet Systems. Attendees will receive and share information\, and actively participate in the latest developments in shaping Automotive Ethernet into a globally deployed\, volume car automotive network. \nPresentations will provide insights into the developments\, trends and solutions in the following topics: \n\nCurrent automotive use-cases and future perspectives\nEthernet’s role to facilitate cloud connectivity\nEthernet network design and specification\nEthernet requirements for automated driving applications\nSafety\, security and reliability of Ethernet communications\nMarkets and strategies\nTools and tests methods\nPresent and future physical layer and protocol solutions\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ethernet-ip-automotive-technology-day/ LOCATION:PACIFICO Yokohama North\, 1 Chome-1-2 Minatomirai\, Nishi Ward\, Yokohama\, Japan CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/EIPATD-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221101T080000 DTEND;TZID=America/Los_Angeles:20221102T170000 DTSTAMP:20221012T185511Z CREATED:20221012T185511Z LAST-MODIFIED:20221012T185511Z UID:5300-1667289600-1667408400@marketingeda.com SUMMARY:Linley Fall Processor Conference 2022 DESCRIPTION:TechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights – a Hybrid Event\, will be held in Santa Clara\, California on November 1-2\, 2022. If you cannot attend in person\, tune in to our virtual livestream or watch the presentations OnDemand at your convenience. \nPresentations will address processors and IP cores for AI applications\, embedded\, data-center\, automotive\, and server designs. In-person attendees will be able to hear presentations and interact with the speakers during Q&A\, lunch\, and the networking reception. \nAnalyst and Industry Keynotes\nLinley Gwennap\, principal analyst\, TechInsights\, will open the conference with an overview of the latest market\, technologies\, equipment-design\, and silicon trends. We will also feature a keynote from another industry leader. \nIn-Depth Technical Sessions\nUnlike many conferences\, we ensure that the presentations deliver real technical content\, not marketing hype. We are the conference of choice for many companies who announce new products or make technology disclosures. \nTechInsights analysts carefully select session topics and choose leading speakers who are experts in their fields. In addition\, the analysts ensure that the content of the presentations are full of insightful\, technical information that will help attendees select the right components and systems for their next project. The program will feature talks and panel discussions covering a broad range of topics that will be announced later. \nWhy Attend\nTechInsights Processor Conferences have been called the highest quality of their kind by previous attendees because they provide a unique opportunity to hear\, question\, and network with key providers of advanced technology products. \nThe Conferences analyze products and design strategies in a particular technology segment\, providing information that engineers can immediately use to improve their designs. The events feature in-depth technical presentations from our own analysts as well as leading technologists from the industry. This conference is intended for system designers\, chip designers\, software designers\, OEM/ODMs\, press\, and financial analysts. \nCovid-19 Policies and Precautions\nWe are working closely with the Hyatt Regency to reduce the risk of attending our in-person event. Individuals and their employers\, however\, must decide what level of risk is acceptable. For those unable to attend in person\, we offer our virtual livestream. \nAttendees will be required to provide proof of vaccination before receiving their conference badge. Consistent with local health orders\, masks are now recommended but not required. Policies are subject to change; we will update this page as needed. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/linley-fall-processor-conference-2022/ LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA,Foundry,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/Linley-Fall-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221030T080000 DTEND;TZID=America/Los_Angeles:20221104T170000 DTSTAMP:20221011T181651Z CREATED:20221011T181651Z LAST-MODIFIED:20221011T181651Z UID:5294-1667116800-1667581200@marketingeda.com SUMMARY:ICCAD 2022 DESCRIPTION:Jointly sponsored by ACM and IEEE\, ICCAD is the premier forum to explore the new challenges\, present leading-edge innovative solutions\, and identify emerging technologies in the electronic design automation research areas. ICCAD covers the full range of CAD topics – from device and circuit-level up through system-level\, as well as post-CMOS design. ICCAD has a long-standing tradition of producing a cutting-edge\, innovative technical program for attendees. The 41st edition of the conference to be held in San Diego\, California\, USA from 30 October-3 November 2022 will be no different! As the worldwide COVID-19 pandemic situations continues to evolve\, an online registration option will be available for presenters and participants who are unable to attend in person due to travel restrictions. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/iccad-2022/ LOCATION:San Diego Mission Bay Resor\, 1775 East Mission Bay Drive\, San Diego\, CA\, 92109\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ICCAD-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221030T080000 DTEND;TZID=America/Los_Angeles:20221103T170000 DTSTAMP:20220929T172053Z CREATED:20220929T172053Z LAST-MODIFIED:20220929T172053Z UID:5242-1667116800-1667494800@marketingeda.com SUMMARY:ISTFA 2022 DESCRIPTION:The demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously according to Moore’s Law. Furthermore\, for latest technologies in nano realm\, a new set of disruptive development in new structures and novel materials was introduced. Thus\, defects causing semiconductor device failures have become smaller and more elusive. To chase such defects\, all failure analysis techniques and methodologies also need to be improved to keep pace with semiconductor technology. Failure characterization\, fault isolation\, electrical failure analysis\, physical analysis\, microscope imaging and materials analysis are examples of the key challenged areas. A gap analysis has been done by the EDFAS FA Technology Roadmap Committee and is available on ASM connect. To close the gap\, you can play a role\, no matter what your area of expertise is. \nShare your experiences and stories of chasing the ever-smaller and more elusive defects at the 48th International Symposium for Testing and Failure Analysis\, the premier event for the microelectronics failure analysis community. We invite you to join us in Pasadena\, California\, at the 48th year of ISTFA. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/istfa-2022/ LOCATION:Pasadena Convention Center\, 300 East Green Stret\, Pasadena\, CA\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISTFA-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Pacific/Honolulu:20221023T080000 DTEND;TZID=Pacific/Honolulu:20221028T170000 DTSTAMP:20220929T190935Z CREATED:20220929T190935Z LAST-MODIFIED:20220929T190935Z UID:5247-1666512000-1666976400@marketingeda.com SUMMARY:The Applied Superconductivity Conference DESCRIPTION:The Applied Superconductivity Conference is the premier international conference on applied superconductivity and quantum computing. Engineers\, scientists and industry representatives interested in developments related to the electronics and materials for superconductors that are involved in any type of quantum system should attend. \nASC’22 Conference Chair’s Statement\nAloha to ASC 2022 in Hawaii! On behalf of our organizing team\, we are excited to invite you to join us at the Hawaii Convention Center for the 2022 ASC Conference\, for a face-to-face meeting\, to be held October 23 – 28\, 2022. This conference will not be offered with a virtual attendance option. Honolulu promises to be a special venue for our conference with a healthy food budget\, ongoing planning for robust and exciting technical and ELEVATE programs\, an overabundance of restaurants loaded with tasty international food\, welcoming hotels and housing opportunities\, and sights to explore. \n– Arthur Lichtenberger \nASC’22 Program Chair’s Welcome\nOur program committee is working to create an exciting and vibrant program with breaking plenaries\, special sessions (including the 11th Transition-Edge Session (TES) Workshop\, successfully held as part of the ASC since 2008)\, engaging talks and posters. Our electronics program provides a unique opportunity for the Quantum Information community to present their latest results in quantum computing/ communication/sensing that involve the use of superconductors in any part of the Quantum System. We invite and welcome your input for plenary speakers and special sessions. Abstract submissions are due March 23\, 2022. Read more. \n– Sam Benz \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/the-applied-superconductivity-conference/ LOCATION:Hawaii Convention Center\, 1801 Kalākaua Ave\, Honolulu\, HI\, 96815\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ASC-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221018T100000 DTEND;TZID=America/Los_Angeles:20221018T180000 DTSTAMP:20221011T163924Z CREATED:20220926T195009Z LAST-MODIFIED:20221011T163924Z UID:5236-1666087200-1666116000@marketingeda.com SUMMARY:RISC-V Con DESCRIPTION:In order to foster stronger collaboration on RISC-V across the computing industry\, RISC-V CON focuses on this disruptive technology\, demonstrating its benefits and identifying commercial strategies. Through RISC-V CON\, the RISC-V community and ecosystem can share the most up-to-date development and RISC-V based products and solutions. \nSeventeen years in business and a Founding Premier member of RISC-V International\, Andes Technology is a leading supplier of high-performance/low-power 32/64-bit embedded processor IP solutions\, and the driving force in taking RISC-V mainstream. Its V5 RISC-V CPU families range from tiny 32-bit cores to advanced 64-bit cores with DSP\, FPU\, Vector\, Linux\, superscalar\, and/or multicore capabilities. The annual volume of Andes-Embedded SoCs has exceeded 3 billion since 2021 and continues to rise. In the end of 2021\, the cumulative volume of Andes-Embedded™ SoCs has surpassed 10 billion. \nBy bringing the leading companies in the RISC-V ecosystem together at RISC-V CON\, Andes aims to boost RISC-V adoption by collaborating with partners and customers to quickly bring innovative designs based on the open RISC-V ISA to market. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/risc-v-con/ LOCATION:DoubleTree Hotel\, 2050 Gateway Place\, San Jose\, CA\, 95110\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/RISC-V-Con.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Indian/Maldives:20221012T080000 DTEND;TZID=Indian/Maldives:20221013T170000 DTSTAMP:20221009T034631Z CREATED:20221009T034234Z LAST-MODIFIED:20221009T034631Z UID:5276-1665561600-1665680400@marketingeda.com SUMMARY:IESA Vision Summit 2022 DESCRIPTION:The 17th edition of IESA flagship event\, IESA Vision Summit 2022 is scheduled on 12th and 13th October 2022 in Bengaluru. This is our flagship event where most of the Semiconductor and ESDM companies from India and the world come under one roof. The objective of the event is to enable DESIGN IN INDIA and to give opportunities to INDIAN BRANDS of electronic products to showcase their products for bigger outreach.The event aims to showcase the ecosystem partners as well who would help MAKE IN INDIA to happen. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/iesa-vision-summit-2022/ LOCATION:The LaLIT\, Bangalore\, India CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IESA-October-12-13-2022-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221004T080000 DTEND;TZID=America/Los_Angeles:20221007T170000 DTSTAMP:20220922T205335Z CREATED:20220922T205335Z LAST-MODIFIED:20220922T205335Z UID:5227-1664870400-1665162000@marketingeda.com SUMMARY:PCB West 2022 DESCRIPTION:For more than 30 years PCB West has trained designers\, engineers\, fabricators and\, lately\, assemblers on making printed circuit boards for every product or use imaginable. More than 2\,500 designers\, fabricators\, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables\, there’s something for everyone involved in the electronics supply chain. This is one show you cannot afford to miss. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/pcb-west-2022/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/PCB-West-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220925T080000 DTEND;TZID=America/Los_Angeles:20220930T170000 DTSTAMP:20220811T164130Z CREATED:20220811T164056Z LAST-MODIFIED:20220811T164130Z UID:5047-1664092800-1664557200@marketingeda.com SUMMARY:International Test Conference DESCRIPTION:We are back live and what a grand place to have our first live event in three years; Disneyland! We have a fantastic program that addresses new test technology challenges that significantly affect today’s electronic products! \nITC is the world’s premier conference dedicated to electronics test. This year’s ITC continues with its mission to play a unique role as an information sharing forum\, where the wide range of its offerings allows ITC participants to learn\, network and conduct business. This year’s program includes a top-notch technical program\, vibrant exhibitors\, information-packed tutorials\, interactive technical panels\, two focused workshops\, as well as the all-important networking that these events can provide. The technical program has been designed to optimize personal interactions on all levels. This year’s program will include papers from a pool of impressive submissions and solicited papers. Of these submissions\, a large number will focus on AI\, automotive\, memory\, and hardware security. In complement to the paper presentations\, there will be special sessions on hardware security certification\, chiplet integration\, silicon lifecycle management\, computing in memory\, as well as design and test of high-power compound devices and quantum electronics. \nWe are continuing and expanding on the inclusion of the Industrial Practice papers sessions as ITC has a very strong focus on industry practice as well as industry and academia advances. The three keynotes will encompass the past\, present and future of our industry. In addition\, there will be a visionary talk on AI accelerators. \nITC 2022 features a vibrant exhibition showcasing relevant companies. The exhibition will serve as a convenient one-stop-shop for all the elements of test technology. \nIn the past 53 years\, ITC has helped globalize our industry and wants to continue to do so in the future. This year’s return to a live event will enable us to embrace all of the features of the conference we have missed such as personal interaction and networking. Join us for the Wine and Cheese event after the Monday evening panel which kicks off ITC 2022. The ITC Grand Reception will be held Tuesday evening on the beautiful Magic Kingdom Lawn. \nLast\, but not least\, I would like to recognize the enormous efforts of the multitude of dedicated volunteers who made ITC possible by donating their time\, expertise\, and enthusiasm. Without their hard work and dedication\, ITC would not be possible. Please feel free to contact us if you would like to join our exciting team in the future. \nITC is the premier event for networking\, where professionals from all over the world converge to sharpen skills\, exchange ideas and do business. Join us\, throughout the conference\, for networking activities to unwind at the “Happiest Place on Earth”\, Disneyland! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/international-test-conference/ LOCATION:Disneyland Hotel\, 1150 West Magic Way\, Anaheim\, CA\, 92802\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITC-2022.jpg END:VEVENT END:VCALENDAR