BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20200308T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20201101T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20210314T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20211107T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Jerusalem BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20210326T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20211030T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20220325T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20221029T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20230324T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20231028T230000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Indian/Maldives BEGIN:STANDARD TZOFFSETFROM:+0500 TZOFFSETTO:+0500 TZNAME:+05 DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220531T080000 DTEND;TZID=America/Los_Angeles:20220603T170000 DTSTAMP:20220524T181804Z CREATED:20220524T181804Z LAST-MODIFIED:20220524T181804Z UID:4755-1653984000-1654275600@marketingeda.com SUMMARY:ITherm 2022 DESCRIPTION:Welcome to ITherm 2022\nThe Intersociety Conference on Thermal and\nThermomechanical Phenomena in Electronic Systems\nMay 31 – June 3\, 2022\nSheraton Hotel & Marina San Diego\, CA USA\n(Co-Located with ECTC)\n  \nSponsored by the IEEE’s Electronics Packaging Society (EPS)\, ITherm 2022 is an international conference for scientific and engineering exploration of thermal\, thermomechanical and emerging technology issues associated with electronic devices\, packages and systems. \nITherm 2022 will be held along with the 72nd Electronic Components and Technology Conference (ECTC 2022 – http://www.ectc.net)\, a premier electronics packaging conference at the Sheraton Hotel & Marina\, San Diego\, CA\, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits\, ITherm 2022 will include panel discussions\, keynote lectures by prominent speakers\, invited technology talks\, ECTC/ITherm joint networking events and short courses\, and a student design competition. \nAll papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/itherm-2022/ LOCATION:Sheraton Hotel & Marina\, 1380 Harbor Island Drive\, San Diego\, CA\, 92101\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/ITherm-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220531T080000 DTEND;TZID=America/Los_Angeles:20220603T170000 DTSTAMP:20210917T063113Z CREATED:20210917T063113Z LAST-MODIFIED:20210917T063113Z UID:3364-1653984000-1654275600@marketingeda.com SUMMARY:2022 IEEE 72nd Electronic Components and Technology Conference DESCRIPTION:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging\, components and microelectronic systems science\, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. \nAbstract Submission is Open | Subscribe to our mailing list \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/2022-ieee-72nd-electronic-components-and-technology-conference/ LOCATION:The Sheraton San Diego Hotel and Marina\, 1380 Harbor Island Drive\, San Diego\, CA\, 92101\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ECTC.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20220531T080000 DTEND;TZID=Asia/Tokyo:20220602T170000 DTSTAMP:20220510T154735Z CREATED:20220510T154735Z LAST-MODIFIED:20220510T154735Z UID:4668-1653984000-1654189200@marketingeda.com SUMMARY:RISC-V Days Tokyo 2022 Spring DESCRIPTION:RISC-V Days Tokyo is Japan’s largest online RISC-V event.  Live online presentations are hosted on May 31st (Tue)\, June 1st (Wed) and 2nd (Thu). There will also be a virtual “RISC-V Pavilion” for the last two days. RISC-V Days Tokyo aims to bring together leading RISC-V technologies and products\, key persons and engineers\, and to provide business opportunities for product recognition\, collaboration among companies\, technology exchange and information gathering. We look forward to your participation in this opportunity! \n \n\nGoogle\nSiemens\nefabless\nImperas\nSHC\nDTS\n\n\n\nSiFive\nCodaSip\neFinix\neSol Trinity\nGigaDevice\nIAR Systems\n\n\n\nImagination\nMIPS\nSIgnate\nRISC-V\nKeio University\nRed Hat\nThe University of Tokyo\nUEC Tokyo\n\n\n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/risc-v-days-tokyo-2022-spring/ LOCATION:CA CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/RISC-V-Day-Tokyo-2022-Spring-Logo.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220528T080000 DTEND;TZID=America/Los_Angeles:20220601T170000 DTSTAMP:20220527T154235Z CREATED:20220527T154235Z LAST-MODIFIED:20220527T154235Z UID:4775-1653724800-1654102800@marketingeda.com SUMMARY:ISCAS 2022 DESCRIPTION:The IEEE International Symposium on Circuits and Systems (ISCAS) \nISCAS 2022 will be held in Austin Texas from May 28 through June 1.  Austin is one of the fastest growing cities in the United States.   Much of this growth is attributable to the rapidly growing tech sector in the Austin metropolitan area.  The large and dynamic tech sector will provide an opportunity to include a strong industrial presence in the conference. \n  \nFollowing the lead of the ISCAS 2021 organizers that used a hybrid format whereby some participants attended in person and others participated virtually\, a hybrid format will be established for ISCAS 2022.   As we hopefully enter the post-pandemic era\, our intentions are to expand the on-site in-person activities but for those that either can-not or prefer to not attend in person\, for whatever reason\, we also plan on providing the opportunity for anyone to participate virtually.  In keeping with the tradition of maintaining a high-quality technical program\, the paper submission procedure and the review guidelines will be identical irrespective of whether the presentation is made in-person in a lecture session\, in-person in a poster session\, or virtually. \n  \nNew to ISCAS 2022 will be an early-bird paper submission option and correspondingly a somewhat earlier review decision date on submitted papers.   This should provide additional lead time for those that need to obtain a visa.   We are tentatively planning on waiving tutorial registration fees for authors of accepted early-bird submissions as well.  Additional details will be provided later. \n  \nWe look forward to your participation in ISCAS 2022 in person\, in Austin Texas\, or virtually if that better suits your needs. \n  \nOn behalf of the ISCAS Organizing Committee:    Randall Geiger and Steve Kang\,      General Co-Chairs \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/iscas-2022/ LOCATION:Austin Hilto\, 500 E 4th Street\, Austin\, TX\, 78701\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/ISCAS-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220522T000000 DTEND;TZID=America/Los_Angeles:20220525T000000 DTSTAMP:20220518T165053Z CREATED:20220518T165053Z LAST-MODIFIED:20220518T165053Z UID:4722-1653177600-1653436800@marketingeda.com SUMMARY:IEEE ISPSD 2022 DESCRIPTION:The IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) is the premier forum for technical discussions in all areas of power semiconductor devices and power integrated circuits. Topics include\, but not limited to\, device physics\, modelling\, design\, fabrication\, materials\, packaging and integration\, device reliability\, and device/circuit interactions. \nThe conference venue rotates annually through regions of the world and this year marks a return to Canada after an absence of more than 20 years. IEEE ISPSD 2022 will be held in hybrid format\, with the in-person portion hosted in Vancouver\, Canada at the waterfront Marriott Pinnacle Downtown Hotel. \nCradled amid snowcapped mountains and sparkling ocean\, Vancouver is one of the world’s premier meeting and convention destinations. World-renowned cuisine and a great venue all add up to an unforgettable conference experience. Conference participants will have the chance to explore a modern\, cosmopolitan city that blends upbeat culture and breath-taking landscape. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-ispsd-2022/ LOCATION:Marriott Pinnacle Downtown Hotel\, Vancouver\, BC\, Canada CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/ISPSD-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220517T080000 DTEND;TZID=America/Los_Angeles:20220518T170000 DTSTAMP:20220511T162123Z CREATED:20220511T162123Z LAST-MODIFIED:20220511T162123Z UID:4677-1652774400-1652893200@marketingeda.com SUMMARY:Embedded Vision Summit DESCRIPTION:The premier event for practical\, deployable computer vision and visual AI\, for product creators who want to bring visual intelligence to products. \n\n\n\n\nThe Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems\, cloud solutions and mobile applications. \n\n\nWhy attend? It’s a First-Rate Program with Powerful Insights into Practical Visual AI. \n\n\n\n\n\nJoin us for four days of learning—from tutorials to deep-dive days\, covering the latest technical insights\, business trends and vision technologies—all with a focus on practical\, deployable computer vision and visual AI. The Summit connects the theories from great academic conferences\, like CVPR\, to the concrete needs of innovators building real-world products. \n\n\n\n\n\n4 Reasons the Embedded Vision Summit is Different from Other Conferences\n\n\n\n\n\n\nThe Summit is by innovators\, for innovators.\n\n\nWe have a relentless focus on practical information for people incorporating vision and AI into products to solve real-world problems.\n\n\nWe’ve been doing this for 11 years.\n\n\nA whopping 97% of our attendees would recommend the Summit to a colleague.\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/embedded-vision-summit/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/Embedded-Vision-Summit-May-16-19-2022.png END:VEVENT BEGIN:VEVENT DTSTART;VALUE=DATE:20220517 DTEND;VALUE=DATE:20220519 DTSTAMP:20220509T181100Z CREATED:20220509T180950Z LAST-MODIFIED:20220509T181100Z UID:4652-1652745600-1652918399@marketingeda.com SUMMARY:Advantest VOICE 2022 DESCRIPTION:VOICE Registration is sold out and the event is at full capacity. We apologize for any inconvenience.\nVOICE is a developer conference\, created by test engineers for test engineers. \n\n\n\n\n\n\n\n\nEach year\, the VOICE Developer Conference unites semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs)\, foundries\, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements\, express new ideas\, share best practices and network with one another. \n  \n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/advantest-voice-2022/ LOCATION:OMNI Scottsdale Resort\, Scottsdale\, AZ\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/Advantest-VOICE-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220512T080000 DTEND;TZID=America/Los_Angeles:20220512T170000 DTSTAMP:20220407T162103Z CREATED:20220407T161329Z LAST-MODIFIED:20220407T162103Z UID:4521-1652342400-1652374800@marketingeda.com SUMMARY:Silicon Leadership Summit DESCRIPTION:The 2022 Silicon Leadership Summit will be hosted as the first in-person live event since early 2020. The SLS is GSA’s technology and business conference\, an unique platform that brings together executives across the expanded semiconductor ecosystem at the intersection of semiconductors\, software\, systems\, solutions\, and services for thought leadership\, and collaborative dialogue\, providing deep insights on technology and business model innovations\, emerging market trends\, and growth opportunities. It is meant to promote innovation\, entrepreneurship\, collaboration\, and advancement of the industry and the wider impact it has on the global economy. \nIncreasing Possibilities and Responsibilities\nAs the world becomes ubiquitously smarter and more connected\, semiconductors are needed more than ever and playing an essential role at the core of technology innovations. Growth opportunities in industrial\, commercial\, to consumer markets\, driven by these innovations continue to emerge\, and the possibilities are endless. Underpinning these emerging opportunities are the advancements in High Performance Computing\, Artificial Intelligence\, and 5G connectivity enabled by semiconductors. The Silicon Leadership Summit will bring together executives and disruptive innovators for thought leadership on evolving technology and market trends driving growth of the industry and conduct an insightful dialogue to address the challenges to make the growth of the industry sustainable. \nPricing: $99 GSA Members | $299 GSA Guests\nSpeakers\n\nAnni Hellman\, European Commission\, Deputy Head of Unit\nArun Iyengar\, Untether AI\, CEO\nDerek Chamorro\, Cloudflare\, Security Expert\nGaurav Gupta\, Gartner\, Vice President\, Emerging Technologies and Trends\nJiani Zhang\, Capgemini Engineering\, EVP & Chief Software Officer\nLucio Lanza\, Lanza techVentures\, Managing Director\nMallik Tatipamula\, Ericsson\, CTO\, Ericsson Silicon Valley\nMarc Canel\, Imagination Technologies\, VP\, Strategy & Business Development\nMax Mirgoli\, imec\, EVP\, Worldwide Strategic Partnerships\nMike Noonen\, Mixcomm\, CEO\nRaghu Kondapalli\, Axiado\, VP\, Architecture\nStephen Rothrock\, ATREG\, >Founder\, President & CEO\nSteve Pawlowski\, Micron Technology\, CVP\, Advanced Memory Systems\nSteven Leslie\, The Economist\, Lead Analyst\nVeerbhan Kheterpal\, Quadric.io\, CEO & co-Founder\nVikas Gupta\, GlobalFoundries\, Sr. Director\, Compute & Wired Infrastructure Business Unit\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/silicon-leadership-summit/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-May-12-2022-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220510T080000 DTEND;TZID=America/Los_Angeles:20220512T170000 DTSTAMP:20220429T015316Z CREATED:20220421T220326Z LAST-MODIFIED:20220429T015316Z UID:4583-1652169600-1652374800@marketingeda.com SUMMARY:AutoSense Detroit 2022 DESCRIPTION:We can’t wait to bring our community back together at the Michigan Science Center in Detroit. Join us 10-12 May to hear from over 50 speakers from companies across the autonomous vehicle perception supply chain\, including  AMD\, BrainChip\, Indie Semiconductor\, ON Semiconductor\, Siemens\, STMicroelectronics\, Cadence\, Valeo\, MOBIS\, Synopsys\, Veoneer\, General Motors and Baraja. \nWith a full exhibition of over 30 key industry players\, a range of round table sessions and two drinks receptions\, you can maximise the opportunity to network with expert engineers\, academics\, and professionals. \nKey topics include developments in RADAR and LiDAR\, image quality\, data\, safe system design\, advances in camera technology\, in-cabin monitoring\, supply chain outlook and more. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/autosense-detroit-2022/ LOCATION:Michigan Science Center\, 5020 John R St\, Detroit\, MI\, 48202\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/AutoSens-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Jerusalem:20220510T080000 DTEND;TZID=Asia/Jerusalem:20220511T170000 DTSTAMP:20220427T065257Z CREATED:20220427T065257Z LAST-MODIFIED:20220427T065257Z UID:4604-1652169600-1652288400@marketingeda.com SUMMARY:ChipEx 2022 DESCRIPTION:ChipEx2022 The main event of the Israeli semiconductor industry\, will be held on May 10\, 2022 at the Expo Tel Aviv Conference Center. The event is expected to attract thousands of industry professionals including engineers\, development managers\, project managers\, professional experts\, procurement managers and more. ChipEx2022 will include lectures by the best experts from around the world who will deal with the challenges of developing leading edge technologies and explore new directions for development of the global semiconductor industry. It will also feature exhibition of the main service providers and manufacturers of advanced technologies for the chip industry. Sign up today to join the annual gathering of the semiconductor industry in Israel. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chipex-2022/ LOCATION:Expo Tel Aviv\, Tel Aviv\, Israel CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/chipex2022lecturerseng25042022-scaled.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Indian/Maldives:20220429T080000 DTEND;TZID=Indian/Maldives:20220501T170000 DTSTAMP:20220425T164358Z CREATED:20220425T164358Z LAST-MODIFIED:20220425T164358Z UID:4595-1651219200-1651424400@marketingeda.com SUMMARY:SemiconIndia Conference 2022 DESCRIPTION:he inaugural ‘SemiconIndia 2022’ Conference is being organised by India Semiconductor Mission in partnership with industry and industry associations under the visionary leadership of Hon’ble Prime Minister Shri Narendra Modi with the aim to make India a global hub for Semiconductor Design\, Manufacturing and Technology Development which will help propel the vision of India Semiconductor Mission. \nTheme: Catalyzing India’s Semiconductor Ecosystem \nVision: To position India on the Semiconductor map of the world and build a vibrant semiconductor innovation and manufacturing ecosystem. \nCONFERENCE HIGHLIGHTS\nThe Conference will be inaugurated by Hon’ble Prime Minister of India\, Shri Narendra Modi via Video Conference on 29th April\, 2022 at 11:00 AM. \nThe Conference brings together global leaders from Industry\, Academia and Research Institutions. \nThe Steering Committee for SemiconIndia Conference 2022 includes a mix of Startups\, Academia and Global Industry Leaders demonstrating the Government’s collaborative approach towards powering India’s semiconductor and electronics manufacturing ambitions. \nThe conference serves as the formal launch pad of India’s semiconductor strategy and policy which envisions making India a global hub for Electronics System Design and Manufacturing. \nEVENT SPEAKERS\nShri Ashwini Vaishnaw\nMinister for Electronics & Information Technology\, Railways and Communications \nShri Rajeev Chandrasekhar\nMinister of State for Electronics & Information Technology and Skill Development & Entrepreneurship \nSanjay Mehrotra\nPresident & CEO\, Micron Technology \nAnirudh Devgan\nPresident & CEO\, Cadence Design Systems \nRandhir Thakur\nPresident\, Intel Foundry Services\, Intel \nVinod Dham\nFounder Indo-Us Venture Partners \nSiva Sivaram\nPresident\, Western Digital \nAjit Manocha\nPresident & CEO\, SEMI \nProf. David Andrew Patterson\nProf. Emeritus\, UC Berkley \nProf. Arogyaswami Paulraj\nProf. Emeritus\, Stanford \nRaja Koduri\nExecutive VP\, Intel \nLars Reger\nCTO\, NXP Semiconductors \nSailesh Chittipeddi\nExecutive VP & GM IOT & Infrastructure\, Renesas \nRangesh Raghavan\nCorporate VP & GM (India)\, LAM Research \nWalden Rhines\nPresident & CEO\, Cornami \nJim Keller\nCTO & President\, Tenstorrent \nMatthew Grob\nCTO\, XCOM Labs \nProf. Kamakoti\nDirector\, IIT Madras \nProf. Umesh Mishra\nUC Santa Barbara \nProf. Rao Tummala\nGeorgia Tech \nDinesh Ramanathan\nCEO\, NextGen Power Systems \nPrimit Parikh\nPresident\, Transphorm \nNivruti Rai\nCountry Head\, Intel India \nBarun Dutta\nChief Scientist\, IMEC \nRaja Manickam\nCEO\, Tata Electroics (OSAT) \nJaya Jagdish\nCountry Head\, AMD India \nAkarsh Hebbar\nMD\, Avanstrate \nParag Naik\nCEO\, SAANKHYA Labs \nRama Divakaruni\nDistinguished Engineer\, IBM Research \nGanapathy Subramaniam\nPartner\, Celesta Capital \nVivek Sharma\nMD\, ST Microelectronics India \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semiconindia-conference-2022/ LOCATION:ITC Gardenia\, 1\, Residency Rd\, Bengaluru\, 560025\, India CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/semicon-india-April-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220426T080000 DTEND;TZID=America/Los_Angeles:20220427T170000 DTSTAMP:20220427T064316Z CREATED:20220127T174859Z LAST-MODIFIED:20220427T064316Z UID:4228-1650960000-1651078800@marketingeda.com SUMMARY:D&R IP SoC Silicon Valley 2022 DESCRIPTION:When : April 26th 2022 \nWhere : Computer History Museum\n1401 N. Shoreline Blvd\nMountain View\, CA 94043\, USA \nD&R IP-SoC Silicon Valley 2022 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. \nIP-SoC providers\, the seed of innovation in Electronic Industry\, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry. \nIP consumers can view at a glance the latest Technology trends and exciting Innovative IP/SoC products. Through a global view\, Electronic systems leaders may identify disruptive innovation leading to new market segment growth. \nPhysical meeting between vendors and consumers is the unique and non replaceable vehicle to engage business discussions between vendors and clients.\nNevertheless this event will also be “replicated” on line after the event aiming at triggering more business opportunities.\nPosting their talk and recording their presentations on easily accessible platforms will extend innovation sharing among the worldwide IP-SoC Community. \nAny question? Please contact us \n\nImportant Dates \n\nSubmission Deadline : March 1st 2022\nSlides and presentation records available on April 1st 2022\nPanel proposal to be submitted before February 25th 2022\nto gabriele.saucier@design-reuse.com\n\nAreas of interest (not limited to) : \nInnovation in technology \n• New technology for new applications\n• Foundries Ecosystem\n• IP and SoC on Advanced node\n• 3D packaging\, D2D\, C2C connectivity\n• Quantum computing and Qubit technology \nInnovative IP SoC \n• Low power Analog IP and Memory\n• Advanced Interface IP\n• IP SoC for Artificial Intelligence\n• IP/SoC for Automotive\, Avionics\, Defense…\n• RISC-V\, GPU\, Dedicated processor…\n• Security Solutions \nIP Best Practice \n• Business models\n• IP Management Platform\n• Market Analysis \nIP/SoC Design Methodology \n• Low Power\, and area optimized design\n• IP Integration & Design Flows\n• Verification and Emulation \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dr-ip-soc-silicon-valley-2022/ LOCATION:Computer History Museum\, 1401 N. Shoreline Blvd\, Mountain View\, CA\, 94043\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Design-and-Reuse-April-26-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220424T080000 DTEND;TZID=America/Los_Angeles:20220427T170000 DTSTAMP:20211119T015030Z CREATED:20211119T015030Z LAST-MODIFIED:20211119T015030Z UID:3754-1650787200-1651078800@marketingeda.com SUMMARY:2022 IEEE Custom Integrated Circuits Conference (CICC) DESCRIPTION:The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations\, exhibits\, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design problems\, improve circuit design techniques\, get exposure to new technology areas\, and network with peers\, authors and industry experts. \nThere are 3 days of Technical Sessions that include lecture presentations addressing state of the art developments in integrated circuit design. The Educational Sessions are a full day of tutorials instructed by recognized invited speakers. The Panels\, and Forums are presented throughout the conference to enrich the learning experience of the attendees. The Panel Discussions and Forums are presented by leaders from the IC industry. CICC includes an Exhibits Hall that is open in the evenings where Semiconductor manufacturers\, software tool suppliers\, silicon IP providers\, design-service houses\, and technical book publishers offer displays and demonstrations of their products. CICC is sponsored by the IEEE Solid-State Circuits Society and technically co-sponsored by the IEEE Electron Devices Society. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/2022-ieee-custom-integrated-circuits-conference-cicc/ LOCATION:Renaissace Newport Beach\, 4500 MacArthur Blvd\, Newport Beach\, CA\, 92660\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CICC-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220420T080000 DTEND;TZID=America/Los_Angeles:20220421T170000 DTSTAMP:20220406T202613Z CREATED:20220406T202537Z LAST-MODIFIED:20220406T202613Z UID:4513-1650441600-1650560400@marketingeda.com SUMMARY:Linley Spring Processor Conference 2022 DESCRIPTION:TechInsights is pleased to continue the semi-annual Linley Processor Conferences\, established more than a decade ago. This year\, the Linley Spring Processor Conference will return to Santa Clara on April 20-21\, 2022 with a new hybrid format; if you can’t attend in person\, you can tune in to our virtual livestream. \nPresentations will address processors and IP cores for AI applications\, embedded\, data-center\, automotive\, and server designs. In-person attendees will be able to hear presentations and interact with the speakers during Q&A\, lunch\, and the networking reception. \nAnalyst and Industry Keynotes \nLinley Gwennap\, principal analyst\, TechInsights\, will open the conference with an overview of the latest market\, technologies\, equipment-design\, and silicon trends. We’ll also feature a keynote from another industry leader. \nIn-Depth Technical Sessions \nUnlike many conferences\, we ensure that the presentations deliver real technical content\, not marketing hype. We’re the conference of choice for many companies who announce new products or make technology disclosures. TechInsights analysts carefully select session topics and choose leading speakers who are experts in their fields. In addition\, the analysts ensure that the content of the presentations are full of insightful\, technical information that will help attendees select the right components and systems for their next project. \nThe program will feature talks and panel discussions covering a broad range of topics: \nAgenda Day 1\nAgenda Day 2 \nWhy Attend \nThe Linley Processor Conferences have been called the highest quality of their kind by previous attendees because they provide a unique opportunity to hear\, question\, and network with key providers of advanced technology products. \nThe conferences analyze products and design strategies in a particular technology segment\, providing information that engineers can immediately use to improve their designs. The events feature in-depth technical presentations from our own analysts as well as leading technologists from the industry. \nFree Admission \nWe offer free admission to qualified registrants\, making it easy to participate. The conference is intended for chip designers\, system designers\, equipment vendors\, OEM/ODMs\, service providers\, press\, and the financial community. \nCOVID-19 Policies and Precautions \nWe are working closely with the Hyatt Regency to reduce the risk of attending our in-person event. Individuals and their employers\, however\, must decide what level of risk is acceptable. For those unable to attend in person\, we offer our virtual livestream. \nAttendees will be required to provide proof of vaccination before receiving their conference badge. Consistent with local health orders\, masks are now recommended but not required. Policies are subject to change; we will update this page as needed. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/linley-spring-processor-conference-2022/ LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Linley-April-20-21-22-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220406T080000 DTEND;TZID=America/Los_Angeles:20220408T170000 DTSTAMP:20210903T184344Z CREATED:20210903T184344Z LAST-MODIFIED:20210903T184344Z UID:3198-1649232000-1649437200@marketingeda.com SUMMARY:ISQED Symposium 2022 DESCRIPTION:The 23rd International Symposium on Quality Electronic Design (ISQED’22) is the premier interdisciplinary and multidisciplinary Electronic Design conference—bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools\, integrated circuit technologies\, semiconductor technology\,packaging\, assembly & test to achieve total design quality. Current and all past ISQED events have been held with the technical sponsorship of IEEE CASS\, IEEE EDS\, IEEE Reliability Society\, and in-cooperation with ACM/SigDA. All past Conference proceedings & Papers have been published in IEEE Xplore digital library and indexed by Scopus. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isqed-symposium-2022/ LOCATION:CA CATEGORIES:Conference ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/ISQED_home_header_2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220405T080000 DTEND;TZID=America/Los_Angeles:20220407T170000 DTSTAMP:20220301T023630Z CREATED:20210903T205459Z LAST-MODIFIED:20220301T023630Z UID:3257-1649145600-1649350800@marketingeda.com SUMMARY:DesignCon 2022 DESCRIPTION:The Must Attend Event for Chip\, Board\, and Systems Design Engineers \nDesignCon is the premier high-speed communications and system design conference\, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/designcon-2022/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DesignCon-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220328T080000 DTEND;TZID=America/Los_Angeles:20220330T170000 DTSTAMP:20220128T183820Z CREATED:20220128T183820Z LAST-MODIFIED:20220128T183820Z UID:4241-1648454400-1648659600@marketingeda.com SUMMARY:tinyML Summit 2022 DESCRIPTION:Registration will open by January 31 \nWhat seemed like a dream a few years ago is quickly turning into reality. Problems which used to require Gigabytes to solve\, became Megabytes and then Kilobytes. Join us at the tinyML Summit 2022 to take part in the sharing\, learning\, and celebrating tinyML. \nWith ever more pervasive advances in technology and algorithms\, tinyML is rapidly becoming a reality. In the tinyML community\, we stand on the shoulders of giants. It is the incredibly open and collaborative nature of ML technology which allows this field to advance so quickly. From its inception in 2019\, the tinyML community has grown tremendously and has benefited greatly by supporting one another. We all hold unique pieces of the puzzle\, but it is through leveraging the collective knowledge of the community that we can move together more quickly. \nIn conjunction with the Summit\, the tinyML Research Symposium 2022 will be held on Monday\, March 28. \n\n\n\n\n\nVenue\n\n\nHyatt Regency San Francisco Airport\n\n1333 Bayshore Highway\, Burlingame\, CA 94010. \n\nRoom Booking\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nVENUE & ACCOMMODATIONS \nHyatt Regency San Francisco Airport \nRoom Booking \nThe cut-off date is Monday\, March 7th\, 2022.  After March 7 rooms may still be available but may have a higher prevailing rate. \nPROGRAM PREVIEW\n \nFive sessions have been planned focusing on several different areas related to tinyML. You will be hearing from selectively invited speakers from each area: \nTalk to Me! TinyML opportunities in smart audio\nSession Leader: Chris Rowen\, Cisco \nAudio is a uniquely attractive target for Tiny machine learning. On one hand\, audio\, especially speech\, hosts richly layered information on communication intent\, identity\, location\, emotion and events. On the other hand\, it is densely encoded so this rich diversity of information is surprisingly hard to extract and interpret. Machine Learning methods prove remarkably effective\, opening up countless applications in speech recognition\, event detection\, voice trigger\, speech transformation and generation. The relatively low bit-rates for audio make it possible to capture and process audio in small power budgets\, and the privacy and latency concerns often make it necessary to concentrate audio processing at the edge – a perfect storm for tinyML audio opportunity. \ntinyML Vision: Efficient design of tiny vision models for IoT devices\nSession Leader: Song Han\, MIT \nComputer vision is popular application for tiny machine learning. Many vision applications require real-time\, low-latency processing\, and privacy is a big priority\, thus recognizing the images/videos locally on tiny edge devices has a lot of opportunity. However\, the large computation and memory footprint poses a challenge on these low-power devices\, which goes worse as the resolution requirement gets larger. Opportunities including model compression and neural network and accelerator co-design opens up a larger design space for tiny machine learning for vision\, which has a large market in smart home\, smart factory\, smart driving\, smart healthcare\, and more. \n\n\n\n\ntinySensing: Scaling tinyML solutions with optimized edge sensing capabilities\nSession Leader: Steve Whalley\, tinyML Board of Directors member \nAs more is done on the edge with less power\, code and real estate\, what does this mean for sensor requirements to stay aligned with the explosive tinyML growth? Going beyond popular tinyML applications in camera sensing for vision and MEMS microphones for audio\, will traditional inertial\, environmental\, medical sensing\, etc. capabilities suffice? What new innovations and ‘smart capabilities’ be required to squeeze more performance\, bandwidth\, lower power\, memory\, analog and ASIC capability into edge sensing solutions? Will changes in Machine Learning methods and tools be needed? Will printed sensing\, with the promise of tiny footprints and power\, be the future darling of tinyML? This session will delve into some of the opportunities\, challenges and trends in the tinySensing world and provide a rigorous dialog on what is needed. \ntinyHardware – there’s plenty of room at the bottom\nSession Leader: Francesco Conti\, University of Bologna \ntinyHardware stands at the crossroads between algorithm\, technology\, and architecture. Aggressive algorithmic optimizations such as quantization\, pruning\, and analog computation do not destroy Machine Learning’s capability to decode and interpret information – rather\, they introduce smooth degradations that can often be tolerated. On the other hand\, these optimizations offer a large “attack surface” for emerging technology such as non-volatile memory\, analog in-memory computing\, and innovative chip-to-chip links – as well as for novel architecture in terms of dataflow choices\, sparsity support\, core/memory coupling and caching schemes. Altogether\, these opportunities define a huge design space spanning from low-bitwidth ISA extensions to multi-chip systolic arrays to System-on-Chips with core-coupled in-memory accelerators – a space that we have just started to navigate in the quest to raise system-level energy efficiency of tinyML applications while enabling more complex Tiny applications. \ntinySW/Tools: Enabling tiny experiences for the real-world\nSession Leader: Alessandro Grande\, Edge Impulse \nSoftware and tools specifically designed for tiny machine learning (tinyML) are empowering researchers\, data scientists and embedded engineers to pave the way for a whole new class of experiences. Whereas the focus was initially on creating software and tools to make each step of the process possible — on one hand enabling data scientists to create datasets\, train and optimize models able to run on resource-constrained devices\, on the other hand helping embedded engineers use the models to develop applications capable of efficiently performing inference on the microcontrollers themselves — we are now starting to see a shift towards software and tools that allow scientists and engineers to leverage tinyML in real-world use cases. Opportunities lie in tightly integrated end-to-end platforms\, new data augmentation methods\, performance analysis tools\, as well as optimization tool techniques. This tinySW/Tools session will explore some of the recent advancements in the field\, while uncovering some of the challenges we are facing as an industry. \nAutoTinyML design\nSession Leader: Danilo Pau\, STMicroelectronics \nLatest generation microcontrollers\, sensors\, digital signal processors\, and ultra-low power accelerometers are opening numerous possibilities in compact machine learning (ML) applications with limited storage and power consumption. Now\, the over 10 million C developers of the embedded community are calling for useful productivity tools to support ML pipeline design from the earliest concept and design phases. The tools should automate ML topology design and optimize configuration without requiring developers to craft new solutions for each issue. \nThis session will focus on tools for Automated Tiny ML design and Hyper Parameter Search. Industrial and university experts will discuss the current and next-generation tools for embedding ML in small\, everyday applications. This is an excellent opportunity for attendees to learn how to deploy their models in tiny devices and ramp up ML design productivity. \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tinyml-summit-2022/ LOCATION:Hyatt Regecy San Francisco Airport\, 1333 Bayshore Highway\, Burlingame\, CA\, 94010\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/tinyML-Summit-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220327T080000 DTEND;TZID=America/Los_Angeles:20220331T170000 DTSTAMP:20220325T014433Z CREATED:20220325T014407Z LAST-MODIFIED:20220325T014433Z UID:4464-1648368000-1648746000@marketingeda.com SUMMARY:IRPS 2022 DESCRIPTION:For 60 years\, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States\, Europe\, Asia\, and all other parts of the world. \nThe 2022 IEEE IRPS will be presented as an in-person conference with a virtual component. \nFor those unable to physically attend IRPS in Dallas\, there will be a HYBRID component that includes the following: \n\n\nTechnical sessions (including Keynote and Invited speakers)\, Tutorials and YIR will be available in a LIVE streaming format. The streaming will only be available in Central Daylight Time (GMT-5) \n\n\nDuring the LIVE conference\, remote attendees will be able to participate in the Q&A period after the presentations \n\n\nTuesday evening Workshops and Wednesday evening Live Poster Session will not be available to remote attendees \n\n\nAfter the conclusion of the conference\, ON DEMAND access to all of the presentations\, posters\, Q&A communications\, as well as ongoing post conference chat capability with the authors will be made available to all registrants (in-person and virtual attendees) for the month of April \n\n\n2022 Keynotes\n\n\nMohsen Alavi – Corporate VP & General Manager Quality and Reliability\, Intel \n\n\nShankar Krishnamoorthy – GM Digital Design Group\, Synopsys \n\n\nNagasubramaniyan Chandrasekaran – Senior VP Technology Development\, Micron \n\n\n\n\nJun He – VP Corporate Quality & Reliability\, TSMC \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/irps-2022/ LOCATION:Hilton DFW Lakes Executive Conference Center\, 1800 Highway 26E\, Grapevine\, TX\, 76051\, United States CATEGORIES:Conference,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IRPS.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220321T080000 DTEND;TZID=America/Los_Angeles:20220324T170000 DTSTAMP:20220128T182927Z CREATED:20220128T182521Z LAST-MODIFIED:20220128T182927Z UID:4235-1647849600-1648141200@marketingeda.com SUMMARY:GOMACTech 2022 DESCRIPTION:WELCOME TO GOMACTech 2022\nEnabling Distributed Capabilities: Microelectronics Thriving in the Face of Change\n\n\nGOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \nSECURITY PROCEDURES\nThe GOMACTech Conference is an Unclassified\, Export-Controlled event that requires participants to be U.S. Citizens or legal U.S. Permanent Residents. All registrants\, including presenters and exhibitors\, must provide proof of U.S. Citizenship or Permanent Resident status prior to being permitted entry into the conference. Additionally\, a signed Non-Disclosure Statement will be required. Note that all NDAs must be completed and signed on site.\nYou may prove U.S. citizenship with any of the following:\n• U.S. Passport\n• Birth certificate AND valid government-issued photo ID\n• Naturalization certificate AND valid government-issued photo ID \nThe following are NOT proof of citizenship:\n• Voter registration card\n• Driver’s license \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gomactech-2022/ LOCATION:Hyatt Regecy Miami\, 400 South East Second Avenue\, Miami\, FL\, 33131-2197\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GOMACTech-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220314T080000 DTEND;TZID=America/Los_Angeles:20220323T170000 DTSTAMP:20220209T212528Z CREATED:20220209T212423Z LAST-MODIFIED:20220209T212528Z UID:4291-1647244800-1648054800@marketingeda.com SUMMARY:DATE 2022 DESCRIPTION:Design\, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test \nDATE conference is the main European event bringing together designers and design automation users\, researchers and vendors\, as well as specialists in the hardware and software design\, test and manufacturing of electronic circuits and systems. DATE puts a strong emphasis on both technology and systems\, covering ICs/SoCs\, reconfigurable hardware and embedded systems\, and embedded software. \nThe multi-day event consists of a conference with regular papers\, complemented by panels\, hot-topic sessions\, tutorials\, workshops\, special focus days and executives. The event will also host the Young People Program\, the University Fair and Multi-Partner Projects dissemination on innovative research activities fostering the networking and the exchange of information on relevant issues\, recent research outcomes and career opportunities. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/date-2022/ LOCATION:CA CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DATE-22.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220307T080000 DTEND;TZID=America/Los_Angeles:20220310T170000 DTSTAMP:20220307T202536Z CREATED:20220307T202536Z LAST-MODIFIED:20220307T202536Z UID:4414-1646640000-1646931600@marketingeda.com SUMMARY:IMAPS Device Packaging DESCRIPTION:The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center\, from March 7-10\, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). \nThe conference is a major forum for the exchange of knowledge and provides numerous technical\, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists\, process engineers\, product engineers\, manufacturing engineers\, professors\, students\, business managers\, and sales & marketing professionals. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/imaps-device-packaging/ LOCATION:We-Ko-Pa Resort & Conference Center\, 10438 Wekopa Way\, Fort McDowell\, AZ\, 85264\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/iMAPS-March-7-10-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220228T080000 DTEND;TZID=America/Los_Angeles:20220303T170000 DTSTAMP:20210916T173438Z CREATED:20210916T173438Z LAST-MODIFIED:20210916T173438Z UID:3356-1646035200-1646326800@marketingeda.com SUMMARY:DVCon U.S. 2022 DESCRIPTION:The Design & Verification Conference & Exhibition is the premier conference on the application of languages\, tools\, methodologies and standards for the design and verification of electronic systems and integrated circuits. The focus of this highly technical conference is on the practical aspects of these technologies and their use in leading-edge projects to encourage attendees to adopt similar techniques to improve their own design and verification flows. We will to return to a live\, in-person conference for 2022. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-u-s-2022/ LOCATION:DoubleTree Hotel\, 2050 Gateway Place\, San Jose\, CA\, 95110\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220227T080000 DTEND;TZID=America/Los_Angeles:20220301T170000 DTSTAMP:20220223T171622Z CREATED:20220223T171622Z LAST-MODIFIED:20220223T171622Z UID:4359-1645948800-1646154000@marketingeda.com SUMMARY:FPGA 22 DESCRIPTION:The ACM/SIGDA International Symposium on Field-Programmable Gate Arrays is a premier conference for presentation of advances in FPGA technology. Accepted papers will be published in the conference proceedings and available in the ACM Digital Library. \nVirtual Conference\nFebruary 27 – March 1\, 2022\nRegistration now open at: www.isfpga.org/registration\n\nStatement from the General Chair:\nWe have made the difficult decision to hold FPGA’22 as a virtual event. The risk that travel restrictions will still be in place\, limiting attendance to people already in the US\, makes keeping our hotel reservation untenable. We are disappointed to be missing out on getting together in-person for a second year\, but look forward to improved software that will make FPGA’22 more interactive and more flexible than last year. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/fpga-22/ LOCATION:CA CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FPGA-22.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220226T080000 DTEND;TZID=America/Los_Angeles:20220303T170000 DTSTAMP:20220228T054851Z CREATED:20210915T164311Z LAST-MODIFIED:20220228T054851Z UID:3327-1645862400-1646326800@marketingeda.com SUMMARY:35th International Conference on VLSI Design DESCRIPTION:International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems\, is attended by over 2000 engineers\, students & faculty\, industry\, academia\, researchers\, bureaucrats and government bodies. \nSilicon and Electronics today are the vital forces for all aspects of technology\, Industry and human life – enabling rapid advances in Computing\, Connectivity\, Storage and Sensors which have resulted in path breaking developments in the areas such as AI/ML\, 5G\, Mobility\, Cloud\, Edge and more. The future is starting to witness a “Confluence” of these technologies with Silicon continuing to be the fulcrum harnessing the power of each in a way that was unimagined so far. VLSID 2022 conference brings a unique opportunity to time travel the future of technologies and explore the role of Silicon in decades to come. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/35th-international-conference-on-vlsi-design/ LOCATION:CA CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/35th-International-Conference-on-VLSI-Design.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220202T080000 DTEND;TZID=America/Los_Angeles:20220204T170000 DTSTAMP:20220202T211210Z CREATED:20220202T211210Z LAST-MODIFIED:20220202T211210Z UID:4261-1643788800-1643994000@marketingeda.com SUMMARY:AltiumLive 2022 DESCRIPTION:Join us at AltiumLive 2022: CONNECT\, where you will Learn\, Connect\, and Get Inspired in a new immersive experience that includes multiple technical tracks and a multitude of networking opportunities. \n\nIn partnership with Apex Expo IPC\n\n\n\nFour Exciting Keynote Presentations from Industry Leaders\n30+ Technical Sessions on five uniquely curated tracks:\nDesign Principles & PracticesAltium Designer & Altium 365 TrainingSimulation\, Test\, & MeasurementSupply ChainManufacturing\n\nNetworking with industry peers\, experts and leading electronics companies\nEntertaining and Educational Virtual tour of the IPC APEX EXPO Floor\nVirtual “Design for Excellence” Tour AT&S\, Europe’s Largest PCB Factory\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/altiumlive-2022/ LOCATION:CA CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/AltiumLive-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220117T080000 DTEND;TZID=America/Los_Angeles:20220120T170000 DTSTAMP:20211222T000633Z CREATED:20211222T000633Z LAST-MODIFIED:20211222T000633Z UID:3940-1642406400-1642698000@marketingeda.com SUMMARY:27th Asia and South Pacific Design Automation Conference DESCRIPTION:In light of the continued COVID-19 pandemic situation\, the ASP-DAC 2022 will be held as a virtual conference. \nTechnical Program\nThe technical program has been announced. Please click here for more detail. \nUpload Presentation Files\nThe presentation guide has been announced. All upload links are available. Please click here for more detail. \nRegistration\nThe registration site is open. Please click here for the guide. The advanced program will be available soon. \nFinal Manuscript Submission\nThe camera-ready submission site has started receiving final manuscripts of accepted and invited papers. Please click here for more information. \nAims of the Conference\nASP-DAC 2022 is the 27th annual international conference on VLSI design automation in Asia and South Pacific region\, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists\, engineers\, and students who are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC. \nGeneral Information\n\n\n\nDate: Jan. 17-20\, 2022\nPlace: Taipei International Convention Center\, Taipei\, Taiwan\n\n\n\nVirtual Conference \n\n\n\nGeneral Chair:\nTing-Chi Wang\, National Tsing Hua University\, Taiwan\n\nTechnical Program Chair:\nMasanori Hashimoto\, Kyoto University\, Japan\n\nTechnical Program Vice Chairs:\nGi-Joon Nam\, IBM Research\, USA\nWai-Kei Mak\, National Tsing Hua University\, Taiwan\n\nDesign Contest Co-Chairs:\nIng-Chao Lin\, National Cheng Kung University\, Taiwan\nTsung-Te Liu\, National Taiwan University\, Taiwan\n\nSubmission of Papers / Design Descriptions:\nDeadline for submission:\n\n\n\nAll deadlines are firm and no extensions are allowed \n\n\n\nRegular paper:\n\nDeadline for paper submission: 5 PM AOE (Anywhere on earth) July 21 (Wed)\, 2021\n\nManuscript PDF\, even if it is a tentative version at this moment\, is necessary.\nAfter 5PM AOE July 21\, new submissions will not be accepted.\n\n\nDeadline for PDF update: 5 PM AOE (Anywhere on earth) July 28 (Wed)\, 2021\n\n\nUDC:\n\nDeadline for abstract submission: 5 PM AOE (Anywhere on earth) July 21 (Wed)\, 2021\nDeadline for summary uploading: 5 PM AOE (Anywhere on earth) July 28 (Wed)\, 2021\n\n\n\n\nNotification of acceptance:\n\nRegular Paper: Sep. 11 (Sat)\, 2021\nUDC: Sep.13 (Mon)\, 2021\n\n\nDeadline for final version:\n\nBoth regular paper and UDC: 5 PM AOE (Anywhere on earth) Nov. 5 (Fri)\, 2021\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/27th-asia-and-south-pacific-design-automation-conference/ LOCATION:CA CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/aspdac2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220105T080000 DTEND;TZID=America/Los_Angeles:20220108T170000 DTSTAMP:20211210T182455Z CREATED:20211210T182455Z LAST-MODIFIED:20211210T182455Z UID:3798-1641369600-1641661200@marketingeda.com SUMMARY:CES 2022 DESCRIPTION:CES is right around the corner\, and the excitement is building! Over 1900 exhibiting companies – with more being added every day – and hundreds of thought leaders from around the world are ready to show you how tech has never been more important in our lives. Key industry audiences are also showing strong commitment: 195 of the Fortune Global 500\, 77 of the Interbrand 100\, 66 of the top retailers\, leading US and global media and attendees from 159 countries are already registered and joining us in Las Vegas. We’re ready to bring the industry back together to experience the next generation of innovation. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ces-2022/ LOCATION:Las Vegas Covention and World Trade Center\, 3150 Paradise Rd\, Las Vegas\, NV\, 89109\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/CES-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220102T080000 DTEND;TZID=America/Los_Angeles:20220104T170000 DTSTAMP:20211221T235831Z CREATED:20211221T235831Z LAST-MODIFIED:20211221T235831Z UID:3932-1641110400-1641315600@marketingeda.com SUMMARY:IEEE Rising Stars Conference DESCRIPTION:Where Students and Young Professionals Come to Connect and be Inspired\nAs a premier event\, IEEE Rising Stars Global is designed to inform\, excite\, enthuse\, and enlighten the top engineering young professionals and students. The conference brings together the most promising students and young professionals around the world to network and is inspired by each other. The program includes interactive events\, competitions\, technical innovation talks from industry experts\, networking opportunities and professional development. The Rising Stars event consists of two tracks. One focuses on bringing together technical professionals who are experts in emerging technologies including autonomous vehicles\, space\, and manufacturing\, cloud computing\, big data\, artificial intelligence\, security\, and IoT. The Professional track consists of technical professionals who come to enlighten and inspire attendees to succeed in an ever-changing job environment and on how to develop as leaders in their respective fields. The IEEE Rising Stars Global provides direction and perspective to performing young professionals and students. Attendees at the event will gain insight on how best to further their careers by networking and learning from industry professionals and executives from leading international companies. Rising Stars Global attendees will leave the event with better preparation to face the challenges presented to them and armed with the appropriate contacts needed to gain the insight to be successful. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-rising-stars-conference/ LOCATION:Tropicana Las Vegas\, 3801 S Las Vegas Blvd\, Las Vegas\, NV\, 89109\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEEE-Rising-Stars.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211228T080000 DTEND;TZID=America/Los_Angeles:20211230T170000 DTSTAMP:20211203T192357Z CREATED:20211203T192357Z LAST-MODIFIED:20211203T192357Z UID:3786-1640678400-1640883600@marketingeda.com SUMMARY:SEMICON Taiwan DESCRIPTION:Semiconductor leaders and visionaries will convene at SEMICON Taiwan\, the region’s premier gathering of the entire electronics manufacturing and design supply chain. Hear about cutting-edge advancements in heterogenous integration\, green manufacturing\, smart manufacturing\, advanced testing\, strategic materials\, and MEMS and Sensors. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semicon-taiwan/ LOCATION:CA CATEGORIES:Conference ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/SEMICON-Taiwan.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211222T080000 DTEND;TZID=America/Los_Angeles:20211223T170000 DTSTAMP:20211213T190243Z CREATED:20211213T190243Z LAST-MODIFIED:20211213T190243Z UID:3818-1640160000-1640278800@marketingeda.com SUMMARY:ICCAD China DESCRIPTION:The CSIA-ICCAD 2021 Annual Conference & Wuxi IC Industry Innovation and Development Summit will be held at Wuxi Taihu International Expo Center on DECEMBER 22-23\, 2021. \nICCAD conference will discuss the opportunities and challenges faced by the IC industry\, especially the IC design industry\, and enhance the innovation capability and the integration capability of China’s IC industry chain to meet market demands and improve international competitiveness. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/iccad-china/ LOCATION:Wuxi Taihu International Expo Center\, Wuxi\, China CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CSIA-ICCAD-2021.jpg END:VEVENT END:VCALENDAR