BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT 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DTSTART:20231105T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20240310T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20241103T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20250309T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20251102T060000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20230101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Seoul BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:KST DTSTART:20230101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20230101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Istanbul BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0300 TZNAME:+03 DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240507T080000 DTEND;TZID=America/Los_Angeles:20240508T170000 DTSTAMP:20240503T163652Z CREATED:20240419T171240Z LAST-MODIFIED:20240503T163652Z UID:7877-1715068800-1715187600@marketingeda.com SUMMARY:ChipEx 2024 DESCRIPTION:ChipEx2024\, the largest annual event of the Israeli semiconductor industry\, will be held on May 7-8\, 2024 in Tel Aviv\, Israel. ChipEx2024 showcases companies including manufacturers\, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world’s leading experts address the industry’s most relevant issues. \nThe event is produced by ASG Ltd. in cooperation with SIA\, Semiconductor Industry Association and with Semi\, the largest global industry association. \nThe goal of ChipEx2024 is to update all professionals involved with the Israeli semiconductor industry with the latest technological innovations and future directions of the industry. \nChipEx2024 target audience are all people involved with the semiconductor industry including engineers\, R&D managers\, industry experts\, senior executives in microelectronics related companies\, multinational design centers\, consultants\, venture capital managers as well as electrical/electronic/computer science students & professors from the various universities around Israel. \nChipEx2024 consists of three main parts: \nVendors’ Exhibition \nThe ChipEx exhibition includes booths in various sizes for presentations and demonstrations of new design and development tools. This year\, the ChipEx2024 exhibition will take place on May 7\, 2024 at the Tel-Aviv Expo Center and will include industry vendors\, service providers\, and manufacturers of electronic design tools\, components and manufacturing equipment from Israel and around the globe. These exhibitors will exhibit and update the visitors with the latest developments in tools and services for the semiconductor industry. \nTechnical Seminar \nTechnical lectures given by industry experts\, senior executives from the semiconductor industry\, vendors\, and university professors. The format of the sessions intends to cultivate and promote an instructive and productive interchange of ideas and solutions among industry developers and designers. The lectures are divided to various tracks in separate halls and address the major topics related to the microelectronics industry. This year\, the ChipEx2024 technical seminar will take place on May 7\, 2024 at the Tel-Aviv Expo Center. \nChipEx2024 Executive Summit \nThe Closing session of ChipEx2024 will take place on May 8\, 2024 at Peres Center for Peace and Innovation and will include top industry figures and will act as the Executive summit of ChipEx2024 targeting Industry leaders and top executives from Israel and around the globe. \nChipEx2024 is a great opportunity for any industry vendor or service provider to meet its target audience as well as interact with the decision makers in the various Israeli semiconductor companies. \nWe invite you to take part in ChipEx2024 as an exhibitor\, a speaker and/or as a sponsor. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chipex-2024/ LOCATION:Tel Aviv Convention Center\, Rokach Boulevard 101\, Tel Aviv\, Israel CATEGORIES:Conference,EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ChipEx-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240430T080000 DTEND;TZID=America/Los_Angeles:20240501T170000 DTSTAMP:20240416T193144Z CREATED:20240416T193144Z LAST-MODIFIED:20240416T193144Z UID:7866-1714464000-1714582800@marketingeda.com SUMMARY:CXL DevCon 2024 DESCRIPTION:The CXL Consortium is looking forward to hosting the first Compute Express Link® (CXL®) DevCon from April 30 – May 1\, 2024\, in Santa Clara\, California! \nCXL DevCon is a unique opportunity for our Members to learn directly from CXL technology experts. Attendees will participate in CXL technical training\, view available products and technology demonstrations\, and network with industry peers. \nRegister for the event HERE. \nIf you are not currently a member of the CXL Consortium\, learn about our membership benefits HERE and contact admin@computeexpresslink.org with any questions or for additional information. \n  \nCONFERENCE PROGRAM \n\n\n\n\n\n\n\nDevCon 2024 Day 1 – Compliance & Implementation\n\n\nTime\nTitle\nPresenter(s)\n\n\n8:00 – 9:00\nRegistration\n\n\n\n9:00 – 9:15\nWelcome\nJim Pappas\, Intel – CXL Chairman\n\n\n9:15 – 9:45\nKeynote – History of CXL\nLarrie Carr\, Rambus – CXL President\n\n\n9:45 – 10:15\nCXL Specifications Overview\nDebendra Das Sharma\, Intel – TTF Co-Chair\n\n\n10:15 – 10:45\nCoffee Break & Exhibit\n\n\n\n10:45 – 11:30\nTechnical Spec Training (1.0/2.0)\nMahesh Wagh\, AMD – TTF Co-Chair\n\n\n11:30 – 12:00\nCXL Use Case – CXL Native Memory\nBill Gervasi\, Wolley\n\n\n12:00 – 1:00\nLunch & Exhibit\n\n\n\n1:00 – 1:20\nProving CXL scale-out and ROI in the data center\nIra Weiny\, Linux\n\n\n1:20 – 1:40\nCXL Software Ecosystem: The Software Stack for CXL\nSteve Scargall\, MemVerge\n\n\n1:40 – 2:00\nExploring Sunfish™: An Open-source Composable Disaggregated Infrastructure Framework\nMichael Aguilar\, OpenFabrics Alliance – OFA Secretary\n\n\n2:00 – 2:20\nRAS for Resilient Data Centric Platforms using a CXL Memory Controller\nSandeep Dattaprasad\, Astera Labs\n\n\n2:20 – 2:40\nMember Implementation: CXL Memory Latency Measurement Tutorial\nTam Do\, Microchip\n\n\n2:40 – 3:10\nBreak & Exhibit\n\n\n\n3:10 – 3:30\nUnderstanding the Need for Compliance\nAnil Godbole\, Intel\n\n\n3:30 – 3:50\nTesting CXL links using Exercisers & Analyzers\nYamini Shastry\, Viavi\n\n\n3:50 – 4:10\nCXL Testing – Protocol Layers & Testing Examples\nGordon Getty\, Teledyne LeCroy\n\n\n4:10 – 4:40\nFocusing on the Future of CXL Compliance\nNathan White\, Intel – CWG Co-Chair\n\n\n4:40 – 5:00\nDay 1 Open Q&A\nCWG / TTF Panel\n\n\n5:00 – 6:30\nNetworking Reception & Exhibit\n\n\n\n\n  \n\n\n\n\n\n\n\nDevCon 2024 Day 2 – Emerging & Future\n\n\nTime\nTitle\nPresenter(s)\n\n\n8:00 – 8:30\nRegistration and Exhibit\n\n\n\n8:30 – 9:30\nTechnical Spec Training (3.0/3.1)\nRob Blankenship\, Intel – PWG Co-Chair\n\n\n9:30 – 10:00\nMember Implementation: Streamlining CXL Adoption for Hyperscale Efficiency\nNilesh Shah\, ZeroPoint Technologies\n\n\n10:00 – 10:30\nTechnical Training – Security: Integrity and Data Encryption (IDE) Trends and Verification Challenges in CXL\nZongyao Wen\, Synopsys\n\n\n10:30 – 11:00\nCoffee Break & Exhibit\n\n\n\n11:00 – 11:20\nMember Implementation\nDr. Miryeong Kwon\, Panmnesia\n\n\n11:20 – 11:40\nMember Implementation\nGeof Findley\, Montage Technology\n\n\n11:40 – 12:10\nMember Implementation: Using a CXL 2.0 switch for CXL memory expansion\, pooling and sharing\nJianping (JP) Jiang\, PhD\, Xconn Technologies\n\n\n12:10 – 12:30\nMember Implementation: Building Composable and Disaggregated Systems of the Future with CXL 3.0\nRaju Pudota\, Cadence\n\n\n12:30 – 1:30\nLunch & Exhibit\n\n\n\n1:30 – 1:50\nMember Implementation: Improving system memory bandwidth with CXL software interweaving\nRavi Kiran Gummaluri\, Micron\n\n\n1:50 – 2:10\nMember Implementation: Exploring system memory expansion and memory pooling/tiering\nKapil Sethi\, Samsung\n\n\n2:10 -2:30\nMember Implementation: Enabling CXL Memory Module\, Exploring Memory Expansion Use Cases & Beyond\nThomas Won Ha Choi\, PhD\, SK hynix\n\n\n2:30 – 2:50\nMember Implementation: Optical Applications of CXL\nDavid Kulansky\, Alphawave Semi\n\n\n2:50 – 3:30\nBreak & Exhibit\n\n\n\n3:30 – 4:30\nFireside chat – open discussion + audience Q&A\nLeadership Panel\n\n\n4:30 – 5:00\nClosing comments and Call to Action\nKurtis Bowman\, AMD – MWG Co-Chair\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cxl-devcon-2024/ LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CXL-DevCon-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240425T080000 DTEND;TZID=America/Los_Angeles:20240425T170000 DTSTAMP:20240410T171939Z CREATED:20240410T171409Z LAST-MODIFIED:20240410T171939Z UID:7830-1714032000-1714064400@marketingeda.com SUMMARY:IP-SoC Silicon Valley 2024 DESCRIPTION:A worldwide connected Event !! \nD&R IP-SoC Silicon Valley 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. \nIP-SoC providers\, the seed of innovation in Electronic Industry\, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry. \nIP consumers can view at a glance the latest Technology trends and exciting Innovative IP/SoC products. Through a global view\, Electronic systems leaders may identify disruptive innovation leading to new market segment growth. \nAny question? Please contact us \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ip-soc-silicon-valley-2024/ LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IP-SoC-Silicon-Valley-24.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240421T080000 DTEND;TZID=America/Los_Angeles:20240424T170000 DTSTAMP:20240419T164318Z CREATED:20240419T164152Z LAST-MODIFIED:20240419T164318Z UID:7873-1713686400-1713978000@marketingeda.com SUMMARY:CICC 2024 DESCRIPTION:The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations\, exhibits\, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design problems\, improve circuit design techniques\, get exposure to new technology areas\, and network with peers\, authors and industry experts. \nThere are 3 days of Technical Sessions that include lecture presentations addressing state of the art developments in integrated circuit design. The Educational Sessions are a full day of tutorials instructed by recognized invited speakers. The Panels\, and Forums are presented throughout the conference to enrich the learning experience of the attendees. The Panel Discussions and Forums are presented by leaders from the IC industry. CICC includes an Exhibits Hall that is open in the evenings where Semiconductor manufacturers\, software tool suppliers\, silicon IP providers\, design-service houses\, and technical book publishers offer displays and demonstrations of their products. CICC is sponsored by the IEEE Solid-State Circuits Society and technically co-sponsored by the IEEE Electron Devices Society. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cicc-2024/ LOCATION:DoubleTree by Hilton Denver\, 3203 Quebec Street\, Denver\, CO\, United States CATEGORIES:Conference,EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CICC-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240419T080000 DTEND;TZID=America/Los_Angeles:20240421T170000 DTSTAMP:20240408T222220Z CREATED:20240212T205659Z LAST-MODIFIED:20240408T222220Z UID:7610-1713513600-1713718800@marketingeda.com SUMMARY:Latch-Up 2024: Boston DESCRIPTION:Friday to Sunday April 19–21\, 2024 in Boston\, MA\, USA \nThe Latch-Up conference is a weekend of presentations and networking dedicated to free and open source silicon. It’s an event for the open source digital design community\, much like its European sister conference ORConf\, run by the FOSSi Foundation. \n\n\n\n\n\nYou are all invited!\nThe FOSSi Foundation is proud to announce Latch-Up\, a conference dedicated to free and open source silicon to be held over the weekend of Friday April 19 to Sunday April 21 in Boston\, MA\, USA. \nLatch-Up is a weekend of presentations and networking for the open source digital design community\, much like its European sister conference ORConf. \nSo save the date\, register to attend\, and submit a presentation or proposal if you have a project or idea on the topic to share! \nQuestions? Ping the organizers via @LatchUpConf or send an email to latch-up@fossi-foundation.org. \n\n\n\nSubmit a talk\nWe encourage anybody involved in the open source semiconductor engineering space to come along and share your work or experience. Presentations slots as short as 3 minute lightning-talks and up to 30 minute talks including Q and A are available. \nSo if you’ve designed\, worked on or even just used open source IP cores and/or management systems\, verification IP\, build flows\, SoCs\, simulators\, synthesis tools\, FPGA and ASIC implementation tools\, languages and DSLs\, compilers\, or anything related we’d love to have you join us to share your experience. \nPresentations are submitted through the registration process and we will let you know if your presentation was accepted. \nTickets and registration\nAttendance of Latch-Up is free of charge. To help us organizing the event\, you are required to register on Eventbrite. Please register as soon as possible\, as we have to close registrations as soon as the room capacity is reached. \nAttendees who are joining us at Latch-Up on behalf of their company and/or can claim the conference as professional training expense are encouraged to purchase a professional ticket. These ticket sales help us provide all that we do at Latch-Up and keep the event accessible to all members of the community. Professional ticket holders are able to get their company name printed on their name badge and receive a special treat. \nWe ask all Latch-Up participants to adhere to the the FOSSi Foundation code of conduct throughout the event. \nFriday\n\n\n\nWhen\nWhat\n\n\n\n\n9:00\nWelcome\n\n\n9:20\nCaster: An Open-source E-Ink Controller\n\n\n9:40\nTeaching Modern EDA using a Tapeout-Centric University Course\n\n\n10:00\nBreak\n\n\n10:20\nCedarEDA for open source silicon\n\n\n10:40\nCohort: Software-Oriented Acceleration for You\, Me\, and Our Heterogeneous SoCs\n\n\n11:00\nTowards xBGAS on CHERI: Examining the Benefits of a Secure Distributed Architecture\n\n\n11:20\nLunch\n\n\n12:20\nTowards Cycle-accurate Simulation of xBGAS\n\n\n12:40\nArtifact Evaluation for the Field Programmable Gate Array Community\n\n\n13:00\nChisel 6 and beyond\n\n\n13:20\nMRPHS: Enabling Transaction-level Deductive Formal Verification Through PDVL\n\n\n13:40\nBreak\n\n\n14:40\nRiding The Wave: Building Wave Pipelines in FPGAs\n\n\n15:00\nGiving Students A Byte of Open-Source: Advancing Hardware Education\n\n\n15:20\nBreak\n\n\n15:40\nOpen-source resources for learning the Bluespec HL-HDLs\n\n\n16:00\nPyHDL-IF: An Easy-to-Use Python/HDL Cross-Calling Interface\n\n\n16:20\nTransition to Draper\n\n\n17:00\nTalks(30-40m) at Draper\n\n\n18:00\nTransition to lightning Talks\n\n\n19:00\nLightning Talks\n\n\n20:00\nGo home\n\n\n\nSaturday\n\n\n\nWhen\nWhat\n\n\n\n\n8:40\nWelcome\n\n\n9:00\nOpen source RTL verification with Verilator\n\n\n9:20\nSonata: A development platform to enable exploring the use of CHERI for embedded applications\n\n\n9:40\nTransparent Checkpointing for Fault Tolerance in RISC-V\n\n\n10:00\nBreak\n\n\n10:20\nHDLAgent\, Enhancing Hardware Language in the age of LLMs\n\n\n10:40\nSpade: An HDL Inspired By Modern Software Languages\n\n\n11:00\nSwitchboard: Calling All Hardware Models\n\n\n11:20\nLunch\n\n\n12:20\nFrom an Open-Source ISA to Open-Source HW to Open-Source Silicon\n\n\n12:40\nOpen Source Hardware: Hacking Silicon for Fun (instead of profit)\n\n\n13:00\nA History of TL-Verilog Google Summer of Code Projects under FOSSi Foundation\n\n\n13:20\nUMI: Universal Memory Interface\n\n\n13:40\nBreak\n\n\n14:20\nABC: The Way It Should Have Been Designed\n\n\n14:40\nBYOL (Build Your Own Linter) – UVMLint for IEEE-UVM core code development\n\n\n15:00\nBeyond EDA lies Edalize\n\n\n15:20\nBreak\n\n\n15:40\nRF Front-end receiver design for 2.4GH/5GHz WiFi application\n\n\n16:00\nCACE Study: Open source analog and mixed-signal design flow\n\n\n16:20\nIHP Open Source PDK: Announcement\, Setup\, Current State and Experiences\, and look ahead\n\n\n16:40\nTiny Tapeout: custom silicon open to all\n\n\n17:20\nMeet at Flattops\n\n\n\nSunday\nComing soon \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/latch-up-2024-boston/ LOCATION:Massachusetts Institute of Technology\, 77 Massachusetts Avenue\, Boston\, MA\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Latch-Up-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20240416T080000 DTEND;TZID=Europe/Brussels:20240417T170000 DTSTAMP:20240410T165555Z CREATED:20240410T165555Z LAST-MODIFIED:20240410T165555Z UID:7826-1713254400-1713373200@marketingeda.com SUMMARY:CS Inernational Conference DESCRIPTION:he 14th CS International builds on the strengths of its predecessors\, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ensuring SiC’s Phenomenal Success; Expanding Horizons for Surface Emitters; Accelerating the Growth of GaN; Taking Power from the Photon; and New Frontiers for the LED. \nThose attending these sessions will be rewarded with greater insight into device technologies while learning of the latest opportunities and trends within the compound semiconductor industry. Delegates will also discover significant advances in tools and processes that enable enhanced yield and throughput. \nAttendees at this two-day conference will also meet a wide variety of key players within the community\, from investors and analysts to fab engineers and managers. \nCS International is part of AngelTech\, which delivers a portfolio of insightful\, informative\, highly valued chip-level conferences. Bringing together 3 conferences with more than 120 presentations\, more than 800 delegates and over 80 exhibitors\, AngelTech is the premier global event covering compound semiconductor\, photonic integrated circuit and power electronic technologies. With a significant overlap between the three conferences\, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cs-inernational-conference/ LOCATION:Sheraton Brussels Airport Hotel\, Brussels\, Belgium CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CS-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240415T130000 DTEND;TZID=America/Los_Angeles:20240415T174500 DTSTAMP:20240403T192855Z CREATED:20240403T192855Z LAST-MODIFIED:20240403T192855Z UID:7807-1713186000-1713203100@marketingeda.com SUMMARY:Open Source Summit - North America DESCRIPTION:Registration Cost: $15 \nThis half day program will Introduce the audience to the many aspects of open source hardware and software development\, and how it is helping the industry to accelerate beyond what Moore’s law has predicted. \nTalks will cover numerous aspects of hardware / software development and provide motivation to learn more about the challenges of open hardware and software design together. \nAGENDA\n \n\nHow can software developers help keep Moore’s law alive? – Michael Gielda\, Antmicro\nOpen Hardware Design: Lessons Learned from OSS – Stefano Cetola\, Intel\nUnderstanding hardware security vulnerabilities: Hardware Bill of Materials – Kate Stewart\, Linux Foundation\nScaling hardware design: squeezing every bit of performance of the open source OpenROAD ASIC toolchain – Karol Gugala\, Antmicro\nAccelerating EDA Flows in the AWS Cloud – David Pellerin\, AWS\nAn Introduction to RISC-V – Keith Graham\, Codasip\nAccelerating the RISC-V Software Development Ecosystem – Jeffrey Osier-Mixon\, Red Hat\nCaliptra: Open Source Root of Trust – Caleb Whitehead\, Microsoft\nGetting “Ware” You Need to Go – Managing Open Hardware with Software (Part 1) – Maximillian Schmidt\, University of Oregon\nGetting “Ware” You Need to Go – AI Software on Open Hardware (Part 2) – Christopher Sullivan\, University of Oregon\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/open-source-summit-north-america/ LOCATION:Seattle Convention Center\, 900 Pine Street\, Seattle\, WA\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Open-Source-Summit-North-America-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20240411T080000 DTEND;TZID=Europe/Paris:20240411T170000 DTSTAMP:20240322T164706Z CREATED:20240322T164706Z LAST-MODIFIED:20240322T164706Z UID:7750-1712822400-1712854800@marketingeda.com SUMMARY:Siemens EDA - TechDay Grenoble 2024 DESCRIPTION:Siemens EDA Technology Day in Grenoble is your opportunity to learn\, grow and connect with fellow technical experts who design leading-edge products using Siemens EDA tools. This event is dedicated to end users of Siemens EDA solutions. This conference is free to attend and includes keynotes from industry leaders and enriching technical sessions. \n  \n\nAnalog/Mixed-Signal Verification\nCalibre Design Solutions\nDigital IC Implementation\nFunctional Design & Verification\nHardware-Assisted Verification\nNext Gen Packaging and DFM\nPCB Design & Simulation\nTessent Test Solutions and Embedded Analytics\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/siemens-eda-techday-grenoble-2024/ LOCATION:CA CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Siemens-April-11-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20240409T080000 DTEND;TZID=Europe/Berlin:20240411T170000 DTSTAMP:20240403T194345Z CREATED:20240119T022657Z LAST-MODIFIED:20240403T194345Z UID:7529-1712649600-1712854800@marketingeda.com SUMMARY:Embedded World 2024 DESCRIPTION:The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community\, including leading experts\, key players and industry associations. It offers unprecedented insight into the world of embedded systems\, from components and modules to operating systems\, hardware and software design\, M2M communication\, services\, and various issues related to complex system design. \nIts expertise and sharp focus on technologies\, processes and future-oriented products make it unparalleled in international comparisons – and THE must-attend event for developers\, system architects\, product managers and technical management. \nKnowledge platform #ew24\nKnow-how at the highest level\nAt the embedded world Conference and the electronic displays Conference\, top-class speakers from research\, development and practice will share their knowledge with you. They discuss the state of the art and possible future developments in the industry. The exhibitor’s forums and top-class discussion panels in the halls also contribute to the high-quality transfer of knowledge. Current topics will be highlighted in numerous expert lectures and panels. And\, of course\, there will be opportunities for intensive technical discussions. \nGuided tours\, tours for trainees and students and special presentations as well as the networking event for women in the embedded systems industry #women4ew complete the offer. \nThe No. 1 hub for the international embedded community\n\nAs the global platform and the industry place to meet for the embedded community\, embedded world attracts the top experts\, key players and industry associations from all over the world. \nBecome part of the community and use THE industry platform to network and make valuable business contacts! \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/embedded-world-2024/ LOCATION:NürnbergMesse\, Messezentrum 1\, Nurnberg\, Germany CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Embedded-World-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240403T080000 DTEND;TZID=America/Los_Angeles:20240405T170000 DTSTAMP:20240326T185839Z CREATED:20230918T162548Z LAST-MODIFIED:20240326T185839Z UID:6808-1712131200-1712336400@marketingeda.com SUMMARY:ISQED Symposium 2024 DESCRIPTION:A pioneer and leading interdisciplinary conference\, the 25thInternational Symposium on Quality Electronic Design (ISQED’24) accepts and promotes original and unpublished papers related to the topics shown below. \nISQED’24 theme is AI/ML& Electronic Design\, Hardware Security\, Quantum Computing\, 3D Integration\, and IoT. Authors are invited to submit papers in following topics (please visit the website for detail list of all tracks and subjects): \n\nHardware and System Security\nElectronic Design Automation Tools and Methodologies\nDesign for Test and Verification\nEmerging Device and Process Technologies and Applications\nCircuit Design\, 3D Integration and Advanced Packaging\nSystem-level Design and Methodologies\nCognitive Computing Hardware\n\nThis must-attend conference starts on Wednesday April 3\, and continues until the early afternoon of Friday April 5. The program includes keynote speeches\, embedded tutorials\, invited talks\, panel discussion\, and many peer-reviewed technical presentations. \nKeynote Speakers\n\nCross-Layer Optimization of Energy Harvesting and Storage\nDr. Naehyuck Chang\nExecutive Vice President\, Samsung SDI America\nWhy we did not have flying cars for 100 years\nJim Dukhovny\nCEO\, Alef Aeronautics\nReflections on Microelectronic and Microelectromechanical Technologies and the Challenges of Implementing Emerging Technologies\nClare D. Thiem\nAir Force Research Laboratory/RITB\n\nEmbedded Tutorials\n\nAdvanced Packaging for Heterogenous Integration\nDr. Tolga Acikalin\nIntel Labs\nSecuring Ubiquitous Devices with Lightweight Circuit Primitives\nProf. Kaiyuan Yang\nRice University\n\nPanel Discussion\n\nAI Hardware: Opportunities and Challenges\n\nTechnical Sessions\nTechnical program consists of over 20 technical sessions featuring over 100 peer-reviewed and invited technical presentations on various challenging topics related to AI/ML & Electronic Design\, Security\, IoT\, Quantum Computing\, etc. See the ISQED 2024 program for details. \nISQED Awards\nISQED best paper award ceremony will be held during plenary session on the morning of Wednesday April 3. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isqed-symposium-2024/ LOCATION:Seven Hills Conference Center\, 800 Font Blvd\, San Francisco\, CA\, 94132\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISQED-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240318T080000 DTEND;TZID=America/Los_Angeles:20240321T170000 DTSTAMP:20240206T194409Z CREATED:20240206T192804Z LAST-MODIFIED:20240206T194409Z UID:7584-1710748800-1711040400@marketingeda.com SUMMARY:GOMACTech 2024 DESCRIPTION:GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gomactech-2024/ LOCATION:Embassy Suites by Hilton\, Charleston Convention Center\, Charleston\, SC\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GOMACTech-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/London:20240313T080000 DTEND;TZID=Europe/London:20240314T170000 DTSTAMP:20240122T194453Z CREATED:20240122T194453Z LAST-MODIFIED:20240122T194453Z UID:7549-1710316800-1710435600@marketingeda.com SUMMARY:GSA International Semiconductor Conference DESCRIPTION:Inaugural GSA event in partnership with the UK Government.  \nMeet senior business leaders\, investors\, and public policy officials from around the world. \nAcross two days\, join us for exciting discussions on semiconductor innovation for a NetZero economy\, with a view on the dramatically changing supply chain\, government interventions and industry outlook. \n  \nSemiconductor Innovation for NetZero (March 13-14) \n\nSupply Chain Resilience and national approaches to Semiconductor Policy\nDifferent government approaches to semiconductor policy\, supply chains and stimulating industry growth\nResource and talent development\, including raising the role of women in the industry\nCapital funding and IP strategies for start-ups and scale-ups\n\nWLI EMEA Kick-Off Event (March 13 morning) \n\nThe first GSA Women Leadership Initiative in Europe\nDiscuss the raising role of women in semiconductors\nHear lessons learned from women who have excelled in navigating a traditionally male-dominated industry\n\n\nTicket will cover both days\, all sections\nVIP Dinner will be held on the evening of March 13th: a separate ticket is required\, very limited seating available!\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gsa-international-semiconductor-conference/ LOCATION:Here East\, 14 E Bay Lane\, London\, United Kingdom CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-March-13-14-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240304T080000 DTEND;TZID=America/Los_Angeles:20240307T170000 DTSTAMP:20240216T181350Z CREATED:20240103T171927Z LAST-MODIFIED:20240216T181350Z UID:7493-1709539200-1709830800@marketingeda.com SUMMARY:DVCon USA 2024 DESCRIPTION:The Design & Verification Conference & Exhibition is the premier conference on the application of languages\, tools\, methodologies and standards for the design and verification of electronic systems and integrated circuits. The focus of this highly technical conference is on the practical aspects of these technologies and their use in leading-edge projects to encourage attendees to adopt similar techniques to improve their own design and verification flows. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-usa-2024/ LOCATION:The DoubleTree by Hilton\, 2050 Gateway Place\, San Jose\, CA\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Madrid:20240226T080000 DTEND;TZID=Europe/Madrid:20240229T170000 DTSTAMP:20240321T221956Z CREATED:20231228T171623Z LAST-MODIFIED:20240321T221956Z UID:7473-1708934400-1709226000@marketingeda.com SUMMARY:MWC 2024 DESCRIPTION:Where technology\, community and commerce converge\n\nMWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator\, device manufacturer\, technology provider\, vendor\, content owner\, or are simply interested in the future of tech\, you need to be here. \nWhy? Because it’s the one time of year where everyone who’s anyone comes together under one roof. Tens of thousands of senior executives from the top global companies\, international governments and trailblazing tech businesses converge at MWC Barcelona to make decisions. \n  \n\nThought leaders become change-makers\nNew ideas turn into business deals\nAnd networking means remarkable connections\n\nIt’s the place to find out where the industry\, your business and your career are headed. Miss out on MWC Barcelona\, miss out on the next 12 months. \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/mwc-2024/ LOCATION:Fira Gran Via\, 08038\, Barcelona\, Spain CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/MWC-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240225T080000 DTEND;TZID=America/Los_Angeles:20240229T180000 DTSTAMP:20240221T174538Z CREATED:20240221T174208Z LAST-MODIFIED:20240221T174538Z UID:7659-1708848000-1709229600@marketingeda.com SUMMARY:SPIE Advanced Lithography + Patterning DESCRIPTION:Attend and hear research\, challenges\, and breakthroughs as you gather with colleagues in San Jose \nJoin other leading researchers who are solving challenges in optical and EUV lithography\, patterning technologies\, metrology\, and process integration for semiconductor manufacturing and adjacent applications. \nFive days of exciting content and connecting with your community\n\nPlenary talks\nTechnical presentations\nNetworking sessions\nCourse offerings\nExhibition\n\nCome to hear world-class speakers\nChan Hwang\n\nSamsung (Korea) \nAnn Kelleher\n\nIntel Corp. (United States) \nTodd Younkin\n\nSemiconductor Research Corporation (USA) \nExplore six great conferences\n\nOptical and EUV Nanolithography\nDTCO and Computational Patterning\nMetrology\, Inspection\, and Process Control\nNovel Patterning Technologies\nAdvances in Patterning Materials and Processes\nAdvanced Etch Technology and Process Integration for Nanopatterning\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/spie-advanced-lithography-patterning/ LOCATION:San Jose Convention Center\, 150 W San Carlos Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SPIE.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240218T080000 DTEND;TZID=America/Los_Angeles:20240222T170000 DTSTAMP:20231230T004304Z CREATED:20231230T004304Z LAST-MODIFIED:20231230T004304Z UID:7483-1708243200-1708621200@marketingeda.com SUMMARY:ISSCC 2024 DESCRIPTION:The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency\, and to network with leading experts. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isscc-2024/ LOCATION:San Francisco Marriot Marquis\, 780 Mission Street\, San Francisco\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISSCC-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20240206T090000 DTEND;TZID=America/New_York:20240206T180000 DTSTAMP:20240129T191342Z CREATED:20240129T191342Z LAST-MODIFIED:20240129T191342Z UID:7559-1707210000-1707242400@marketingeda.com SUMMARY:Canada's Semiconductor Summit DESCRIPTION:Help build Canada’s role in North America’s integrated semiconductor supply chain.\n\n\nFeaturing key industry and government decision-makers from Canada\, the United States\, and international jurisdictions\, your insights at this by-invitation-only event will help us build an effective action plan. The summit will establish priorities and define opportunities to accelerate the growth\, development\, and competitiveness of Canada’s semiconductor sector. \n\nProgram\n\n\n9-9:10 AM Welcome & Introductory Remarks \nMC:  Ruth Rayman\, former Director General\, Advanced Electronics and Photonics Research Centre\, NRC \n\n\n\n\n\n9:10-9:30 AM An Unprecedented Global Recalibration \nSemiconductors are the backbone of the digital economy. As an integrated North American semiconductor supply chain takes shape\, Canada has the opportunity to transform existing\, discrete areas of expertise into a coherent offering\, forge new collaborations and maximize new markets. \nKey topics: \n\nLay of the land\, threats and opportunities etc.\n\nSpeaker: Dr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council \n\n\n\n\n\n9:30-10:45 AM Automotive\, EVs\, and Batteries: Amplifying Our Strengths \nCanada is creating a world class EV supply chain with OEMs and electrification sub-systems. Semiconductors lie at the heart of the 21st century automobile. How can Canada play a larger role in the semiconductor supply chain for EVs? What are the short and long-term opportunities? \nKey topics: \n\nWhat is the size of the automotive semiconductor market in Canada? What is its impact on the automotive manufacturing ecosystem in Canada?\nEV sub-systems: which is the best sub-system to target for Canada to grow the auto semiconductor ecosystem?\nHow can semiconductors complement the increasing investment in EV manufacturing in Canada in the future?\n\nModerator: Kirk Ouellette\,  Vice President\, Strategy Development and Strategic Marketing\, STMicroelectronics \nPanelists: \n\nAndrea Tranchida\, Vice President\, Global Automotive Solutions\, NXP Semiconductors\nBenoit Rousseau\, Vice President – GaN Automotive\, Infineon Technologies\nDaniel Boisvert\, Director of Business Development\, C-MAC Electronics Solutions\nMona Eghanian\, Assistant Vice President\, OVIN\n\n\n\n\n\n\n10:45-11 AM Break \nNetworking and refreshments. \n\n\n\n\n\n11 AM-12:15 PM Advanced Technologies: Leveraging Canadian Capabilities \nCanada needs to strategically leverage existing areas of strength and promising new advanced technologies to integrate with critical capabilities into the global semiconductor supply chain. What future-looking technologies are worth pursuing? What is the market telling us—and what criteria should guide our investments?  \nKey topics: \n\nPhotonics/RF\nAI\nSensors\nCompound semiconductors\nQuantum computing\n\nModerator: Duncan Stewart\, Partner\, Deep Tech Venture Fund\, BDC \nPanelists: \n\nJon Rogers\, Co-founder and SVP Engineering\, Alphawave Semi\nI-Cheng Chen\, Fellow\, Platform Architecture\, AMD Canada\nIgor Arsovski\, Head of Silicon\, Fellow\, Groq\nJim Hjartarson\, President and COO\, Inpho\n\n\n\n\n\n\n12:15-1:15 PM Catered buffet lunch with guest speaker \nSilicon Valley legend\, John East\, former CEO of Actel\, and veteran of AMD and Fairchild Semiconductor\, remembers those formative\, chaotic years in Silicon Valley—and the analogies in Canada today. \nSpeaker: John East\, Chairman of the Board\, SPARK Microsystems \n\n\n\n\n\n1:15-2:30 PM Building a Competitive Semiconductor Ecosystem: Harnessing an Economic Juggernaut \nSilicon Valley\, Taiwan\, South Korea\, Saxony\, IMEC\, Albany etc. Not every successful tech ecosystem has to adhere to the same model. What can Canada learn from successful semiconductor ecosystems? What relationships need to be established with key US hubs? How should the private sector\, academia and government collaborate? \nKey topics: \n\nEcosystem overview\nWhat gave the stimulus to get it off the ground?\nWhat’s the private/government split?\n\nModerator: Normand Bourbonnais\, Président Directeur Général\, Technum Québec \nPanelists: \n\nLode Lauwers\, SVP\, Business Development & Sales\, IMEC\nMarie-Josée Turgeon\, Présidente – Directrice générale\, C2MI\nLaMar Hill\, Director\, NY Creates\nCharles Sturman\, CEO\, TechWorks\n\n\n\n\n\n\n2:30-2:45 PM Break \nNetworking and refreshments. \n\n\n\n\n\n2:45-4PM The Talent Question: Building the Pipeline \nThe semiconductor workforce must double to an estimated half a million people to meet the demands of North American semiconductor reshoring. What mix of training\, apprenticeship programs\, immigration\, financial incentives\, and creative retention strategies will build the pipeline for Canada? \nKey topics: \n\nTraining programs\nImmigration\nFinancial incentives\nApprenticeship programs\nFunding university Chairs\nRetention\nBrain drain\n\nModerator: Dr. Tony Chan Carusone\, CTO\, Alphawave Semi \nPanelists: \n\nDino Toffolon\, SVP of Engineering-Interface IP\, Synopsys\nKate Alcott\, Director of Workforce Programs\, NY Creates\nSylvain Charbonneau\, Vice-President\, Research and Innovation\, University of Ottawa\nArvind Gupta\, Professor at Department of Computer Science\, University of Toronto\n\n\n\n\n\n\n4-5 PM Strategic Initiatives and Next Steps for 2024: Making It Happen \nCanada has a powerful opportunity to establish itself as new niches emerge across the North American corridor. But we need to act fast.  Regional hubs have formed this year and are actively forging new partnerships and market plays.  How can we  ensure Canadian technology and expertise accesses these burgeoning markets?   \nKey topics: \n\nCSC 2024 Federal Budget Proposal\nAnnounced proposals ie. CSC\, FABrIC\, SECTR etc.\nFinancing growth\nPrivate-public partnerships\n\nModerator: Chris Ouslis\, Industrial Technology Advisor\, NRC \nPanelists: \n\nGord Harling\, President & CEO\, CMC Microsystems\nClaude Jean\, Executive Vice President\, Strategy & Partnership\, Teledyne Digital\nVelko Tzolov\, Director General\, Canadian Photonics Fabrication Centre (CPFC)\nDr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council\n\n\n\n\n\n\n5-5:30 PM Wrap Up & Closing Remarks \nSpeaker: Dr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council \n\n\n\n\n\n5:30-6:30 PM Networking Reception \nNetworking and refreshments. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/canadas-semiconductor-summit/ LOCATION:Brookstreet Hotel\, 525 Leggett Drive\, Ottawa\, Canada CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Canada-Semi-Summit-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240206T080000 DTEND;TZID=America/Los_Angeles:20240208T170000 DTSTAMP:20240103T034734Z CREATED:20240103T034448Z LAST-MODIFIED:20240103T034734Z UID:7490-1707206400-1707411600@marketingeda.com SUMMARY:Chiplet Summit DESCRIPTION:The Second Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. \nThey’ll get the scoop on ways to make their chiplets run faster\, scale better\, use less power\, and be more flexible. \nThis unique event gives attendees a place to network with peers\, ask questions of the experts\, and talk to vendors offering a wide variety of products and services. \n\n\nKeynote Speakers\n\n\n\n\n\n\n\n\nSubi Kengeri – Applied Materials \nNitza Basoco – proteanTecs \nDaniel Armbrust – Silicon Catalyst \nBob Brennan – Intel Foundry Services \nSheng Lu – Corigine \nCliff Grossner – Open Compute Project \nBapi Vinnakota – Open Compute Project \n\n\n\n\n\n\n\n\nKEYNOTE SPEAKER DETAILS \nThought-Provoking Panels Where Attendees Can Ask Questions of Leading Experts: \n\nChoosing the Right Architecture for Your Application\nNext Great Breakthrough in Chiplets\nBest Development Platform for Chiplets\nBest Interface for Chiplets\nWhat Standards Are Needed?\nOptimizing Chiplets\n\nATTENDEES \nEngineers and managers who are looking for ways to help meet performance challenges\, handle the move to smaller dimensions\, provide the modularity and scalability today’s chips require\, and develop solutions focused on the latest applications and interfaces.  Designers of enterprise networks\, telecom systems\, high-performance computing\, financial systems\, IoT\, and mil/aero applications all know that chiplets will play a big role in their future. \nBACKGROUND \nChiplets improve chip yields and costs\, but still provide the performance of a large monolithic chip.  Designers can mix-and-match chiplets\, use the process technologies best suited to particular functions\, take advantage of chiplet IP\, simplify moves to new process nodes\,  and avoid wafer waste and manufacturing defects.  Chiplets are the key to producing the extremely high-density\, high-performance chips required for today’s networking\, storage\, AI/ML\, analytics\, media processing\, HPC\, and virtual reality applications. \n\n\n\n\n\n\nExhibit\nPosition Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  Share Thoughts with Key Experts and Analysts.  Show Movers and Shakers How Your Products and Roadmap Will Drive the Industry. Meet Highly Motivated Customer Prospects. \n\n\nOnly event totally dedicated to the skyrocketing chiplet market \n\n\nTop experts\, major keynotes\, and critical topics will draw big-time customers \n\n\nPractical orientation will attract key designers and specifiers \n\n\nVendor-neutral show offers opportunities to everyone \n\n\n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chiplet-summit-2/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Chiplet-Summit-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240130T080000 DTEND;TZID=America/Los_Angeles:20240201T170000 DTSTAMP:20231212T172849Z CREATED:20231212T172135Z LAST-MODIFIED:20231212T172849Z UID:7160-1706601600-1706806800@marketingeda.com SUMMARY:DesignCon 2024 DESCRIPTION:The Must Attend Event for Chip\, Board\, and Systems Design Engineers\n\n\n\n\nDesignCon is the premier high-speed communications and system design conference and exposition\, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. \n\n\n40 Under 40\n\n\n\n\nCalling all Emerging Engineers and Leaders! \nDesignCon’s 40 Under 40 program launches in 2024 and provides an opportunity for up-and-coming engineers to further their careers through access to DesignCon’s full conference education\, including 14 tracks plus DesignCon’s automotive-focused Drive World conference. \n\nNominate yourself or a fellow engineer. Those accepted receive a complimentary Education Pass plus access to an exclusive networking breakfast with leading engineers and mentors.  Deadline: 12/14/23.   \n» Click here to learn more. \n\n\nThe Conference – A Systematic Approach to Learning & Discovery\n\n\n\n\nAttend the expertly curated 14-track conference created by engineers for engineers featuring technical paper sessions\, tutorials\, and industry panels covering all aspects of chip\, board\, and systems design. \n\n\nThe Expo – Take Your Electronic Design Expertise to the Next Level at DesignCon\n\n\n\n\nBrowse exhibits with hundreds of new products and technologies in the expo hall\, attend educational sessions in the Chiphead Theater\, see interactive demos\, and network with high-caliber industry professionals at multiple social functions. \n\n\nExpanded Drive World Conference Track and Exhibits\n\n\n\n\nDrive World expands in 2024 to support electric vehicle technology in addition to sessions in the areas of automotive electronics and intelligence\, as engineers prepare for unprecedented growth in an automotive electronics market forecast to see revenue surge more 37% 2023-2027. Accelerate the path to autonomous and electric vehicles by attending the Drive World conference track with education on advancing automotive tech. \nNew in 2024 — the Advanced Automotive section of the expo floor highlighting advanced automotive electronics suppliers focused on the autonomous\, EV and energy-storage markets. \n\n\nEngineer of the Year\n\n\n\n\nDesignCon’s “Engineer of the Year” Award is given out each year during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip\, board\, or system level. \nThe award winner is selected based on his or her leadership\, creativity\, and out-of-the-box thinking brought to design/test of chips\, boards\, or systems\, with particular attention paid to areas of signal and power integrity. \nVoting to choose the 2024 Engineer of the Year is now open. \nCast your vote for the finalist who you feel should be the DesignCon 2024 Engineer of the Year. Voting ends December 19 at noon Pacific. \n» Click to the ballot \nRead about all 5 finalists on Design News \n\n\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/designcon-2024/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DesignCon-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20240124T080000 DTEND;TZID=Asia/Tokyo:20240126T170000 DTSTAMP:20231227T195553Z CREATED:20231227T195553Z LAST-MODIFIED:20231227T195553Z UID:7462-1706083200-1706288400@marketingeda.com SUMMARY:Automotive World 2024 DESCRIPTION:Combination of exhibitions & conferences covering important topics in the automotive industry such as automotive electronics\, connected car\, autonomous driving\, EV/HV/FCV\, lightweight\, processing technology and MaaS. Automotive OEMs and Tier 1 suppliers visit the exhibition to find suppliers and partners. \n\n1\,650 Exhibitors\n85\,000 Visitors\n170 Speakers\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/automotive-world-2024/ LOCATION:Tokyo Big Sight\, 3 Choe-11-1 Ariake\, Tokyo\, Japan CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Automotive-World-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Seoul:20240122T080000 DTEND;TZID=Asia/Seoul:20240125T170000 DTSTAMP:20231229T165332Z CREATED:20231229T165332Z LAST-MODIFIED:20231229T165332Z UID:7479-1705910400-1706202000@marketingeda.com SUMMARY:ASP-DAC 2024 DESCRIPTION:ASP-DAC 2024 is the 29th annual international conference on VLSI design automation in Asia and South Pacific regions\, one of the most active regions of design\, CAD and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to design and Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists\, engineers\, and students who are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/asp-dac-2024/ LOCATION:Incheon Songdo Convensia\, 123 Central Street\, Yeonsu-gu\, Incheon\, Korea\, Democratic People's Republic of CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ASP-DAC-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20240116T090000 DTEND;TZID=Asia/Tokyo:20240116T170000 DTSTAMP:20231211T175014Z CREATED:20231211T175014Z LAST-MODIFIED:20231211T175014Z UID:7149-1705395600-1705424400@marketingeda.com SUMMARY:RISC-V Day\, Tokyo 2024 Winter DESCRIPTION:The RISC-V Day Tokyo conference is the largest RISC-V event in Japan. The RISC-V Day Tokyo 2024 Winter conference will be held on Tuesday\, January 16\, 2024 from 9:00-17:00 JST (UTC+9) at the Ito International Research Center\, The University of Tokyo. We will bring together excellent RISC-V-related technologies and products\, as well as key people and engineers\, and provide business opportunities such as increasing product awareness\, realizing collaboration between companies\, technology exchange\, and information gathering. We look forward to your participation on this occasion! A video of the presentation and information on materials will be posted on the website at a later date. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/risc-v-day-tokyo-2024-winter/ LOCATION:Ito International Research Center\, The University of Tokyo\, Tokyo\, Japan CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/RISC-V-Tokyo-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240109T080000 DTEND;TZID=America/Los_Angeles:20240112T170000 DTSTAMP:20231230T005013Z CREATED:20231129T225332Z LAST-MODIFIED:20231230T005013Z UID:7133-1704787200-1705078800@marketingeda.com SUMMARY:CES 2024 DESCRIPTION:Registration is now open for CES® 2024 — taking place Jan. 9-12\, in Las Vegas. \nFlip the switch on global business opportunity with CES\, where you can meet with partners\, customers\, media\, investors\, and policymakers from across the industry and the world all in one place. \nDon’t miss your chance to be a part of the most powerful tech event in the world. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ces-2024/ LOCATION:Las Vegas Covention and World Trade Center\, 3150 Paradise Rd\, Las Vegas\, NV\, 89109\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CES-2023-2.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20240106T080000 DTEND;TZID=Asia/Kolkata:20240110T170000 DTSTAMP:20231228T190611Z CREATED:20231227T173925Z LAST-MODIFIED:20231228T190611Z UID:7458-1704528000-1704906000@marketingeda.com SUMMARY:VLSID 2024 DESCRIPTION:The 37th International Conference on VLSI Design & the 23rd International Conference on Embedded Systems (VLSID 2024) are being held at Kolkata\, India\, during January 6-10\, 2024. VLSID 2024 is returning to the city after 8 years since 2016. This flagship conference is bringing worldwide industry leaders\, Indian and international industry bodies\, and academic researchers in a common platform. \nIn the present era of automation and connected things\, VLSI technology armed with AI and Quantum could be pivotal in changing the VLSI landscape starting from manufacturing to devices to design. To elaborate on this paradigm shift\, the theme 2024 VLSI Design conference is aptly chosen to be “VLSI meets AI and Quantum for Cyber Physical Systems”. \nBrilliant minds across the VLSI domain will brainstorm during the conference to redefine the future course of VLSI Design and Embedded research and application in India. Kolkata (Known as Calcutta during the British Imperial rule) is surrounded by several premier technical and scientific institutes like IIEST Shibpur (B. E. College\, Shibpur)\, IIT Kharagpur\, ISI Calcutta\, Calcutta University\, Jadavpur University etc. \nEast and north-eastern region of our country is a hub of innovation with a focus on emerging technologies. Over the years the region has generated huge number of ESDM professionals and academicians who are right now fueling the growth of ESDM industry. It is high time to operationalize state level high technology clusters in the field of VLSI design\, embedded systems\, cognitive system design and silicon/display/compound fab. VLSID 2024 provides the unique stage where MNCs\, start-ups\, industry bodies and academicians come together and get synergized with what the states of this region have to offer. \nOver a span of five-days of VLSID2024\, the summit will feed brains and nurture minds with state-of-the-art exhibitors\, presentations\, panel discussions\, innovation forums\, and tutorials by established technologists. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/vlsid-2024/ LOCATION:ITC Royal Bengal\, Kolkata\, India CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/VLSID-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240105T080000 DTEND;TZID=America/Los_Angeles:20240107T170000 DTSTAMP:20231228T191521Z CREATED:20231228T191521Z LAST-MODIFIED:20231228T191521Z UID:7476-1704441600-1704646800@marketingeda.com SUMMARY:IEEE Rising Stars 2024 DESCRIPTION:The IEEE Rising Stars Conference is designed to inform\, excite\, enthuse\, and bring together the top engineering Young Professionals and Students around the world to network and be inspired by each other. The program includes Technical Innovation Talks\, Professional Development\, Workshops & Competitions\, and Networking Opportunities with industry and peers. \nThe conference gathers Technical Professionals who are experts in emerging technologies such as: Autonomous Vehicles\, Artificial Intelligence\, Space & Manufacturing\, Power & Sustainability\, Cybersecurity\, IoT & more! \nRising Stars attendees will leave the event with better preparation to face the technical and professional challenges presented to them and armed with the appropriate contacts needed to gain the insight to be successful. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-rising-stars-2024/ LOCATION:Tropicana Las Vegas\, 3801 S Las Vegas Blvd\, Las Vegas\, NV\, 89109\, United States CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEEE-Rising-Stars-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20231213T080000 DTEND;TZID=Asia/Kolkata:20231217T170000 DTSTAMP:20231101T195305Z CREATED:20231101T195220Z LAST-MODIFIED:20231101T195305Z UID:7022-1702454400-1702832400@marketingeda.com SUMMARY:International Workshop on Physics of Semiconductor Devices - IWPSD 2023 DESCRIPTION:The XXII International Workshop on the Physics of Semiconductor Devices (IWPSD 2023) is being jointly organized by the Indian Institute of Technology Madras in collaboration with Society for Semiconductor Devices and Semiconductor Society (India). This series of biennial workshops\, started in 1981\, provides a global forum for interaction between scientists and technologists working in the area of semiconductor materials and devices. \nThe topics to be covered in the Workshop are\, but not limited to:\n\n2D Materials and Devices\nCrystal Growth and Epitaxy\nDevice Modelling and Simulation\nDevices for Quantum Technology\nII – VI and Oxide Semiconductors\nIII – V Semiconductors\nMemory and Logic Devices\nMEMS\, NEMS and Sensors\nOrganic and Flexible Electronics\nPhotovoltaics\nPower Semiconductor Devices\nOptoelectronics\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/international-workshop-on-physics-of-semiconductor-devices-iwpsd-2023/ LOCATION:Research Park\, IIT Madras\, Tamil Nadu 600036\, Chennai\, India CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IWPSD-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20231209T080000 DTEND;TZID=America/Los_Angeles:20231213T170000 DTSTAMP:20231207T174511Z CREATED:20230920T171734Z LAST-MODIFIED:20231207T174511Z UID:6838-1702108800-1702486800@marketingeda.com SUMMARY:69th International Electron Devices Meeting - IEDM DESCRIPTION:IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology\, design\, manufacturing\, physics\, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology\, advanced memory\, displays\, sensors\, MEMS devices\, novel quantum and nano-scale devices and phenomenology\, optoelectronics\, devices for power and energy harvesting\, high-speed devices\, as well as process technology and device modeling and simulation. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/69th-international-electron-devices-meeting-iedm/ LOCATION:Hilton San Francisco Union Square\, 333 O'Farrell Street\, San Francisco\, 94102\, United States CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEDM-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20231204T090000 DTEND;TZID=Europe/Paris:20231205T170000 DTSTAMP:20231128T173642Z CREATED:20231128T172805Z LAST-MODIFIED:20231128T173642Z UID:7122-1701680400-1701795600@marketingeda.com SUMMARY:IP-SoC Conference 23 - Grenoble DESCRIPTION:A worldwide connected Event !! \nIP-SoC 2023 will be the 26th edition of the working conference fully dedicated to IP (Silicon Intellectual Property) and IP based electronic systems. \nThe event is the annual opportunity for IP providers and IP consumers to share information about technology trends\, innovative IP SoC products\, Breaking IP/SoC News\, Market evolution and more. \nThe Grenoble event is a special event as it is also the annual IP Think Tank meeting where high level executives\, market analyzer and technical experts from Foundry/technology\, to new applications share their vision about the future of the IP concept. It will be the right time to analyze the fast evolution and consolidation in the IP market and IP business. \nAs far as the application domains are concerned it is important to give high to new application domains and take into account new system requirements such as 3D packaging\, Security\, Artificial Intelligence\, Green Electronics\, … \nAnd over all you cannot miss The wine Tasting Party !! \nExhibition tables and “discussion panels” will favor vendor and customer meetings. \nAny question? Please contact us \nRegistration and Exhibition installation opens at 7 am. \n\n\n\n\n\n\nDay 1 – December 4th\, 2023\n\n\n\n\n\n\n\n9.00 am\nIntroduction Session\n\n\n\nWelcome : Innovation in semi conductor industry \nGabrièle Saucier\nCEO\nD&R \nAbout me\n\n\n\n\nEmpowering Innovation in the Age of Custom Silicon \nEric Lalardie\nDirector\nArm Ltd. \nAbout me\n\n\n\n\n9.40 am\nBreak\n\n\n\n10.00 am\nNew technology the lead of innovation\n \nChairperson: Yves Quere – CEA\n\n\n\n\nGreening the Road Ahead: Revolutionizing the Automotive Industry with FD SOI Technology \nPhilippe Flatresse\nProduct Marketing\nSOITEC \nAbout me\n\n\n\n\nTechnologies enabling future mobile connectivity & sensing \nFrancois Brunier\nPartnership Program Manager\nSOITEC \nAbout me\n\n\n\n\nDigital Beamforming design in mmW: A 22nm FDSOI transceiver practical case \nJérôme Prouvée\nLayout Engineer & Project Manager\nCEA \nAbout me\n\n\n\n\n11.00 am\nBreak\n\n\n\n11.20 am\nArtificial Intelligence IP and SoC\n \nChairperson: Costas Conistis – Alphawave Semi\n\n\n\n\nMeeting the Needs of AI Training with HBM3 \nPhilip Van Den Heuvel\nRegional Sales Manager\nRambus\, Inc. \nAbout me\n\n\n\n\nInnovative Integrated IP SoC Design for Edge AI \nTim Menasveta\nDirector of IoT Product Management\nArm Ltd. \nAbout me\n\n\n\n\nTransforming Far-Edge Computer Vision with Energy-Efficient A \nVincent Huard\nChief Technology Officer\nDolphin Design \nAbout me\n\n\n\n\n12.30 pm\nLunch\n\n\n\n1.30 pm\nNew Challenges\n \nChairperson: Eric Lalardie – Arm\n\n\n\n\nThe Lossless Compression Challenge: from Networking to Data centers \nDr. Calliope-Louisa Sotiropoulou\nSales Engineer\nCAST\, Inc. \nAbout me\n\n\n\n\nAddressing connectivity scalability in the AI world with Mulit-Standard IO Chiplets driving next generation interconnects \nMichael Klempa\nProduct Marking Specialist\nAlphawave Semi \nAbout me\n\n\n\n\n2.10 pm\nBreak\n\n\n\n2.30 pm\nSafety Critical Applications\n \nChairperson: Dr. Calliope-Louisa Sotiropoulou – CAST\n\n\n\n\nIP Core Considerations for Ensuring Functional Safety in Safety-Critical Applications \nPhilipp Jacobsohn\nSenior Staff Applications Engineer\nSmartDV Technologies \nAbout me\n\n\n\n\nGRLIB: VHDL IP library for fault-tolerant SoC \nFabio Malatesta\nProduct Marketing Engineer\nFrontgrade Gaisler \nAbout me\n\n\n\n\n3.10 pm\nAutomotive Applications\n\n\n\nCAN XL – can safety go in hand with performance? \nJacek Hanke\nCEO\nDigital Core Design \nAbout me\n\n\n\n\nSolve the Latest ISO 21434 Cybersecurity Challenge with an Automotive HSM \nRuud Derwig\nSenior Staff Engineer for Security IP\nSynopsys\, Inc. \nAbout me\n\n\n\n\n4.00 pm\nBreak\n\n\n\n4.20 pm\nSecurity Solutions\n \nChairperson: Bart Stevens – Rambus\, Inc.\n\n\n\n\nWhich IP for Which Security Certification Standard\, \nLudovic Merrien\nSecurity Certification Leader\nTiempo Secure \nAbout me\n\n\n\n\nLDPC Encoder/Decoder \nManish Mahajan\nFounder\nSecantec\, Inc. \nAbout me\n\n\n\n\nSecurity from chip to cloud with PQC (Post-Quantum Cryptography) \nBrice Gaignoux\nEMEA Pre-Sales Engineer\nSecure-IC \nAbout me\n\n\n\n\n5.20 pm\nBreak\n\n\n\n5.40 pm\nSecurity Solutions – 2\n \nChairperson: Ruud Derwig – Synopsys\, Inc.\n\n\n\n\nQuantum Safe Cryptography: Protecting Devices and Data in the Quantum Era \nBart Stevens\nSenior Director of Product Marketing\nRambus\, Inc. \nAbout me\n\n\n\n\nHow will platform and communication security evolve in the quantum computing era? \nGraeme Hickey\nVP Engineering\nPQShield \nAbout me\n\n\n\n\nThe Power of Physical Unclonable Functions (PUFs) \nChris Jones\nDirector\, Field Application\nCrypto Quantique \nAbout me\n\n\n\n\n7.00 pm\nYou should not miss ! \nWine tasting party sponsored by Soitec\n\n\n\n\n8.00 pm\nBanquet sponsored by D&R\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nDay 2 – December 5th\, 2023\n\n\n\n\n\n\n\n9.00 am\nProcessor IP\n \nChairperson: Philippe Quinio – STMicroelectronics\n\n\n\n\nBeyond one-size-fits-all: The power of tailored CPUs \nMike Eftimakis\nVP Strategy & Ecosystem\nCodasip GmbH \nAbout me\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nSurvey of market available processor IP \n\n\n\nDagmara Zielinska\nPartnership Program Manager\nD&Rwith Gabrièle Saucier\nCEO\nD&R \nAbout me\n\n\n\n\n\n\n\n\n9.40 – 11.00 am\nFrom Processor IP to Processor or supercomputer chip:  \n\nWhat is needed and what is the next success track ? \nThis panel gives an opportunity to exchange some vision about the future of processor IP up to extension to processor / multiprocessor chip.\n\nWith the participation of: \n\nFabio Malatesta – Product Marketing Engineer – Frontgrade Gaisler\nMike Eftimakis – VP Strategy and Ecosystem – Codasip GmbH\nLoic Lietar – Co-Founder & CEO – GreenWaves Technologies\nThierry Lelégard – Head of Platform Security – SiPearl\n\n\n\n\n\n\n11.00 am\nBreak\n\n\n\n11.30 am\nAnalog IP\n \nChairperson: Philippe Flatresse – SOITEC\n\n\n\n\nAdaptive Voltage Scaling (AVS): Enhancing Chip Efficiency \nVincent Telandro\nProduct Marketing manager (Power Management IP)\nDolphin Design \nAbout me\n\n\n\n\nTechnology Analysis: what you need to know before embarking on analog design migration \nJean-François Lambert\nDirector of Business Development\nThalia \nAbout me\n\n\n\n\n12.15 pm\nLunch\n\n\n\n1.20 pm\nDesign Platform\n \nChairperson: Philippe Flatresse – SOITEC\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nHybrid Cloud Management for IP Development \n\n\n\nSundar M\nDirector\nTessolve Semiconductor Private Limitedwith Pitchumani Guruswamy\nTessolve Semiconductor Private Limited \nAbout me\n\n\n\n\nOnline Only\n\n\n\n\nA novel approach for SoC design resource management and prediction \nChouki Aktouf\nCo-Founder\nInnova Advanced Technologies \nAbout me\n\n\n\n\nMulti-IO co-processor with TSN \nVincent Laporte\nCTO – V.P. BU\nCetraC \nAbout me\n\n\n\n\n2.10 pm\nBreak\n\n\n\n2.30 pm\nVerification Platform\n \nChairperson: Patrick Blouet\n\n\n\n\nIP QA Best Practices \nLionel Couder\nSr. Applications Engineer\nSiemens Digital Industries Software \nAbout me\n\n\n\n\nImportant Considerations for Verification of CXL Devices \nNicolas Dai\nApplication Engineer Architect\nCadence Design Systems\, Inc. \nAbout me\n\n\n\n\n3.10 pm\nMonitoring Platform\n\n\n\nChip Condition Monitoring and Performance Optimization. Process/Voltage/Temperature Detectors in ASIC Design Methodology. \nVsevolod Sergeenko\nRFID Team Leader\nNTLab \nAbout me\n\n\n\n\nThe Critical Role of Embedded Monitor IP in Enabling Silicon Lifecycle Management Use Cases \nDan Alexandrescu\nR&D Engineer\nSynopsys\, Inc. \nAbout me\n\n\n\n\n4.00 pm\nGive Away – Event Closure\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ip-soc-conference-23-grenoble/ LOCATION:Hotel Europole\, 29 rue Pierre-Sémard\, Grenoble\, France CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IP-SoC-23-Grenoble.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Istanbul:20231204T080000 DTEND;TZID=Europe/Istanbul:20231207T170000 DTSTAMP:20230313T211025Z CREATED:20230313T210903Z LAST-MODIFIED:20230313T211025Z UID:6124-1701676800-1701968400@marketingeda.com SUMMARY:IEEE 30th International Conference on Electronics\, Circuits and Systems (ICECS) DESCRIPTION:The IEEE 30th International Conference on Electronics\, Circuits and Systems (ICECS) will be held in Istanbul\, Turkey 4-7 December 2023. As the flagship conference of IEEE Circuits and Systems Society in Region 8 (Europe\, Middle East\, and Africa)\, ICECS 2023 will consist of tutorials\, plenary lectures\, regular\, special and poster sessions focusing on recent trends\, emerging technologies and advances. \n  \nTracks\n  \n\nAnalog/Mixed-Signal/Microwave Circuits\nBio-Medical\, Bio-Inspired Circuits/Systems\nEDA\, Test and Reliability\nDigital Circuits and Systems\nLinear and Non-Linear Circuits and Systems\nNon-Linear Devices\, Memristors\nLow-Power\, Low-Voltage Design\nEmbedded and Micro/Systems\nNeural Networks\, Machine/Deep Learning\nSensors and Sensing Systems\nSignal Processing\, Image and Video\nVLSI Systems and Applications\nSmart Systems for CAS Applications\n\n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-30th-international-conference-on-electronics-circuits-and-systems-icecs/ LOCATION:Hilton Maslak\, Büyükdere Cd. No:233\, Istanbul\, Turkey CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ICECS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20231116T080000 DTEND;TZID=Europe/Berlin:20231116T170000 DTSTAMP:20231022T003818Z CREATED:20231022T003818Z LAST-MODIFIED:20231022T003818Z UID:6984-1700121600-1700154000@marketingeda.com SUMMARY:Formal Verification Conference: Osmosis 2023 DESCRIPTION:Elevate your success with osmosis 2023\nOsmosis is about sharing success in using formal techniques to solve verification challenges\, and networking with our R&D experts and other attendees. As such\, we have put together the following conference program covering a wide range of formal verification topics – along with delivering sneak-previews of our future product roadmaps. \nConference program\nCheck-in and continental breakfast – doors open at 8:00 AM\, Program starts at 9:00 AM \n\n\n\nTopic\nPresenter\n\n\nLimits of verification: learnings from catastrophic system failures\nPhilippe Luc – Codasip\n\n\nSpectres\, Meltdowns\, Zombies\, Orcs:  How formal methods could banish the ghosts that haunt our computing systems\nProf. Wolfgang Kunz – RPTU\n\n\nHow to sign-off cryptographic hash implementations with generated formal assertions\nTobias Ludwig – Lubis EDA\n\n\nDebugging enhancements for formal property checking\nHolger Busch – Infineon\n\n\nLunch\n\n\n\nReducing formal verification runtime in SystemC utilizing modular interface\nHideki Kazama – Sony\n\n\nHierarchical verification flow for FPGA design projects\nMamma Benmoussa Garsault – Arcys\n\n\nSafeguarding datapath integrity and compliance with formal security verification\nKeerthi Devarajegowda – Siemens\n\n\nEC-FPGA update (including a sneak preview of new synthesizer support)\nKevin Urish\, Siemens\n\n\nCombined formal and functional verification approach for digitally controlled analog frontend\nMihajlo Katona – Veriest\n\n\nFormal technology update and roadmap\nChris Giles\, Siemens\n\n\n\n\nRegister here: https://onespin.com/osmosis-2023/registration\n\nIf you have any questions (including whether if you could “bump” one of our R&D presenters to share your formal verification story)\, email osmosis.sisw@siemens.com with the “osmosis” keyword in the subject header.\nWe look forward to seeing you!!! \nThe Siemens Formal Verification Team \n* The agenda and speakers are subject to change without notice. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/formal-verification-conference-osmosis-2023/ LOCATION:Holiday Inn City Center\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Osmosis-2023.jpg END:VEVENT END:VCALENDAR