BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Asia/Jerusalem BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20220325T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20221029T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20230324T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20231028T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20240329T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20241026T230000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 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TZOFFSETTO:-0600 TZNAME:CST DTSTART:20221106T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20230312T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20231105T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20240310T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20241103T070000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Stockholm BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Taipei BEGIN:STANDARD TZOFFSETFROM:+0800 TZOFFSETTO:+0800 TZNAME:CST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Vienna BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Karachi BEGIN:STANDARD TZOFFSETFROM:+0500 TZOFFSETTO:+0500 TZNAME:PKT DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Paris BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Budapest BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Asia/Jerusalem:20231024T080000 DTEND;TZID=Asia/Jerusalem:20231024T170000 DTSTAMP:20231003T164756Z CREATED:20231003T164756Z LAST-MODIFIED:20231003T164756Z UID:6907-1698134400-1698166800@marketingeda.com SUMMARY:SemIsrael Expo 2023 DESCRIPTION:SemIsrael Expo 2023 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields and aspects of the semiconductor industry. \nThe Expo will host some 750 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups\, local R&D offices of multinationals and IDMs\, foundries\, design houses\, labs and universities.​   \nMeet Our Keynote Speakers\nVivek MishraCorporate Vice President – Product EngineeringCadence \nDr. Charlie SuCo-Founder\, President and CTOAndes Technology \nDr. Yervant ZorianChief Architect and FellowSynopsys \nKay EnjojiPresidentTEL Ventures \nLee HarrisonDirector Tessent Product MarketingSiemens EDA \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semisrael-expo-2023/ LOCATION:Avenue Convention Center\, Airport City\, Israel CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/semisrael-expo-2023-logo-blue-795-455.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20231015T080000 DTEND;TZID=America/Los_Angeles:20231018T170000 DTSTAMP:20231016T234413Z CREATED:20231016T234413Z LAST-MODIFIED:20231016T234413Z UID:6959-1697356800-1697648400@marketingeda.com SUMMARY:EPEPS 2023 DESCRIPTION:EPEPS is the premier international conference on advanced and emerging issues in electrical modeling\, analysis and design of electronic interconnections\, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal\, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society\, IEEE Microwave Theory and Techniques Society\, and IEEE Antenna and Propagation Society. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/epeps-2023/ LOCATION:Sonesta San Jose – Milpitas\, 777 Bellew Drive\, Milpitas\, CA\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/epeps-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Shanghai:20231014T080000 DTEND;TZID=Asia/Shanghai:20231017T170000 DTSTAMP:20230426T190115Z CREATED:20230426T190115Z LAST-MODIFIED:20230426T190115Z UID:6337-1697270400-1697562000@marketingeda.com SUMMARY:IEEE 32nd Asian Test Symposium DESCRIPTION:With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems\, incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things\, cloud computing\, automotive electronics\, etc.\, global proliferation and cooperation is increasingly more important. The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world to exchange innovative ideas on system\, board\, and device testing with design\, manufacturing\, and field consideration in mind. \nATS 2023\, the 32nd in the series\, will be held in Beijing China\, on Oct.14-17\, 2023. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-32nd-asian-test-symposium/ LOCATION:CA CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ATS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20231008T080000 DTEND;TZID=America/Los_Angeles:20231013T170000 DTSTAMP:20230811T182512Z CREATED:20230811T182341Z LAST-MODIFIED:20230811T182512Z UID:6699-1696752000-1697216400@marketingeda.com SUMMARY:International Test Conference 2023 DESCRIPTION:International Test Conference\, the cornerstone of TestWeek™ events\, is the world’s premier conference dedicated to the electronic test of devices\, boards and systems-covering the complete cycle from design verification\, test\, diagnosis\, failure analysis and back to process and design improvement. At ITC\, test and design professionals can confront the challenges the industry faces\, and learn how these challenges are being addressed by the combined efforts of academia\, design tool and equipment suppliers\, designers\, and test engineers. \nITC: A FORUM FOR EXCHANGE… THE HARBINGER OF CHANGE\nIn 1970\, engineers facing the test challenges posed by the then-novel semiconductor memory device organized a symposium on IC testing. That meeting at the Rickshaw Inn in Cherry Hill\, NJ drew a crowd of 147 people. That symposium is now a week-long conference attended by more than 2\,000 engineers from around the world including sister ITC conferences in India and Asia. \nIn its fifty-year history\, International Test Conference has become the world’s leading electronics test conference. No other industry has changed as much – or changed the world as much – in those fifty years as semiconductor technology. ITC has kept pace\, always seeking to develop new and innovative ways to fulfill its primary objective: the exchange of technical information. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/international-test-conference-2023/ LOCATION:Disneyland Hotel\, 1150 West Magic Way\, Anaheim\, CA\, 92802\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20231005T080000 DTEND;TZID=America/Los_Angeles:20231006T170000 DTSTAMP:20230917T004644Z CREATED:20230917T004644Z LAST-MODIFIED:20230917T004644Z UID:6804-1696492800-1696611600@marketingeda.com SUMMARY:EDPS 2023 DESCRIPTION:EDPS 2023 is approaching fast! The program is firming up – please see the program page for a preliminary list of talks. REGISTRATION IS NOW OPEN. Everyone\, including speakers\, must register. 2023-ieee-edps.eventbrite.com \nNote that this year we’ll be meeting on the Synopsys Campus.\nSynopsys Building 1\n800 North Mary Avenue\nSunnyvale\, CA\, 94085\n  \nMost of the talks from EDPS 2022 and the last 23 years of EDPS are now available\, and searchable\, on the Prior Years page. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/edps-2023/ LOCATION:Synopsys Building 1\, 800 North Mary Avenue\, Sunnyvale\, CA\, 94085\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/EDPS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20231002T080000 DTEND;TZID=America/Los_Angeles:20231005T170000 DTSTAMP:20230929T224251Z CREATED:20230929T224230Z LAST-MODIFIED:20230929T224251Z UID:6903-1696233600-1696525200@marketingeda.com SUMMARY:56th International Microelectronics Assembly and Packaging Society (IMAPS) DESCRIPTION:This packed conference brings together industry engineers\, researchers and top experts involved in advanced packaging and microelectronics assembly.  IMAPS Symposium offers a robust technical program with 5 concurrent tracks and 100+ speakers and posters covering SiP Design / Manufacturing Optimization; Wafer Level / Panel Level (Advanced RDL); High Performance\, High Reliability; Advanced Packages (Flip Chip\, 2.5D\, 3D\, Optical); and Advanced Process & Materials. \nProfessional Development Courses are supplemental two-hour classroom-style tutorials with a narrow educational focus taught by the best in the industry. The topics offered at IMAPS 2023 are designed to help attendees broaden their scope of knowledge. \nThe 2023 PDC courses are offered on Monday\, October 2\, prior to IMAPS 2023. Attendees must register for each course as an add-on to their overall symposium registration – additional fee for each PDC selected. Attendees may select up to one course in each time slot.  Make sure to review your preferred course’s time slot before registration. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/56th-international-microelectronics-assembly-and-packaging-society-imaps/ LOCATION:CA CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IMAPS-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20230925T080000 DTEND;TZID=Asia/Tokyo:20230927T170000 DTSTAMP:20230922T165957Z CREATED:20230922T165957Z LAST-MODIFIED:20230922T165957Z UID:6861-1695628800-1695834000@marketingeda.com SUMMARY:20th International Conference on IC Design and Technology (ICICDT) DESCRIPTION:2023 ICICDT is the twentieth edition (20th) in the series of the International Conference on IC Design and Technology\, organized since 2004. 2023 ICICDT will be co-organized and held at the University of Tokyo\, Tokyo\, Japan from September 25-27\, 2023. Design and technology co-optimization (DTCO) plays a critical role in the era of big data with an explosion of new applications in the prominent fields of artificial intelligence (AI) and 5G. To meet the ever-growing demand for speed and power efficiency in data computing and transmission\, separating design and technology\, as is done in traditional integrated circuit (IC) engineering\, encounters significant challenges. The ever-increasing complexity and variability require close interaction and collaboration for best optimization and trade-off by design\, device\, process and materials. Savvy IC engineers also require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window. ICICDT is\, by design\, a forum for engineers\, researchers\, graduate students\, and professors\, to cross the design-technology boundary by bringing design\, technology\, and process experts together. ICICDT has a unique format where each paper has a short presentation and a poster to encourage inquisitive discussions and the sharing of knowledge on a one-to-one basis during the poster session. This conference workshop style provides an excellent opportunity for all attendees to exchange breakthrough ideas and collaborate efficiently. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/20th-international-conference-on-ic-design-and-technology-icicdt/ LOCATION:University of Tokyo\, 7 Chome-3-1 Hongo\, Tokyo\, Japan CATEGORIES:Conference ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ICICDT-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230919T080000 DTEND;TZID=America/Los_Angeles:20230922T170000 DTSTAMP:20230918T231423Z CREATED:20230918T231423Z LAST-MODIFIED:20230918T231423Z UID:6821-1695110400-1695402000@marketingeda.com SUMMARY:PCB West 2023 DESCRIPTION:The Largest Conference and Exhibition for Printed Circuit Board Design\,\nFabrication and Assembly in the Silicon Valley \n\n\n\n\n\n\nFor more than 30 years PCB West has trained designers\, engineers\, fabricators and\, lately\, assemblers on making printed circuit boards for every product or use imaginable. More than 2\,000 designers\, fabricators\, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables\, there’s something for everyone involved in the electronics supply chain. This is one show you cannot afford to miss. \nBrought to you by PCEA: Engineering Tomorrow’s Electronics! \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/pcb-west-2023/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/PCB-West-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230919T080000 DTEND;TZID=Europe/Brussels:20230921T170000 DTSTAMP:20230801T171626Z CREATED:20230801T171626Z LAST-MODIFIED:20230801T171626Z UID:6634-1695110400-1695315600@marketingeda.com SUMMARY:AutoSens Brussels 2023 DESCRIPTION:We’re bringing AutoSens to Autoworld in Brussels once again to meet and shape the future of ADAS and AV. \nYou can look forward to the freshest agenda of over 60 speakers across expert panels\, technical case studies\, and sessions covering 12 key themes. You will experience an exhibition full of demos from technology companies at the forefront of sensors and computer vision to explore. \nJoin us on 19-21 September 2023 at the Autoworld Museum in Brussels. \n\n\nWindshield Technology\n\n\n\n\nEvery vehicle has one\, but are they optimised for ADAS/AD? A plenary session will consider the challenges of light\, heat\, tilt and yaw\, measurement\, and other important factors when pairing cameras with windshields. \n\n\nInfrastructure\n\n\n\n\nA keynote session will explore infrastructure from a perception and observation perspective\, as well as the communication between vehicles and the world around them (V2I and V2X). \n\n\nCyber Security & Data Privacy\n\n\n\n\nWith L4 and L5 drawing closer\, we must consider the ‘hackability’ of vehicles more than ever before\, not only for occupant safety\, but to prevent (or at least minimise) the weaponisation of autonomous vehicles.  \n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/autosens-brussels-2023/ LOCATION:Autoworld Museum\, 1000 Brussels\, Brussels\, Belgium CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/AutoSense-Brussels-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20230915T080000 DTEND;TZID=Europe/Berlin:20230917T170000 DTSTAMP:20230522T195247Z CREATED:20230522T195211Z LAST-MODIFIED:20230522T195247Z UID:6422-1694764800-1694970000@marketingeda.com SUMMARY:ORConf 2023 DESCRIPTION:FOSSi Foundation are pleased to announce ORConf 2023 will be taking place in beautiful Munich\, Germany on September\, 15th to 17th\, 2023. It will start Friday morning and Sunday is currently reserved for tutorials and workshops. \n\nORConf is an annual conference for open source digital\, semiconductor and embedded systems designers and users. Each year attendees are treated to an ever-impressive array of presentations from all corners of the open source hardware space. \nWe invite anyone with an interest in the field to join us and also consider a presentation\, big or small\, on your experience as a developer or a user of open source digital design projects. \nORConf remains to be free to attend thanks to each year’s sponsors. Please do get in touch should you be interested in getting exposure for your company by becoming a sponsor of ORConf! \nORConf is organized by the Free and Open Source Silicon (FOSSi) Foundation. \nQuestions? Contact the organisers. \nSubmit a talk\n\nWe encourage anyone involved in the open source semiconductor engineering space to come along and give share your work or experience. \nThis year we’re offering lightning talk and 15-minute speaking slots\, with the choice of opting in to be considered for an extended slot of 30-40 minutes. We are intentionally reducing the standard speaking slot length this year to ensure we can accommodate all of the exceptional talk submissions we receive\, and to maximize face-to-face time throughout the event. We encourage speakers to skip the technical deep-dive presentations and instead provide high-level introductions and overviews of what makes their work great\, and prepare a poster or hardware demo for people to come and discuss details during the breaks. \nSo if you’ve designed\, worked on or even just used open source IP cores and/or management systems\, verification IP\, build flows\, SoCs\, simulators\, synthesis tools\, FPGA and ASIC implementation tools\, languages and DSLs\, compilers\, or anything related we’d love to have you join us to share your experience. \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/orconf-2023/ LOCATION:Hochschule Munchen University of Applied Sciences\, Lothstr. 64\, Munich\, Germany CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ORConf-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Copenhagen:20230914T080000 DTEND;TZID=Europe/Copenhagen:20230914T170000 DTSTAMP:20230901T173607Z CREATED:20230901T173607Z LAST-MODIFIED:20230901T173607Z UID:6773-1694678400-1694710800@marketingeda.com SUMMARY:FPGAworld Conference 2023 - Copenhagen DESCRIPTION:The FPGAworld Conference is an international forum for researchers\, engineers\, teachers\, students\, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems\, FPGA/ASIC-based products\, educational & industrial cases\, and more. Registration for attendees is free and includes 2*coffee\, lunch and go-home drink. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/fpgaworld-conference-2023-copenhagen-2/ LOCATION:DTU Science Park\, 2800 Kongens\, Lyngby\, Denmark CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FPGAworld-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Chicago:20230914T080000 DTEND;TZID=America/Chicago:20230914T170000 DTSTAMP:20230808T170957Z CREATED:20230619T165240Z LAST-MODIFIED:20230808T170957Z UID:6524-1694678400-1694710800@marketingeda.com SUMMARY:Verification Futures 2023 Austin DESCRIPTION:The Verification Futures conferences is dedicated to discussing the challenges faced in hardware and software verification. \nTo view the agenda for this event please visit the VF2023 Event Page. \nThe full conference program includes 17 talks covering verification challenges and solutions\, formal verification\,  RISC-V\,  System Verilog\, UVM for AMS Verification\, and VHDL Verification \nView the full conference agenda below. \n\n\n\n08:30\nArrival: Breakfast and Networking\nSlides\nVideos\n\n\n09:25\nWelcome: Mike Bartley\, Tessolve Semiconductor Ltd\n\n\n\n\n\nKeynote Speakers\n\n\n\n\n09:30\nSafety and Security challenges in hardware IP development \nVivek Vedula (Arm Ltd.)\n\n\n\n\n\nUser Top Verification Challenges\n\n\n\n\n10:15\nEricsson’s Challenges of IP Development and Verification for Products with a Long Shelf Life \nAlex Duhovich (Ericsson)\n\n\n\n\n10:30\nEngines\, Logistics and AI \nBahadir Erimli (Cadence Design Systems) Platinum Sponsor\n\n\n\n\n11:00\nRefreshments and Networking\n\n\n\n\n\nMulti-Track Session (AM)\n\n\n\n\n\nUser Presentations\n\n\n\n\n11:30\n10 years of Verification Challenges \nMike Bartley(Tessolve Semiconductor Ltd)\n\n\n\n\n11:40\nRISCV CPU Verification – Opportunities and Challenges \nDivyang Agrawal(Tenstorrent\, Inc)\n\n\n\n\n12:10\nValidation of Hybrid Architectures \nSuneil Mohan(Intel Corporation)\n\n\n\n\n\nTrack 2 – Training Session 1\n\n\n\n\n11:30\nWhat Can Formal Do For Me? \nDoug Smith (Doulos) Gold Sponsor\n\n\n\n\n\nTrack 3 – UVM for AMS Verification\n\n\n\n\n11:30\nRenesas’s Submission to the UVM-(A)MS working group \nPeter Grove\, Steven Holloway (Renesas)\n\n\n\n\n12:30\nLunch and Networking\n\n\n\n\n13:30\nA Modern Fable: The Lost Art of Processor Verification \nLarry Lapides (Imperas Software Ltd.) Platinum Sponsor\n\n\n\n\n14:00\nAdvanced RISC-V Verification Technique Learnings for SoC Validation \nAdnan Hamid (Breker Verification Systems) Gold Sponsor\n\n\n\n\n14:20\nImprove the Quality of the Testbenches using specialized PySlint solutions \nBalram Naik Meghavath (Broadcom ltd.\,)\n\n\n\n\n14:40\nVerification by Documentation \nHemendra Talesara (Independent Board Member)\n\n\n\n\n15:00\nRefreshments and Networking\n\n\n\n\n\nMulti-Track Session (PM)\n\n\n\n\n\nTrack 1 – Latest topics in Verification\n\n\n\n\n15:30\nLeveraging AMS verification and DMS verification for efficiency and quality in Mixed-signal designs \nAditya Devarakonda (NXP Semiconductor)\n\n\n\n\n15:50\nSigmasense\n\n\n\n\n16:10\nMethodology focused testbench generation \nBenjamin Delsol (UVMGen)\n\n\n\n\n\nTrack 2 – Training Session 2\n\n\n\n\n15:30\nUsing Non-Determinism with Formal \nDoug Smith(Doulos) Gold Sponsor\n\n\n\n\n\nTrack 3 – VHDL Verification\n\n\n\n\n15:30\nOSVVM in a NutShell\, VHDL’s #1 Verification Methodology \nJim Lewis (SynthWorks Design Inc)\n\n\n\n\n16:30\nEvent Closes\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/verification-futures-2023-austin/ LOCATION:Austin Marriott South\, 4415 South Interstate 35 Frontage Road\, Austin\, TX\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/VF-2023-Austin.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20230913T080000 DTEND;TZID=Asia/Kolkata:20230914T170000 DTSTAMP:20230907T175227Z CREATED:20230727T164506Z LAST-MODIFIED:20230907T175227Z UID:6617-1694592000-1694710800@marketingeda.com SUMMARY:DVCon India 2023 DESCRIPTION:On behalf of the DVCon India 2023 steering committee\, it is my pleasure to welcome you all to the 8th edition of the Design and Verification Conference in India planned from 13- 14th September 2023 as an In-Person conference.  We want to carry forward the momentum\, excitement and the enthusiasm witnessed during last year’s edition into DVCon India 2023. The conference would be following the contemporary Indian version of a two-day conference with in-depth technical content spreading across both the days. We thank you all and the entire ecosystem for the understanding and cooperation throughout this journey. \nThis year’s edition will have a good blend of Vision and Keynote talks\, lively panel discussions tutorials and technical sessions spread across both the days. We are looking at some of the feedback and see how to set an agenda that provides key takeaways to everyone at the conference. \nThis conference will give you ample opportunities to share and highlight your technical contributions in the areas of Verification & Validation\, Methodology & Automation\, Functional Safety & Security\, Low Power and Mixed Signal Design\, Static and Formal methods and Digital Twins and SystemC Modelling and New Design Areas and Disruptive Trends in Design Verification to showcase the latest work being done in AI/ML implementation\, Big Data analysis and new algorithms in HW/SW co-design and co- verification. We want to remind you that this isn’t just a Verification conference\, but a Design AND Verification conference and we want to ensure that the Design community has greater participation. \nThis year\, we will be expanding our Technical Program Committee and we want to make it even stronger than what it is now. The entire team is planning and putting in the extra hours to ensure we deliver a world class technical conference and am sure you will participate to elevate the conference experience. \nWe invite the entire technical fraternity from the ecosystem to actively participate\, engage\, share learnings with the rest of the community and take an enthusiastic part in DVCon India 2023 and make it a grand success! \n\n \nPradeep Salla\nSiemens EDA\nGeneral Chair\, DVCon India 2023 \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-india-2023/ LOCATION:Radisson Blu\, Outer King Road\, Bengaluru\, India CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-India-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230912T080000 DTEND;TZID=America/Los_Angeles:20230914T170000 DTSTAMP:20230424T172221Z CREATED:20230424T172221Z LAST-MODIFIED:20230424T172221Z UID:6320-1694505600-1694710800@marketingeda.com SUMMARY:AI Hardware & Edge AI Summit DESCRIPTION:The combined AI Hardware & Edge AI Summit comprehensively covers the design and deployment of ML hardware and software infrastructure across the cloud-edge continuum. \nFor Enterprise ML Experts: Attend a unique AI systems event that will give you both hardware and software tools and techniques for training\, deploying\, and serving machine learning – the program contains a mixture of state-of-the-art topics and practical tutorials\, so you know what is out there\, and what you can use. 40% of our audience are enterprise ML practitioners just like you! \nFor Technology Vendors: Attend the premier event for the AI infrastructure ecosystem\, which blends systems\, software\, tooling and applications for a unique proposition that focuses on making ML faster\, more efficient and more affordable. If your product fits into this category\, your peers and customers are here! \n2023 LUMINARY KEYNOTE ANNOUNCEMENTS\nAndrew Ng\, Founder & CEO\, Landing AI \nJim Keller\, CEO\, Tenstorrent \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ai-hardware-edge-ai-summit/ LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/AI-Summit-2023.jpg ORGANIZER;CN="Kisaco Research":MAILTO:events@kisacoresearch.com END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Stockholm:20230912T080000 DTEND;TZID=Europe/Stockholm:20230912T170000 DTSTAMP:20230216T012619Z CREATED:20230216T011624Z LAST-MODIFIED:20230216T012619Z UID:5985-1694505600-1694538000@marketingeda.com SUMMARY:FPGAworld Conference 2023 - Stockholm DESCRIPTION:The FPGAworld Conference is an international forum for researchers\, engineers\, teachers\, students\, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems\, FPGA/ASIC-based products\, educational & industrial cases\, and more. Registration for attendees is free and includes 2*coffee\, lunch and go-home drink. \n\nKeynote Speaker Copenhagen and Stockholm 2023\n\n\nKeynote speaker: Martin Kellermann \, Microchip Technology GmbH\, Munich\n\n\nTitle: RISC-V: Paving the Path Together to a Safe\, Secure and Reliable Future\n\n\nAbstract: RISC-V is an open-source instruction set that has created opportunities for companies of all sizes to innovate and make decisions independently. It is predicted to shape the future of computing for the next 50 years by providing a processor architecture that allows for more processing with a smaller carbon footprint\, more features with less development resources\, and new ways to combat threats with existing technologies. Companies are already utilizing RISC-V to develop applications such as High-Performance Spaceflight Computing (HPSC) processors. This keynote will explore how companies can benefit from this independence and how the ecosystems can enable easy adoption and scalability. It will also highlight companies that are already a part of this revolution and discuss how they can help create a safe and secure future. Through RISC-V\, companies can reach their goals and protect their future. Together\, we can move mountains. \nCV: Martin Kellermann is an experienced FPGA and SoC engineer with a diploma in Electrical Engineering from the Landshut University of Applied Sciences. He has expertise in high-speed serial data transmission\, signal integrity\, and hardware debugging\, successfully delivering projects in the industrial\, automotive\, and data-center domains. As Marketing Manager at Microchip Technology GmbH\, Munich\, he works with the European Sales and Field Application team to showcase the strengths of their FPGAs and SoCs. \n\nKeynote Speakers Stockholm 2023\n\n\nKeynote speaker: Mark Frost\, Intel’s Programmable Solutions Group (previously Altera)\, England\n\n\nTitle: Key Factors for Success in Today’s and Tomorrow’s Markets\n\n\nAbstract: This presentation will explore the key areas that FPGA suppliers must consider in order to succeed: industry-leading supply chain management\, product leadership\, and an up-to-date developer experience. We will examine the current supply chain landscape\, which is facing an unprecedented imbalance in demand and supply\, leading to long lead times and product allocations. We will also discuss the need for FPGA companies to make strategic investments to achieve product leadership and remain competitive. Furthermore\, we will look at the importance of having up-to-date knowledge and skills\, fast and appropriate EDA tools\, the right SoCs\, and the right RTL\, SW\, and hardware IP from generation to generation for FPGA developers to be productive. The presentation will then provide an overview of the different options available to FPGA vendors\, preferred standards\, and flows. Finally\, we will look at how FPGA technology is being used in different parts of the world and provide a prediction of its future. \nCV: Mark is the FPGA Security and 5G Technical Marketing Manager within Intel’s Programmable Solutions Group (previously Altera). Within this role Mark liaises between customers\, sales and engineering teams worldwide for security and 5G communication topics\, and works to create market awareness of Intel’s portfolio. During his 11 years with Intel he has held roles in both marketing and as a field application engineer covering programmable technology. Prior to Intel\, Mark had worked for over 15 years in a variety of engineering roles\, spanning telecommunications through to designing instruments for ESA satellites. Mark has a BEng in Electrical Engineering from the University of Plymouth. \nSeptember 14 details in Copenhagen \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/fpgaworld-conference-2023/ LOCATION:ÅF\, Frösundaleden 2A\, 169 70 Solna\, Sweden CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/FPGAworld-2023.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Taipei:20230907T080000 DTEND;TZID=Asia/Taipei:20230907T170000 DTSTAMP:20230406T174802Z CREATED:20230406T174802Z LAST-MODIFIED:20230406T174802Z UID:6241-1694073600-1694106000@marketingeda.com SUMMARY:DVCon Taiwan 2023 DESCRIPTION:The Design & Verification Conference & Exhibition is the premier conference on the application of languages\, tools\, methodologies and standards for the design and verification of electronic systems and integrated circuits. \nConference Sponsor: Accellera \nGlobal Sponsors: Synospys\, Cadence\, Siemens \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-taiwan-2023/ LOCATION:National Yang Ming Chiao Tung University\, 300\, Hsinchu City\, Taiwan CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-Taiwan-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230905T080000 DTEND;TZID=America/Los_Angeles:20230908T170000 DTSTAMP:20230413T202528Z CREATED:20230413T202528Z LAST-MODIFIED:20230413T202528Z UID:6272-1693900800-1694192400@marketingeda.com SUMMARY:IEEE SOCC 2023 DESCRIPTION:SoCs and SiPs for Edge Intelligence and Accelerated Computing \nSystem-on-Chip (SoC) and System-in-Package (SiP) devices\, comprising digital\, analog\, optical\, RF\, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication\, entertainment\, medical and smart mobility technologies underpinning emerging “Digital Societies”. \nRecent advances in systems\, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices\, various accelerators\, new products and applications. This enormous demand for computing per silicon-based SoC and SiP integration creates new challenges with respect to storage\, memory\, security\, reliability\, power\, on- and off-chip communication\, packaging including reliable design and verification. \nFor over 35 years the IEEE International System-on-Chip Conference (SOCC) has been a premier forum for sharing latest advancements in SoC architectures\, systems\, logic and circuit design\, process technology\, test\, design tools\, and application scenarios. We consequently continue this tradition with the 2023 conference at the heart of Silicon Valley in Santa Clara\, CA. \nThe 36th SOCC offers a three days technical program including keynote and plenary speeches\, oral and poster presentations\, hot-topic panel sessions\, and one day of industrial talks. In addition\, SOCC has a long tradition of high-class social events complementing the technical program\, helping you to discuss your work with your colleagues\, and enhancing your professional network. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-socc-2023/ LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEEE-SOCC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230827T080000 DTEND;TZID=America/Los_Angeles:20230829T170000 DTSTAMP:20230613T165859Z CREATED:20230613T165859Z LAST-MODIFIED:20230613T165859Z UID:6490-1693123200-1693328400@marketingeda.com SUMMARY:Hot Chips 2023 DESCRIPTION:Hot Chips 2023 (advance program) will be held as a hybrid conference with in-person attendance at Stanford University from August 27 to 29\, 2023. \nConference Format\nHot Chips 2023 will be a hybrid conference. You may register to attend virtual or in-person. The conference venue is the Dinkelspiel Auditorium on the Stanford University Conference. \n\nSunday (August 27) is a Tutorial Day.\nMonday and Tuesday (August 28 and 29) are Conference Days.\n\nVirtual Conference: Includes full access to conference videos\, presentation PDFs and Slack Channels for both Tutuorial and Conference Days. All talks are transmitted in real time and are also recorded so that you also may view them at a time convenient for your time zone. Details are here. \nIn-Person Conference: You may register for Conference Days only or both Conference and Tutorial Days. In either case you will have full access to Videos\, presentation PDFs and Slack channels. The conference fee includes breakfast\, lunch\, coffee breaks and receptions. Details are here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/hot-chips-2023/ LOCATION:Stanford University\, 471 Lagunita Drive\, Stanford\, CA\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/14054931_10155065287553998_1856342906013349235_n.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230822T080000 DTEND;TZID=America/Los_Angeles:20230824T170000 DTSTAMP:20230802T171343Z CREATED:20230802T171343Z LAST-MODIFIED:20230802T171343Z UID:6655-1692691200-1692896400@marketingeda.com SUMMARY:ERI 2.0 Summit DESCRIPTION:Watch as leaders from our government agencies\, the Defense Industrial Base\, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry\, national and economic security\, and future research directions. \nThe Electronics Resurgence Initiative (ERI)\, DARPA’s response to national-level microelectronics concerns\, is designed to ensure U.S. leadership in cross-functional\, next-generation microelectronics research\, development\, and manufacturing. The initiative\, aimed at both national security capabilities and commercial economic competitiveness and sustainability\, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry\, the defense industrial base\, and university researchers. \nDARPA expanded ERI’s focus with the announcement of ERI 2.0\, which seeks to reinvent domestic microelectronics manufacturing. ERI 2.0 will strengthen DARPA’s leadership in driving the next generation of microelectronics for national security by creating a national capability for 3DHI manufacturing and pursuing focused research in: \n\nManufacturing complex 3D systems\nDeveloping electronics for extreme environments\n\n…while maintaining the following thrust areas:\n  \n\nOptimizing design and test for complex circuits and prototypes\nOvercoming security threats across the entire hardware lifecycle\nIncreasing information processing density and efficiency\nAccelerating innovation in artificial intelligence hardware to make decisions at the edge faster\nSecuring communications\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/eri-2-0-summit/ LOCATION:Hyatt Regency Seattle\, 805 Howell Street\, Seattle\, WA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ERI-2.0.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230808T080000 DTEND;TZID=America/Los_Angeles:20230810T170000 DTSTAMP:20230726T200743Z CREATED:20230726T200648Z LAST-MODIFIED:20230726T200743Z UID:6612-1691481600-1691686800@marketingeda.com SUMMARY:Flash Memory Summit DESCRIPTION:Why Attend Flash Memory Summit?\nFlash Memory Summit (FMS) is an all-inclusive international memory and storage showcase. It is the event for the memory and storage industry. It is the one-stop place to catch up on the latest technologies\, see the hottest products\, and learn about what’s happening and where the latest trends are heading. FMS is now the largest memory and storage industry show with the most high-level keynoters from leading companies\, the largest exhibits\, and the most sessions covering everything from applications and architectures through enterprise storage\, controllers\, and new technologies. \nOur industry continues to thrive and grow with new technology and more applications than ever. FMS has expanded to an all- inclusive memory and storage summit welcoming all emerging memory and storage solutions The scope of FMS23 will include DRAM\, DNA data storage\, UCIe chiplet interconnects\, Compute Express Link (CXL)\, wearables\, automotive\, AI/ML\, data centers\, and entertainment applications\, along with 3D flash\, NVMe\, ZNS\, and important industry announcements. As one past attendee put it\, “Flash is a big society and FMS is the right show.” \nWhy You Should Participate\n• Establish your company as a leader in the emerging memory and storage market.\n• Display your products and expertise to an audience known to be interested in memory and storage.\n• Promote memory and storage to a wider market of equipment manufacturers\, solution providers\, system integrators\, consultants. \nHow You Can Participate:\n• Attend: Register online for the sessions\n• Exhibit: Promote your latest products – exhibit booths\n• Sponsor: Receive special recognition both at the event and in publicity\n• Present: Display your knowledge and commitment to flash memory \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/flash-memory-summit-2/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FMS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Vienna:20230807T080000 DTEND;TZID=Europe/Vienna:20230808T170000 DTSTAMP:20230207T013618Z CREATED:20230207T013618Z LAST-MODIFIED:20230207T013618Z UID:5914-1691395200-1691514000@marketingeda.com SUMMARY:ISPLED 2023 DESCRIPTION:The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design\, ranging from process technologies and analog/digital circuits\, simulation and synthesis tools\, system-level design and optimization\, to system software and applications. \n  \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ispled-2023/ LOCATION:TU Wien\, Gußhausstraße 27-29/384\, Vienna\, Austria CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISLPED-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230731T080000 DTEND;TZID=America/Los_Angeles:20230804T170000 DTSTAMP:20230719T194258Z CREATED:20230719T194258Z LAST-MODIFIED:20230719T194258Z UID:6601-1690790400-1691168400@marketingeda.com SUMMARY:EMC+SIPI 2023 DESCRIPTION:EMC+SIPI 2023 leads the industry in providing state-of-the-art education on EMC and Signal Integrity and Power Integrity techniques. Don’t miss out on this valuable opportunity to learn from and network with industry leaders and peers. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/emcsipi-2023/ LOCATION:DeVos Place\, 303 Monroe Ave NW\, Grand Rapids\, MI\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/EMCSIPI.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230723T080000 DTEND;TZID=America/Los_Angeles:20230725T170000 DTSTAMP:20230616T205921Z CREATED:20230616T205921Z LAST-MODIFIED:20230616T205921Z UID:6512-1690099200-1690304400@marketingeda.com SUMMARY:ITC India 2023 DESCRIPTION:Keynote speakers\n\n\nFadi Maamari \n\n\n\n\nVP of Engineering at Synopsys \n\n\nSule Ozev \n\n\n\n\nArizona State University \n\n\nAbout Us \n\n\n\n\nInternational Test Conference is the world’s premier venue dedicated to the electronic test of devices\, boards and systems-covering the complete cycle from design verification\, design-for-test\, design-for-manufacturing\, silicon debug\, manufacturing test\, system test\, diagnosis\, reliability and failure analysis\, and back to process and design improvement. \n\n\n\n\nAt ITC India\, design\, test\, and yield professionals can confront challenges faced by the industry\, and learn how these challenges are being addressed by the combined efforts of academia\, design tool and equipment suppliers\, designers\, and test engineers. \n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/itc-india-2023/ LOCATION:Hotel Radisson Blu\, Marathalli ORR\, Bengaluru\, India CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITC-India-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Karachi:20230723T080000 DTEND;TZID=Asia/Karachi:20230725T170000 DTSTAMP:20230225T064841Z CREATED:20230225T064841Z LAST-MODIFIED:20230225T064841Z UID:6018-1690099200-1690304400@marketingeda.com SUMMARY:International Test Conference - India\, 2023 DESCRIPTION:International Test Conference is the world’s premier venue dedicated to the electronic test of devices\, boards and systems-covering the complete cycle from design verification\, design-for-test\, design-for-manufacturing\, silicon debug\, manufacturing test\, system test\, diagnosis\, reliability and failure analysis\, and back to process and design improvement. \n\n\n\n\nAt ITC India\, design\, test\, and yield professionals can confront challenges faced by the industry\, and learn how these challenges are being addressed by the combined efforts of academia\, design tool and equipment suppliers\, designers\, and test engineers. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/international-test-conference-india-2023/ LOCATION:Radisson Blu\, Outer King Road\, Bengaluru\, India CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITC-India-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20230710T080000 DTEND;TZID=Europe/Paris:20230712T170000 DTSTAMP:20230222T233720Z CREATED:20230222T233720Z LAST-MODIFIED:20230222T233720Z UID:6009-1688976000-1689181200@marketingeda.com SUMMARY:Free Silicon Conference - FSiC2023 DESCRIPTION:The 2023 Free Silicon Conference (FSiC) will take place in Paris (Sorbonne) on July 10\,11\,12 2023 (Monday to Wednesday). This event will build on top of the past FSiC2019 and FSiC2022 editions. The conference will connect experts and enthusiasts who want to build a complete Free and Open Source CAD ecosystem for designing analog and digital integrated circuits. The conference will cover the full spectrum of the design process\, from system architecture\, to layout and verification. After the daily talks\, the discussion will continue until late in an informal and relaxed atmosphere. \nTentative program\n\nHigh-level design\nHardware security\nOn-going FOS silicon projects\nMemories\nFoundries and PDKs\nTransistor modelling\nPlace-and-route tools\nParasitic extraction\nDesign rule checking\nSchematic editors\nPhotonics\nSustainability\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/free-silicon-conference-fsic2023/ LOCATION:Sorbonne Université\, 15-21 Rue de l'École de Médecine\, Paris\, France CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FSiC2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20230704T080000 DTEND;TZID=Europe/Paris:20230706T170000 DTSTAMP:20230120T171956Z CREATED:20230120T171956Z LAST-MODIFIED:20230120T171956Z UID:5862-1688457600-1688662800@marketingeda.com SUMMARY:FPGA Conference Europe 2023 DESCRIPTION:FPGAs have made a regular evolutional leap forward in terms of new approaches and solutions for both hardware- and software developers. \nThe FPGA Conference Europe\, organized by ELEKTRONIKPRAXIS and the FPGA training center PLC2\, is addressing that progress across all major manufacturers. It focusses on user-oriented\, practically applicable solutions that developers can quickly integrate into their own everyday work. At this year’s event\, one focus is on the energy efficiency of flexible logic devices. This applies in particular to small\, low-power components that rely on special production techniques or deliberately have only a limited number of programmable cells. \nPGAs belong to the hidden champions of microelectronics and are at the forefront of embedded development. From tiny and energy-efficient sensor fusion solutions for the automotive industry\, to intelligent platforms for condition monitoring in networked factories\, to powerful deep learning accelerators in the largest data centers\, these flexible logic devices play an important role in many applications and will be discussed on the FPGA Conference. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/fpga-conference-europe-2023/ LOCATION:NH München Ost Conference Center\, Einsteinring 20\, Munich\, Aschheim\, 85609\, Germany CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FPGA-Europe-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Budapest:20230629T080000 DTEND;TZID=Europe/Budapest:20230630T170000 DTSTAMP:20230620T163638Z CREATED:20230620T163638Z LAST-MODIFIED:20230620T163638Z UID:6532-1688025600-1688144400@marketingeda.com SUMMARY:30th MIXDES Conference DESCRIPTION:The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design\, modeling\, simulation\, testing and manufacturing in various areas such as micro- and nanoelectronics\, semiconductors\, sensors\, actuators and power devices.\nThe MIXDES conference papers will be submitted for inclusion into IEEE Xplore\, subject to IEEE Xplore’s scope and quality requirements. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/30th-mixdes-conference/ LOCATION:Lodz Univesity of Technology\, Wólczańska 221/223\, Lodz\, Poland CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/MIXDES-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230627T093000 DTEND;TZID=America/Los_Angeles:20230627T170000 DTSTAMP:20230523T005957Z CREATED:20230523T005957Z LAST-MODIFIED:20230523T005957Z UID:6427-1687858200-1687885200@marketingeda.com SUMMARY:2023 Andes RISC-V CON DESCRIPTION:RISC-V is revolutionizing the future of Artificial Intelligence (AI) in industries such as automotive\, data center\, communications\, and IoT. Its open-source instruction set architecture (ISA) provides higher performance\, lower power\, and compact silicon footprint\, features highly desired by these industry segments. RISC-V has gained rapid widespread adoption due to its compact instruction set and extensibility. The upcoming RISC-V CON\, an annual conference organized by Andes Technology\, will focus on the theme of “RISC-V: Redefining AI’s Future in Automotive\, Data Center\, Communications\, and IoT” The event will provide a perfect opportunity to connect with the RISC-V community and showcase the latest trends\, market developments\, emerging applications\, and technological breakthroughs in this revolutionary ISA. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/2023-andes-risc-v-con/ LOCATION:The DoubleTree by Hilton\, 2050 Gateway Place\, San Jose\, CA\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Andes-June-27-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230626T080000 DTEND;TZID=America/Los_Angeles:20230628T170000 DTSTAMP:20230424T194057Z CREATED:20230424T194057Z LAST-MODIFIED:20230424T194057Z UID:6329-1687766400-1687971600@marketingeda.com SUMMARY:3D & Systems Summit DESCRIPTION:The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market\, products\, and tech advancements brought by disruptive technologies and Moore’s Law plateauing. Therefore\, continued developments and innovation are essential to growing the business. \nIndustry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications. \nParticipants can enjoy the exclusive exhibition areas that will feature the most prominent names in the industry alongside new and innovative companies. \nSeveral B2B matching opportunities await during the conference\, including networking reception\, coffee breaks\, lunches\, and a unique Networking Dinner Cruise at the beautiful Elbe River. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/3d-systems-summit/ LOCATION:Dresden Hilton Hotel\, An der Frauenkirche 5 D\, Dresden\, Germany CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-June-26-28-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20230626T080000 DTEND;TZID=Europe/Paris:20230627T170000 DTSTAMP:20230621T192056Z CREATED:20230621T191832Z LAST-MODIFIED:20230621T192056Z UID:6553-1687766400-1687885200@marketingeda.com SUMMARY:European Nanoelectronics Applications Design and Technology Conference DESCRIPTION:FOCUS \nThe European Nanoelectronics Applications\, Design & Technology Conference will focus on electronic components\, electronic system design\, design automation\, and manufacturing topics related to micro- and nanoelectronics\, which are critical to success for many European companies. Exhaustive research and development in this area have been supported by EUREKA\, Horizon Europe\, and local governments in recent years. This conference will highlight the exciting and promising results primarily from the PENTA/XECS\, ECSEL/KDT & H2020/Horizon Europe projects. \nThis annual event has a clear focus on deep technical discussions between the leading European experts in the addressed fields\, independent from the research programs where the individual projects were started. All European projects related to electronic system design\, to design technology and to manufacturing topics are invited to contribute to the conference. \nThe 100 expected attendees will include project managers and leading experts in R&D projects in the fields of nanoelectronics and design technologies and their applications\, semiconductor-industry R&D managers\, microelectronics experts in applications industries like automotive and industrial\, and the major research organizations in the European scientific community. \nVENUE \nThis year\,  ADTC takes place in the Y-SPOT Building\, 5\, Place Nelson Mandela\, Grenoble\,  in “Attique” room. For more information\, please sroll down. \nFINANCIAL CONCEPT \nADTC is organized as collaboration event for experts in the field. All attendees benefit from the intensive information exchange and share the cost\, which will be kept low. It is a nonprofit event\, the local organisers do not get any compensation for their work. Most attendees contribute actively to the event\, e.g. as speaker or panelist\, therefore free participation is not possible. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/european-nanoelectronics-applications-design-and-technology-conference/ LOCATION:Y-SPOT Building\, 5\, Place Nelson Mandela\, Grenoble\, France CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ADTC23-3.jpg END:VEVENT END:VCALENDAR