BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Stockholm BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Taipei BEGIN:STANDARD TZOFFSETFROM:+0800 TZOFFSETTO:+0800 TZNAME:CST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Vienna BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 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TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/London BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Andorra BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 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TZOFFSETTO:-0500 TZNAME:EST DTSTART:20241103T060000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Jerusalem BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20220325T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20221029T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20230324T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20231028T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20240329T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20241026T230000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20230913T080000 DTEND;TZID=Asia/Kolkata:20230914T170000 DTSTAMP:20230907T175227Z CREATED:20230727T164506Z LAST-MODIFIED:20230907T175227Z UID:6617-1694592000-1694710800@marketingeda.com SUMMARY:DVCon India 2023 DESCRIPTION:On behalf of the DVCon India 2023 steering committee\, it is my pleasure to welcome you all to the 8th edition of the Design and Verification Conference in India planned from 13- 14th September 2023 as an In-Person conference.  We want to carry forward the momentum\, excitement and the enthusiasm witnessed during last year’s edition into DVCon India 2023. The conference would be following the contemporary Indian version of a two-day conference with in-depth technical content spreading across both the days. We thank you all and the entire ecosystem for the understanding and cooperation throughout this journey. \nThis year’s edition will have a good blend of Vision and Keynote talks\, lively panel discussions tutorials and technical sessions spread across both the days. We are looking at some of the feedback and see how to set an agenda that provides key takeaways to everyone at the conference. \nThis conference will give you ample opportunities to share and highlight your technical contributions in the areas of Verification & Validation\, Methodology & Automation\, Functional Safety & Security\, Low Power and Mixed Signal Design\, Static and Formal methods and Digital Twins and SystemC Modelling and New Design Areas and Disruptive Trends in Design Verification to showcase the latest work being done in AI/ML implementation\, Big Data analysis and new algorithms in HW/SW co-design and co- verification. We want to remind you that this isn’t just a Verification conference\, but a Design AND Verification conference and we want to ensure that the Design community has greater participation. \nThis year\, we will be expanding our Technical Program Committee and we want to make it even stronger than what it is now. The entire team is planning and putting in the extra hours to ensure we deliver a world class technical conference and am sure you will participate to elevate the conference experience. \nWe invite the entire technical fraternity from the ecosystem to actively participate\, engage\, share learnings with the rest of the community and take an enthusiastic part in DVCon India 2023 and make it a grand success! \n\n \nPradeep Salla\nSiemens EDA\nGeneral Chair\, DVCon India 2023 \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-india-2023/ LOCATION:Radisson Blu\, Outer King Road\, Bengaluru\, India CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-India-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230912T080000 DTEND;TZID=America/Los_Angeles:20230914T170000 DTSTAMP:20230424T172221Z CREATED:20230424T172221Z LAST-MODIFIED:20230424T172221Z UID:6320-1694505600-1694710800@marketingeda.com SUMMARY:AI Hardware & Edge AI Summit DESCRIPTION:The combined AI Hardware & Edge AI Summit comprehensively covers the design and deployment of ML hardware and software infrastructure across the cloud-edge continuum. \nFor Enterprise ML Experts: Attend a unique AI systems event that will give you both hardware and software tools and techniques for training\, deploying\, and serving machine learning – the program contains a mixture of state-of-the-art topics and practical tutorials\, so you know what is out there\, and what you can use. 40% of our audience are enterprise ML practitioners just like you! \nFor Technology Vendors: Attend the premier event for the AI infrastructure ecosystem\, which blends systems\, software\, tooling and applications for a unique proposition that focuses on making ML faster\, more efficient and more affordable. If your product fits into this category\, your peers and customers are here! \n2023 LUMINARY KEYNOTE ANNOUNCEMENTS\nAndrew Ng\, Founder & CEO\, Landing AI \nJim Keller\, CEO\, Tenstorrent \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ai-hardware-edge-ai-summit/ LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/AI-Summit-2023.jpg ORGANIZER;CN="Kisaco Research":MAILTO:events@kisacoresearch.com END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Stockholm:20230912T080000 DTEND;TZID=Europe/Stockholm:20230912T170000 DTSTAMP:20230216T012619Z CREATED:20230216T011624Z LAST-MODIFIED:20230216T012619Z UID:5985-1694505600-1694538000@marketingeda.com SUMMARY:FPGAworld Conference 2023 - Stockholm DESCRIPTION:The FPGAworld Conference is an international forum for researchers\, engineers\, teachers\, students\, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems\, FPGA/ASIC-based products\, educational & industrial cases\, and more. Registration for attendees is free and includes 2*coffee\, lunch and go-home drink. \n\nKeynote Speaker Copenhagen and Stockholm 2023\n\n\nKeynote speaker: Martin Kellermann \, Microchip Technology GmbH\, Munich\n\n\nTitle: RISC-V: Paving the Path Together to a Safe\, Secure and Reliable Future\n\n\nAbstract: RISC-V is an open-source instruction set that has created opportunities for companies of all sizes to innovate and make decisions independently. It is predicted to shape the future of computing for the next 50 years by providing a processor architecture that allows for more processing with a smaller carbon footprint\, more features with less development resources\, and new ways to combat threats with existing technologies. Companies are already utilizing RISC-V to develop applications such as High-Performance Spaceflight Computing (HPSC) processors. This keynote will explore how companies can benefit from this independence and how the ecosystems can enable easy adoption and scalability. It will also highlight companies that are already a part of this revolution and discuss how they can help create a safe and secure future. Through RISC-V\, companies can reach their goals and protect their future. Together\, we can move mountains. \nCV: Martin Kellermann is an experienced FPGA and SoC engineer with a diploma in Electrical Engineering from the Landshut University of Applied Sciences. He has expertise in high-speed serial data transmission\, signal integrity\, and hardware debugging\, successfully delivering projects in the industrial\, automotive\, and data-center domains. As Marketing Manager at Microchip Technology GmbH\, Munich\, he works with the European Sales and Field Application team to showcase the strengths of their FPGAs and SoCs. \n\nKeynote Speakers Stockholm 2023\n\n\nKeynote speaker: Mark Frost\, Intel’s Programmable Solutions Group (previously Altera)\, England\n\n\nTitle: Key Factors for Success in Today’s and Tomorrow’s Markets\n\n\nAbstract: This presentation will explore the key areas that FPGA suppliers must consider in order to succeed: industry-leading supply chain management\, product leadership\, and an up-to-date developer experience. We will examine the current supply chain landscape\, which is facing an unprecedented imbalance in demand and supply\, leading to long lead times and product allocations. We will also discuss the need for FPGA companies to make strategic investments to achieve product leadership and remain competitive. Furthermore\, we will look at the importance of having up-to-date knowledge and skills\, fast and appropriate EDA tools\, the right SoCs\, and the right RTL\, SW\, and hardware IP from generation to generation for FPGA developers to be productive. The presentation will then provide an overview of the different options available to FPGA vendors\, preferred standards\, and flows. Finally\, we will look at how FPGA technology is being used in different parts of the world and provide a prediction of its future. \nCV: Mark is the FPGA Security and 5G Technical Marketing Manager within Intel’s Programmable Solutions Group (previously Altera). Within this role Mark liaises between customers\, sales and engineering teams worldwide for security and 5G communication topics\, and works to create market awareness of Intel’s portfolio. During his 11 years with Intel he has held roles in both marketing and as a field application engineer covering programmable technology. Prior to Intel\, Mark had worked for over 15 years in a variety of engineering roles\, spanning telecommunications through to designing instruments for ESA satellites. Mark has a BEng in Electrical Engineering from the University of Plymouth. \nSeptember 14 details in Copenhagen \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/fpgaworld-conference-2023/ LOCATION:ÅF\, Frösundaleden 2A\, 169 70 Solna\, Sweden CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/FPGAworld-2023.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Taipei:20230907T080000 DTEND;TZID=Asia/Taipei:20230907T170000 DTSTAMP:20230406T174802Z CREATED:20230406T174802Z LAST-MODIFIED:20230406T174802Z UID:6241-1694073600-1694106000@marketingeda.com SUMMARY:DVCon Taiwan 2023 DESCRIPTION:The Design & Verification Conference & Exhibition is the premier conference on the application of languages\, tools\, methodologies and standards for the design and verification of electronic systems and integrated circuits. \nConference Sponsor: Accellera \nGlobal Sponsors: Synospys\, Cadence\, Siemens \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-taiwan-2023/ LOCATION:National Yang Ming Chiao Tung University\, 300\, Hsinchu City\, Taiwan CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-Taiwan-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230905T080000 DTEND;TZID=America/Los_Angeles:20230908T170000 DTSTAMP:20230413T202528Z CREATED:20230413T202528Z LAST-MODIFIED:20230413T202528Z UID:6272-1693900800-1694192400@marketingeda.com SUMMARY:IEEE SOCC 2023 DESCRIPTION:SoCs and SiPs for Edge Intelligence and Accelerated Computing \nSystem-on-Chip (SoC) and System-in-Package (SiP) devices\, comprising digital\, analog\, optical\, RF\, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication\, entertainment\, medical and smart mobility technologies underpinning emerging “Digital Societies”. \nRecent advances in systems\, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and chiplet system integration unleashing the massive rise of AI-based edge devices\, various accelerators\, new products and applications. This enormous demand for computing per silicon-based SoC and SiP integration creates new challenges with respect to storage\, memory\, security\, reliability\, power\, on- and off-chip communication\, packaging including reliable design and verification. \nFor over 35 years the IEEE International System-on-Chip Conference (SOCC) has been a premier forum for sharing latest advancements in SoC architectures\, systems\, logic and circuit design\, process technology\, test\, design tools\, and application scenarios. We consequently continue this tradition with the 2023 conference at the heart of Silicon Valley in Santa Clara\, CA. \nThe 36th SOCC offers a three days technical program including keynote and plenary speeches\, oral and poster presentations\, hot-topic panel sessions\, and one day of industrial talks. In addition\, SOCC has a long tradition of high-class social events complementing the technical program\, helping you to discuss your work with your colleagues\, and enhancing your professional network. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-socc-2023/ LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEEE-SOCC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230827T080000 DTEND;TZID=America/Los_Angeles:20230829T170000 DTSTAMP:20230613T165859Z CREATED:20230613T165859Z LAST-MODIFIED:20230613T165859Z UID:6490-1693123200-1693328400@marketingeda.com SUMMARY:Hot Chips 2023 DESCRIPTION:Hot Chips 2023 (advance program) will be held as a hybrid conference with in-person attendance at Stanford University from August 27 to 29\, 2023. \nConference Format\nHot Chips 2023 will be a hybrid conference. You may register to attend virtual or in-person. The conference venue is the Dinkelspiel Auditorium on the Stanford University Conference. \n\nSunday (August 27) is a Tutorial Day.\nMonday and Tuesday (August 28 and 29) are Conference Days.\n\nVirtual Conference: Includes full access to conference videos\, presentation PDFs and Slack Channels for both Tutuorial and Conference Days. All talks are transmitted in real time and are also recorded so that you also may view them at a time convenient for your time zone. Details are here. \nIn-Person Conference: You may register for Conference Days only or both Conference and Tutorial Days. In either case you will have full access to Videos\, presentation PDFs and Slack channels. The conference fee includes breakfast\, lunch\, coffee breaks and receptions. Details are here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/hot-chips-2023/ LOCATION:Stanford University\, 471 Lagunita Drive\, Stanford\, CA\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/14054931_10155065287553998_1856342906013349235_n.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230822T080000 DTEND;TZID=America/Los_Angeles:20230824T170000 DTSTAMP:20230802T171343Z CREATED:20230802T171343Z LAST-MODIFIED:20230802T171343Z UID:6655-1692691200-1692896400@marketingeda.com SUMMARY:ERI 2.0 Summit DESCRIPTION:Watch as leaders from our government agencies\, the Defense Industrial Base\, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry\, national and economic security\, and future research directions. \nThe Electronics Resurgence Initiative (ERI)\, DARPA’s response to national-level microelectronics concerns\, is designed to ensure U.S. leadership in cross-functional\, next-generation microelectronics research\, development\, and manufacturing. The initiative\, aimed at both national security capabilities and commercial economic competitiveness and sustainability\, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry\, the defense industrial base\, and university researchers. \nDARPA expanded ERI’s focus with the announcement of ERI 2.0\, which seeks to reinvent domestic microelectronics manufacturing. ERI 2.0 will strengthen DARPA’s leadership in driving the next generation of microelectronics for national security by creating a national capability for 3DHI manufacturing and pursuing focused research in: \n\nManufacturing complex 3D systems\nDeveloping electronics for extreme environments\n\n…while maintaining the following thrust areas:\n  \n\nOptimizing design and test for complex circuits and prototypes\nOvercoming security threats across the entire hardware lifecycle\nIncreasing information processing density and efficiency\nAccelerating innovation in artificial intelligence hardware to make decisions at the edge faster\nSecuring communications\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/eri-2-0-summit/ LOCATION:Hyatt Regency Seattle\, 805 Howell Street\, Seattle\, WA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ERI-2.0.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230808T080000 DTEND;TZID=America/Los_Angeles:20230810T170000 DTSTAMP:20230726T200743Z CREATED:20230726T200648Z LAST-MODIFIED:20230726T200743Z UID:6612-1691481600-1691686800@marketingeda.com SUMMARY:Flash Memory Summit DESCRIPTION:Why Attend Flash Memory Summit?\nFlash Memory Summit (FMS) is an all-inclusive international memory and storage showcase. It is the event for the memory and storage industry. It is the one-stop place to catch up on the latest technologies\, see the hottest products\, and learn about what’s happening and where the latest trends are heading. FMS is now the largest memory and storage industry show with the most high-level keynoters from leading companies\, the largest exhibits\, and the most sessions covering everything from applications and architectures through enterprise storage\, controllers\, and new technologies. \nOur industry continues to thrive and grow with new technology and more applications than ever. FMS has expanded to an all- inclusive memory and storage summit welcoming all emerging memory and storage solutions The scope of FMS23 will include DRAM\, DNA data storage\, UCIe chiplet interconnects\, Compute Express Link (CXL)\, wearables\, automotive\, AI/ML\, data centers\, and entertainment applications\, along with 3D flash\, NVMe\, ZNS\, and important industry announcements. As one past attendee put it\, “Flash is a big society and FMS is the right show.” \nWhy You Should Participate\n• Establish your company as a leader in the emerging memory and storage market.\n• Display your products and expertise to an audience known to be interested in memory and storage.\n• Promote memory and storage to a wider market of equipment manufacturers\, solution providers\, system integrators\, consultants. \nHow You Can Participate:\n• Attend: Register online for the sessions\n• Exhibit: Promote your latest products – exhibit booths\n• Sponsor: Receive special recognition both at the event and in publicity\n• Present: Display your knowledge and commitment to flash memory \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/flash-memory-summit-2/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FMS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Vienna:20230807T080000 DTEND;TZID=Europe/Vienna:20230808T170000 DTSTAMP:20230207T013618Z CREATED:20230207T013618Z LAST-MODIFIED:20230207T013618Z UID:5914-1691395200-1691514000@marketingeda.com SUMMARY:ISPLED 2023 DESCRIPTION:The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design\, ranging from process technologies and analog/digital circuits\, simulation and synthesis tools\, system-level design and optimization\, to system software and applications. \n  \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ispled-2023/ LOCATION:TU Wien\, Gußhausstraße 27-29/384\, Vienna\, Austria CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISLPED-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230731T080000 DTEND;TZID=America/Los_Angeles:20230804T170000 DTSTAMP:20230719T194258Z CREATED:20230719T194258Z LAST-MODIFIED:20230719T194258Z UID:6601-1690790400-1691168400@marketingeda.com SUMMARY:EMC+SIPI 2023 DESCRIPTION:EMC+SIPI 2023 leads the industry in providing state-of-the-art education on EMC and Signal Integrity and Power Integrity techniques. Don’t miss out on this valuable opportunity to learn from and network with industry leaders and peers. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/emcsipi-2023/ LOCATION:DeVos Place\, 303 Monroe Ave NW\, Grand Rapids\, MI\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/EMCSIPI.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230723T080000 DTEND;TZID=America/Los_Angeles:20230725T170000 DTSTAMP:20230616T205921Z CREATED:20230616T205921Z LAST-MODIFIED:20230616T205921Z UID:6512-1690099200-1690304400@marketingeda.com SUMMARY:ITC India 2023 DESCRIPTION:Keynote speakers\n\n\nFadi Maamari \n\n\n\n\nVP of Engineering at Synopsys \n\n\nSule Ozev \n\n\n\n\nArizona State University \n\n\nAbout Us \n\n\n\n\nInternational Test Conference is the world’s premier venue dedicated to the electronic test of devices\, boards and systems-covering the complete cycle from design verification\, design-for-test\, design-for-manufacturing\, silicon debug\, manufacturing test\, system test\, diagnosis\, reliability and failure analysis\, and back to process and design improvement. \n\n\n\n\nAt ITC India\, design\, test\, and yield professionals can confront challenges faced by the industry\, and learn how these challenges are being addressed by the combined efforts of academia\, design tool and equipment suppliers\, designers\, and test engineers. \n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/itc-india-2023/ LOCATION:Hotel Radisson Blu\, Marathalli ORR\, Bengaluru\, India CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITC-India-2023-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Karachi:20230723T080000 DTEND;TZID=Asia/Karachi:20230725T170000 DTSTAMP:20230225T064841Z CREATED:20230225T064841Z LAST-MODIFIED:20230225T064841Z UID:6018-1690099200-1690304400@marketingeda.com SUMMARY:International Test Conference - India\, 2023 DESCRIPTION:International Test Conference is the world’s premier venue dedicated to the electronic test of devices\, boards and systems-covering the complete cycle from design verification\, design-for-test\, design-for-manufacturing\, silicon debug\, manufacturing test\, system test\, diagnosis\, reliability and failure analysis\, and back to process and design improvement. \n\n\n\n\nAt ITC India\, design\, test\, and yield professionals can confront challenges faced by the industry\, and learn how these challenges are being addressed by the combined efforts of academia\, design tool and equipment suppliers\, designers\, and test engineers. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/international-test-conference-india-2023/ LOCATION:Radisson Blu\, Outer King Road\, Bengaluru\, India CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITC-India-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20230710T080000 DTEND;TZID=Europe/Paris:20230712T170000 DTSTAMP:20230222T233720Z CREATED:20230222T233720Z LAST-MODIFIED:20230222T233720Z UID:6009-1688976000-1689181200@marketingeda.com SUMMARY:Free Silicon Conference - FSiC2023 DESCRIPTION:The 2023 Free Silicon Conference (FSiC) will take place in Paris (Sorbonne) on July 10\,11\,12 2023 (Monday to Wednesday). This event will build on top of the past FSiC2019 and FSiC2022 editions. The conference will connect experts and enthusiasts who want to build a complete Free and Open Source CAD ecosystem for designing analog and digital integrated circuits. The conference will cover the full spectrum of the design process\, from system architecture\, to layout and verification. After the daily talks\, the discussion will continue until late in an informal and relaxed atmosphere. \nTentative program\n\nHigh-level design\nHardware security\nOn-going FOS silicon projects\nMemories\nFoundries and PDKs\nTransistor modelling\nPlace-and-route tools\nParasitic extraction\nDesign rule checking\nSchematic editors\nPhotonics\nSustainability\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/free-silicon-conference-fsic2023/ LOCATION:Sorbonne Université\, 15-21 Rue de l'École de Médecine\, Paris\, France CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FSiC2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20230704T080000 DTEND;TZID=Europe/Paris:20230706T170000 DTSTAMP:20230120T171956Z CREATED:20230120T171956Z LAST-MODIFIED:20230120T171956Z UID:5862-1688457600-1688662800@marketingeda.com SUMMARY:FPGA Conference Europe 2023 DESCRIPTION:FPGAs have made a regular evolutional leap forward in terms of new approaches and solutions for both hardware- and software developers. \nThe FPGA Conference Europe\, organized by ELEKTRONIKPRAXIS and the FPGA training center PLC2\, is addressing that progress across all major manufacturers. It focusses on user-oriented\, practically applicable solutions that developers can quickly integrate into their own everyday work. At this year’s event\, one focus is on the energy efficiency of flexible logic devices. This applies in particular to small\, low-power components that rely on special production techniques or deliberately have only a limited number of programmable cells. \nPGAs belong to the hidden champions of microelectronics and are at the forefront of embedded development. From tiny and energy-efficient sensor fusion solutions for the automotive industry\, to intelligent platforms for condition monitoring in networked factories\, to powerful deep learning accelerators in the largest data centers\, these flexible logic devices play an important role in many applications and will be discussed on the FPGA Conference. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/fpga-conference-europe-2023/ LOCATION:NH München Ost Conference Center\, Einsteinring 20\, Munich\, Aschheim\, 85609\, Germany CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FPGA-Europe-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Budapest:20230629T080000 DTEND;TZID=Europe/Budapest:20230630T170000 DTSTAMP:20230620T163638Z CREATED:20230620T163638Z LAST-MODIFIED:20230620T163638Z UID:6532-1688025600-1688144400@marketingeda.com SUMMARY:30th MIXDES Conference DESCRIPTION:The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design\, modeling\, simulation\, testing and manufacturing in various areas such as micro- and nanoelectronics\, semiconductors\, sensors\, actuators and power devices.\nThe MIXDES conference papers will be submitted for inclusion into IEEE Xplore\, subject to IEEE Xplore’s scope and quality requirements. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/30th-mixdes-conference/ LOCATION:Lodz Univesity of Technology\, Wólczańska 221/223\, Lodz\, Poland CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/MIXDES-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230627T093000 DTEND;TZID=America/Los_Angeles:20230627T170000 DTSTAMP:20230523T005957Z CREATED:20230523T005957Z LAST-MODIFIED:20230523T005957Z UID:6427-1687858200-1687885200@marketingeda.com SUMMARY:2023 Andes RISC-V CON DESCRIPTION:RISC-V is revolutionizing the future of Artificial Intelligence (AI) in industries such as automotive\, data center\, communications\, and IoT. Its open-source instruction set architecture (ISA) provides higher performance\, lower power\, and compact silicon footprint\, features highly desired by these industry segments. RISC-V has gained rapid widespread adoption due to its compact instruction set and extensibility. The upcoming RISC-V CON\, an annual conference organized by Andes Technology\, will focus on the theme of “RISC-V: Redefining AI’s Future in Automotive\, Data Center\, Communications\, and IoT” The event will provide a perfect opportunity to connect with the RISC-V community and showcase the latest trends\, market developments\, emerging applications\, and technological breakthroughs in this revolutionary ISA. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/2023-andes-risc-v-con/ LOCATION:The DoubleTree by Hilton\, 2050 Gateway Place\, San Jose\, CA\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Andes-June-27-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230626T080000 DTEND;TZID=America/Los_Angeles:20230628T170000 DTSTAMP:20230424T194057Z CREATED:20230424T194057Z LAST-MODIFIED:20230424T194057Z UID:6329-1687766400-1687971600@marketingeda.com SUMMARY:3D & Systems Summit DESCRIPTION:The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market\, products\, and tech advancements brought by disruptive technologies and Moore’s Law plateauing. Therefore\, continued developments and innovation are essential to growing the business. \nIndustry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications. \nParticipants can enjoy the exclusive exhibition areas that will feature the most prominent names in the industry alongside new and innovative companies. \nSeveral B2B matching opportunities await during the conference\, including networking reception\, coffee breaks\, lunches\, and a unique Networking Dinner Cruise at the beautiful Elbe River. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/3d-systems-summit/ LOCATION:Dresden Hilton Hotel\, An der Frauenkirche 5 D\, Dresden\, Germany CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-June-26-28-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20230626T080000 DTEND;TZID=Europe/Paris:20230627T170000 DTSTAMP:20230621T192056Z CREATED:20230621T191832Z LAST-MODIFIED:20230621T192056Z UID:6553-1687766400-1687885200@marketingeda.com SUMMARY:European Nanoelectronics Applications Design and Technology Conference DESCRIPTION:FOCUS \nThe European Nanoelectronics Applications\, Design & Technology Conference will focus on electronic components\, electronic system design\, design automation\, and manufacturing topics related to micro- and nanoelectronics\, which are critical to success for many European companies. Exhaustive research and development in this area have been supported by EUREKA\, Horizon Europe\, and local governments in recent years. This conference will highlight the exciting and promising results primarily from the PENTA/XECS\, ECSEL/KDT & H2020/Horizon Europe projects. \nThis annual event has a clear focus on deep technical discussions between the leading European experts in the addressed fields\, independent from the research programs where the individual projects were started. All European projects related to electronic system design\, to design technology and to manufacturing topics are invited to contribute to the conference. \nThe 100 expected attendees will include project managers and leading experts in R&D projects in the fields of nanoelectronics and design technologies and their applications\, semiconductor-industry R&D managers\, microelectronics experts in applications industries like automotive and industrial\, and the major research organizations in the European scientific community. \nVENUE \nThis year\,  ADTC takes place in the Y-SPOT Building\, 5\, Place Nelson Mandela\, Grenoble\,  in “Attique” room. For more information\, please sroll down. \nFINANCIAL CONCEPT \nADTC is organized as collaboration event for experts in the field. All attendees benefit from the intensive information exchange and share the cost\, which will be kept low. It is a nonprofit event\, the local organisers do not get any compensation for their work. Most attendees contribute actively to the event\, e.g. as speaker or panelist\, therefore free participation is not possible. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/european-nanoelectronics-applications-design-and-technology-conference/ LOCATION:Y-SPOT Building\, 5\, Place Nelson Mandela\, Grenoble\, France CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ADTC23-3.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20230622T080000 DTEND;TZID=Asia/Tokyo:20230622T170000 DTSTAMP:20230620T165624Z CREATED:20230620T165624Z LAST-MODIFIED:20230620T165624Z UID:6537-1687420800-1687453200@marketingeda.com SUMMARY:DVCon Japan 2023 DESCRIPTION:The Design & Verification Conference & Exhibition is the premier conference on the application of languages\, tools\, methodologies and standards for the design and verification of electronic systems and integrated circuits. The focus of this highly technical conference is on the practical aspects of these technologies and their use in leading-edge projects to encourage attendees to adopt similar techniques to improve their own design and verification flows. \nDVCon Japan 2023 will be held on June 22\, 2023 at Kawasaki City Industrial Promotion Hall. \n  \nThe first DVCon Japan was held in June 2022\, with online and on-demand streaming. We would like to thank the many people who attended and participated in the conference. We were able to provide a wide variety of content with a variety of paper presentations and tutorial sessions. At the same time we could add a new page in the 30+ years history of DVCon worldwide. We would like to thank all the participants\, presenters\, sponsors\, and all those involved. \n  \nDVCon Japan 2023 is planned to be held in Kawasaki City Industrial Promotion Hall in the form of an impersonal conference format. Focusing on the extremely important issue of functional verification\, the conference will cover a wide range of topics including IEEE standards such as SystemVerilog\, UVM\, UPF\, and also Portable Test and Stimulus Standard\, formal verification methodologies\, analog mixed-signal\, IP-XACT and so on. We also would like to invite you to join us for discussions including functional safety and security. And please network with other attendees\, presenters and attendees\, sponsors\, and Accellera representatives. \n  \nDesigners\, Engineers\, and Managers are encouraged to participate in paper presentations\, tutorials\, panel discussions\, and exhibits. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-japan-2023/ LOCATION:Kawasaki CIty Industrial Promotion Hall\, Kawasaki City\, Japan CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/DVCon-Japan-2023.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/London:20230622T080000 DTEND;TZID=Europe/London:20230622T170000 DTSTAMP:20230502T170523Z CREATED:20230302T000903Z LAST-MODIFIED:20230502T170523Z UID:6043-1687420800-1687453200@marketingeda.com SUMMARY:Verification Futures 2023 UK DESCRIPTION:The Verification Futures conference provides a unique blend of conference presentations\, exhibitions\, training and industry networking sessions dedicated to discussing the challenges faced in hardware and software verification. Verification Futures provides a unique opportunity for end-users to define their current and future verification challenges and collaborate with the vendors to create solutions. It also provides an excellent opportunity to network and catch up with other verification engineers and vendors from across Europe. Finally\, we welcome students to encourage them on their first step into semiconductors as verification engineers. \n\n\n\n08:30\nArrival: Breakfast and Networking\n\n\n09:25\nWelcome:  Mike Bartley\, Tessolve Semiconductor Ltd\n\n\n09:30\nFunctional safety for the world of Autonomous and Zonal.\nMadhusudan Rao\, ARM Ltd\n\n\n10:15\nHow to build the future verification engineers?\nFrancois Cerisier (AEDVICES)\n\n\n10:30\nApplication of AI in IC Design and Verification\nMatt Graham (Cadence Design Systems)\n\n\n11:00\nRefreshments and Networking\n\n\n11:30\nUser presentations on Formal Verification\nStudent Session 1\nVHDL Verification\n\n\n11:30\nThe Power of Formal Verification: From flops to billion-gate designs \nDr Ashish Darbari (Axiomise)\nIntroduction to Verification and SystemVerilog for Beginners\nDr David Long (Doulos)\nSpeed up VHDL verification significantly by making a better testbench architecture and a simpler test sequencer.\nEspen Tallaksen\n(EmLogic)\n\n\n11:50\nAutomatic Software Formal Verification\nNick Tudor (D-RisQ Ltd)\n\n\n12:10\nFormally Verified High-Level Synthesis\nYann Herklotz Grave (Imperial College)\n\n\n12:30\nLunch and Networking\n\n\n13:30\nHow does ChatGPT change ML in EDA Landscape?\nRamesh Narayanaswamy (Synopsys Inc)      \n\n\n14:00\nVerification\, bring-up\, production – the wholly trinity\nYiannis Nikolaou (Jump Trading International Ltd. )\n\n\n14:20\nRISC-V verification and implications of the 5:1 ratio of DV to design engineers\nSimon Davidmann (Imperas Software)\n\n\n14:40\nFormal Verification in Practice\nDr. Tobias Ludwig  (Lubis EDA)\n\n\n15:00\nRefreshments and Networking\n\n\n15:30\nLatest topics in Verification\nStudent Session 2\nVHDL Verification\nUVM for AMS Verification\n\n\n15:30\nVerification Makeover with RISC-V Processor Designs\nLavanya Jagan (Vyoma Systems Private Ltd)\nIs it easy to get started with UVM\, or should I use Formal instead?\nDr David Long (Doulos)\nFaster than “Lite” Verification Component Development with OSVVM\nJim Lewis\n(SynthWorks\nDesign Inc)\nRenesas’s Submission to the UVM-(A)MS working group \nPeter Grove\nSteven Holloway\n(Renesas)\n\n\n15:50\nUser experiences with open-source mainstream verification techniques\nSrinivasan Venkataramanan\, Deepa Palaniappan (AsFigo Technologies)\n\n\n16:10\nClosing Functional Coverage on A Compression Encoder with Deep Reinforcement Learning\nEric Ohana\, The University of Bielefeld\, Germany\n\n\n16:30\nEvent Closes\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/verification-futures-2023-uk/ LOCATION:University of Reading\, Whiteknights Campus Park House\, Reading\, United Kingdom CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Verification-Futures-2023-UK.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20230620T090000 DTEND;TZID=Asia/Tokyo:20230620T203000 DTSTAMP:20230606T163917Z CREATED:20230606T163917Z LAST-MODIFIED:20230606T163917Z UID:6456-1687251600-1687293000@marketingeda.com SUMMARY:RISC-V Days Tokyo 2023 Summer DESCRIPTION:RISC-V Day Tokyo 2023 Summer Conference is Japan’s largest RISC-V real event. RISC-V Day Tokyo 2023 Summer Conference will be held on June 20\, 2023 (Tuesday) from 9:00 to 20:30 Japan time (JST). A real presentation will be held at Ito Hall ( B2 floor of Ito International Research Center\, the University of Tokyo ). The “RISC-V Booth” will be held in the foyer and the Event space of Ito Hall. We will also have an “Online RISC-V Booth” on our website. RISC-V Day(s) Tokyo gathers excellent RISC-V related technologies and products\, as well as key persons and engineers\, to improve product recognition\, realize collaboration between companies\, exchange technology\, collect information\, etc. We aim to provide business opportunities for We are looking forward to your participation at this opportunity! At a later date (around the end of August)\, we are planning to post a video and the presentation material on the web page. Information will be provided on a website. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/risc-v-days-tokyo-2023-summer/ LOCATION:Ito International Research Center\, The University of Tokyo\, Tokyo\, Japan CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/RISC-V-Tokyo-2023.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230613T080000 DTEND;TZID=America/Los_Angeles:20230614T170000 DTSTAMP:20230608T190924Z CREATED:20230608T190924Z LAST-MODIFIED:20230608T190924Z UID:6470-1686643200-1686762000@marketingeda.com SUMMARY:PCI-SIG Developers Conference 2023 DESCRIPTION:The PCI-SIG Developers Conference 2023 is returning to Santa Clara on June 13-14\, 2023! Members of the PCI-SIG community including systems architects\, designers\, engineers\, and engineering managers agree that this is an event you won’t want to miss. \nOverview\nThe PCI-SIG Developers Conferences is a free event for our 900+ member companies that develop and bring to market new products utilizing PCI Express® technology. It is an opportunity to learn directly from the industry’s PCIe® experts and participate in technical trainings to gain best practices to improve product roll-out and interoperability. \nAttendee Registration– Register Now!\nOnline attendee registration will close on Thursday\, June 8th at 5:00 pm PST. You can still register onsite! All employees of member companies are welcome to attend this exciting conference! \nPCI-SIG Annual Meeting – Register Now!\nThe PCI-SIG Annual Meeting will be held on June 13th\, 2023. This is an opportunity for members to meet with each other\, meet the newly elected PCI-SIG Board of Directors\, and receive the latest PCI-SIG update. Per the bylaws\, the PCI-SIG maintains nine Directors on its Board. Registration for the Annual meeting is the same link as the Developers Conference. \nAgenda\nThe 2023 US Developer Conference agenda has been posted to the PCI-SIG website. \nTo leverage PCI-SIG public relations services including media relations\, event and press release support\, please contact: pr@pcisig.com. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/pci-sig-developers-conference-2023/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/PCI-SIG_Web_Banner_US_DevCon_2023_1000x500_011923.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230611T080000 DTEND;TZID=America/Los_Angeles:20230616T170000 DTSTAMP:20230517T171859Z CREATED:20230517T171859Z LAST-MODIFIED:20230517T171859Z UID:6407-1686470400-1686934800@marketingeda.com SUMMARY:International Microwave Symposium - IMS 2023 DESCRIPTION:IMS will be presented in-person\, 11-16 June 2023 in San Diego\, CA. \n\n\n\n\n\nIMS is the flagship event in a week dedicated to all things microwaves and RF. The week also includes the IEEE MTT-S Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio Frequency Techniques Group (ARFTG). \n\n\n\n\n\n\n\n\n2023 Sponsors\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/international-microwave-symposium-ims-2023/ LOCATION:San Diego Convention Center\, 111 W. Harbor Drive\, San Diego\, CA\, 92101\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IMS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Andorra:20230605T080000 DTEND;TZID=Europe/Andorra:20230609T170000 DTSTAMP:20230211T031337Z CREATED:20230211T031337Z LAST-MODIFIED:20230211T031337Z UID:5944-1685952000-1686330000@marketingeda.com SUMMARY:RISC-V Summit Europe DESCRIPTION:On 5-9th June\, in Barcelona\, RISC-V Summit Europe brings together developers\, architects\, technical decision and policy makers from across European RISC-V ecosystem. Attendees from academia\, research\, SMEs\, industry and open source communities will gather to exchange knowledge\, ideas\, technologies\, and research shaping the future of RISC-V computing. \nThe event will include a single track of keynotes\, invited and selected talks alongside an exhibition showcasing the latest developments across industry and research including technology demonstrations and poster sessions. \nRISC-V Summit Europe is an opportunity not to be missed\, comme to Barcelona from 5-9th June 2023 to be part of the new wave of European computing innovation! \nThe Program Committee\n\nJan Andersson (Cobham Gaisler)\nHolger Blasum (Sysgo)\nAlex Bradbury (Igalia)\nRamon Canal (UPC)\nDenis Dutoit (CEA)\nAngelo Garofalo (ETH Zürich)\nBenedikt Gierlichs (KU Leuven)\nFrederic Heitzmann (Tiempo Secure)\nJohn Hengeveld (Intel)\nEyck Jentzsch (MINRES)\nNick Kossifidis (FORTH)\nMarie-Minerve Louerat (LIP6)\nAndreas Mauderer (Bosch)\nDaniel Müller-Gritschneder (TUM)\, PC Co-Chair\nJérôme Quévremont (Thales)\nRihards Novickis (EDI\, Latvia)\nKatzalin Olcoz Herrero (UCM)\nOlivier Savry (CEA)\nDavide Schiavone (OpenHW Group)\nGeorg Sigl (TUM)\, PC Co-Chair\nJonathan Woodruff (Cambridge Univ.)\nDaniel Müller-Gritschneder (TU Münich)\nJérôme Quévremont (Thales R&T)\nBorja Pérez Pavon (Univ. de Cantabria)\, Submission Chair\n\nThe Steering Committee\n\nNarcís Avellana (NVision)\nTeresa Cervero (BSC)\nRomain Dolbeau (SiPearl)\nWolfgang Ecker (Infineon)\nRoger Espasa (Semidynamics)\nChristian Fabre (CEA)\nFrank K. Gürkaynak (ETH Zürich)\nDaniel Müller-Gritschneder (TU Münich)\nBorja Pérez Pavon (Univ. de Cantabria)\nJérôme Quévremont (Thales R&T)\nOlivier Sentieys (INRIA\, France)\nPhilipp Tomsich (VRULL)\nStefan Wallentowitz (HM Münich)\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/risc-v-summit-europe/ LOCATION:Barcelona\, Barcelona\, Spain CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/RISC-V-Summit-Europe-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20230531T083000 DTEND;TZID=America/New_York:20230531T170000 DTSTAMP:20230530T203817Z CREATED:20230530T203817Z LAST-MODIFIED:20230530T203817Z UID:6438-1685521800-1685552400@marketingeda.com SUMMARY:STAC Summit DESCRIPTION:STAC Summits bring together CTOs and other industry leaders responsible for solution architecture\, infrastructure engineering\, application development\, machine learning/deep learning engineering\, data engineering\, and operational intelligence to discuss important technical challenges in trading and investment. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/stac-summit/ LOCATION:New York Marriott Marquis\, 1535 Broadway\, New York City\, NY\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/STAC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230522T080000 DTEND;TZID=America/Los_Angeles:20230524T170000 DTSTAMP:20230331T185032Z CREATED:20230331T184530Z LAST-MODIFIED:20230331T185032Z UID:6216-1684742400-1684947600@marketingeda.com SUMMARY:Embedded Vision Summit 2023 DESCRIPTION:The Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems\, cloud solutions and mobile applications. \n\n\nWhy attend? It’s a First-Rate Program with Powerful Insights into Practical Perceptual AI.\n\n\n\n\n\nJoin us for four days of learning—from tutorials to deep-dive days\, covering the latest technical insights\, business trends and vision technologies—all with a focus on practical\, deployable computer vision and visual/perceptual AI. The Summit connects the theories from great academic conferences\, like CVPR\, to the concrete needs of innovators building real-world products. \n\n\n\n\n\n4 Reasons the Embedded Vision Summit is Different from Other Conferences\n\n\n\n\n\n\nThe Summit is by innovators\, for innovators.\n\n\nWe have a relentless focus on practical information for people incorporating vision and AI into products to solve real-world problems.\n\n\nWe’ve been doing this for 12 years.\n\n\nA whopping 99% of our attendees would recommend the Summit to a colleague.\n\n\n\n\n\n\nLearn\n\n\n\n\n\nIn order to deliver real-world insights and know-how into the most current topics in the industry to our attendees\, we have packed the program with learning opportunities\, including: \nSpeakers and Sessions: Learn from the best and listen to over 100 expert speakers who actively work in the industry present on the latest applications\, techniques\, technologies and opportunities in computer vision and visual AI. \n\n\nSee\n\n\n\n\n\n100+ Exhibitors and Hundreds of Demos: Visit the exhibitors on the exhibit floor and see their latest technologies that enable perception—processors\, algorithms\, software\, sensors\, developer tools\, services and more! You’ll get to see technology in action by watching cool demos from building-block component suppliers to learn about new and existing solutions to your business and engineering challenges. \nEnabling Technologies Track: If you’re a product developer\, engineer or business leader looking for real-world\, commercial technologies that will help you add visual intelligence and AI to your new products\, you’ll want to attend this track’s sessions. You can see things\, like: \n\nProcessors and tools for deep-learning-based object recognition.\nOptimized software components for low-cost\, energy-efficient\, real-time vision.\nFrameworks and services for faster product development.\n\n\n\nConnect\n\n\n\n\n\nBuilding valuable business connections is crucial. At the Summit you can connect with engineers\, marketers\, executives—they’re all here! Here’s how: \n\nQ&A Sessions: Join in on post-talk Q&A sessions and have your important questions answered directly by the expert speakers.\nMeet the Exhibitors and Sponsors: Connect with key engineers and technologists from top computer vision building-block suppliers to learn about their latest processors\, software\, development tools and more.\nMingle at the Technology Exhibits Reception. The evening of Tuesday\, May 23\, enjoy great food and refreshing beverages while meeting new folks and seeing awesome tech demos at our Exhibits Reception!\nNetwork at the 3rd annual Women In Vision Reception sponsored by Perceive.\n\n\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/embedded-vision-summit-2023/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Embedded-Vision-Summit-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230521T080000 DTEND;TZID=America/Los_Angeles:20230525T170000 DTSTAMP:20230122T013506Z CREATED:20230122T013506Z LAST-MODIFIED:20230122T013506Z UID:5867-1684656000-1685034000@marketingeda.com SUMMARY:ISCAS 2023 DESCRIPTION:The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premiere forum for researchers in the active fields of theory\, design and implementation of circuits and systems. \nKeynote Speakers\n\nDr. Margaret Martonosi\n\n\n\nMargaret Martonosi is the US National Science Foundation’s (NSF) Assistant Director for Computer and information Science and Engineering (CISE). With an annual budget of more than $1B\, the CISE directorate at NSF has the mission to uphold the Nation’s leadership in scientific discovery and engineering innovation through its support of fundamental research and education in computer and information science and engineering as well as transformative advances in research cyberinfrastructure. While at NSF\, Dr. Martonosi is on leave from Princeton University where she is the Hugh Trumbull Adams ’35 Professor of Computer Science. \n\nStuart Russell\n\n\n\ntuart Russell is a Professor of Computer Science at the University of California at Berkeley\, holder of the Smith-Zadeh Chair in Engineering\, and Director of the Center for Human-Compatible AI. He is a recipient of the IJCAI Computers and Thought Award and Research Excellence Award and held the Chaire Blaise Pascal in Paris. In 2021 he received the OBE from Her Majesty Queen Elizabeth and gave the Reith Lectures. He is an Honorary Fellow of Wadham College\, Oxford\, an Andrew Carnegie Fellow\, and a Fellow of the American Association for Artificial Intelligence\, the Association for Computing Machinery\, and the American Association for the Advancement of Science. His book “Artificial Intelligence: A Modern Approach” (with Peter Norvig) is the standard text in AI\, used in 1500 universities in 135 countries. His research covers a wide range of topics in artificial intelligence\, with a current emphasis on the long-term future of artificial intelligence and its relation to humanity. He has developed a new global seismic monitoring system for the nuclear-test-ban treaty and is currently working to ban lethal autonomous weapons. \n\nYoky Matsuoka\n\n\n\nYoky Matsuoka is the Founder & CEO of Yohana\, an independently led subsidiary of Panasonic focused on building consumer technology products and services to help people live healthier and happier lives. As an accomplished executive and technologist\, Matsuoka brings more than two decades of leadership experience to her role where she also leads global innovation and serves as the Managing Executive Officer of Panasonic Corporation. \n\nDongjin (DJ) Seo\n\n\n\nDongjin (DJ) Seo is co-founder and VP of Brain Interfaces at Neuralink\, where he leads the team responsible for everything (electrodes\, materials\, electronics\, firmware\, packaging\, manufacturing\, algorithms\, and more) in the brain implant. DJ received his PhD from UC Berkeley in 2016 for his work on ultrasonic wireless neural implant technology called neural dust and BS in EE at Caltech in 2011 where he designed ICs and antennas for next-gen wireless communication and imaging systems. He also held several internships building high-performance and low-power circuits for sensor networks. For his work\, DJ was named one of MIT Technology Review’s Innovators Under 35 in 2020. \n\nDr. Thomas Anderson\n\n\n\nDr. Andersen heads the Artificial Intelligence and Silicon Innovation group at Synopsys\, where he focuses on developing new technologies in the AI\, ML and advanced technology space to automate the future of chip design. \nLieven Vandersypen\nProf. Dr. ir Lieven Vandersypen is Antoni van Leeuwenhoek professor in Quantum Nanoscience at Delft University of Technology and Scientific Director of QuTech\, an advanced research center for Quantum Computing and Quantum Internet. He received a MSc in Mechanical Engineering from KU Leuven\, and a MSc/PhD in Electrical Engineering from Stanford University for the first experiments in quantum computing. \n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/iscas-2023/ LOCATION:Monterey\, CA\, Monterey\, CA\, United States CATEGORIES:Conference,EDA,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISCAS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230516T080000 DTEND;TZID=Europe/Brussels:20230517T170000 DTSTAMP:20230414T161617Z CREATED:20230414T161617Z LAST-MODIFIED:20230414T161617Z UID:6275-1684224000-1684342800@marketingeda.com SUMMARY:ITF World 2023 DESCRIPTION:Imec’s flagship event on semiconductor advances & deep-tech solutions\n\n\nformerly known as Future Summits.\n\n\n\n\nSemiconductors have become increasingly instrumental – and often even dominant – for the future of industries and application domains worldwide. \nFor many decades\, imec has played a major role in the global semiconductor industry. Our expertise and partnerships now also progress Chips Act initiatives around the globe. \nITF World aims to bring together all the different players. \n\nITF World features: \n\nA program clearly centered around semiconductor technologies & system scaling\nAn important focus on deep-tech venturing\, featuring inspiring cases\nInsights that highlight imec’s role & activities to progress Chips Act initiatives worldwide\n\nIn conjunction with ITF World\, we also organize ITF Flanders\, a dedicated event for Flemish companies and stakeholders. \nThis one-of-a-kind experience is marked by: \n\nKeynotes by world-renowned tech experts and industry leaders\nDemos showcasing state-of-the-art technologies and innovative solutions in a wide array of application domains\nExchange with key players from the global semiconductor and deep-tech scenes and innovators from various application domains\nAn onsite networking dinner\n\nITF World welcomes 2\,000 attendees from around the globe – ranging from industry experts and business leaders to policy makers\, futurists\, technology gurus\, entrepreneurs from start-ups to scale-ups\, analysts and investors. \n\n\n\n\n\n\nITF World is a 1.5-day event taking place at the majestic Flanders Meeting & Convention Center in the heart of Antwerp\, Belgium. Our event is widely valued for its dynamic and vibrant atmosphere. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nExtend your experience with a half-day participation in ITF Flanders if you’re interested in: \n\nThe role of nano & digital technologies to accelerate Flemish economy and society\nDedicated tracks on Health\, Energy\, Mobility\, and Sustainable industries\nNetworking with policy makers & entrepreneurs from Belgium’s strong economic region\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/itf-world-2023/ LOCATION:Flanders Meeting & Convention Center Antwerp\, Antwerp\, Belgium CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITF-World-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230509T080000 DTEND;TZID=America/Los_Angeles:20230510T170000 DTSTAMP:20230313T174913Z CREATED:20230313T174913Z LAST-MODIFIED:20230313T174913Z UID:6108-1683619200-1683738000@marketingeda.com SUMMARY:Advantest VOICE DESCRIPTION:VOICE is a developer conference\, created by test engineers for test engineers.\n\n\n\n\n\n\n\n\nEach year\, the VOICE Developer Conference unites semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs)\, foundries\, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements\, express new ideas\, share best practices and network with one another. \nAdvantest’s annual VOICE Developer Conference is the leading premier forum for the growing international community of users and strategic partners involved with Advantest’s V93000 and T2000 SoC test platforms as well as Advantest memory testers\, handlers and test cell solutions\, product engineering\, and test technology. \nVOICE promises a collaboration of minds and ample opportunities for peer networking. Join us at VOICE for a dynamic and memorable conference experience! \nAttendees gain valuable insights into the newest test solutions and best practices\, forge long-lasting relationships\, learn about the latest and upcoming equipment and technology from Advantest\, and much more through VOICE’s technical information-rich agenda\, which includes: \n\nKeynote speakers\nTechnical paper presentations\nPartners’ Expo\nTechnology Kiosk Showcases\nNetworking\nWorkshop Day\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/advantest-voice/ LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Advantest-VOICE-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Jerusalem:20230508T080000 DTEND;TZID=Asia/Jerusalem:20230509T170000 DTSTAMP:20230331T183459Z CREATED:20230331T183459Z LAST-MODIFIED:20230331T183459Z UID:6212-1683532800-1683651600@marketingeda.com SUMMARY:ChipEx 2023 DESCRIPTION:The major annual event of the Israeli semiconductor industry \nChipEx2023\, the largest annual event of the Israeli semiconductor industry\, will be held on May 9\, 2023 in Tel Aviv\, Israel. ChipEx2023 showcases companies including manufacturers\, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world’s leading experts address the industry’s most relevant issues. \nThe event is produced by ASG Ltd. in cooperation with SIA\, Semiconductor Industry Association and with Semi\, the largest global industry association. \nThe goal of ChipEx2023 is to update all professionals involved with the Israeli semiconductor industry with the latest technological innovations and future directions of the industry. \nChipEx2023 target audience are all people involved with the semiconductor industry including engineers\, R&D managers\, industry experts\, senior executives in microelectronics related companies\, multinational design centers\, consultants\, venture capital managers as well as electrical/electronic/computer science students & professors from the various universities around Israel. \nChipEx2023 consists of three main parts: \nVendors’ Exhibition \nThe ChipEx exhibition includes booths in various sizes for presentations and demonstrations of new design and development tools. This year\, the ChipEx2023 exhibition will take place on May 9\, 2023 at the Tel-Aviv Expo Center and will include industry vendors\, service providers\, and manufacturers of electronic design tools\, components and manufacturing equipment from Israel and around the globe. These exhibitors will exhibit and update the visitors with the latest developments in tools and services for the semiconductor industry. \nTechnical Seminar \nTechnical lectures given by industry experts\, senior executives from the semiconductor industry\, vendors\, and university professors. The format of the sessions intends to cultivate and promote an instructive and productive interchange of ideas and solutions among industry developers and designers. The lectures are divided to various tracks in separate halls and address the major topics related to the microelectronics industry. This year\, the ChipEx2023 technical seminar will take place on May 9\, 2023 at the Tel-Aviv Expo Center. \n  \nChipEx2023 Executive Summit \n  \nThe opening session of ChipEx2023 will take place on May 8\, 2023 at Hilton Hotel Tel-aviv and will include top industry figures and will act as the Executive summit of ChipEx2023 targeting Industry leaders and top executives from Israel and around the globe. \n  \nChipEx2023 is a great opportunity for any industry vendor or service provider to meet its target audience as well as interact with the decision makers in the various Israeli semiconductor companies. \n  \nWe invite you to take part in ChipEx2023 as an exhibitor\, a speaker and/or as a sponsor. \n  \nFor more details please contact us at:\nPhone: +972-9-7454007\nFax: +972-9-7748858\ninfo@chiportal.co.il\nwww.chipex.co.il \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chipex-2023/ LOCATION:Hilton Hotel Tel-aviv\, HaYarkon St 205\, Tel aviv\, Israel CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ChipEx-2023.jpg END:VEVENT END:VCALENDAR