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BEGIN:VEVENT
DTSTART;TZID=Asia/Tokyo:20240418T150000
DTEND;TZID=Asia/Tokyo:20240418T160000
DTSTAMP:20240415T174855Z
CREATED:20240415T174855Z
LAST-MODIFIED:20240415T174855Z
UID:7844-1713452400-1713456000@marketingeda.com
SUMMARY:Optimizing Chiplet architectures of RISC-V clusters\, GPU and DNN using System-Level IP
DESCRIPTION:Multi-die SoC containing multiple RISC-V clusters\, GPU\, NPU\, accelerators and DNN have considerable benefits for applications in automotive\, space and industrial. Architecture exploration of the chiplet-based SoC requires multiple interconnect protocol models\, and multiple coherent and non-coherent compute resources. This Webinar will demonstrate a methodology for rapid modeling and architecture trade-off using UCIe in modeling and simulating a multi-die SoC in a matter of weeks. These models can be used for UCIe setup\, task partitioning\, distribution of compute resources across dies\, sharing coherency between RISC-V clusters\, GPU and AI Engines. We will show how workloads and application task graphs can be used to optimize the settings to meet the requirements\, identify system bottlenecks and optimize for PPA. Results from actual hardware designs with different configurations and allocations will be discussed during the session.
URL:https://marketingeda.com/event/optimizing-chiplet-architectures-of-risc-v-clusters-gpu-and-dnn-using-system-level-ip/
LOCATION:CA
CATEGORIES:EDA,IP,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Mirabilis-18-April-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240418T100000
DTEND;TZID=America/Los_Angeles:20240418T110000
DTSTAMP:20240415T175505Z
CREATED:20240415T175505Z
LAST-MODIFIED:20240415T175505Z
UID:7847-1713434400-1713438000@marketingeda.com
SUMMARY:Optimizing Chiplet architectures of RISC-V clusters\, GPU and DNN using System-Level IP
DESCRIPTION:Multi-die SoC containing multiple RISC-V clusters\, GPU\, NPU\, accelerators and DNN have considerable benefits for applications in automotive\, space and industrial. Architecture exploration of the chiplet-based SoC requires multiple interconnect protocol models\, and multiple coherent and non-coherent compute resources. This Webinar will demonstrate a methodology for rapid modeling and architecture trade-off using UCIe in modeling and simulating a multi-die SoC in a matter of weeks. These models can be used for UCIe setup\, task partitioning\, distribution of compute resources across dies\, sharing coherency between RISC-V clusters\, GPU and AI Engines. We will show how workloads and application task graphs can be used to optimize the settings to meet the requirements\, identify system bottlenecks and optimize for PPA. Results from actual hardware designs with different configurations and allocations will be discussed during the session.
URL:https://marketingeda.com/event/optimizing-chiplet-architectures-of-risc-v-clusters-gpu-and-dnn-using-system-level-ip-2/
LOCATION:CA
CATEGORIES:EDA,IP,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Mirabilis-April-18-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240417T090000
DTEND;TZID=America/Los_Angeles:20240417T103000
DTSTAMP:20240415T184123Z
CREATED:20240415T184123Z
LAST-MODIFIED:20240415T184123Z
UID:7855-1713344400-1713349800@marketingeda.com
SUMMARY:Introduction to ParagonX
DESCRIPTION:Are you ready to supercharge your design process? Introducing our Diakopto Training Program – your gateway to a faster\, easier\, and more intuitive approach to design analysis and optimization! \nIn this course\, you’ll learn how to:\n Analyze and visualize layout parasitics with precision using R/C/delay/I maps.\n Perform net matching for accurate and refined designs.\n Identify the root cause of bottlenecks in post-layout simulation results with ease.\n Iterate over layout improvements efficiently before running post-layout simulations using the powerful Diakopto – ParagonX tool. \nCourse Details:-\nDate: Wednesday\, April 17th \, 2024\nTime: 9:00 am to 10:30 am Pacific Time (PDT)\nInstructor: Maxim Ershov\, Senior Director R&D\, USA \nRegister here:- https://ansys.me/3x6p95i\nDon’t miss this opportunity to revolutionize your design workflow and unlock new levels of efficiency and precision. Sign up for the Diakopto ParagonX Training today!
URL:https://marketingeda.com/event/introduction-to-paragonx/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Ansys-April-17-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240417T081500
DTEND;TZID=America/Los_Angeles:20240417T170000
DTSTAMP:20240306T181435Z
CREATED:20240306T181435Z
LAST-MODIFIED:20240306T181435Z
UID:7716-1713341700-1713373200@marketingeda.com
SUMMARY:CadenceLIVE Silicon Valley 2024
DESCRIPTION:Join us for CadenceLIVE Silicon Valley 2024 on April 17 at the Santa Clara Convention Center. This annual user conference features peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products. \nCadenceLIVE brings users\, developers\, and industry experts together to connect\, share ideas\, and inspire design creativity. Attendees have the opportunity to view captivating keynotes\, attend engaging user presentations\, and interact with Cadence experts\, peers\, and our sponsors in the Designer Expo. \nRegister today to secure your spot. \n\n\nApril 17\, 2024 08:15\n\nRegistration\n\n\n\n\n\n\nApril 17\, 2024 09:00\n\nSession Tracks\n\n\n\n\n\n\nApril 17\, 2024 10:15\n\nKeynotes\n\n\n\n\n\n\nApril 17\, 2024 11:45\n\nDesigner Expo and Lunch\n\n\n\n\n\n\nApril 17\, 2024 13:15\n\nSession Tracks\n\n\n\n\n\n\nApril 17\, 2024 15:45\n\nClosing Keynote\n\n\n\n\n\n\nApril 17\, 2024 16:30\n\nDesigner Expo / Reception / Awards
URL:https://marketingeda.com/event/cadencelive-silicon-valley-2024/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:EDA,IP,User Group
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-April-17-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240416T100000
DTEND;TZID=America/Los_Angeles:20240416T110000
DTSTAMP:20240411T185913Z
CREATED:20240411T185913Z
LAST-MODIFIED:20240411T185913Z
UID:7841-1713261600-1713265200@marketingeda.com
SUMMARY:Streamline MMIC Design  Efficiency with Intelligent  Design Data Management
DESCRIPTION:In the fast-evolving world of monolithic microwave integrated circuit (MMIC) design\, meeting higher-frequency requirements is just the beginning. Are you seeking insights on achieving dimensional accuracy for both analog and RF components? Wondering about the automatic synchronization of schematics and layouts across various electronic design automation (EDA) tools? \nTrusted by hundreds of IC design organizations worldwide\, Keysight Design Data Management (SOS) transforms design data chaos into intelligence. Attend to experience a live demonstration showcasing the synergy of Cadence Virtuoso Studio\, Keysight ADS\, and Keysight SOS in action. \nJoin our upcoming webinar for practical insights from Keysight design experts Karim Khalfan and Nupur Bhonge. Learn how to: \n\nSecure and simplify data transfer and design collaboration across the enterprise.\nReduce network storage with smart caching.\nFacilitate efficient co-simulation across Cadence Virtuoso Studio and Keysight ADS with real-time analytics.\nEliminate versioning issues with comprehensive virtualization.\n\n  \nRegister now to streamline your design data management and expedite your MMIC design cycles.  \n\nHandouts\nRequest a personalized demo View/Download\nApply for a free trial View/Download\nBrochure – Keysight Design Data Management SOS View/Download\neBook – Essential IP-Based Design Strategies for Chiplet Success View/Download\n\n\nPresenters\n\nKarim Khalfan\nDirector Solutions Engineering\, Data and IP Management\, at Keysight Technologies.\nKarim leads solutions engineering for data and IP management for Keysight EDA. Before joining Keysight in May 2023 through the acquisition of Cliosoft Inc.\, Karim was Vice President of Applications Engineering managing the Application Engineering group and the office of customer advocacy for the previous 18 years. He has led various efforts to ensure the broad deployment of Keysight design data and IP management across the semiconductor industry. Karim has received his Bachelor of Science degree in Computer Science from the University of Texas. He has authored several articles and white papers on the importance and need of SoC design management solutions. He also has a patent on defining a universal data management adapter to be used for integration with any EDA tool.\n\n\n\nNupur Bhonge\nSenior Solutions Engineer at Keysight Technologies\nNupur works with IC design teams on Keysight Design Data Management (SOS) and IP design (HUB) management platforms. She specializes in deploying EDA workloads to the cloud and new product integrations with SOS and HUB. With a Master’s Degree in Computer Engineering from Syracuse University\, she brings in-depth knowledge and experience with EDA tools and workflows to her work.
URL:https://marketingeda.com/event/streamline-mmic-design-efficiency-with-intelligent-design-data-management/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Keysight-April-16-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Brussels:20240416T080000
DTEND;TZID=Europe/Brussels:20240417T170000
DTSTAMP:20240410T165555Z
CREATED:20240410T165555Z
LAST-MODIFIED:20240410T165555Z
UID:7826-1713254400-1713373200@marketingeda.com
SUMMARY:CS Inernational Conference
DESCRIPTION:he 14th CS International builds on the strengths of its predecessors\, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ensuring SiC’s Phenomenal Success; Expanding Horizons for Surface Emitters; Accelerating the Growth of GaN; Taking Power from the Photon; and New Frontiers for the LED. \nThose attending these sessions will be rewarded with greater insight into device technologies while learning of the latest opportunities and trends within the compound semiconductor industry. Delegates will also discover significant advances in tools and processes that enable enhanced yield and throughput. \nAttendees at this two-day conference will also meet a wide variety of key players within the community\, from investors and analysts to fab engineers and managers. \nCS International is part of AngelTech\, which delivers a portfolio of insightful\, informative\, highly valued chip-level conferences. Bringing together 3 conferences with more than 120 presentations\, more than 800 delegates and over 80 exhibitors\, AngelTech is the premier global event covering compound semiconductor\, photonic integrated circuit and power electronic technologies. With a significant overlap between the three conferences\, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.
URL:https://marketingeda.com/event/cs-inernational-conference/
LOCATION:Sheraton Brussels Airport Hotel\, Brussels\, Belgium
CATEGORIES:Conference,EDA,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CS-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Indian/Christmas:20240416T080000
DTEND;TZID=Indian/Christmas:20240416T170000
DTSTAMP:20240301T172523Z
CREATED:20240301T172523Z
LAST-MODIFIED:20240301T172523Z
UID:7699-1713254400-1713286800@marketingeda.com
SUMMARY:DVClub India - Ensuring my Design Verification is ISO26262 Compliant
DESCRIPTION:TBD
URL:https://marketingeda.com/event/dvclub-india-ensuring-my-design-verification-is-iso26262-compliant/
LOCATION:Cadence\, Bengaluru\, Sarjapur Outer Ring Road\, Bengaluru\, 560103\, India
CATEGORIES:EDA
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVClub-India-April-16-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240416T080000
DTEND;TZID=America/Los_Angeles:20240416T090000
DTSTAMP:20240326T180707Z
CREATED:20240326T180707Z
LAST-MODIFIED:20240326T180707Z
UID:7763-1713254400-1713258000@marketingeda.com
SUMMARY:Win The Tick to Trade Race by Root Causing Bugs Faster with the Latest Innovations In QuestaSim
DESCRIPTION:Root causing RTL design or simulation testbench bugs can be tedious process\, especially if just relying on traditional waveform viewing and debug. Also\, it can be costly if more sophisticated debug ties up precious simulation resources during the debug process.\n‌\nLearn how the latest innovations in QuestaSim address these challenges by enabling full off-line debugging freeing up simulation licenses for more simulations runs per day. Also\, learn how unique debugging features like driver tracing\, biometric search\, temporal causality trace back\, and much more will enable you root cause bugs more straight forward and faster. All the while delivering industry-leading performance and capacity through aggressive\, global compile and simulation optimization algorithms for SystemVerilog\, VHDL\, and SystemC. \nWhat you will learn: \nIn this Web Seminar\, we will highlight the key innovations in QuestaSim that enable full debug visibility with significant reduction in simulation performance overhead and waveform database size. For existing QuestaSim users\, we will show the simple change to scripts to see a 2X performance boost and 3X reduction in waveform database.\n‌\nWe will highlight the debug features in our Visualizer debugger now included as part of every QuestaSim license\, such as:\n‌ \n\nDriver/receiver tracing from wave and source code\n‘x’ tracing through sequential logic and time\nFSM debug & cross probing\nSchematics exploration with smart hierarchical flattening and pruning.\nWaveforms with cross probing & biometric search\nDesign search by type\n\n‌\nWe will step through some design and testbench examples showing how these features can speed up root causing bugs and tackle complex logic that may be impossible for humans to figure out.\n‌ \nWho should attend: \nUltra Low Latency FPGA Designers in the High Frequency Trade industry \n\n\nWhat/Which Products are Covered:   \n\nQuestaSim with Visualizer Debugger\n\n\n\nSpeaker:\n\n\n\n\n\n\nRich Edelman\nProduct Engineer\, Siemens EDA\n\n\n\n\nRich Edelman is a Product Engineer at Siemens EDA and is responsible for the Visualizer Debug Environment. He holds a Bachelor of Science Degree in Electrical Engineering\, a Bachelor of Science Degree in Computer Science\, and a Master of Science Degree in Computer Science from Washington University in St. Louis. Prior to Siemens EDA\, Rich worked for a C Synthesis company\, a compute farm company\, Design Acceleration\, and a couple of ASIC houses. Rich’s best days are in Yosemite backpacking – or at least dreaming about it.
URL:https://marketingeda.com/event/win-the-tick-to-trade-race-by-root-causing-bugs-faster-with-the-latest-innovations-in-questasim/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Siemens-April-16-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240415T130000
DTEND;TZID=America/Los_Angeles:20240415T174500
DTSTAMP:20240403T192855Z
CREATED:20240403T192855Z
LAST-MODIFIED:20240403T192855Z
UID:7807-1713186000-1713203100@marketingeda.com
SUMMARY:Open Source Summit - North America
DESCRIPTION:Registration Cost: $15 \nThis half day program will Introduce the audience to the many aspects of open source hardware and software development\, and how it is helping the industry to accelerate beyond what Moore’s law has predicted. \nTalks will cover numerous aspects of hardware / software development and provide motivation to learn more about the challenges of open hardware and software design together. \nAGENDA\n \n\nHow can software developers help keep Moore’s law alive? – Michael Gielda\, Antmicro\nOpen Hardware Design: Lessons Learned from OSS – Stefano Cetola\, Intel\nUnderstanding hardware security vulnerabilities: Hardware Bill of Materials – Kate Stewart\, Linux Foundation\nScaling hardware design: squeezing every bit of performance of the open source OpenROAD ASIC toolchain – Karol Gugala\, Antmicro\nAccelerating EDA Flows in the AWS Cloud – David Pellerin\, AWS\nAn Introduction to RISC-V – Keith Graham\, Codasip\nAccelerating the RISC-V Software Development Ecosystem – Jeffrey Osier-Mixon\, Red Hat\nCaliptra: Open Source Root of Trust – Caleb Whitehead\, Microsoft\nGetting “Ware” You Need to Go – Managing Open Hardware with Software (Part 1) – Maximillian Schmidt\, University of Oregon\nGetting “Ware” You Need to Go – AI Software on Open Hardware (Part 2) – Christopher Sullivan\, University of Oregon
URL:https://marketingeda.com/event/open-source-summit-north-america/
LOCATION:Seattle Convention Center\, 900 Pine Street\, Seattle\, WA\, United States
CATEGORIES:Conference,EDA
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Open-Source-Summit-North-America-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240411T110000
DTEND;TZID=America/Los_Angeles:20240411T120000
DTSTAMP:20240408T161908Z
CREATED:20240408T161857Z
LAST-MODIFIED:20240408T161908Z
UID:7813-1712833200-1712836800@marketingeda.com
SUMMARY:Making a Structured VHDL Testbench – A Demo for Beginners
DESCRIPTION:Abstract: \nThis demonstrated tutorial is intended for designers and verification engineers who want to learn to make better and more structured testbenches. \nThis session will show you what is needed for any good testbench\, irrespective of its complexity.\nWe will make a testbench from scratch for a simple VHDL module and do the following:\n\nAdd a balanced and controllable clock generator\nAdd logging of progress in a simple way\nCheck default values and reset\nAccess module via an interface – using BFMs (Bus Functional models)\nCheck output signals with and without a positive acknowledge\nWait for flag or interrupt or a given value – with a timeout\nCheck that signals have been stable – without pulses or spikes for a given time\nReport an alert summary\n… and more\n\n…all  using well-documented VHDL procedures and functions from UVVM\, the open source fastest growing VHDL verification methodology.\nThe presented solution will use UVVM Utility Library and BFMs\, but the principles and mechanisms are 100% general verification methodology; i.e.\, independent of library and available functionality.\nAlthough this testbench is applied on a very simple design under test (DUT)\, the same principles also apply to advanced testbenches for complex DUTs. (But the advanced testbenches need more on top.)\nAgenda\n\nQuality and Efficiency Enablers\nThe simple DUT and simple TB architecture\nUVVM: Concepts\, Download and Compile\nMaking the testbench – prior to test cases\nAdding clock generator and starting logging and checking\nBFMs: Explained\, Usage\, Making simple overloads\nAlert handling\, Verbosity control and Timeouts\nConclusion\nQ&A\n\nWebinar Duration\n\n45 min presentation/live demo\n15 min Q&A\n\nPresenter \n \nBio: \nEspen is also the author and architect of UVVM and founder of previous Bitvis. He has a strong interest for methodology cultivation and pragmatic efficiency and quality improvement\, and he has given many presentations on various international conferences with great feedback. He has also given courses on FPGA Design and Verification world-wide.
URL:https://marketingeda.com/event/making-a-structured-vhdl-testbench-a-demo-for-beginners/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Aldec-April-11-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240411T100000
DTEND;TZID=America/Los_Angeles:20240411T110000
DTSTAMP:20240314T180820Z
CREATED:20240314T180820Z
LAST-MODIFIED:20240314T180820Z
UID:7736-1712829600-1712833200@marketingeda.com
SUMMARY:Cadence Managed Cloud for Cost Efficient and Productive Chip Design
DESCRIPTION:Join us for an informative webinar\, as we unveil the capabilities of our cloud solutions designed to revolutionize EDA workloads. Whether you require completely hosted environments or need peak/burst capacity\, our cloud solutions offer unparalleled flexibility and efficiency. \nWe will discuss how Cadence Managed Cloud can optimize cost-efficiency and productivity for your chip design projects. Learn how to harness the full potential of cloud technology to streamline your EDA workflows and achieve remarkable results. \nDon’t miss our live demonstration of Cadence Managed Cloud\, where we’ll showcase its robust productivity and security features. Plus\, discover how you can kickstart your journey with a 30-day free trial. \nWho should attend:\nChip designers\, Cloud IT Architects\, CAD Platform team\, and business decision makers. \nPresenters: \nKushal Koolwal\, Business Development Director\, Cadence \nMike Stranton\, IT Group Director\, Cadence
URL:https://marketingeda.com/event/cadence-managed-cloud-for-cost-efficient-and-productive-chip-design/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-April-11-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Paris:20240411T080000
DTEND;TZID=Europe/Paris:20240411T170000
DTSTAMP:20240322T164706Z
CREATED:20240322T164706Z
LAST-MODIFIED:20240322T164706Z
UID:7750-1712822400-1712854800@marketingeda.com
SUMMARY:Siemens EDA - TechDay Grenoble 2024
DESCRIPTION:Siemens EDA Technology Day in Grenoble is your opportunity to learn\, grow and connect with fellow technical experts who design leading-edge products using Siemens EDA tools. This event is dedicated to end users of Siemens EDA solutions. This conference is free to attend and includes keynotes from industry leaders and enriching technical sessions. \n  \n\nAnalog/Mixed-Signal Verification\nCalibre Design Solutions\nDigital IC Implementation\nFunctional Design & Verification\nHardware-Assisted Verification\nNext Gen Packaging and DFM\nPCB Design & Simulation\nTessent Test Solutions and Embedded Analytics
URL:https://marketingeda.com/event/siemens-eda-techday-grenoble-2024/
LOCATION:CA
CATEGORIES:Conference,EDA
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Siemens-April-11-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240410T100000
DTEND;TZID=America/Los_Angeles:20240410T110000
DTSTAMP:20240221T221535Z
CREATED:20240221T221535Z
LAST-MODIFIED:20240221T221535Z
UID:7677-1712743200-1712746800@marketingeda.com
SUMMARY:Virtuoso - Finding Hidden Treasures to Accelerate Routing Your Layout
DESCRIPTION:Every layout designer frets over routing all the interconnects DRC clean and correct as per the circuit designer’s expectations. On the one hand\, you want a magic wand that just hooks up all the connections with perfect smartness. On the other hand\, you need to guide the connections carefully while weaving your own creative magic – too tough to tell the auto-router the exact constraints. With the assisted routing features in your familiar layout editor in Virtuoso Studio\, you have the Swiss army knife to finish your routing tasks more than 10X faster. Finish more work in the same amount of time or regain your work-life balance with the assisted routing functionality. \nThis webinar takes you on a treasure hunt to find the hidden gems – some you already had but didn’t know\, and some that are part of Virtuoso Studio. Strap your seat belts and learn about: \n\nHow simulation-driven routing goes a step ahead than the create-verify-fix paradigm\nReplicate complicated yet similar bus structures with more than just a simple shape copy\n Fast interactive routing with auto twigs feature\nOptimal routing widths in advanced node with WSP compliance\, wire stranding and wire stacking\nAuto Via Assistant\n\nWebinar #1: March 12\nAccelerate Layout Creation with Automated Place and Route in Virtuoso Studio \nWebinar #2: March 19\nSaving on Signoff Effort with iPegasus Verification System for Virtuoso Studio – In-Design DRC and Fill \nWebinar #3: April 4\nMaximizing the Benefits of Virtuoso Layout Suite XL \nWebinar #4: April 10\nFinding Hidden Treasures to Accelerate Routing Your Layout
URL:https://marketingeda.com/event/virtuoso-finding-hidden-treasures-to-accelerate-routing-your-layout/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-March-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20240409T080000
DTEND;TZID=Europe/Berlin:20240411T170000
DTSTAMP:20240403T194345Z
CREATED:20240119T022657Z
LAST-MODIFIED:20240403T194345Z
UID:7529-1712649600-1712854800@marketingeda.com
SUMMARY:Embedded World 2024
DESCRIPTION:The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community\, including leading experts\, key players and industry associations. It offers unprecedented insight into the world of embedded systems\, from components and modules to operating systems\, hardware and software design\, M2M communication\, services\, and various issues related to complex system design. \nIts expertise and sharp focus on technologies\, processes and future-oriented products make it unparalleled in international comparisons – and THE must-attend event for developers\, system architects\, product managers and technical management. \nKnowledge platform #ew24\nKnow-how at the highest level\nAt the embedded world Conference and the electronic displays Conference\, top-class speakers from research\, development and practice will share their knowledge with you. They discuss the state of the art and possible future developments in the industry. The exhibitor’s forums and top-class discussion panels in the halls also contribute to the high-quality transfer of knowledge. Current topics will be highlighted in numerous expert lectures and panels. And\, of course\, there will be opportunities for intensive technical discussions. \nGuided tours\, tours for trainees and students and special presentations as well as the networking event for women in the embedded systems industry #women4ew complete the offer. \nThe No. 1 hub for the international embedded community\n\nAs the global platform and the industry place to meet for the embedded community\, embedded world attracts the top experts\, key players and industry associations from all over the world. \nBecome part of the community and use THE industry platform to network and make valuable business contacts!
URL:https://marketingeda.com/event/embedded-world-2024/
LOCATION:NürnbergMesse\, Messezentrum 1\, Nurnberg\, Germany
CATEGORIES:Conference,EDA,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Embedded-World-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240409T080000
DTEND;TZID=America/Los_Angeles:20240409T170000
DTSTAMP:20240401T175124Z
CREATED:20240401T175124Z
LAST-MODIFIED:20240401T175124Z
UID:7794-1712649600-1712682000@marketingeda.com
SUMMARY:Ansys 2024 R1: High Frequency Electronics What’s New
DESCRIPTION:Learn about the latest improvements and new features to the high frequency electronics simulation tools. There are many enhancements for engineers involved in RF\, automotive\, A&D\, and consumer electronics designs that our subject matter experts will discuss. \n\n\nOverview\nThis Ansys 2024 R1 webinar will review the high-frequency electronics tool updates\, enhancements\, and new features – HFSS\, Q3D\, SIwave\, and NuHertz. Engineers developing PCBs\, antennas\, and other RF capabilities for telecommunications\, HPC\, automotive\, A&D\, and IoT applications will find many new capabilities and improvements in this update. \nWhat you will learn\n\nEncrypted technology file support in HFSS 3D Layout IC Mode\nEnhanced support for FlexPCB in HFSS 3D\nHFSS Finite Array metadata export and mask automation\nIcepak Thermal Mesh Fusion\nSolver enhancements for SIwave and Q3D\nImprovements to HPC/Distributed Computing support for all products\n\nWho should attend and why\nEngineers involved in new product development for any electronics market \nSpeaker\n\nJuliano Mologni\n\n\n\n\n\nJuliano Mologni is a Lead Product Manager in the Electronics Business Unit at Ansys\, responsible for all HF electronics products. He has over 20 years of experience in computational electromagnetics and is the author of multiple patents and more than 60 journal and conference papers. Juliano is involved in many RF and EMC projects with top automotive\, A&D\, appliances\, and high tech companies. He holds a BSc degree in telecommunication engineering and an MSc in microelectronics and has authored a PhD thesis on automotive EMC and signal integrity.
URL:https://marketingeda.com/event/ansys-2024-r1-high-frequency-electronics-whats-new/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Ansys-April-9-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240409T080000
DTEND;TZID=America/Los_Angeles:20240409T090000
DTSTAMP:20240402T170530Z
CREATED:20240402T170530Z
LAST-MODIFIED:20240402T170530Z
UID:7803-1712649600-1712653200@marketingeda.com
SUMMARY:Guiding your aerospace electrical journey
DESCRIPTION:Aerospace electrical/electronic (EE) design requires a delicate balance between innovative technology and uncompromising reliability. Meanwhile\, the pressure to get products to market faster is growing exponentially. Finding ways to design electrical systems quickly\, cost-effectively and efficiently has become a central focus of manufacturers. \nSiemens has the solutions and partnerships to guide the development of best-in-class solutions to these problems. This session will highlight how Capital plays a part in these solutions. \nMeet the speaker\n\n\n\n\n\n\nSIEMENS IES\nChad Holley\nTechnical Product Manager \n\nChad Holley is a Technical Product Manager in IES supporting our Connectivity offerings. He has been working for Siemens for over 8 years and has supported many customers in their Capital deployments. Prior to Siemens\, Chad has held varying positions in wiring and systems design in both the automotive and aerospace and defense industries. Chad is a veteran of the United States Navy as an electrician and holds a bachelor’s degree in Electrical Engineering from Michigan State University.
URL:https://marketingeda.com/event/guiding-your-aerospace-electrical-journey/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Siemens-April-9-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240404T110000
DTEND;TZID=America/Los_Angeles:20240404T120000
DTSTAMP:20240311T212213Z
CREATED:20240311T212000Z
LAST-MODIFIED:20240311T212213Z
UID:7730-1712228400-1712232000@marketingeda.com
SUMMARY:High-Performance RTL Simulation Workflow with Libero and Active-HDL
DESCRIPTION:Based on recent industry research\, the FPGA market was valued at approximately USD 7.5 Billion in 2023\, with an expected compound annual growth rate (CAGR) of around 10% by 2032. More and more engineers will be adopting FPGAs due to their versatility\, acceleration capability\, power efficiency and lower non-recurring engineering (NRE) costs (compared to ASICs). Major FPGA vendors like AMD\, Altera and Microchip are continuously innovating their technologies\, architectures\, and IPs – and consequently enhancing their respective design capabilities and workflows. For example\, Vivado\, Quartus and Libero all provide useful design and RTL simulation features. Aldec collaborates closely with the FPGA vendors as partners to ensure seamless simulation of all their IPs and libraries using Aldec’s simulation tool\, Active-HDL. \nIn terms of verification\, FPGA designs undergo testing directly in the lab or through simulations\, depending on factors such as design size\, complexity\, and project objectives. While some FPGA designs may find adequate simulation support from the FPGA vendor tools\, many require higher simulation performance and a more comprehensive language support\, particularly those with larger designs with complex logic and deep hierarchies. \nSimulation stands as the primary verification method for FPGA designs\, essential for minimizing non-trivial bugs escaping into production. The ability to run more simulation enables the verification of a wider range of test scenarios\, thus elevating verification quality. Aldec’s Active-HDL offers a faster compilation/simulation engine\, robust debugging features and comprehensive language support for the latest versions of VHDL\, SystemVerilog\, and SystemC. \nIn this three-part webinar series\, we will show how to turbocharge FPGA simulation workflows by using Active-HDL as the default simulator within AMD® Vivado\, Altera® Quartus and Microchip® Libero SoC. \n  \nAbstract: \nIn the concluding part of this three-part webinar series\, we will show how to simulate a Microchip design example. We will generate a design example from Libero SoC and simulate it using Active-HDL as the default simulator. We will discuss various tips that you can use to optimize compilation and simulation run times. The tips will be categorized from zero-cost effort to high-cost effort and\, depending on your budget/resource constraints\, you will have a path to speed up your simulation by a huge factor. We will turn on Profiler so that you can determine the bottlenecks in your design/testbench and we will perform debugging using Breakpoints\, Xtrace\, Drivers/Readers and Advanced Dataflow. \nAgenda\n\nWorkflow with Libero SoC and Active-HDL\nTips on how to optimize simulation performance\nPerformance bottleneck analysis with Design Profiler\nBreakpoints\, Xtrace and Advanced Dataflow\, Drivers and Readers\nLive Demo\nQ&A\n\nWebinar Duration\n\n45 min presentation/live demo\n15 min Q&A\n\nPresenter Bio: \n \nLouie De Luna\, Director of Marketing at Aldec \nLouie De Luna is Aldec’s Director of Marketing with 20+ years’ experience in FPGA/SoC design verification and EDA tools. He currently directs the overall product and technical marketing of Aldec’s design verification solutions. He earned his B.S. in Computer Engineering from University of Nevada\, Las Vegas\, in 2001.  His practical engineering experience includes simulation-based verification\, linting\, CDC analysis\, and hardware-assisted verification.
URL:https://marketingeda.com/event/high-performance-rtl-simulation-workflow-with-libero-and-active-hdl/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Aldec-April-4-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240404T100000
DTEND;TZID=America/Los_Angeles:20240404T110000
DTSTAMP:20240318T163105Z
CREATED:20240318T163105Z
LAST-MODIFIED:20240318T163105Z
UID:7740-1712224800-1712228400@marketingeda.com
SUMMARY:Hierarchical Analysis of EM Crosstalk with EMX Planar 3D Solver
DESCRIPTION:Identifying sources of electromagnetic (EM) coupling and safeguarding today’s complex electronic designs from EM crosstalk are daunting tasks. For designs with multiple levels of hierarchy\, identification\, and detailed analysis of the “EM-sensitive” content is a challenge. The manual creation of wrapper cells or new layout views to enable this quickly becomes a time-consuming and error-prone task. \nLearn how the Cadence EMX Planar 3D Solver black-box flow lets you specify hierarchical layout cells to be excluded from the EM analysis\, saving design time and eliminating errors. Automate the flow and integrate with Virtuoso ADE Suite and Spectre Simulation platforms for more control during circuit analysis. \nLearn through real-life circuit examples how to achieve: \n\nFaster design cycles: Streamline your analysis process and free up time for innovation.\nReduced errors and rework: Eliminate manual tasks and minimize the risk of mistakes.\nEnhanced confidence in your designs: Gain superior control over signal integrity for optimal performance.
URL:https://marketingeda.com/event/hierarchical-analysis-of-em-crosstalk-with-emx-planar-3d-solver/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-April-4-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240404T100000
DTEND;TZID=America/Los_Angeles:20240404T110000
DTSTAMP:20240221T221413Z
CREATED:20240221T221413Z
LAST-MODIFIED:20240221T221413Z
UID:7675-1712224800-1712228400@marketingeda.com
SUMMARY:Maximizing the Benefits of Virtuoso Layout Suite XL
DESCRIPTION:Find out how the Virtuoso Layout Suite XL you’ve known for many years is setting new standards in custom layout authoring. The connectivity-driven paradigm keeps the layout in synch with the circuit design and ensures that the design intents are always honored. Learn how we strengthened the layout editor in Virtuoso Studio\, launched in 2023\, with new features that empower you to achieve tasks much faster. In this webinar\, you will learn about: \n\nNew features such as Schematic Assistant\, Incremental Check Against Source\nWhether Group Array can solve your historical problem of mosaics conflicting with Virtuoso Layout Suite XL\nStreamlining the daunting task of managing the sanctity of review process using the design review feature in Virtuoso Studio\nPerformance improvements you will gain if you switch to Virtuoso Studio\n\nWebinar #1: March 12\nAccelerate Layout Creation with Automated Place and Route in Virtuoso Studio \nWebinar #2: March 19\nSaving on Signoff Effort with iPegasus Verification System for Virtuoso Studio – In-Design DRC and Fill \nWebinar #3: April 4\nMaximizing the Benefits of Virtuoso Layout Suite XL \nWebinar #4: April 10\nFinding Hidden Treasures to Accelerate Routing Your Layout
URL:https://marketingeda.com/event/maximizing-the-benefits-of-virtuoso-layout-suite-xl/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-March-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240403T080000
DTEND;TZID=America/Los_Angeles:20240405T170000
DTSTAMP:20240326T185839Z
CREATED:20230918T162548Z
LAST-MODIFIED:20240326T185839Z
UID:6808-1712131200-1712336400@marketingeda.com
SUMMARY:ISQED Symposium 2024
DESCRIPTION:A pioneer and leading interdisciplinary conference\, the 25thInternational Symposium on Quality Electronic Design (ISQED’24) accepts and promotes original and unpublished papers related to the topics shown below. \nISQED’24 theme is AI/ML& Electronic Design\, Hardware Security\, Quantum Computing\, 3D Integration\, and IoT. Authors are invited to submit papers in following topics (please visit the website for detail list of all tracks and subjects): \n\nHardware and System Security\nElectronic Design Automation Tools and Methodologies\nDesign for Test and Verification\nEmerging Device and Process Technologies and Applications\nCircuit Design\, 3D Integration and Advanced Packaging\nSystem-level Design and Methodologies\nCognitive Computing Hardware\n\nThis must-attend conference starts on Wednesday April 3\, and continues until the early afternoon of Friday April 5. The program includes keynote speeches\, embedded tutorials\, invited talks\, panel discussion\, and many peer-reviewed technical presentations. \nKeynote Speakers\n\nCross-Layer Optimization of Energy Harvesting and Storage\nDr. Naehyuck Chang\nExecutive Vice President\, Samsung SDI America\nWhy we did not have flying cars for 100 years\nJim Dukhovny\nCEO\, Alef Aeronautics\nReflections on Microelectronic and Microelectromechanical Technologies and the Challenges of Implementing Emerging Technologies\nClare D. Thiem\nAir Force Research Laboratory/RITB\n\nEmbedded Tutorials\n\nAdvanced Packaging for Heterogenous Integration\nDr. Tolga Acikalin\nIntel Labs\nSecuring Ubiquitous Devices with Lightweight Circuit Primitives\nProf. Kaiyuan Yang\nRice University\n\nPanel Discussion\n\nAI Hardware: Opportunities and Challenges\n\nTechnical Sessions\nTechnical program consists of over 20 technical sessions featuring over 100 peer-reviewed and invited technical presentations on various challenging topics related to AI/ML & Electronic Design\, Security\, IoT\, Quantum Computing\, etc. See the ISQED 2024 program for details. \nISQED Awards\nISQED best paper award ceremony will be held during plenary session on the morning of Wednesday April 3.
URL:https://marketingeda.com/event/isqed-symposium-2024/
LOCATION:Seven Hills Conference Center\, 800 Font Blvd\, San Francisco\, CA\, 94132\, United States
CATEGORIES:Conference,EDA,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISQED-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240403T080000
DTEND;TZID=America/Los_Angeles:20240404T170000
DTSTAMP:20240212T202640Z
CREATED:20240212T202640Z
LAST-MODIFIED:20240212T202640Z
UID:7607-1712131200-1712250000@marketingeda.com
SUMMARY:Siemens EDA User2User Conference
DESCRIPTION:Engineer a smarter future\, faster at Siemens EDA User2User Conference \nApril 3-4\, 2024 Santa Clara\, CA. \nJoin your colleagues from around the industry for a day of technical sessions\, networking\, keynote sessions\, labs and more. User2User is free of charge for Siemens EDA customers and includes sessions\, lunch\, and parking. \nTechnology tracks covering the latest from: \n• 3DIC/Chiplet Package Design \n• Aprisa Digital IC Implementation \n• Calibre Design Solutions & Power Integrity Analysis \n• Custom IC Verification \n• Functional Design and Verification \n• Hardware Assisted Verification \n• High-Level Synthesis/Verification & RTL Power Estimation/Optimization \n• Package/PCB Analysis & Verification \n• Tessent Test and Embedded Analytics Solutions \nNEW this year\, the option to attend a full day of training from our Learning Services team. \nWe are excited to offer a unique training opportunity on Wednesday\, April 3rd\, the day before User2User! Our experts will deliver curated material from our most sought-after courses in a condensed format. User2User attendees who participate in either class will also take home a free ODT subscription for the full self-paced training course to expand your knowledge on the topic and perform hands-on labs in our virtual cloud-enabled environment. Space is extremely limited\, so click below to learn how you can get into this User2User-exclusive!
URL:https://marketingeda.com/event/siemens-eda-user2user-conference/
LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:EDA,IP,User Group
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Siemens-April-3-4-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240402T100000
DTEND;TZID=America/Los_Angeles:20240402T110000
DTSTAMP:20240327T160224Z
CREATED:20240327T160224Z
LAST-MODIFIED:20240327T160224Z
UID:7768-1712052000-1712055600@marketingeda.com
SUMMARY:RISC-V Instruction Set Architecture: Enhancing Computing Power
DESCRIPTION:*Work email required for registration*  \nDon’t miss out on this exclusive opportunity to stay ahead in the rapidly evolving landscape of chip design. Join us for an engaging discussion that promises to inspire and inform: \n– Gain insights into the latest trends shaping chip design. \n– Learn from industry leaders about the strategies behind successful SoC design. \n– Discover how RISC-V and software-defined products are shaping the future of chip architecture. \n– Network with professionals and experts in the field. \nSoftware Defined Products: Meeting the Challenges of Change \nAndes Technology Corp.  \nPresenter: Bing Yu\, Computer and AI Architect\, Andes Technology USA Corp. The adoption of the RISC-V instruction set architecture has revolutionized chip design. For the first time\, designers can extend the instruction set architecture to achieve significant improvements in performance or reductions in power consumption. Bing Yu will delve into how this trend has propelled Andes Technology Corp. to success. \nMenta SAS  \nPresenter: Gareth Baron\, Applications Engineering Director\, Menta SAS North America. As the industry moves towards software-defined products\, there’s an increasing demand for flexibility in chip design\, including the flexibility to update some portions of the logic post-fab. Gareth Baron will explore this trend\, drawing from examples like Software Defined vehicles. Learn how Menta SAS has navigated the challenges of designing for change in silicon. \n*This webinar is in partnership with SemiWiki\, Andes\, and Menta SaS*
URL:https://marketingeda.com/event/risc-v-instruction-set-architecture-enhancing-computing-power/
LOCATION:CA
CATEGORIES:EDA,IP,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Amdes-Menta-April-2-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240328T110000
DTEND;TZID=America/Los_Angeles:20240328T120000
DTSTAMP:20240311T211521Z
CREATED:20240311T211521Z
LAST-MODIFIED:20240311T211521Z
UID:7727-1711623600-1711627200@marketingeda.com
SUMMARY:High-Performance RTL Simulation Workflow with Quartus and Active-HDL
DESCRIPTION:Based on recent industry research\, the FPGA market was valued at approximately USD 7.5 Billion in 2023\, with an expected compound annual growth rate (CAGR) of around 10% by 2032. More and more engineers will be adopting FPGAs due to their versatility\, acceleration capability\, power efficiency and lower non-recurring engineering (NRE) costs (compared to ASICs). Major FPGA vendors like AMD\, Altera and Microchip are continuously innovating their technologies\, architectures\, and IPs – and consequently enhancing their respective design capabilities and workflows. For example\, Vivado\, Quartus and Libero all provide useful design and RTL simulation features. Aldec collaborates closely with the FPGA vendors as partners to ensure seamless simulation of all their IPs and libraries using Aldec’s simulation tool\, Active-HDL. \nIn terms of verification\, FPGA designs undergo testing directly in the lab or through simulations\, depending on factors such as design size\, complexity\, and project objectives. While some FPGA designs may find adequate simulation support from the FPGA vendor tools\, many require higher simulation performance and a more comprehensive language support\, particularly those with larger designs with complex logic and deep hierarchies. \nSimulation stands as the primary verification method for FPGA designs\, essential for minimizing non-trivial bugs escaping into production. The ability to run more simulation enables the verification of a wider range of test scenarios\, thus elevating verification quality. Aldec’s Active-HDL offers a faster compilation/simulation engine\, robust debugging features and comprehensive language support for the latest versions of VHDL\, SystemVerilog\, and SystemC. \nIn this three-part webinar series\, we will show how to turbocharge FPGA simulation workflows by using Active-HDL as the default simulator within AMD® Vivado\, Altera® Quartus and Microchip® Libero SoC. \nAbstract: \nIn part two of this three-part webinar series\, we will show how to simulate an Altera design example. We will generate a design example from Quartus and simulate it using Active-HDL as the default simulator. We will discuss various tips that you can use to optimize compilation and simulation run times. The tips will be categorized from zero-cost effort to high-cost effort and\, depending on your budget/resource constraints\, you will have a path to speed up your simulation by a huge factor. We will turn on Profiler so that you can determine the bottlenecks in your design/testbench\, and we will show how you to do a post-simulation debug using Waveform Viewer\, Hierarchy\, Object and Watch windows. \n\nAgenda\n\nWorkflow with Quartus and Active-HDL\nTips on how to optimize simulation performance\nPerformance bottleneck analysis with Profiler\nPost-simulation debugging with Waveform Viewer\, Hierarchy and Watch window\nLive demo\nQ&A\n\nWebinar Duration\n\n45 min presentation/live demo\n15 min Q&A\n\nPresenter Bio: \n \nLouie De Luna\, Director of Marketing at Aldec \nLouie De Luna is Aldec’s Director of Marketing with 20+ years’ experience in FPGA/SoC design verification and EDA tools. He currently directs the overall product and technical marketing of Aldec’s design verification solutions. He earned his B.S. in Computer Engineering from University of Nevada\, Las Vegas\, in 2001.  His practical engineering experience includes simulation-based verification\, linting\, CDC analysis\, and hardware-assisted verification.
URL:https://marketingeda.com/event/high-performance-rtl-simulation-workflow-with-quartus-and-active-hdl/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Akdec-March-28-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240328T100000
DTEND;TZID=America/Los_Angeles:20240328T110000
DTSTAMP:20240322T224737Z
CREATED:20240322T224737Z
LAST-MODIFIED:20240322T224737Z
UID:7753-1711620000-1711623600@marketingeda.com
SUMMARY:Analyze the Impact of Surface Defect Dot on Short Circuit Phenomena in SiC Devices
DESCRIPTION:Learn How STMicroelectronics Silicon Carbide (SiC) Research Team uses Silvaco TCAD to Analyze the Impact of Surface Defect Dot on Short Circuit Phenomena in SiC Devices\nDuring SiC device switching operations\, it is possible that devices could be reaching abnormal overload conditions\, which is why some applications require “robustness” specifications (e.g.\, Short Circuit and UIS tests). Such overload phenomena can be simulated by mixed-mode circuits and an accurate tuning of simulation parameters\, thanks to simulation/experiment information exchange. This allows us to predict electrothermal behavior during a dynamic phase. As an example\, we report here a study of short circuit phenomenon. The impact of a short circuit of a defect localized in active area has been investigated by means of TCAD simulations performed with Silvaco software. Different cases have been studied in which the defect dot was localized at flat interface body/drain\, at SiC/oxide interface in the channel region\, and at curved interface body/drain. A sensitivity with position has also been performed. \nWhat You Will Learn\n\nWide bandgap (WBG) technologies and key features of SiC\nSiC MOSFET switching operation and ruggedness\nTCAD simulations and device reliability\nShort circuit: Impact of surface defect dot\n\n\n\n\n\n\nPresenter\n\n\n\n\nSalvatore Cascino\, SiC R&D Engineer\, ST Microelectronics \nSalvatore Cascino was born in Palermo (Italy) in 1970. He obtained a Degree in Physics from the University of Palermo. He was involved at ENEA (Frascati – Rome) with Nuclear Fusion Department (FTU project) and with the Fusion Research group in Padua (RFX project). He is currently at STMicroelectronics (Catania) with the R&D Group and his current research interest is aimed to technology development for Silicon Carbide devices. In the past he worked on development of devices for sensing applications and radiofrequency\, too. \n\n\n\n\n\nWHO SHOULD ATTEND:\n\n\n\n\nSemiconductor Device and Process engineers\, product managers\, and engineering management.
URL:https://marketingeda.com/event/analyze-the-impact-of-surface-defect-dot-on-short-circuit-phenomena-in-sic-devices/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Silvaco-March-28-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240327T100000
DTEND;TZID=America/Los_Angeles:20240327T110000
DTSTAMP:20240306T173441Z
CREATED:20240306T173441Z
LAST-MODIFIED:20240306T173441Z
UID:7713-1711533600-1711537200@marketingeda.com
SUMMARY:Reduce Gate-level Simulation Bring-up Time with Semi-formal X Verification
DESCRIPTION:Gate-level simulations (GLS) are a crucial step in the verification of an ASIC/FPGA. GLS is used for verifying power-up\, reset operation\, timing\, multi-cycle paths\, and power estimation. However\, GLS can be a bottleneck in the project cycle due to its complexity. The nature of a GLS can cause simulations to run much longer than the equivalent RTL simulations. Additionally\, GLS bring-up and debug is slow and manual. In GLS\, engineers spend time cleaning up sources of unknowns (Xs).  Xs can be caused by uninitialized inputs\, registers\, and simulation artifacts such as X-pessimism. Ad-hoc methods to handle Xs in GLS could mask problems. \nThis webinar will describe a reliable formal-based method to manage Xs in GLS.  It centers on the use of Siemens Avery SimXACT solution alongside your preferred simulator. \nWhat You Will Learn:  \n\nX mitigation techniques to use in RTL\nHow to eliminate X-pessimism in GLS for a streamlined bring-up\nGenerate fixes for unknowns in a fraction of time compared to manual debug\nThe SimXACT workflow\n\nWho Should Attend:  \n\nDesigners and Design Verification engineers\nDesign Managers and Directors responsible for project tapeout schedule\n\nWhat/Which Products are Covered:   \n\nSiemens Avery SimXACT\nQuesta simulation\n\n\n\nSpeakers:\n\n\n\n\n\n\nRick Koster\nLow Power Specialist\, Siemens EDA\n\n\n\n\nRick Koster is the North America Low Power Specialist for verification tools at Siemens EDA.  Rick started his career at Texas Instruments and has held engineering positions at the US Army\, Bytex Corporation.  For more than 25 years\, Rick has worked in verification at Siemens EDA through Mentor Graphics and Ikos Systems. \n\n\n\n\n\n\n\nKai-hui Chang\nSiemens EDA\n\n\n\n\nKai-hui Chang is the architect of the SimXACT tool. He has been with Avery Design Systems for 20 years and recently joined Siemens through the Avery acquisition. His work focuses on simulation technologies and formal verification. He has a Ph. D. in computer science and engineering from the University of Michigan\, Ann Arbor.
URL:https://marketingeda.com/event/reduce-gate-level-simulation-bring-up-time-with-semi-formal-x-verification/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Siemens-March-27-202.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240321T110000
DTEND;TZID=America/Los_Angeles:20240321T120000
DTSTAMP:20240311T211030Z
CREATED:20240311T211030Z
LAST-MODIFIED:20240311T211030Z
UID:7724-1711018800-1711022400@marketingeda.com
SUMMARY:High-Performance RTL Simulation Workflow with Vivado and Active-HDL
DESCRIPTION:Based on recent industry research\, the FPGA market was valued at approximately USD 7.5 Billion in 2023\, with an expected compound annual growth rate (CAGR) of around 10% by 2032. More and more engineers will be adopting FPGAs due to their versatility\, acceleration capability\, power efficiency and lower non-recurring engineering (NRE) costs (compared to ASICs). Major FPGA vendors like AMD\, Altera and Microchip are continuously innovating their technologies\, architectures\, and IPs – and consequently enhancing their respective design capabilities and workflows. For example\, Vivado\, Quartus and Libero all provide useful design and RTL simulation features. Aldec collaborates closely with the FPGA vendors as partners to ensure seamless simulation of all their IPs and libraries using Aldec’s simulation tool\, Active-HDL. \nIn terms of verification\, FPGA designs undergo testing directly in the lab or through simulations\, depending on factors such as design size\, complexity\, and project objectives. While some FPGA designs may find adequate simulation support from the FPGA vendor tools\, many require higher simulation performance and a more comprehensive language support\, particularly those with larger designs with complex logic and deep hierarchies. \nSimulation stands as the primary verification method for FPGA designs\, essential for minimizing non-trivial bugs escaping into production. The ability to run more simulation enables the verification of a wider range of test scenarios\, thus elevating verification quality. Aldec’s Active-HDL offers a faster compilation/simulation engine\, robust debugging features and comprehensive language support for the latest versions of VHDL\, SystemVerilog\, and SystemC. \nIn this three-part webinar series\, we will show how to turbocharge FPGA simulation workflows by using Active-HDL as the default simulator within AMD® Vivado\, Altera® Quartus and Microchip® Libero SoC. \nAbstract: \nIn part one of this three-part webinar series\, we will show you how to simulate an AMD example design. We will generate a design example from Vivado and simulate it using Active-HDL as the default simulator. We will discuss various tips that you can use to optimize compilation and simulation run times. The tips will be categorized from zero-cost effort to high-cost effort and\, depending on your budget/resource constraints\, you will have a path to speed up your simulation by a huge factor. We will turn on Profiler so that you can determine the bottlenecks in your design/testbench\, and we will show you advanced debugging capabilities using our advanced waveform viewer. We will also turn on code coverage and analyze the results in html format. \n\nAgenda\n\nWorkflow with Vivado and Active-HDL\nTips on how to optimize simulation performance\nPerformance bottleneck analysis with Profiler\nAdvanced Debugging with Waveform Viewer\nCode Coverage\nLive Demo\nQ&A\n\nWebinar Duration\n\n45 min presentation/live demo\n15 min Q&A\n\nPresenter Bio: \n \nLouie De Luna\, Director of Marketing at Aldec \nLouie De Luna is Aldec’s Director of Marketing with 20+ years’ experience in FPGA/SoC design verification and EDA tools. He currently directs the overall product and technical marketing of Aldec’s design verification solutions. He earned his B.S. in Computer Engineering from University of Nevada\, Las Vegas\, in 2001.  His practical engineering experience includes simulation-based verification\, linting\, CDC analysis\, and hardware-assisted verification.
URL:https://marketingeda.com/event/high-performance-rtl-simulation-workflow-with-vivado-and-active-hdl/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Aldec-March-21-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240321T100000
DTEND;TZID=America/Los_Angeles:20240321T153000
DTSTAMP:20240222T182630Z
CREATED:20240222T182630Z
LAST-MODIFIED:20240222T182630Z
UID:7686-1711015200-1711035000@marketingeda.com
SUMMARY:AI-Powered Electromagnetics Symposium
DESCRIPTION:Accelerate Your Designs with Generative AI-Powered Multiphysics Analysis and Optimization \nHow are you addressing the ever-increasing complexity and density of your high-performance electronic systems? What role do electromagnetic effects such as electromagnetic interference (EMI)\, electromagnetic compatibility (EMC)\, power integrity\, and signal integrity play? \nDiscover how Cadence is transforming electromagnetic (EM) simulation for optimal design performance with innovative\, AI-driven multiphysics optimization software and breakthrough 3D EM analysis. \nJoin our CadenceCONNECT: AI-Powered EM Symposium\, where industry experts\, including Cadence\, Meta\, Microsoft\, and more\, will share insights highlighting how the Cadence Clarity 3D Solver and Optimality Intelligent Explorer workflow streamlines design results in optimized electronic product designs. \n\n\n\n\n\n\n\n\n\n\n\n\nAgenda \n10:00am – 10:30am               Registration | Light Breakfast \n10:30am – 12:00pm               Morning Sessions \n12:00pm – 1:00pm                 Lunch | Live Demonstrations \n1:00pm – 2:30pm                   Afternoon Sessions \n2:30pm – 3:30pm                   Networking Event | Live Demonstrations
URL:https://marketingeda.com/event/ai-powered-electromagnetics-symposium/
LOCATION:Cadence Design Systems\, Building 5\, 2655 Seely Avenue\, San Jose\, CA\, 95131\, United States
CATEGORIES:EDA,Symposium
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-March-21-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240321T100000
DTEND;TZID=America/Los_Angeles:20240321T110000
DTSTAMP:20240229T180535Z
CREATED:20240229T180535Z
LAST-MODIFIED:20240229T180535Z
UID:7696-1711015200-1711018800@marketingeda.com
SUMMARY:Shift-Left Thermal Analysis with AI-Enabled Celsius Studio Platform
DESCRIPTION:With the growing complexities of 3D-ICs\, chiplets\, advanced packaging\, and high-performance boards\, engineers need a unified solution that provides early insight and analysis to detect and correct design problems before it is too late. This solution must also offer the ability to simulate the entire design efficiently\, providing confidence in system signoff. \nJoin our webinar as we present the new Cadence Celsius Studio the industry’s first complete thermal platform for electronic systems developed specifically to address thermal analysis\, thermal stress\, and electronics cooling design issues. This solution provides accurate system-level thermal analysis by combining finite element method (FEM) with computational fluid dynamics (CFD) technologies for full-system thermal analysis from chip to packaging to board through to the end-system product. \nAttendees will learn: \n\nHow Celsius Studio provides AI-enabled thermal analysis for electro-mechanical systems design\nHow the convergence of FEM and CFD engines addresses thermal challenges spanning from the chip to the packaging and out to the board and end system
URL:https://marketingeda.com/event/shift-left-thermal-analysis-with-ai-enabled-celsius-studio-platform/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-March-21-2024-1.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240320T080000
DTEND;TZID=America/Los_Angeles:20240321T170000
DTSTAMP:20240305T220415Z
CREATED:20240305T220415Z
LAST-MODIFIED:20240305T220415Z
UID:7710-1710921600-1711040400@marketingeda.com
SUMMARY:SNUG Silicon Valley 2024
DESCRIPTION:Connecting the Synopsys User Community\nSNUG conferences have connected Synopsys global users for more than three decades. SNUG 2024 will once again provide a place where users and technical experts can meet\, network\, and share ideas about chip and system design. \nTechnical Committee\nSNUG thanks the members of the Technical Committee who volunteer their time and expertise to support SNUG’s technical quality and deliver the benefit of their perspective to the users of Synopsys tools and technology. \nTechnical Committee Chair: \nDon Mills\, Microchip \nCommittee Members: \nAnand Iyer\, Synopsys \nAndy Copperhall\, Independent \nAnwarul Hasan\, Independent \nBrian Kane\, Northrop Grumman \nBryan Morris\, Ciena \nChris Kiegle\, Marvell Semiconductor \nCliff Cummings\, Paradigm Works \nFirouzeh Nourkhalaj\, Synopsys \nGlen McDonnell\, Broadcom \nHongda Lu\, SARC \nJack Dong\, Intel \nJason Rziha\, Microchip \nJeff Montesano\, Meta \nJing Zhang\, Intel \nJohn Thomson\, NVIDIA \nJohn Wei\, Independent \nJon Colburn\, NVIDIA \nJT Longino\, Tesla \nKarthik Rajan\, Microchip \nLeah Clark\, Synopsys \nMark Sprague\, Intel \nNaveen Mysore\, Intel \nNeel Sonara\, Broadcom \nNitin Navale\, AMD \nOlivia Poon\, Marvell Semiconductor \nPinal Patel\, eInfochips \nRavikishore Gandikota\, NVIDIA \nRonald Goodstein\, Lockheed Martin \nRonald Kalim\, Intel \nSachin Parikh\, Broadcom \nSangeetha Chandran Sarala\, Micron \nSathappan Palaniappan\, Broadcom \nSaurabh Bhadoriya\, NVIDIA \nSavita Banerjee\, Meta \nShaiful Alam\, Intel \nStella Matarrese\, Synopsys \nTom Mahatdejkul\, Arm \nTony Todesco\, AMD \nUpasna Vishnoi\, Marvell Semiconductor \nVictoria Kolesov\, Intel \nZafar Hasan\, NVIDIA
URL:https://marketingeda.com/event/snug-silicon-valley-2024/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:EDA,IP,User Group
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SNG-Silicon-Valley-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/London:20240319T130000
DTEND;TZID=Europe/London:20240319T140000
DTSTAMP:20240410T161048Z
CREATED:20240216T190810Z
LAST-MODIFIED:20240410T161048Z
UID:7624-1710853200-1710856800@marketingeda.com
SUMMARY:DVClub Europe: Latest VHDL Verification Techniques
DESCRIPTION:This DVClub focuses on the latest verification techniques in VHDL including UVVM and OSVVM \nAgenda (GMT) \n13:00   Welcome and Introduction – Mike Bartley\, Tessolve \n13:00   Epsen Tallaksen\, EmLogic – Get the right FPGA quality through efficient Specification Coverage (aka Requirement Coverage) \n13:30   Jim Lewis\, SynthWorks – OSVVM in a NutShell\, VHDL’s #1 Verification Methodology \n14:00    Close \nAdditional Information\nFor additional information please visit the Tessolve DVClub Europe webpage for this event. \nSponsors\nDVClub Europe is made possible through the generous support of our sponsors: Agnisys\, Cadence\, Breker Verification System\, Synopsys
URL:https://marketingeda.com/event/dvclub-europe-latest-vhdl-verification-techniques/
LOCATION:CA
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVClub-Europe-19-March-2024.jpg
END:VEVENT
END:VCALENDAR