BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://marketingeda.com
X-WR-CALDESC:Events for Marketing EDA
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20200308T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20201101T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20210314T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20211107T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20220313T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20221106T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20230312T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20231105T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20240310T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20241103T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Asia/Taipei
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:CST
DTSTART:20220101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/Denver
BEGIN:DAYLIGHT
TZOFFSETFROM:-0700
TZOFFSETTO:-0600
TZNAME:MDT
DTSTART:20220313T090000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0600
TZOFFSETTO:-0700
TZNAME:MST
DTSTART:20221106T080000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0700
TZOFFSETTO:-0600
TZNAME:MDT
DTSTART:20230312T090000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0600
TZOFFSETTO:-0700
TZNAME:MST
DTSTART:20231105T080000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0700
TZOFFSETTO:-0600
TZNAME:MDT
DTSTART:20240310T090000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0600
TZOFFSETTO:-0700
TZNAME:MST
DTSTART:20241103T080000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Europe/Berlin
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20220327T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20221030T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20230326T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20231029T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20240331T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20241027T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Europe/Amsterdam
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20210328T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20211031T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20220327T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20221030T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20230326T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20231029T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20240331T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20241027T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Asia/Kolkata
BEGIN:STANDARD
TZOFFSETFROM:+0530
TZOFFSETTO:+0530
TZNAME:IST
DTSTART:20220101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Europe/London
BEGIN:DAYLIGHT
TZOFFSETFROM:+0000
TZOFFSETTO:+0100
TZNAME:BST
DTSTART:20210328T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0100
TZOFFSETTO:+0000
TZNAME:GMT
DTSTART:20211031T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0000
TZOFFSETTO:+0100
TZNAME:BST
DTSTART:20220327T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0100
TZOFFSETTO:+0000
TZNAME:GMT
DTSTART:20221030T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0000
TZOFFSETTO:+0100
TZNAME:BST
DTSTART:20230326T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0100
TZOFFSETTO:+0000
TZNAME:GMT
DTSTART:20231029T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Europe/Budapest
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20210328T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20211031T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20220327T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20221030T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20230326T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20231029T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/Winnipeg
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/New_York
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20200308T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20201101T060000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20210314T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20211107T060000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
TZNAME:EDT
DTSTART:20220313T070000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
TZNAME:EST
DTSTART:20221106T060000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Asia/Hong_Kong
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:HKT
DTSTART:20200101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20231113T083000
DTEND;TZID=America/Los_Angeles:20231113T160000
DTSTAMP:20231026T171213Z
CREATED:20231026T171213Z
LAST-MODIFIED:20231026T171213Z
UID:6998-1699864200-1699891200@marketingeda.com
SUMMARY:CadenceCONNECT: The Race Is On!
DESCRIPTION:Event Overview \n\n\n\n\n\n\n\n\n\n\n\n\nDate: Monday\, November 13\, 2023 \nTime: 8:30am – 4:00pm\, followed by an exclusive networking event \nLocation: Cadence Headquarters\, San Jose\, CA \n\n\n\n\n\n\n\n\n\n\n\n\nThere is an unprecedented demand for advanced-node chip design that pushes beyond traditional boundaries. Computing power\, security\, reliability\, and other multifaceted requirements have surpassed the basic performance\, power consumption\, and area constraints of traditional chip design. The race is on to enable traditional automotive companies to enter the new field of automotive electronic chips quickly\, and to improve the performance of established automotive chips to deliver higher and higher computing capabilities while meeting safety and reliability requirements. \n\nJoin Cadence on November 13\, at Cadence headquarters in San Jose\, as we present a new generation of automotive electronics chip design full-flow solutions. Learn about the most recent advancements in the field of automotive chips\, including upcoming technology trends and innovations\, such as autonomous driving to electric vehicles\, functional safety\, reliability of automotive semiconductors\, and more. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nWho Should Attend \n\n\n\n\n\n\n\n\n\n\n\n\nCAE professionals with a background in electrical engineering\, fluid dynamics\, engineering directors and managers\, and engineering team members who work in automotive electronics (SoC) design\, as well as academics and researchers from relevant fields are welcome. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nWhat You Will Learn \n\n\n\n\n\n\n\n\n\n\n\n\n\nDesign IP for Automotive SoC Design\n3D-IC Design and Interconnect IP Solution for Chiplet-Based Design\nConfigurable Multi-Core DSP and AI Platform for Automotive Applications\nFMEDA-Driven Safety Analysis and Verification\nSafety-Aware Implementation\nAnalog/Mixed-Signal Safety Verification\nSystem Design and Analysis (EMI\, EMC\, Electrothermal)\nAutomotive CFD Solutions (Aerodynamics\, Aeroacoustics\, HVAC\, Turbo/Pumps\, ​\nThermal Management)\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nRev Up Your Networks! \n\n\n\n\n\n\n\n\n\n\n\n\n“The race is on!” not just on the circuits\, but also here in the center of our event. Accelerate your knowledge at our seminar and shift your networking into high gear. \nWe’re thrilled to announce that a special guest will be joining us. Be ready to mingle with an elite McLaren Formula 1 driver at our exclusive networking event. Don’t miss this unique opportunity to meet and interact with one of racing’s finest up close and personal. Whether you’re a die-hard F1 fan or simply looking to network with experts in the industry\, this is a pit stop you won’t want to miss! \n\nStay tuned for more information! \n\n\n\n\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/cadenceconnect-the-race-is-on/
LOCATION:Cadence\, San Jose\, CA\, United States
CATEGORIES:EDA,Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-November-13-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20231109T090000
DTEND;TZID=America/Los_Angeles:20231109T133000
DTSTAMP:20231027T171914Z
CREATED:20231027T171914Z
LAST-MODIFIED:20231027T171914Z
UID:7001-1699520400-1699536600@marketingeda.com
SUMMARY:CHIPS Alliance - FuseSOC: Package manager and build abstraction tool for FPGA/ASIC development
DESCRIPTION:IP share and reuse is fundamental for efficient chip design. But in order to do this efficiently we need tools and methods. On the software side\, the concept of package managers is widely used to build a product from many different sources\, but chip designers often rely on ad-hoc solutions which tends to build up a maintenance cost and burden. Fortunately FuseSoC and Edalize exists to help. Being the most popular package manager for IP cores\, there are already hundreds of FuseSoC-compatible IP cores available. Most high-profile open source silicon projects have already adopted FuseSoC or are looking at doing so\, and it is being increasingly used inside small and large companies for development of proprietary systems as well. With support for almost 40 different EDA tool flows it covers a wide range of work flows from synthesis to simulation to formal verification. Sounds great\, doesn’t it? It sure does\, and this presentation will take you through the basics of FuseSoC to help you get started\, using VeeRwolf\, the CHIPS Alliance-governed reference platform for the VeeR family of CPU cores as an example\, and looks beyond this to how FuseSoC can help you focus on your core business instead of your cores. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/chips-alliance-fusesoc-package-manager-and-build-abstraction-tool-for-fpga-asic-development/
LOCATION:Google\, 237 Moffett Park Drive\, Sunnyvale\, CA\, United States
CATEGORIES:EDA,Forum,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Chips-Alliance-November-9-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Taipei:20231108T080000
DTEND;TZID=Asia/Taipei:20231108T170000
DTSTAMP:20230913T234027Z
CREATED:20230913T234027Z
LAST-MODIFIED:20230913T234027Z
UID:6800-1699430400-1699462800@marketingeda.com
SUMMARY:TSMC 2023 Taiwan OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N2\, N3/N3E/N3P/N3AE\, N4/N4P\, N5/N5A\, N6/N6e/N6RF/N7\, N12e\, and N22\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem specific TSMC reference flow implementations\, P&R optimization\, machine learn-ing to improve design quality and productivity\, and cloud-based design solutions\nSuccessful \, real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: events@pl-marketing.biz. \nWe look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/tsmc-2023-taiwan-oip-ecosystem-forum/
LOCATION:Ambassador Hotel Hsinchu\, 0F\, No.188\, Sec. 2\, Zhonghua Rd.\, Hsinchu City\, Taiwan
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Denver:20231102T093000
DTEND;TZID=America/Denver:20231102T170000
DTSTAMP:20231019T045430Z
CREATED:20231019T045430Z
LAST-MODIFIED:20231019T045430Z
UID:6972-1698917400-1698944400@marketingeda.com
SUMMARY:RISC-V in Space
DESCRIPTION:Join us for “RISC-V in… Space” on November 2\, 2023\, as we explore the exciting intersection of RISC-V\, electronics design\, and space! \n\n\n\nAgenda\n\n\n\n\n\n9:30 AM – 10:00 AM \nRegistration & Welcome \n\n\n\n\n10:00 AM – 12:00 PM \nCase Study Presentations: Tenstorrent\, Synopsys\, RISC AI\, Arteris IP \n\n\n\n\n12:00 PM – 1:00 PM \nLunch Buffet \n\n\n\n\n1:00 PM – 3:00 PM \nCase Study Presentations: Breker Systems\, Imperas\, Cycuity\, Codasip \n\n\n\n\n3:00 PM – 5:00 PM \nNetworking Reception with appetizers and refreshments \n\n\n\n\n\n\nAbout this event\n\n\n7 hours\nMobile eTicket\n\n\n\n\nTenstorrent is hosting a meet up in Denver aimed at practitioners and entrepreneurs developing electronic systems and components for space applications. Alongside partners Codasip\, Cycuity\, Breker Systems\, Imperas\, RISC AI\, Synopsys\, and Arteris IP we are excited to invite you to explore with us at the Omni Interlocken Hotel in Broomfield\, CO. \nThrough user-group discussions\, case studies\, and application notes (and steering clear of sales pitches) we’ll explore the exciting sector of space electronics with crucial emphasis on: \n\nArtificial Intelligence & Machine Learning\nEmbedded Processing\nSecurity\nDesign Verification\n\n\n\n\n\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/risc-v-in-space/
LOCATION:Omni Interlocken Hotel\, 5000 Interlocken boulevard\, Broomfield\, CO\, United States
CATEGORIES:EDA,Forum,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Temstorrent-November-2-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20231019T080000
DTEND;TZID=Europe/Berlin:20231019T170000
DTSTAMP:20231017T164930Z
CREATED:20231017T164930Z
LAST-MODIFIED:20231017T164930Z
UID:6963-1697702400-1697734800@marketingeda.com
SUMMARY:Samsung Foundry Forum 2023 EMEA
DESCRIPTION:We’re inviting global partners and customers to our upcoming Samsung Foundry Forum (SFF) and Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2023. The events will provide opportunities to share insights and innovative technologies to build a strong foundry ecosystem to accelerate innovation beyond boundaries. Join us to experience the spirit and power of innovation. SFF & SAFE™ Forum 2023 will be held in several different countries around the world. Check the map below to see where our other forums will be held this year. \n  \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/samsung-foundry-forum-2023-emea/
LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-Foundry-Forum-2023-EMEA.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Amsterdam:20231004T080000
DTEND;TZID=Europe/Amsterdam:20231004T170000
DTSTAMP:20230913T233730Z
CREATED:20230913T233730Z
LAST-MODIFIED:20230913T233730Z
UID:6798-1696406400-1696438800@marketingeda.com
SUMMARY:TSMC 2023 Europe OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N2\, N3/N3E/N3P/N3AE\, N4/N4P\, N5/N5A\, N6/N6e/N6RF/N7\, N12e\, and N22\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem specific TSMC reference flow implementations\, P&R optimization\, machine learn-ing to improve design quality and productivity\, and cloud-based design solutions\nSuccessful \, real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/tsmc-2023-europe-oip-ecosystem-forum/
LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20230927T090000
DTEND;TZID=America/Los_Angeles:20230927T170000
DTSTAMP:20230920T165423Z
CREATED:20230913T232432Z
LAST-MODIFIED:20230920T165423Z
UID:6795-1695805200-1695834000@marketingeda.com
SUMMARY:TSMC 2023 North America OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N2\, N3/N3E/N3P/N3AE\, N4/N4P\, N5/N5A\, N6/N6e/N6RF/N7\, N12e\, and N22\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem specific TSMC reference flow implementations\, P&R optimization\, machine learn-ing to improve design quality and productivity\, and cloud-based design solutions\nSuccessful \, real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/tsmc-2023-north-america-oip-ecosystem-forum/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20230627T080000
DTEND;TZID=America/Los_Angeles:20230628T170000
DTSTAMP:20230620T180630Z
CREATED:20230620T180400Z
LAST-MODIFIED:20230620T180630Z
UID:6541-1687852800-1687971600@marketingeda.com
SUMMARY:SFF & SAFE™ Forum 2023 San Jose\, CA
DESCRIPTION:Day 1 June 27th\, 2023\n\n\n\n\n12:00 – 1:00pm PDT\nNetworking Lunch & Registration\n\n\n\n\n1:00 – 1:05pm PDT\nOpening\nJinman Han\nEVP\, Head of DSA Office\,\nSamsung Electronics\n\n\n\n\n1:05 – 1:20pm PDT\nSamsung Keynote\nSiyoung Choi\nPresident and GM\, Foundry Business\,\nSamsung Electronics\n\n\n\n\n1:20 – 1:35pm PDT\nAn Energy Efficient Future of AI\nJoe Macri\nSVP\, CTO of Computing & Graphics\,\nAMD\n\n\n\n\n1:35 – 1:50pm PDT\nMeeting System User Demands in a Slowing Moore’s Law Era\nChidi Chidambaram\nFellow\, Technology and Foundry Engineering\, Qualcomm\n\n\n\n\n1:50 – 2:05pm PDT\nBreak\n\n\n\n\n2:05 – 2:35pm PDT\nProcess Technology\nGitae Jeong\nEVP\, Head of Technology Development\,\nSamsung Electronics\nOhkyum Kwon\nVP\, Head of 8-inch Manufacturing Technology Team\,\nSamsung Electronics\n\n\n\n\n2:35 – 2:50pm PDT\nManufacturing Excellence\nSang Sup Jeong\nEVP\, Head of Foundry Manufacturing Technology Center\,\nSamsung Electronics\n\n\n\n\n2:50 – 3:10pm PDT\nDesign Platform\nJongwook Kye\nEVP\, Head of Foundry Design Platform Development\,\nSamsung Electronics\n\n\n\n\n3:10 – 3:25pm PDT\nSustainability\nClaire Hyun\nJung Seo\nVP\, DS Corporate Sustainability Management Office\,\nSamsung Electronics\n\n\n\n\n3:25 – 3:40pm PDT\nBreak\n\n\n\n\n3:40 – 3:55pm PDT\nRiscV\, AI and the Next Generation of Compute\nJim Keller\nPresident and CEO\,\nTenstorrent\n\n\n\n\n3:55 – 4:15pm PDT\nAdvanced Heterogeneous Integration\nMoonSoo Kang\nEVP\, Head of AVP Business Team\,\nSamsung Electronics\n\n\n\n\n4:15 – 4:35pm PDT\nBusiness & Customers\nSang-Pil Sim\nEVP\, Head of Foundry Worldwide Sales and Marketing\,\nSamsung Electronics\n\n\n\n\n4:35 – 4:40pm PDT\nClosing\nMarco Chisari\nEVP\, Head of U.S. Foundry and SSIC\,\nSamsung Electronics\n\n\n\n\n4:40 – 5:30pm PDT\nPartner Pavilion & Networking\n\nDay 2 June 28th\, 2023\n\n\n\n\n9:00 – 10:00am PDT\nRegistration\n\n\n\n\n10:00 – 10:05am PDT\nOpening\nJinman Han\nEVP\, Head of DSA Office\,\nSamsung Electronics\n\n\n\n\n10:05 – 10:15am PDT\nWelcoming Remarks\nJongwook Kye\nEVP\, Head of Foundry Design Platform Development\,\nSamsung Electronics\n\n\n\n\n10:15 – 10:35am PDT\nThe 3Ps of 3D-ICs\nAjei Gopal\nPresident and CEO\,\nAnsys\n\n\n\n\n10:35 – 10:55am PDT\nUnleashing a New Era of Compute with Chiplet-Powered Silicon\nTony E. Pialis\nPresident and CEO\,\nAlphawave Semi\n\n\n\n\n10:55 – 11:15am PDT\nHigh-Performance Design in Samsung Foundry\nLeon Stok\nVP\, EDA\, IBM Infrastructure\,\nIBM\n\n\n\n\n11:15 – 11:35am PDT\nSamsung Foundry Process & Business Update\nGibong Jeong\nEVP\, Head of Foundry Business Development Team\,\nSamsung Electronics\n\n\n\n\n11:35 – 12:45pm PDT\nLunch\n\n\n\n\n12:45 – 1:00pm PDT\nBreak\n\n\n\n\n1:00 – 4:15pm PDT\nTech Session I: Advanced Technology and Design Infrastructure\nSangyun Kim\n(Tech Talk) VP\, Head of Foundry Design Technology Team\,\nSamsung Electronics\nSynopsys\, ARM\, ADTechnology\, Cadence\, Ansys\n\n\n\n\n1:00 – 4:15pm PDT\nTech Session II: Advanced Design Solutions for HPC and Automotive\nJongshin Shin\n(Tech Talk) EVP\, Head of Foundry IP Ecosystem\,\nSamsung Electronics\nCadence\, Alphawave\, Samsung AVP\, CoAsia\, Siemens\, Synopsys\, SemiFive\n\n\n\n\n4:15 – 4:30pm PDT\nClosing\nMarco Chisari\nEVP\, Head of U.S. Foundry and SSIC\,\nSamsung Electronics\n\n\n\n\n4:30 – 5:30pm PDT\nPartner Pavilion & Networking\n\n\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/sff-safe-forum-2023-san-jose-ca/
LOCATION:Signia by Hilton\, 170 S Market Street\, San Jose\, CA\, 95113\, United States
CATEGORIES:EDA,Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SAFE-San-Jose-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20230614T080000
DTEND;TZID=Europe/Berlin:20230615T170000
DTSTAMP:20230612T171200Z
CREATED:20230313T202424Z
LAST-MODIFIED:20230612T171200Z
UID:6114-1686729600-1686848400@marketingeda.com
SUMMARY:GSA 2023 European Executive Forum
DESCRIPTION:Dealing with Uncertainty\nThe global economy is sending mixed messages\, and with every new data release comes a new batch of upbeat or defeatist headlines. \nUncertainty remains if inflation is fully under control and how quickly economic growth will pick up strongly again. On one side the labor market seems healthier than it’s been in years\, on the other all major tech companies have announced significant layoffs.  The chip shortage is not over yet in some segments\, but in some others there is excess supply. Our new multipolar world order will enforce structural changes to the economy\, such as the need to rebuild reliable supply chains closer to home\, which often comes at higher prices. \nDespite these uncertainties\, innovation in our industry remains as strong as ever\, with relentless growth driven by automotive\, 5G and next generation connectivity\, new silicon design paradigms including RISC-V and chiplets\, big trends towards decarbonization and new materials like SiC\, the positive effects of increased diversity and inclusion. And large amounts of government money is made available globally to support this growth\, through “chips acts” and “green deals”. \nThere is therefore a strong belief that tech innovation and growth will continue to prevail and\, with a little more positive international cooperation\, deal with the apparent challenges altogether. \n\n\n\n\n\n\n\n\n\n\nThe GSA European Executive Forum is our flagship event in Europe which\, over two days\, always attracts the very top speakers and attendees: close to 300 senior decision makers\, the majority VP and C-level profiles. \nOver the past 20 years\, it has become the reference executive event for the semiconductor industry in the EMEA region. \n\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/gsa-2023-european-executive-forum/
LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany
CATEGORIES:EDA,Forum,IP,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-June-14-15-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Kolkata:20230329T084500
DTEND;TZID=Asia/Kolkata:20230329T164500
DTSTAMP:20230317T205939Z
CREATED:20230317T205939Z
LAST-MODIFIED:20230317T205939Z
UID:6189-1680079500-1680108300@marketingeda.com
SUMMARY:Siemens Tessent DFT Forum 2023 India
DESCRIPTION:About Siemens Tessent DFT Forum 2023 India\nPresenting silicon lifecycle solutions from Siemens EDA:  Engineering a smarter future faster \nJoin us for the Siemens Tessent Design-for-Test (DFT) India Tech Forum\, being held in Hotel Radisson Blu\, Marathalli ORR\, Bengalur India\, on 29th March\, 2023 learn from Industry leaders\, fellow designers and experts from Siemens about how to leverage the Tessent Platform to address your Design-for-Test challenges while solving more complex challenges. \nThe in-person forum will focus on EDA silicon lifecycle solutions\, allowing you to Engineer a Smarter Future Faster with Siemens EDA. \nWith multi-billion transistor instances\, design complexity is increasing ever so rapidly\, and Industry has to mitigate with smart solutions that are highly efficient\, automatable & future proof. Siemens EDA is actively delivering new solutions and use models that enable our customers to deliver innovations to market smartly and efficiently. \nThis event is your opportunity to hear Siemens EDA Tessent experts discuss how to get the most from the Tessent design-for-test platform. Hear about the latest tool features to improve DFT efficiency\, save test time\, and deploy IP for in-life monitoring. \nSlots are limited to maximize your learning experience\, submit your registration immediately to request your spot today. \nA place to connect\nExclusive event for our executive and global community to share strategies on how they are transforming their organization’s business process\, products\, and industry through digitalization.​ \nWhat will you learn\nHow is Industry solving chiplet\, 2.5D & 3D challenge with Tessent Multi-die. \nHow Tessent solutions are catering to stringent needs of Automotive\, safety & security.   \nHow to turbo charge your network access throughput with Fast IJTAG. \nHow Tessent DFT for tiling designs saving weeks of engineering effort & benefiting backend flows. \nHow Streaming Scan Network is transforming scan delivery & how the industry is leveraging packetized test in their next designs. \nAccess to a wealth of content on Tessent DFT\nThe opportunity to meet peers and Siemens Tessent & Design for Test(DFT) experts to address and resolve strategic opportunities and tactical barriers.​ \nDesign Engineers and Experts from around the Globe come together to learn how to improve the DFT experiences and capabilities.​ \nWhat to expect?\nAn exclusive\, unique experience to understand about the latest Design for Test techniques besides listening to leading experts who are leading the change in the Industry. \n  \n\nExecutive-level concentrated agenda on the digital future\nIndustry leaders presenting Design for Test use cases\nInnovation leaders sharing business challenges and roadblocks\nContent demonstrating business results\nProven strategies for successful business transformation\n\n… and more than 6 hours of networking with like-minded peers! \n  \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/siemens-tessent-dft-forum-2023-india/
LOCATION:Hotel Radisson Blu\, Marathalli ORR\, Bengaluru\, India
CATEGORIES:EDA,Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Tessent-March-29-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20230316T083000
DTEND;TZID=America/Los_Angeles:20230316T113000
DTSTAMP:20230217T231519Z
CREATED:20230217T231519Z
LAST-MODIFIED:20230217T231519Z
UID:6002-1678955400-1678966200@marketingeda.com
SUMMARY:Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession
DESCRIPTION:Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes\, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers. \nJoin us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term\, including regional and global economies\, and the Chips Act. \nSpeakers will discuss strategies for mitigating the impact and how to capture value. \nTopics include: \n\nMarket Trends & Forecast & Outlook\nAccessing Chips Act Funding and Roll out of Incentives\nGeopolitical Impact\nAdvanced Packaging & Chiplets\nEmerging and Expanding Markets\n\n  \nThis Virtual Forum is 8:30–11:00am Pacific Time\, 11:30am–2:00pm Eastern Time \nAGENDA\n\nVirtual Forum | Thursday\, March 16\, 2023 | Pacific Time\n\n\n8:30 am – 8:35 am\n\n\n\nEd Sperling\nEditor-in-Chief\nSemiconductor Engineering\n\n\n\nWelcome Remarks\n\nBiography \n\n\n\n\n\n8:35 am – 8:55 am\n\n\n\nJohn Cooney\nVice President\, Global Public Policy & Advocacy\nSEMI\n\n\n\nAn Update on the CHIPS Act and How to Apply for Funding\n\nBiography \n\n\n\n\n\n8:55 am – 9:20 am\n\n\n\nJay Vleeschhouwer\nSoftware Research\nGriffin Securities\n\n\n\nThe State of EDA: A View from Wall Street\n\nBiography \n\n\n\n\n\n9:20 am – 9:45 am\n\n\n\nDan Hutcheson\nVice Chair\nTechInsights\n\n\n\nNew Perspectives in Semiconductors: Cycles & Outlooks\n\nBiography \n\n\n\n\n\n9:45 am – 10:10 am\n\n\n\nJean-Christophe Eloy\nPresident and CEO\nYole Développement\n\n\n\nStatus of the Advanced Packaging Industry: How the Chiplet Revolution is Impacting the Industry?\n\nBiography \n\n\n\n\n\n10:10 am – 10:35 am\n\n\n\nPaul McLellan\nEditor of Breakfast Bytes\nCadence\n\n\n\nThree Things to Watch: 3DIC\, Supply Chain Disaggregation\, and Intel\n\nBiography \n\n\n\n\n\n10:35 am – 10:55 am\n\n\n\nLita Shon-Roy\nPresident/CEO\nTECHCET\n\n\n\nThe Impact on Supply-Chains – Materials & Equipment Consumables\n\nBiography \n\n\n\n\n\n10:55 am – 11:00 am\n\n\n\nEd Sperling\nEditor-in-Chief\nSemiconductor Engineering\n\n\n\nClosing Remarks\n\nBiography \n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/semiconductor-outlook-navigating-through-turbulent-times-and-the-impact-of-the-recession/
LOCATION:CA
CATEGORIES:EDA,Forum,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-March-16-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/London:20221129T120000
DTEND;TZID=Europe/London:20221129T133000
DTSTAMP:20221117T175858Z
CREATED:20221117T175811Z
LAST-MODIFIED:20221117T175858Z
UID:5415-1669723200-1669728600@marketingeda.com
SUMMARY:RISC-V Verification Strategies
DESCRIPTION:With the popularity of the RISC-V open architecture\, many companies are looking for Verification Strategies for developing their own cores or how to verify their integration into a subsystem or SoC. \n\n\n\nTime\nSession Description\nSlides\nVideos\n\n\n12.00 GMT\nWelcome and Introduction\nMike Bartley\, Senior Vice President – VLSI Design\, Tessolve\n\n\n\n\n12.05 GMT\nRISC-V processor verification with new open standard RVVI based methodology\nSimon Davidmann\, Imperas Software\n\n\n\n\n12.25 GMT\nRISC-V Verif Generators : A Configurable ISA warrants a Configurable Verification Environment\nDr. Neel Gala\, InCore Semiconductors Pvt. Ltd.\n\n\n\n\n12.45 GMT\nRISC-V SoC integration verification including system coherency. Is your RISC-V SoC-ready?\nJohn Sotiropoulos\, Breker Verification Systems Inc\n\n\n\n\n13.05 GMT\nCORE-V-VERIF: an open-source SV/UVM environment for RISC-V cores\nMike Thompson\, OpenHW Group\n\n\n\n\n13.25 GMT\nClosing Remarks\n\n\n\n\n13.30 GMT\nClose\n\n\n\n\n\nAbout DVClub\n\n\n\n\nThe principal goal of each DVCLUB meeting is to have fun while helping build the European verification community through regular educational and networking events. Attendance at DVClub Europe meetings is free and is open to all non-service provider semiconductor professionals. Each meeting addresses a specific issue faced by the design and verification community and whatever your speciality provides an excellent opportunity for updating knowledge as well as share experiences\, insights and issues with other members of the verification community. \n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/risc-v-verification-strategies/
LOCATION:CA
CATEGORIES:EDA,Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVClub-Europe-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Amsterdam:20221108T090000
DTEND;TZID=Europe/Amsterdam:20221108T180000
DTSTAMP:20221104T201045Z
CREATED:20221104T201045Z
LAST-MODIFIED:20221104T201045Z
UID:5373-1667898000-1667930400@marketingeda.com
SUMMARY:TSMC 2022 EU OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/tsmc-2022-eu-oip-ecosystem-forum/
LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands
CATEGORIES:Forum,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2022-EU.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20221103T080000
DTEND;TZID=America/Los_Angeles:20221103T113000
DTSTAMP:20221013T202008Z
CREATED:20221013T202008Z
LAST-MODIFIED:20221013T202008Z
UID:5306-1667462400-1667475000@marketingeda.com
SUMMARY:THE FUTURE OF MORE THAN MOORE—Chiplets\, Advanced Packaging\, and More
DESCRIPTION:Presented by the SEMI\nPacific Northwest and Silicon Valley Chapters \nHow can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology\, economics\, and new opportunities in the semiconductor supply chain. \nJoin us at the Forum on Thursday\, November 3\, 2022\, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person\, Virtual\, and On-Demand for your convenience. \nSpeakers\nASE\nMark Gerber\nSr. Director\, Engineering & Technical Marketing \nAdvanced Packaging: Enabling a New Generation of Silicon Systems\n\n\nFORMFACTOR\nAmy Leong\nSVP\, CMO\, GM Emerging Growth/M&A \nStrategy for Wafer Probe in a Chiplet World \nGARTNER\nBob Johnson\nVice President\,\nAnalyst \nSemiconductor Market Outlook: Change in the Midst of Uncertainty \n\nGOOGLE\nMartin Dixon\nDirector of\nEngineering \n[KEYNOTE] Open Chiplets to Enable a New Era of Silicon\n\n\nINTEL CORPORATION\nMartha Dudek\, PhD\nSr. Director\, Assembly Materials Global Supply Chain \n[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging \n\n\n\nBIAMP SYSTEMS\nJoe Andrulis\nExecutive Vice President\,\nCorporate Development \n[HOST] Welcome &\nTour of Biamp \n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/the-future-of-more-than-moore-chiplets-advanced-packaging-and-more/
LOCATION:Biamp Systems\, 9300 SW Gemini Dr.\, Beaverton\, OR\, United States
CATEGORIES:Forum,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-November-3-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20221026T090000
DTEND;TZID=America/Los_Angeles:20221026T183000
DTSTAMP:20221013T003013Z
CREATED:20221013T003013Z
LAST-MODIFIED:20221013T003013Z
UID:5303-1666774800-1666809000@marketingeda.com
SUMMARY:TSMC 2022 OIP - California
DESCRIPTION:Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges! \nRegister Now\n\n\n\n\nLearn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nYour health and safety are important to us. TSMC continues to monitor guidelines for health safety measures from the Centers for Disease Control and Prevention\, California Department of Public Health\, and the Santa Clara County Department of Public Health. TSMC will follow applicable federal\, state and local laws\, then adapt TSMC plans accordingly and share updates with you. \n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/tsmc-2022-oip-california/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:EDA,Forum,IP,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-OIP-2022-1.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20221003T080000
DTEND;TZID=America/Los_Angeles:20221004T170000
DTSTAMP:20220831T201004Z
CREATED:20220831T201004Z
LAST-MODIFIED:20220831T201004Z
UID:5157-1664784000-1664902800@marketingeda.com
SUMMARY:Samsung Foundry Forum & SAFE Forum 2022 - US
DESCRIPTION:Through the various session programs\, clients\, partners\, and experts in each field will be able to meet again in person and prepare to go forth into the new future of the semiconductor market. \n  \nThe 2022 Samsung Foundry Forum and SAFE Forum are in-person events\, and will be held in San Jose in the U.S.\,Munich in Germany\, Tokyo in Japan\, and Seoul in South Korea. Check the locations for each event.※ Guests from China will be provided online access to the SFF & SAFE Forum 2022 starting October 21. \n  \nIntroducing the partners of Samsung Foundry’s reinforced SAFE ecosystem. Don’t miss the opportunity to expand your knowledge and gain innovative inspiration by networking with our various partners. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/samsung-foundry-forum-safe-forum-2022-us/
LOCATION:Signia by Hilton\, 170 S Market Street\, San Jose\, CA\, 95113\, United States
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-October-03-04-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220927T080000
DTEND;TZID=America/Los_Angeles:20220927T170000
DTSTAMP:20220705T205605Z
CREATED:20220705T205605Z
LAST-MODIFIED:20220705T205605Z
UID:4906-1664265600-1664298000@marketingeda.com
SUMMARY:U.S. Executive Forum
DESCRIPTION:The 2022 GSA U.S. Executive Forum is coming up on September 27 in Menlo Park\, California. USEF 2022 is one of the most anticipated GSA events of the year and attendance is filling up quickly. Make sure to secure your spot before it’s too late. \nIn this unique and exclusive gathering\, thought leaders\, visionaries and innovators will shed light on the leadership role that the semiconductor industry must embrace to lead the world to a brighter future. Our program features some of the biggest names in semis fostering discussions on the industry’s most pressing issues. We hope you’ll join us at USEF 2022 for a day of leadership\, networking and enrichment. \nTraditionally\, even as semiconductors have been at the core of technological innovation and have changed the world beyond any other technology\, they have often been seen as a commodity and rarely in the spotlight or getting noticed. \nThis has all changed with the acceleration of digital transformation across industries and digitalization of work and life styles. Semiconductors are enabling new technologies and applications\, such as AI and IoT\, that have sparked a new wave of innovation for the industry. \nIn addition\, the implementation of 5G networks coincides with the growing demand for faster high-performance computing devices in the cloud and at the edge. \nIt is time for the industry to step up and show leadership in not only the technology field but also as a responsible global industry in areas of social impact. Climate change\, digital inequality\, diversity\, are all areas that the industry impacts and can show leadership in change. \nIn this unique and exclusive gathering\, thought leaders\, visionaries\, and innovators will shed light on the leadership role that the semiconductor industry needs to embrace and lead the world for a brighter future. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/u-s-executive-forum/
LOCATION:CA
CATEGORIES:EDA,Forum,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA.-September-27-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220914T080000
DTEND;TZID=America/Los_Angeles:20220916T170000
DTSTAMP:20220724T164508Z
CREATED:20220724T164508Z
LAST-MODIFIED:20220724T164508Z
UID:4954-1663142400-1663347600@marketingeda.com
SUMMARY:Forum on Specification and Design Languages
DESCRIPTION:FDL is a well-established international forum to exchange experiences and promote new trends in the application of languages\, their associated design methods\, and tools for the design of electronic systems. FDL stimulates scientific and controversial discussions within and in-between scientific topics as described below. \nThe program structure includes research working sessions\, embedded tutorials\, panels\, and technical discussions. The forum includes tutorials and fringe meetings\, such as user group or standardization meetings. “Wild and Crazy Ideas” and work in progress are also welcome. \nElectronic systems of interest to FDL include (but are not limited to) those that are used in internet-of-things (IoT)\, cyber-physical systems (CPS)\, mixed criticality embedded systems\, embedded systems for high-performance computing\, automatic driving and driver assistance\, real-time systems\, reconfigurable and secure computing. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/forum-on-specification-and-design-languages/
LOCATION:LIT Open Innovation Center\, Altenberger Str. 69\, Linz\, 4040\, Austria
CATEGORIES:Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/687BCA82-7F03-47F4-A206-8749F26F6C2B.jpeg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220908T093000
DTEND;TZID=America/Los_Angeles:20220908T170000
DTSTAMP:20220726T205633Z
CREATED:20220726T205620Z
LAST-MODIFIED:20220726T205633Z
UID:4968-1662629400-1662656400@marketingeda.com
SUMMARY:ARC Processor Summit 2022
DESCRIPTION:Attend this free one-day event to get in-depth information from industry leaders on the latest ARC processor IP and related hardware/software technologies that enable you to achieve differentiation in your chip or system design. You will hear Synopsys experts\, partners\, and the ARC user community discuss electronic market trends and present on a range of topics including artificial intelligence\, automotive safety\, security\, software development for embedded systems and much\, much more.\nWhether you are a developer of chips\, systems or software\, the ARC Processor Summit will give you practical information to help you create more differentiated products in the shortest amount of time.\nWe look forward to seeing you in person this year!\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/arc-processor-summit-2022/
LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Forum,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Synopsys-September-8-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Budapest:20220524T170000
DTEND;TZID=Europe/Budapest:20220524T200000
DTSTAMP:20220509T160948Z
CREATED:20220509T160948Z
LAST-MODIFIED:20220509T160948Z
UID:4639-1653411600-1653422400@marketingeda.com
SUMMARY:Veriest - Verification Meetup in Budapest
DESCRIPTION:At Veriest\, we believe in knowledge sharing. In our recent meetup events\, hundreds of professionals from 20+ different countries gathered to listen to different industry experts from companies such as Intel\, ST Microelectronics\, arm\, Texas Instruments\, Nvidia and more. \n\nThis time\, we’ll host our first event in Budapest.\nMr. Szabolcs Szolnoki\, from the Hungarian Innovation agency\, will share his experience working in the interface between Israel and Hungary technology centers.\nThis will be followed by a Technical presentation by Tamás Kállay\, a Team leader at Veriest’s Budapest office about the polemic topic of using Python in Verification​ \nLooking forward to hosting you! \n\n\nSpeakers and Agenda \n\n\n\n\nHost \n\n\n\n\n\n\n\nIstván Fabók​ \nVeriest Hungary \n\n\n\n\n\n\nWelcome \n\n\n\n\n\n\n\nMoshe Zalcberg \nCEO\, Veriest \n\n\n\nKeynote \n\n\n\n\nTechnical presentation \n\n\n\n\n\n\n\nSzabolcs Szolnoki​ \nDeputy CEO for Valorization at Express Innovation Agency \n\nMindset Reprogramming Mission for creating the innovation oriented culture \n\n\n\n\n\n\n\n\n\n\nTamás Kállay \nTeam leader\, Veriest Hungary \n\n\nPython-based framework for silicon bring-up tests \n\n  \n\n\nRead more» \n\n\n\n\n\n\n\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/veriest-verification-meetup-in-budapest/
LOCATION:Regus Milpark Center\, 44 Soroksári St.\, Budapest\, Hungary
CATEGORIES:EDA,Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Veriest-May-24-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220428T170000
DTEND;TZID=America/Los_Angeles:20220428T193000
DTSTAMP:20220326T031011Z
CREATED:20220326T031011Z
LAST-MODIFIED:20220326T031011Z
UID:4468-1651165200-1651174200@marketingeda.com
SUMMARY:ESDA CEO Outlook & Membership Meeting
DESCRIPTION:The evening begins at the Keysight office\, Thursday\, April 28\, at 5:00pm with the ESD Alliance Annual Membership Meeting. You’ll get an overview of the past year’s activities and discover what’s in store for 2022. The meeting flows directly into a Welcome Reception followed by the powerful CEO Outlook. \nEnjoy a lively\, nourishing networking reception that kicks off the CEO Outlook panel. Hear influential executives from Arm | Cadence | D2S | Keysight | Siemens share their insights on the current and future state of the design and semiconductor industries. Ed Sperling\, Editor-in-Chief of Semiconductor Engineering\, moderates a spirited\, robust discussion\, including an audience Q&A. \nRegistration | FREE for ESD Alliance and SEMI members | Non-member: $49 per person. \nAGENDA\n\n5:00 pm – 5:30 pm\n\n\nBob Smith\nExecutive Director\nESD Alliance\n\n\n\nESD Alliance Annual Membership Meeting\n\nOverview of ESD Alliance activities for 2021 and plans for 2022. \n\n\n\n\n\n5:30 pm – 6:30 pm\nNetworking\n\n\nEnjoy light food and refreshments as you network with your peers. \n\n\n\n\n\nCEO Outlook Panel \n\n\n\n\n6:30 pm – 7:30 pm\n\n\n\nEd Spurling | Moderator\nEditor & Chief\nSemiconductor Engineering\n\n\n\nModerator & Panelists\n\nHear panelists from ARM | CADENCE | D2S | Keysight | Siemens EDA discuss the state of the electronic system design industry as well as their views of the outlook for the coming years. \nSimon Segars\, CEO\, Arm\n• Niels Fache\, Keysight\n• Aki Fujimura\, D2S\n• Joseph Sawicki\, Siemens EDA\n• Simon Segars\, Arm \n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/esda-ceo-outlook-membership-meeting/
LOCATION:Keysight\, 5301 Stevens Creek Blvd\, Building 5\, Santa Clara\, 95051\, United States
CATEGORIES:Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ESDA-April-28-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220405T080000
DTEND;TZID=America/Los_Angeles:20220406T170000
DTSTAMP:20211217T171728Z
CREATED:20211217T171712Z
LAST-MODIFIED:20211217T171728Z
UID:3841-1649145600-1649264400@marketingeda.com
SUMMARY:2022 European Executive Forum
DESCRIPTION:We have all been waiting for this…\nTHE EEF IS BACK AS AN IN-PERSON EVENT!\n2022 EUROPEAN EXECUTIVE FORUM: Facing New Realities\nThis in-person EEF will feature an elite line-up of expert speakers exploring themes such as blockchain and the Metaverse\, the supply chain crisis and the geopolitics of tech\, the future of quantum\, photonics and automotive computing\, entrepreneurship and investment\, and more. What really inspires this event\, though\, is the congregation of first-rate executives and principal players from across the expanded semiconductor ecosystem. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/2022-european-executive-forum/
LOCATION:CA
CATEGORIES:Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/2022EEF.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Winnipeg:20220330T113000
DTEND;TZID=America/Winnipeg:20220330T133000
DTSTAMP:20220329T011205Z
CREATED:20220329T011205Z
LAST-MODIFIED:20220329T011205Z
UID:4473-1648639800-1648647000@marketingeda.com
SUMMARY:DVClub Austin - March 30\, 2022\, Rahul Peddi (Arm) & Vaibhav Agrawal (Arm)
DESCRIPTION:Please join us on March 30\, 2022 at the Norris Conference Center for a catered lunch and networking.  Rahul Peddi\, a Senior Design Engineer at Arm\, and Vaibhav Agrawal\, a member of the CPU formal verification team at Arm\, will be our guest speakers. \n\n11:30am — Doors Open / Networking\n12:00pm — Lunch / Presentations by Rahul Peddi and Vaibhav Agrawal\n1:00pm   — Networking\n\nPresentation #1 \n“Accelerating the verification cycle of a Hyperscaler Compute Subsystem” by Rahul Peddi (Arm) \nHyperscalar Compute Subsystems are increasing in size and complexity with every generation which poses various challenges to verification efforts required to achieve time to market. This talk provides insights into the optimizations and strategies used to reduce simulation run time\, thereby accelerating the verification cycle. \n\nRahul Peddi is a Senior Design Engineer at ARM. He completed his Masters in Computer Engineering from University of Maryland\, College Park. He works in the Systems Development team to develop next Gen Server based SoCs . His work is focused on SV/UVM based test environments and Python/Ruby based Scripting for automation.\n\n  \n Presentation #2 \n“Divide and Conquer: An overview of Formal verification strategy for CPUs designed at Arm in Austin” by Vaibhav Agrawal (Arm) \nWith ever increasing complexity of high end A-class CPUs designed at Arm\, it was imperative to use formal-verification as a complementary technique to simulation-based-verification to find RTL bugs sooner in the design cycle\, and also to enable deep bug hunting. In this talk\, we present our formal verification strategy as deployed on core and fetch blocks over several generations of processors – toward the goal of achieving an overall shift-left in CPU quality. \n\nVaibhav Agrawal has been a member of CPU formal Verification team at Arm in Austin since 2013\, and has been engaged in enabling\, owning\, and deploying formal testbenches to find bugs in CPU blocks\, with the goal of achieving a net “Shift-Left” in the overall CPU quality. He leads a small team of talented and motivated engineers who make this possible.\n\nRSVP and please share with your colleagues! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/dvclub-austin-march-30-2022-rahul-peddi-arm-vaibhav-agrawal-arm/
LOCATION:Norris Conference Center\, 2525 W Anderson Ln\, #365\, Austin\, TX\, 78757\, United States
CATEGORIES:Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVclub-March-30-2022-1.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220308T080000
DTEND;TZID=America/Los_Angeles:20220310T170000
DTSTAMP:20220225T222016Z
CREATED:20220225T222016Z
LAST-MODIFIED:20220225T222016Z
UID:4384-1646726400-1646931600@marketingeda.com
SUMMARY:EE Times: Advanced Automotive Tech Forum
DESCRIPTION:In the last year\, the evolution towards electric vehicles accelerated faster than anticipated. Autonomous driving technology has already been pushed from a short-term priority to a long-term goal\, but the race to be first with AVs remains fierce. Meanwhile\, there seems to be a shift in priorities from driver-assist technologies toward driver monitoring systems. The Advanced Automotive Tech Forum will offer keynotes\, panel discussions\, technical presentations and tutorials on the latest automotive design trends\, including the multi-prong effort to develop power efficient\, advanced EVs with automated features. \nMoving Electric and Autonomous Vehicles Forward \nIt’s fast approaching…our 2nd annual Advanced Automotive Tech Forum will examine the rapidly changing landscape in the automotive market for electric vehicles and autonomous driving technology. \nDon’t miss this free virtual conference March 8-10 for keynotes\, panel discussions\, technical presentations and tutorials on the latest automotive design trends\, including the multi-prong effort to develop power efficient\, advanced EVs with automated features. \n• Powertrain Electrification/Design  • Testing  • Sensors  • Fast Charging \n • AV Software Platforms        • Battery Management Systems \n• The Digital Cockpit   • Wide Bandgap Semiconductor Materials   • Safety \nHere are just a few of our distinguished speakers: \n\nDr. Mahmoud Ismail\, Senior Application Manager\, Automotive Energy Management Systems\, Infineon\nDr. Stephen Lambert\, Head of Electrification\, McLaren Applied\nAlexander Lidow\, Ph.D.\, CEO and co-founder of EPC\nDr. John Palmour\, Co-Founder and CTO\, Wolfspeed\n\nConference Agenda  |  Full Speaker List \nVisit our Exhibition area throughout the event to chat with product experts and download educational materials. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/ee-times-advanced-automotive-tech-forum/
LOCATION:CA
CATEGORIES:Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/EE-Times-March-8-10-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20211221T080000
DTEND;TZID=America/Los_Angeles:20211221T170000
DTSTAMP:20211219T004814Z
CREATED:20211219T004814Z
LAST-MODIFIED:20211219T004814Z
UID:3868-1640073600-1640106000@marketingeda.com
SUMMARY:Club Formal India
DESCRIPTION:Summary: \nCadence is pleased to once again bring you Club Formal\, a platform for formal verification experts to come together and discuss the latest in formal technologies\, including challenges\, benefits\, and best practices. Hear from your peers on how they are using formal verification techniques in their flows and interact with members of the Cadence® R&D team to discuss the technology\, roadmap\, and use cases. \nIn this half-day digital seminar\, you will hear an industry keynote\, a Cadence R&D keynote on the latest in JasperGold® technology\, and several users who will discuss best practices. Plus\, we will have deep technical demos and presentations by Cadence Formal experts. \n\n\n\n\n\n\n\n\n\n\nDate and Time: \nTuesday\, December 21\, 2021 \n9:30 – 13:25 (India Time) \n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/club-formal-india/
LOCATION:CA
CATEGORIES:Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/1639844164835.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20211215T110000
DTEND;TZID=America/New_York:20211215T160000
DTSTAMP:20211201T212947Z
CREATED:20211201T212947Z
LAST-MODIFIED:20211201T212947Z
UID:3780-1639566000-1639584000@marketingeda.com
SUMMARY:Design and Analysis Solutions for Integrated RF Systems
DESCRIPTION:Opening Keynote \n10:00am EST | Cadence Solutions for RF Design Excellence\, presented by\nDavid Vye\, Dr. Melika Roshandell\, Graeme Richie\, Dr. Yashwanth Reddy Padooru\, Gus Dallman\, Shane Coffman\, Cadence \nTechnical Talks \n\n11:00am EST | Design of Integrated Phased-Array Antenna Systems for 5G CPE\, presented by David Vye\, Andy Hughes\, Cadence\n1:00pm EST | Simulation and Modeling of MMIC PAs for Communication Systems\, presented by Prof. Zoya Popovich\, University of Colorado\, Boulder\, David Farkas\, NxBeam\n2:00pm EST | Virtuoso RF Solution Integrates EM Analysis for RFIC and System-in-Package Design\, presented by Kevin Morot\, STMicroelectronics\, Ron Pongratz\, Dr. Claudia Roesch\, Art Schaldenbrand\, Cadence\n3:00pm EST | Enhancing the Accuracy of RF Front-End Simulations with Standard-Compliant Signal Processing\, presented by Markus Lörner\, Rohde & Schwarz\, and Dr. Gent Paparisto\, Cadence\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/design-and-analysis-solutions-for-integrated-rf-systems/
LOCATION:CA
CATEGORIES:Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/cadence-December-15-2021.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20211117T100000
DTEND;TZID=America/Los_Angeles:20211117T170000
DTSTAMP:20211112T184020Z
CREATED:20211112T184020Z
LAST-MODIFIED:20211112T184020Z
UID:3735-1637143200-1637168400@marketingeda.com
SUMMARY:Samsung SAFE Forum 2021
DESCRIPTION:Join us for Samsung Foundry’s annual SAFE™ Forum. \nWhat will you take away from Samsung Foundry’s ecosystem event? Bump your SoC PPA knowledge with the latest information on: \nHigh speed interconnect IPs for HPC and Data Center applications and foundational IPs\nHigh bandwidth memory subsystems\nKey IP trends for automotive and mobile applications\nFoundational Analog Mixed Signal IP for a variety of applications\nThere will also be an opportunity to network with experts in IP\, EDA\, Cloud\, Design Services and Packaging during the virtual partner pavilion. \nRegister today! Participate to join the raffle for exciting prizes! \n– SAFE Forum Team \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/samsung-safe-forum-2021/
LOCATION:CA
CATEGORIES:Forum,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SAFE-2021.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Hong_Kong:20211116T090000
DTEND;TZID=Asia/Hong_Kong:20211116T170000
DTSTAMP:20211013T020759Z
CREATED:20211013T020759Z
LAST-MODIFIED:20211013T020759Z
UID:3505-1637053200-1637082000@marketingeda.com
SUMMARY:GSA - Asia Pacific Executive Forum
DESCRIPTION:We invite you to join us at the 2021 Asia Pacific Executive Forum\, happening virtually on Tuesday\, November 16 at 9:00 AM HKT. \nIn adapting to the challenges of COVID\, the world has experienced dramatic changes that are redefining our daily lives. New capabilities empowered by AI\, IoT\, hyperscale computing and 5G are driving digital transformation impacting millions of people. The dependency between the global economy and technology is greater today than it’s ever been\, creating booming demand and broadening the growth drivers for the semiconductor industry.\n\nAPEF 2021 will showcase industry leaders and experts to provide thought leadership on topics changing the landscape of the industry\, ranging from heterogeneous and hyperscale computing\, application-driven growth markets\, and the industry focus on global sustainability\, and on the evolving global economy and future market outlook of our industry.\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/gsa-asia-pacific-executive-forum/
LOCATION:CA
CATEGORIES:Forum
ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/GSA-November-16.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20211026T093000
DTEND;TZID=America/Los_Angeles:20211026T170000
DTSTAMP:20211019T165643Z
CREATED:20211019T165643Z
LAST-MODIFIED:20211019T165643Z
UID:3540-1635240600-1635267600@marketingeda.com
SUMMARY:TSMC 2021 Online OIP Ecosystem Forum
DESCRIPTION:The TSMC OIP Ecosystem Forum brings together TSMC’s design ecosystem partners and customers to share practical\, tested solutions to today’s design challenges. \nMore than 95% of last year’s event attendees found that the Forum helped them better understand TSMC’s Open Innovation Platform and found it insightful to hear directly from TSMC OIP member companies. This year’s event will prove equally valuable\, providing an opportunity for you to learn how TSMC OIP partners apply their technologies and design solutions to address your high-performance computing (HPC)\, mobile\, automotive\, and Internet-of-Thing (IoT) design challenges. \nThis year’s online forum kicks off with trend-setting talks and announcements from TSMC and leading IC design company executives. The technical sessions are dedicated to 35 selected papers from TSMC’s EDA\, IP\, Design Center Alliance\, and Value Chain Aggregator partners. Also\, the Ecosystem Pavilion features 70 OIP member companies showcasing their products and services. \nJoin us and learn about:\n\nEmerging advanced process design challenges at N3\, N4/N5\, N6/N7\, N12e\, N22\, and 3D IC design flows and methodologies\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, RF\, and automotive designs\nSuccessful\, real-life applications of design technologies and IP from ecosystem partners and TSMC customers\nEcosystem-specific TSMC reference flow implementations\nNew next-generation product designs targeting HPC\, mobile\, automotive\, and IoT applications\n\nEvent Schedule:\n  \nTuesday\, October 26\nTSMC 2021 North America Open Innovation Platform® (OIP) Ecosystem Forum \n  \nWednesday\, October 27\nTSMC 2021 China Open Innovation Platform® (OIP) Ecosystem Forum \n  \nWednesday\, October 27\nTSMC 2021 Europe Open Innovation Platform® (OIP) Ecosystem Forum \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/tsmc-2021-online-oip-ecosystem-forum/
LOCATION:CA
CATEGORIES:Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-20201-OIP.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20211020T100000
DTEND;TZID=America/New_York:20211020T140000
DTSTAMP:20211007T172053Z
CREATED:20211007T172053Z
LAST-MODIFIED:20211007T172053Z
UID:3493-1634724000-1634738400@marketingeda.com
SUMMARY:CadenceCONNECT - Mission Critical 2021
DESCRIPTION:Overview\nCadenceCONNECT will introduce you to optimized design methodologies for mission-critical electronics system applications like A&D\, safety\, security\, 5G\, and others. The event brings together Cadence® technology users\, developers\, and industry experts for networking\, sharing best practices on critical design and verification\, and discovering new techniques for designing advanced silicon\, SoCs\, and systems. \nKeynote\n10:00 am – 10:25 am (EDT) \nComputational Software for Intelligent System Design and Maximum Verification Throughput \nPaul Cunningham\, Ph.D. Senior Vice President and General Manager\, System & Verification Group\, Cadence \nAgenda\nSystem Oriented \n10:30 am – 11:00 am (Bombardier) Automated Meshing and Adaptive Re-Meshing at Bombardier \n11:00 am – 11:30 am (Northrop Grumman) Emulation Digital Twin for SoC with eFPGA \n11:30 am – 12:00 pm (Medtronic) Dynamic Duo Verifies a Patient-Provider Telemedical System \n12:00 pm – 12:30 pm (L3 Harris) Robust FPGA Verification and Quantified Metrics for Safety-Critical Missions \n12:30 pm – 1:00 pm (Northrop Grumman) Continuous Front-End Design and Verification Metrics Analysis to Speed System Deployment \n1:00 pm – 1:30 pm (Analog Devices) Fault Campaign Framework for ISO 26262 Compliance \n1:30pm – 2:00pm (Nano Dimensions) Additively Manufactured Electronics (AME) From Design to Fabrication \nIC/Packaging \n10:30 am – 11:00 am (Motorola) Delivering Mixed-Signal Design in 22FDX MSOA Flow with Innovus \n11:00 am – 11:30 am (Rianta) Power Optimization via Joules \n11:30 am – 12:00 pm (Texas Instruments) Using Design Intent and Simulation Driven Routing for Power Critical Circuit Designs \n12:00 pm – 12:30 pm (Analog Devices) Electromagnetic Simulation of Large Chip/Package Designs Using Clarity \n12:30 pm – 1:00 pm (BroadPak) Large-Scale Silicon Interposer Design Methodology in Allegro APD+ \n1:00 pm – 1:30 pm (Rohde-Schwarz) Enhancing the Accuracy of RF Front-End Simulations with Standard Compliant Signal Processing \n1:30 pm – 2:00 pm (Butterfly) Real Number Modeling for Mixed-Signal Verification \n*Note times are Eastern Daylight Time \nAgenda subject to change \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading…
URL:https://marketingeda.com/event/cadenceconnect-mission-critical-2021/
LOCATION:CA
CATEGORIES:EDA,Forum
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CadenceCONNECT-Mission-Critical.jpg
END:VEVENT
END:VCALENDAR