BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Europe/Amsterdam BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Los_Angeles 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TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Winnipeg BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20210314T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20211107T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20220313T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20221106T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20230312T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20231105T070000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20200308T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20201101T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20210314T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20211107T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20220313T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20221106T060000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Hong_Kong BEGIN:STANDARD TZOFFSETFROM:+0800 TZOFFSETTO:+0800 TZNAME:HKT DTSTART:20200101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Europe/Amsterdam:20221108T090000 DTEND;TZID=Europe/Amsterdam:20221108T180000 DTSTAMP:20221104T201045Z CREATED:20221104T201045Z LAST-MODIFIED:20221104T201045Z UID:5373-1667898000-1667930400@marketingeda.com SUMMARY:TSMC 2022 EU OIP Ecosystem Forum DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tsmc-2022-eu-oip-ecosystem-forum/ LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands CATEGORIES:Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2022-EU.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221103T080000 DTEND;TZID=America/Los_Angeles:20221103T113000 DTSTAMP:20221013T202008Z CREATED:20221013T202008Z LAST-MODIFIED:20221013T202008Z UID:5306-1667462400-1667475000@marketingeda.com SUMMARY:THE FUTURE OF MORE THAN MOORE—Chiplets\, Advanced Packaging\, and More DESCRIPTION:Presented by the SEMI\nPacific Northwest and Silicon Valley Chapters \nHow can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology\, economics\, and new opportunities in the semiconductor supply chain. \nJoin us at the Forum on Thursday\, November 3\, 2022\, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person\, Virtual\, and On-Demand for your convenience. \nSpeakers\nASE\nMark Gerber\nSr. Director\, Engineering & Technical Marketing \nAdvanced Packaging: Enabling a New Generation of Silicon Systems\n\n\nFORMFACTOR\nAmy Leong\nSVP\, CMO\, GM Emerging Growth/M&A \nStrategy for Wafer Probe in a Chiplet World \nGARTNER\nBob Johnson\nVice President\,\nAnalyst \nSemiconductor Market Outlook: Change in the Midst of Uncertainty \n\nGOOGLE\nMartin Dixon\nDirector of\nEngineering \n[KEYNOTE] Open Chiplets to Enable a New Era of Silicon\n\n\nINTEL CORPORATION\nMartha Dudek\, PhD\nSr. Director\, Assembly Materials Global Supply Chain \n[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging \n\n\n\nBIAMP SYSTEMS\nJoe Andrulis\nExecutive Vice President\,\nCorporate Development \n[HOST] Welcome &\nTour of Biamp \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/the-future-of-more-than-moore-chiplets-advanced-packaging-and-more/ LOCATION:Biamp Systems\, 9300 SW Gemini Dr.\, Beaverton\, OR\, United States CATEGORIES:Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-November-3-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221026T090000 DTEND;TZID=America/Los_Angeles:20221026T183000 DTSTAMP:20221013T003013Z CREATED:20221013T003013Z LAST-MODIFIED:20221013T003013Z UID:5303-1666774800-1666809000@marketingeda.com SUMMARY:TSMC 2022 OIP - California DESCRIPTION:Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges! \nRegister Now\n\n\n\n\nLearn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nYour health and safety are important to us. TSMC continues to monitor guidelines for health safety measures from the Centers for Disease Control and Prevention\, California Department of Public Health\, and the Santa Clara County Department of Public Health. TSMC will follow applicable federal\, state and local laws\, then adapt TSMC plans accordingly and share updates with you. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tsmc-2022-oip-california/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:EDA,Forum,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-OIP-2022-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221003T080000 DTEND;TZID=America/Los_Angeles:20221004T170000 DTSTAMP:20220831T201004Z CREATED:20220831T201004Z LAST-MODIFIED:20220831T201004Z UID:5157-1664784000-1664902800@marketingeda.com SUMMARY:Samsung Foundry Forum & SAFE Forum 2022 - US DESCRIPTION:Through the various session programs\, clients\, partners\, and experts in each field will be able to meet again in person and prepare to go forth into the new future of the semiconductor market. \n  \nThe 2022 Samsung Foundry Forum and SAFE Forum are in-person events\, and will be held in San Jose in the U.S.\,Munich in Germany\, Tokyo in Japan\, and Seoul in South Korea. Check the locations for each event.※ Guests from China will be provided online access to the SFF & SAFE Forum 2022 starting October 21. \n  \nIntroducing the partners of Samsung Foundry’s reinforced SAFE ecosystem. Don’t miss the opportunity to expand your knowledge and gain innovative inspiration by networking with our various partners. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/samsung-foundry-forum-safe-forum-2022-us/ LOCATION:Signia by Hilton\, 170 S Market Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Forum,Foundry ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-October-03-04-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220927T080000 DTEND;TZID=America/Los_Angeles:20220927T170000 DTSTAMP:20220705T205605Z CREATED:20220705T205605Z LAST-MODIFIED:20220705T205605Z UID:4906-1664265600-1664298000@marketingeda.com SUMMARY:U.S. Executive Forum DESCRIPTION:The 2022 GSA U.S. Executive Forum is coming up on September 27 in Menlo Park\, California. USEF 2022 is one of the most anticipated GSA events of the year and attendance is filling up quickly. Make sure to secure your spot before it’s too late. \nIn this unique and exclusive gathering\, thought leaders\, visionaries and innovators will shed light on the leadership role that the semiconductor industry must embrace to lead the world to a brighter future. Our program features some of the biggest names in semis fostering discussions on the industry’s most pressing issues. We hope you’ll join us at USEF 2022 for a day of leadership\, networking and enrichment. \nTraditionally\, even as semiconductors have been at the core of technological innovation and have changed the world beyond any other technology\, they have often been seen as a commodity and rarely in the spotlight or getting noticed. \nThis has all changed with the acceleration of digital transformation across industries and digitalization of work and life styles. Semiconductors are enabling new technologies and applications\, such as AI and IoT\, that have sparked a new wave of innovation for the industry. \nIn addition\, the implementation of 5G networks coincides with the growing demand for faster high-performance computing devices in the cloud and at the edge. \nIt is time for the industry to step up and show leadership in not only the technology field but also as a responsible global industry in areas of social impact. Climate change\, digital inequality\, diversity\, are all areas that the industry impacts and can show leadership in change. \nIn this unique and exclusive gathering\, thought leaders\, visionaries\, and innovators will shed light on the leadership role that the semiconductor industry needs to embrace and lead the world for a brighter future. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/u-s-executive-forum/ CATEGORIES:EDA,Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA.-September-27-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220914T080000 DTEND;TZID=America/Los_Angeles:20220916T170000 DTSTAMP:20220724T164508Z CREATED:20220724T164508Z LAST-MODIFIED:20220724T164508Z UID:4954-1663142400-1663347600@marketingeda.com SUMMARY:Forum on Specification and Design Languages DESCRIPTION:FDL is a well-established international forum to exchange experiences and promote new trends in the application of languages\, their associated design methods\, and tools for the design of electronic systems. FDL stimulates scientific and controversial discussions within and in-between scientific topics as described below. \nThe program structure includes research working sessions\, embedded tutorials\, panels\, and technical discussions. The forum includes tutorials and fringe meetings\, such as user group or standardization meetings. “Wild and Crazy Ideas” and work in progress are also welcome. \nElectronic systems of interest to FDL include (but are not limited to) those that are used in internet-of-things (IoT)\, cyber-physical systems (CPS)\, mixed criticality embedded systems\, embedded systems for high-performance computing\, automatic driving and driver assistance\, real-time systems\, reconfigurable and secure computing. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/forum-on-specification-and-design-languages/ LOCATION:LIT Open Innovation Center\, Altenberger Str. 69\, Linz\, 4040\, Austria CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/687BCA82-7F03-47F4-A206-8749F26F6C2B.jpeg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220908T093000 DTEND;TZID=America/Los_Angeles:20220908T170000 DTSTAMP:20220726T205633Z CREATED:20220726T205620Z LAST-MODIFIED:20220726T205633Z UID:4968-1662629400-1662656400@marketingeda.com SUMMARY:ARC Processor Summit 2022 DESCRIPTION:Attend this free one-day event to get in-depth information from industry leaders on the latest ARC processor IP and related hardware/software technologies that enable you to achieve differentiation in your chip or system design. You will hear Synopsys experts\, partners\, and the ARC user community discuss electronic market trends and present on a range of topics including artificial intelligence\, automotive safety\, security\, software development for embedded systems and much\, much more.\nWhether you are a developer of chips\, systems or software\, the ARC Processor Summit will give you practical information to help you create more differentiated products in the shortest amount of time.\nWe look forward to seeing you in person this year!\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/arc-processor-summit-2022/ LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Forum,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Synopsys-September-8-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Budapest:20220524T170000 DTEND;TZID=Europe/Budapest:20220524T200000 DTSTAMP:20220509T160948Z CREATED:20220509T160948Z LAST-MODIFIED:20220509T160948Z UID:4639-1653411600-1653422400@marketingeda.com SUMMARY:Veriest - Verification Meetup in Budapest DESCRIPTION:At Veriest\, we believe in knowledge sharing. In our recent meetup events\, hundreds of professionals from 20+ different countries gathered to listen to different industry experts from companies such as Intel\, ST Microelectronics\, arm\, Texas Instruments\, Nvidia and more. \n\nThis time\, we’ll host our first event in Budapest.\nMr. Szabolcs Szolnoki\, from the Hungarian Innovation agency\, will share his experience working in the interface between Israel and Hungary technology centers.\nThis will be followed by a Technical presentation by Tamás Kállay\, a Team leader at Veriest’s Budapest office about the polemic topic of using Python in Verification​ \nLooking forward to hosting you! \n\n\nSpeakers and Agenda \n\n\n\n\nHost \n\n\n\n\n\n\n\nIstván Fabók​ \nVeriest Hungary \n\n\n\n\n\n\nWelcome \n\n\n\n\n\n\n\nMoshe Zalcberg \nCEO\, Veriest \n\n\n\nKeynote \n\n\n\n\nTechnical presentation \n\n\n\n\n\n\n\nSzabolcs Szolnoki​ \nDeputy CEO for Valorization at Express Innovation Agency \n\nMindset Reprogramming Mission for creating the innovation oriented culture \n\n\n\n\n\n\n\n\n\n\nTamás Kállay \nTeam leader\, Veriest Hungary \n\n\nPython-based framework for silicon bring-up tests \n\n  \n\n\nRead more» \n\n\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/veriest-verification-meetup-in-budapest/ LOCATION:Regus Milpark Center\, 44 Soroksári St.\, Budapest\, Hungary CATEGORIES:EDA,Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Veriest-May-24-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220428T170000 DTEND;TZID=America/Los_Angeles:20220428T193000 DTSTAMP:20220326T031011Z CREATED:20220326T031011Z LAST-MODIFIED:20220326T031011Z UID:4468-1651165200-1651174200@marketingeda.com SUMMARY:ESDA CEO Outlook & Membership Meeting DESCRIPTION:The evening begins at the Keysight office\, Thursday\, April 28\, at 5:00pm with the ESD Alliance Annual Membership Meeting. You’ll get an overview of the past year’s activities and discover what’s in store for 2022. The meeting flows directly into a Welcome Reception followed by the powerful CEO Outlook. \nEnjoy a lively\, nourishing networking reception that kicks off the CEO Outlook panel. Hear influential executives from Arm | Cadence | D2S | Keysight | Siemens share their insights on the current and future state of the design and semiconductor industries. Ed Sperling\, Editor-in-Chief of Semiconductor Engineering\, moderates a spirited\, robust discussion\, including an audience Q&A. \nRegistration | FREE for ESD Alliance and SEMI members | Non-member: $49 per person. \nAGENDA\n\n5:00 pm – 5:30 pm\n\n\nBob Smith\nExecutive Director\nESD Alliance\n\n\n\nESD Alliance Annual Membership Meeting\n\nOverview of ESD Alliance activities for 2021 and plans for 2022. \n\n\n\n\n\n5:30 pm – 6:30 pm\nNetworking\n\n\nEnjoy light food and refreshments as you network with your peers. \n\n\n\n\n\nCEO Outlook Panel \n\n\n\n\n6:30 pm – 7:30 pm\n\n\n\nEd Spurling | Moderator\nEditor & Chief\nSemiconductor Engineering\n\n\n\nModerator & Panelists\n\nHear panelists from ARM | CADENCE | D2S | Keysight | Siemens EDA discuss the state of the electronic system design industry as well as their views of the outlook for the coming years. \nSimon Segars\, CEO\, Arm\n• Niels Fache\, Keysight\n• Aki Fujimura\, D2S\n• Joseph Sawicki\, Siemens EDA\n• Simon Segars\, Arm \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/esda-ceo-outlook-membership-meeting/ LOCATION:Keysight\, 5301 Stevens Creek Blvd\, Building 5\, Santa Clara\, 95051\, United States CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ESDA-April-28-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220405T080000 DTEND;TZID=America/Los_Angeles:20220406T170000 DTSTAMP:20211217T171728Z CREATED:20211217T171712Z LAST-MODIFIED:20211217T171728Z UID:3841-1649145600-1649264400@marketingeda.com SUMMARY:2022 European Executive Forum DESCRIPTION:We have all been waiting for this…\nTHE EEF IS BACK AS AN IN-PERSON EVENT!\n2022 EUROPEAN EXECUTIVE FORUM: Facing New Realities\nThis in-person EEF will feature an elite line-up of expert speakers exploring themes such as blockchain and the Metaverse\, the supply chain crisis and the geopolitics of tech\, the future of quantum\, photonics and automotive computing\, entrepreneurship and investment\, and more. What really inspires this event\, though\, is the congregation of first-rate executives and principal players from across the expanded semiconductor ecosystem. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/2022-european-executive-forum/ CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/2022EEF.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Winnipeg:20220330T113000 DTEND;TZID=America/Winnipeg:20220330T133000 DTSTAMP:20220329T011205Z CREATED:20220329T011205Z LAST-MODIFIED:20220329T011205Z UID:4473-1648639800-1648647000@marketingeda.com SUMMARY:DVClub Austin - March 30\, 2022\, Rahul Peddi (Arm) & Vaibhav Agrawal (Arm) DESCRIPTION:Please join us on March 30\, 2022 at the Norris Conference Center for a catered lunch and networking.  Rahul Peddi\, a Senior Design Engineer at Arm\, and Vaibhav Agrawal\, a member of the CPU formal verification team at Arm\, will be our guest speakers. \n\n11:30am — Doors Open / Networking\n12:00pm — Lunch / Presentations by Rahul Peddi and Vaibhav Agrawal\n1:00pm   — Networking\n\nPresentation #1 \n“Accelerating the verification cycle of a Hyperscaler Compute Subsystem” by Rahul Peddi (Arm) \nHyperscalar Compute Subsystems are increasing in size and complexity with every generation which poses various challenges to verification efforts required to achieve time to market. This talk provides insights into the optimizations and strategies used to reduce simulation run time\, thereby accelerating the verification cycle. \n\nRahul Peddi is a Senior Design Engineer at ARM. He completed his Masters in Computer Engineering from University of Maryland\, College Park. He works in the Systems Development team to develop next Gen Server based SoCs . His work is focused on SV/UVM based test environments and Python/Ruby based Scripting for automation.\n\n  \n Presentation #2 \n“Divide and Conquer: An overview of Formal verification strategy for CPUs designed at Arm in Austin” by Vaibhav Agrawal (Arm) \nWith ever increasing complexity of high end A-class CPUs designed at Arm\, it was imperative to use formal-verification as a complementary technique to simulation-based-verification to find RTL bugs sooner in the design cycle\, and also to enable deep bug hunting. In this talk\, we present our formal verification strategy as deployed on core and fetch blocks over several generations of processors – toward the goal of achieving an overall shift-left in CPU quality. \n\nVaibhav Agrawal has been a member of CPU formal Verification team at Arm in Austin since 2013\, and has been engaged in enabling\, owning\, and deploying formal testbenches to find bugs in CPU blocks\, with the goal of achieving a net “Shift-Left” in the overall CPU quality. He leads a small team of talented and motivated engineers who make this possible.\n\nRSVP and please share with your colleagues! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvclub-austin-march-30-2022-rahul-peddi-arm-vaibhav-agrawal-arm/ LOCATION:Norris Conference Center\, 2525 W Anderson Ln\, #365\, Austin\, TX\, 78757\, United States CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVclub-March-30-2022-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220308T080000 DTEND;TZID=America/Los_Angeles:20220310T170000 DTSTAMP:20220225T222016Z CREATED:20220225T222016Z LAST-MODIFIED:20220225T222016Z UID:4384-1646726400-1646931600@marketingeda.com SUMMARY:EE Times: Advanced Automotive Tech Forum DESCRIPTION:In the last year\, the evolution towards electric vehicles accelerated faster than anticipated. Autonomous driving technology has already been pushed from a short-term priority to a long-term goal\, but the race to be first with AVs remains fierce. Meanwhile\, there seems to be a shift in priorities from driver-assist technologies toward driver monitoring systems. The Advanced Automotive Tech Forum will offer keynotes\, panel discussions\, technical presentations and tutorials on the latest automotive design trends\, including the multi-prong effort to develop power efficient\, advanced EVs with automated features. \nMoving Electric and Autonomous Vehicles Forward \nIt’s fast approaching…our 2nd annual Advanced Automotive Tech Forum will examine the rapidly changing landscape in the automotive market for electric vehicles and autonomous driving technology. \nDon’t miss this free virtual conference March 8-10 for keynotes\, panel discussions\, technical presentations and tutorials on the latest automotive design trends\, including the multi-prong effort to develop power efficient\, advanced EVs with automated features. \n• Powertrain Electrification/Design  • Testing  • Sensors  • Fast Charging \n • AV Software Platforms        • Battery Management Systems \n• The Digital Cockpit   • Wide Bandgap Semiconductor Materials   • Safety \nHere are just a few of our distinguished speakers: \n\nDr. Mahmoud Ismail\, Senior Application Manager\, Automotive Energy Management Systems\, Infineon\nDr. Stephen Lambert\, Head of Electrification\, McLaren Applied\nAlexander Lidow\, Ph.D.\, CEO and co-founder of EPC\nDr. John Palmour\, Co-Founder and CTO\, Wolfspeed\n\nConference Agenda  |  Full Speaker List \nVisit our Exhibition area throughout the event to chat with product experts and download educational materials. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ee-times-advanced-automotive-tech-forum/ CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/EE-Times-March-8-10-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211221T080000 DTEND;TZID=America/Los_Angeles:20211221T170000 DTSTAMP:20211219T004814Z CREATED:20211219T004814Z LAST-MODIFIED:20211219T004814Z UID:3868-1640073600-1640106000@marketingeda.com SUMMARY:Club Formal India DESCRIPTION:Summary: \nCadence is pleased to once again bring you Club Formal\, a platform for formal verification experts to come together and discuss the latest in formal technologies\, including challenges\, benefits\, and best practices. Hear from your peers on how they are using formal verification techniques in their flows and interact with members of the Cadence® R&D team to discuss the technology\, roadmap\, and use cases. \nIn this half-day digital seminar\, you will hear an industry keynote\, a Cadence R&D keynote on the latest in JasperGold® technology\, and several users who will discuss best practices. Plus\, we will have deep technical demos and presentations by Cadence Formal experts. \n\n\n\n\n\n\n\n\n\n\nDate and Time: \nTuesday\, December 21\, 2021 \n9:30 – 13:25 (India Time) \n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/club-formal-india/ CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/1639844164835.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20211215T110000 DTEND;TZID=America/New_York:20211215T160000 DTSTAMP:20211201T212947Z CREATED:20211201T212947Z LAST-MODIFIED:20211201T212947Z UID:3780-1639566000-1639584000@marketingeda.com SUMMARY:Design and Analysis Solutions for Integrated RF Systems DESCRIPTION:Opening Keynote \n10:00am EST | Cadence Solutions for RF Design Excellence\, presented by\nDavid Vye\, Dr. Melika Roshandell\, Graeme Richie\, Dr. Yashwanth Reddy Padooru\, Gus Dallman\, Shane Coffman\, Cadence \nTechnical Talks \n\n11:00am EST | Design of Integrated Phased-Array Antenna Systems for 5G CPE\, presented by David Vye\, Andy Hughes\, Cadence\n1:00pm EST | Simulation and Modeling of MMIC PAs for Communication Systems\, presented by Prof. Zoya Popovich\, University of Colorado\, Boulder\, David Farkas\, NxBeam\n2:00pm EST | Virtuoso RF Solution Integrates EM Analysis for RFIC and System-in-Package Design\, presented by Kevin Morot\, STMicroelectronics\, Ron Pongratz\, Dr. Claudia Roesch\, Art Schaldenbrand\, Cadence\n3:00pm EST | Enhancing the Accuracy of RF Front-End Simulations with Standard-Compliant Signal Processing\, presented by Markus Lörner\, Rohde & Schwarz\, and Dr. Gent Paparisto\, Cadence\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/design-and-analysis-solutions-for-integrated-rf-systems/ CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/cadence-December-15-2021.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211117T100000 DTEND;TZID=America/Los_Angeles:20211117T170000 DTSTAMP:20211112T184020Z CREATED:20211112T184020Z LAST-MODIFIED:20211112T184020Z UID:3735-1637143200-1637168400@marketingeda.com SUMMARY:Samsung SAFE Forum 2021 DESCRIPTION:Join us for Samsung Foundry’s annual SAFE™ Forum. \nWhat will you take away from Samsung Foundry’s ecosystem event? Bump your SoC PPA knowledge with the latest information on: \nHigh speed interconnect IPs for HPC and Data Center applications and foundational IPs\nHigh bandwidth memory subsystems\nKey IP trends for automotive and mobile applications\nFoundational Analog Mixed Signal IP for a variety of applications\nThere will also be an opportunity to network with experts in IP\, EDA\, Cloud\, Design Services and Packaging during the virtual partner pavilion. \nRegister today! Participate to join the raffle for exciting prizes! \n– SAFE Forum Team \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/samsung-safe-forum-2021/ CATEGORIES:Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SAFE-2021.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Hong_Kong:20211116T090000 DTEND;TZID=Asia/Hong_Kong:20211116T170000 DTSTAMP:20211013T020759Z CREATED:20211013T020759Z LAST-MODIFIED:20211013T020759Z UID:3505-1637053200-1637082000@marketingeda.com SUMMARY:GSA - Asia Pacific Executive Forum DESCRIPTION:We invite you to join us at the 2021 Asia Pacific Executive Forum\, happening virtually on Tuesday\, November 16 at 9:00 AM HKT. \nIn adapting to the challenges of COVID\, the world has experienced dramatic changes that are redefining our daily lives. New capabilities empowered by AI\, IoT\, hyperscale computing and 5G are driving digital transformation impacting millions of people. The dependency between the global economy and technology is greater today than it’s ever been\, creating booming demand and broadening the growth drivers for the semiconductor industry.\n\nAPEF 2021 will showcase industry leaders and experts to provide thought leadership on topics changing the landscape of the industry\, ranging from heterogeneous and hyperscale computing\, application-driven growth markets\, and the industry focus on global sustainability\, and on the evolving global economy and future market outlook of our industry.\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gsa-asia-pacific-executive-forum/ CATEGORIES:Forum ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/GSA-November-16.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211026T093000 DTEND;TZID=America/Los_Angeles:20211026T170000 DTSTAMP:20211019T165643Z CREATED:20211019T165643Z LAST-MODIFIED:20211019T165643Z UID:3540-1635240600-1635267600@marketingeda.com SUMMARY:TSMC 2021 Online OIP Ecosystem Forum DESCRIPTION:The TSMC OIP Ecosystem Forum brings together TSMC’s design ecosystem partners and customers to share practical\, tested solutions to today’s design challenges. \nMore than 95% of last year’s event attendees found that the Forum helped them better understand TSMC’s Open Innovation Platform and found it insightful to hear directly from TSMC OIP member companies. This year’s event will prove equally valuable\, providing an opportunity for you to learn how TSMC OIP partners apply their technologies and design solutions to address your high-performance computing (HPC)\, mobile\, automotive\, and Internet-of-Thing (IoT) design challenges. \nThis year’s online forum kicks off with trend-setting talks and announcements from TSMC and leading IC design company executives. The technical sessions are dedicated to 35 selected papers from TSMC’s EDA\, IP\, Design Center Alliance\, and Value Chain Aggregator partners. Also\, the Ecosystem Pavilion features 70 OIP member companies showcasing their products and services. \nJoin us and learn about:\n\nEmerging advanced process design challenges at N3\, N4/N5\, N6/N7\, N12e\, N22\, and 3D IC design flows and methodologies\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, RF\, and automotive designs\nSuccessful\, real-life applications of design technologies and IP from ecosystem partners and TSMC customers\nEcosystem-specific TSMC reference flow implementations\nNew next-generation product designs targeting HPC\, mobile\, automotive\, and IoT applications\n\nEvent Schedule:\n  \nTuesday\, October 26\nTSMC 2021 North America Open Innovation Platform® (OIP) Ecosystem Forum \n  \nWednesday\, October 27\nTSMC 2021 China Open Innovation Platform® (OIP) Ecosystem Forum \n  \nWednesday\, October 27\nTSMC 2021 Europe Open Innovation Platform® (OIP) Ecosystem Forum \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tsmc-2021-online-oip-ecosystem-forum/ CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-20201-OIP.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20211020T100000 DTEND;TZID=America/New_York:20211020T140000 DTSTAMP:20211007T172053Z CREATED:20211007T172053Z LAST-MODIFIED:20211007T172053Z UID:3493-1634724000-1634738400@marketingeda.com SUMMARY:CadenceCONNECT - Mission Critical 2021 DESCRIPTION:Overview\nCadenceCONNECT will introduce you to optimized design methodologies for mission-critical electronics system applications like A&D\, safety\, security\, 5G\, and others. The event brings together Cadence® technology users\, developers\, and industry experts for networking\, sharing best practices on critical design and verification\, and discovering new techniques for designing advanced silicon\, SoCs\, and systems. \nKeynote\n10:00 am – 10:25 am (EDT) \nComputational Software for Intelligent System Design and Maximum Verification Throughput \nPaul Cunningham\, Ph.D. Senior Vice President and General Manager\, System & Verification Group\, Cadence \nAgenda\nSystem Oriented \n10:30 am – 11:00 am (Bombardier) Automated Meshing and Adaptive Re-Meshing at Bombardier \n11:00 am – 11:30 am (Northrop Grumman) Emulation Digital Twin for SoC with eFPGA \n11:30 am – 12:00 pm (Medtronic) Dynamic Duo Verifies a Patient-Provider Telemedical System \n12:00 pm – 12:30 pm (L3 Harris) Robust FPGA Verification and Quantified Metrics for Safety-Critical Missions \n12:30 pm – 1:00 pm (Northrop Grumman) Continuous Front-End Design and Verification Metrics Analysis to Speed System Deployment \n1:00 pm – 1:30 pm (Analog Devices) Fault Campaign Framework for ISO 26262 Compliance \n1:30pm – 2:00pm (Nano Dimensions) Additively Manufactured Electronics (AME) From Design to Fabrication \nIC/Packaging \n10:30 am – 11:00 am (Motorola) Delivering Mixed-Signal Design in 22FDX MSOA Flow with Innovus \n11:00 am – 11:30 am (Rianta) Power Optimization via Joules \n11:30 am – 12:00 pm (Texas Instruments) Using Design Intent and Simulation Driven Routing for Power Critical Circuit Designs \n12:00 pm – 12:30 pm (Analog Devices) Electromagnetic Simulation of Large Chip/Package Designs Using Clarity \n12:30 pm – 1:00 pm (BroadPak) Large-Scale Silicon Interposer Design Methodology in Allegro APD+ \n1:00 pm – 1:30 pm (Rohde-Schwarz) Enhancing the Accuracy of RF Front-End Simulations with Standard Compliant Signal Processing \n1:30 pm – 2:00 pm (Butterfly) Real Number Modeling for Mixed-Signal Verification \n*Note times are Eastern Daylight Time \nAgenda subject to change \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cadenceconnect-mission-critical-2021/ CATEGORIES:EDA,Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CadenceCONNECT-Mission-Critical.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211006T080000 DTEND;TZID=America/Los_Angeles:20211008T170000 DTSTAMP:20210928T210856Z CREATED:20210927T171838Z LAST-MODIFIED:20210928T210856Z UID:3440-1633507200-1633712400@marketingeda.com SUMMARY:Samsung Foundry Forum 2021 DESCRIPTION:Join now and become a member of the Samsung Foundry Forum 2021! \nSamsung Foundry would like to invite global customers and partners to the Samsung Foundry Forum 2021\, designed to share Samsung Foundry’s vision\, trends\, the latest technologies and solutions for various applications in order to strengthen our valuable partnerships. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/samsung-foundry-forum-2021/ CATEGORIES:Forum,Foundry ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-Foundry-Forum-2021.jpg END:VEVENT END:VCALENDAR