BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.5.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20200308T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20201101T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20210314T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20211107T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20200308T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20201101T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20210314T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20211107T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20220313T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20221106T060000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Hong_Kong BEGIN:STANDARD TZOFFSETFROM:+0800 TZOFFSETTO:+0800 TZNAME:HKT DTSTART:20200101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211221T080000 DTEND;TZID=America/Los_Angeles:20211221T170000 DTSTAMP:20211219T004814Z CREATED:20211219T004814Z LAST-MODIFIED:20211219T004814Z UID:3868-1640073600-1640106000@marketingeda.com SUMMARY:Club Formal India DESCRIPTION:Summary: \nCadence is pleased to once again bring you Club Formal\, a platform for formal verification experts to come together and discuss the latest in formal technologies\, including challenges\, benefits\, and best practices. Hear from your peers on how they are using formal verification techniques in their flows and interact with members of the Cadence® R&D team to discuss the technology\, roadmap\, and use cases. \nIn this half-day digital seminar\, you will hear an industry keynote\, a Cadence R&D keynote on the latest in JasperGold® technology\, and several users who will discuss best practices. Plus\, we will have deep technical demos and presentations by Cadence Formal experts. \n\n\n\n\n\n\n\n\n\n\nDate and Time: \nTuesday\, December 21\, 2021 \n9:30 – 13:25 (India Time) \n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/club-formal-india/ CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/1639844164835.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20211215T110000 DTEND;TZID=America/New_York:20211215T160000 DTSTAMP:20211201T212947Z CREATED:20211201T212947Z LAST-MODIFIED:20211201T212947Z UID:3780-1639566000-1639584000@marketingeda.com SUMMARY:Design and Analysis Solutions for Integrated RF Systems DESCRIPTION:Opening Keynote \n10:00am EST | Cadence Solutions for RF Design Excellence\, presented by\nDavid Vye\, Dr. Melika Roshandell\, Graeme Richie\, Dr. Yashwanth Reddy Padooru\, Gus Dallman\, Shane Coffman\, Cadence \nTechnical Talks \n\n11:00am EST | Design of Integrated Phased-Array Antenna Systems for 5G CPE\, presented by David Vye\, Andy Hughes\, Cadence\n1:00pm EST | Simulation and Modeling of MMIC PAs for Communication Systems\, presented by Prof. Zoya Popovich\, University of Colorado\, Boulder\, David Farkas\, NxBeam\n2:00pm EST | Virtuoso RF Solution Integrates EM Analysis for RFIC and System-in-Package Design\, presented by Kevin Morot\, STMicroelectronics\, Ron Pongratz\, Dr. Claudia Roesch\, Art Schaldenbrand\, Cadence\n3:00pm EST | Enhancing the Accuracy of RF Front-End Simulations with Standard-Compliant Signal Processing\, presented by Markus Lörner\, Rohde & Schwarz\, and Dr. Gent Paparisto\, Cadence\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/design-and-analysis-solutions-for-integrated-rf-systems/ CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/cadence-December-15-2021.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211117T100000 DTEND;TZID=America/Los_Angeles:20211117T170000 DTSTAMP:20211112T184020Z CREATED:20211112T184020Z LAST-MODIFIED:20211112T184020Z UID:3735-1637143200-1637168400@marketingeda.com SUMMARY:Samsung SAFE Forum 2021 DESCRIPTION:Join us for Samsung Foundry’s annual SAFE™ Forum. \nWhat will you take away from Samsung Foundry’s ecosystem event? Bump your SoC PPA knowledge with the latest information on: \nHigh speed interconnect IPs for HPC and Data Center applications and foundational IPs\nHigh bandwidth memory subsystems\nKey IP trends for automotive and mobile applications\nFoundational Analog Mixed Signal IP for a variety of applications\nThere will also be an opportunity to network with experts in IP\, EDA\, Cloud\, Design Services and Packaging during the virtual partner pavilion. \nRegister today! Participate to join the raffle for exciting prizes! \n– SAFE Forum Team \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/samsung-safe-forum-2021/ CATEGORIES:Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SAFE-2021.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Hong_Kong:20211116T090000 DTEND;TZID=Asia/Hong_Kong:20211116T170000 DTSTAMP:20211013T020759Z CREATED:20211013T020759Z LAST-MODIFIED:20211013T020759Z UID:3505-1637053200-1637082000@marketingeda.com SUMMARY:GSA - Asia Pacific Executive Forum DESCRIPTION:We invite you to join us at the 2021 Asia Pacific Executive Forum\, happening virtually on Tuesday\, November 16 at 9:00 AM HKT. \nIn adapting to the challenges of COVID\, the world has experienced dramatic changes that are redefining our daily lives. New capabilities empowered by AI\, IoT\, hyperscale computing and 5G are driving digital transformation impacting millions of people. The dependency between the global economy and technology is greater today than it’s ever been\, creating booming demand and broadening the growth drivers for the semiconductor industry.\n\nAPEF 2021 will showcase industry leaders and experts to provide thought leadership on topics changing the landscape of the industry\, ranging from heterogeneous and hyperscale computing\, application-driven growth markets\, and the industry focus on global sustainability\, and on the evolving global economy and future market outlook of our industry.\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gsa-asia-pacific-executive-forum/ CATEGORIES:Forum ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/GSA-November-16.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211026T093000 DTEND;TZID=America/Los_Angeles:20211026T170000 DTSTAMP:20211019T165643Z CREATED:20211019T165643Z LAST-MODIFIED:20211019T165643Z UID:3540-1635240600-1635267600@marketingeda.com SUMMARY:TSMC 2021 Online OIP Ecosystem Forum DESCRIPTION:The TSMC OIP Ecosystem Forum brings together TSMC’s design ecosystem partners and customers to share practical\, tested solutions to today’s design challenges. \nMore than 95% of last year’s event attendees found that the Forum helped them better understand TSMC’s Open Innovation Platform and found it insightful to hear directly from TSMC OIP member companies. This year’s event will prove equally valuable\, providing an opportunity for you to learn how TSMC OIP partners apply their technologies and design solutions to address your high-performance computing (HPC)\, mobile\, automotive\, and Internet-of-Thing (IoT) design challenges. \nThis year’s online forum kicks off with trend-setting talks and announcements from TSMC and leading IC design company executives. The technical sessions are dedicated to 35 selected papers from TSMC’s EDA\, IP\, Design Center Alliance\, and Value Chain Aggregator partners. Also\, the Ecosystem Pavilion features 70 OIP member companies showcasing their products and services. \nJoin us and learn about:\n\nEmerging advanced process design challenges at N3\, N4/N5\, N6/N7\, N12e\, N22\, and 3D IC design flows and methodologies\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, RF\, and automotive designs\nSuccessful\, real-life applications of design technologies and IP from ecosystem partners and TSMC customers\nEcosystem-specific TSMC reference flow implementations\nNew next-generation product designs targeting HPC\, mobile\, automotive\, and IoT applications\n\nEvent Schedule:\n  \nTuesday\, October 26\nTSMC 2021 North America Open Innovation Platform® (OIP) Ecosystem Forum \n  \nWednesday\, October 27\nTSMC 2021 China Open Innovation Platform® (OIP) Ecosystem Forum \n  \nWednesday\, October 27\nTSMC 2021 Europe Open Innovation Platform® (OIP) Ecosystem Forum \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tsmc-2021-online-oip-ecosystem-forum/ CATEGORIES:Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-20201-OIP.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20211020T100000 DTEND;TZID=America/New_York:20211020T140000 DTSTAMP:20211007T172053Z CREATED:20211007T172053Z LAST-MODIFIED:20211007T172053Z UID:3493-1634724000-1634738400@marketingeda.com SUMMARY:CadenceCONNECT - Mission Critical 2021 DESCRIPTION:Overview\nCadenceCONNECT will introduce you to optimized design methodologies for mission-critical electronics system applications like A&D\, safety\, security\, 5G\, and others. The event brings together Cadence® technology users\, developers\, and industry experts for networking\, sharing best practices on critical design and verification\, and discovering new techniques for designing advanced silicon\, SoCs\, and systems. \nKeynote\n10:00 am – 10:25 am (EDT) \nComputational Software for Intelligent System Design and Maximum Verification Throughput \nPaul Cunningham\, Ph.D. Senior Vice President and General Manager\, System & Verification Group\, Cadence \nAgenda\nSystem Oriented \n10:30 am – 11:00 am (Bombardier) Automated Meshing and Adaptive Re-Meshing at Bombardier \n11:00 am – 11:30 am (Northrop Grumman) Emulation Digital Twin for SoC with eFPGA \n11:30 am – 12:00 pm (Medtronic) Dynamic Duo Verifies a Patient-Provider Telemedical System \n12:00 pm – 12:30 pm (L3 Harris) Robust FPGA Verification and Quantified Metrics for Safety-Critical Missions \n12:30 pm – 1:00 pm (Northrop Grumman) Continuous Front-End Design and Verification Metrics Analysis to Speed System Deployment \n1:00 pm – 1:30 pm (Analog Devices) Fault Campaign Framework for ISO 26262 Compliance \n1:30pm – 2:00pm (Nano Dimensions) Additively Manufactured Electronics (AME) From Design to Fabrication \nIC/Packaging \n10:30 am – 11:00 am (Motorola) Delivering Mixed-Signal Design in 22FDX MSOA Flow with Innovus \n11:00 am – 11:30 am (Rianta) Power Optimization via Joules \n11:30 am – 12:00 pm (Texas Instruments) Using Design Intent and Simulation Driven Routing for Power Critical Circuit Designs \n12:00 pm – 12:30 pm (Analog Devices) Electromagnetic Simulation of Large Chip/Package Designs Using Clarity \n12:30 pm – 1:00 pm (BroadPak) Large-Scale Silicon Interposer Design Methodology in Allegro APD+ \n1:00 pm – 1:30 pm (Rohde-Schwarz) Enhancing the Accuracy of RF Front-End Simulations with Standard Compliant Signal Processing \n1:30 pm – 2:00 pm (Butterfly) Real Number Modeling for Mixed-Signal Verification \n*Note times are Eastern Daylight Time \nAgenda subject to change \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cadenceconnect-mission-critical-2021/ CATEGORIES:EDA,Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CadenceCONNECT-Mission-Critical.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211006T080000 DTEND;TZID=America/Los_Angeles:20211008T170000 DTSTAMP:20210928T210856Z CREATED:20210927T171838Z LAST-MODIFIED:20210928T210856Z UID:3440-1633507200-1633712400@marketingeda.com SUMMARY:Samsung Foundry Forum 2021 DESCRIPTION:Join now and become a member of the Samsung Foundry Forum 2021! \nSamsung Foundry would like to invite global customers and partners to the Samsung Foundry Forum 2021\, designed to share Samsung Foundry’s vision\, trends\, the latest technologies and solutions for various applications in order to strengthen our valuable partnerships. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/samsung-foundry-forum-2021/ CATEGORIES:Forum,Foundry ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-Foundry-Forum-2021.jpg END:VEVENT END:VCALENDAR