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BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20241211T080000
DTEND;TZID=Asia/Shanghai:20241212T170000
DTSTAMP:20260407T072010
CREATED:20241206T210925Z
LAST-MODIFIED:20241206T211410Z
UID:8556-1733904000-1734022800@marketingeda.com
SUMMARY:ICCAD-Expo 2024
DESCRIPTION:The China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has always played an important role in promoting industrial agglomeration\, connecting industrial resources\, and mastering industry trends. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/iccad-expo-2024/
LOCATION:Shanghai International Convention Center\, No. 2727\, Riverside Avenue\, Shanghai\, China
CATEGORIES:Conference,EDA,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ICCAD-Expo-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20241120T090000
DTEND;TZID=America/Los_Angeles:20241120T180000
DTSTAMP:20260407T072010
CREATED:20241113T213125Z
LAST-MODIFIED:20241113T213239Z
UID:8510-1732093200-1732125600@marketingeda.com
SUMMARY:Tower Semiconductor - Technical Global Symposium 2024
DESCRIPTION:TGS offers a wonderful opportunity for networking\, learning\, and sharing\nthe latest technology developments with our community\, as well as\nmeeting with Tower’s executives and team of experts.\nWe invite you to join us! \n\n\nTime\n\n\n\n\nSession\n\n\n\n\nSpeaker\n\n\n\n\n9:00 – 10:00\n\n\n\n\nRegistration\n\n\n\n\n10:00 – 10:05\n\n\n\n\nOpening\n\n\n\n\nMr. Lei Qin\, SVP of Worldwide Sales\n\n\n\n\n10:05 – 10:40\n\n\n\n\nCEO Keynote\n\n\n\n\nMr. Russell Ellwanger\, CEO\n\n\n\n\n10:40 – 11:00\n\n\n\n\nWhy an Analog Foundry is Critical for AI\n\n\n\n\nDr. Avi Strum\, CTO\n\n\n\n\n11:00 – 11:30\n\n\n\n\nInvited Talk by Nvidia:\nIntegrated Optics Ecosystem for Future Gen AI Systems\n\n\n\n\nDr. Ashkan Seyedi\, Director\, LinkX Products\, Nvidia\n\n\n\n\n11:30 – 12:00\n\n\n\n\nMarket Megatrends and Tower’s Technology Solutions in RF Mobile\, Infrastructure\, Power\, and Sensors\n\n\n\n\nDr. Marco Racanelli\, President\n\n\n\n\n12:00 – 13:30\n\n\n\n\nLunch\n\n\n\n\n13:30 – 14:15\n\n\n\n\nTower’s RF and Silicon Photonics Technology Platforms – Advanced Solutions for High-speed Connectivity\n\n\n\n\nDr. Ed Preisler\, VP & Co-General Manager of RF Business Unit\n\n\n\n\n14:15 – 15:00\n\n\n\n\nTower’s Power 65nm BCD and 0.18um BCD Offering for Power Applications\n\n\n\n\nDr. David Mistele\, Director of Power Management R&D\n\n\n\n\n15:00 – 15:15\n\n\n\n\nCoffee Break\n\n\n\n\n15:15 – 15:45\n\n\n\n\nTechnologies for the Future of Digital Imaging\, from Sensors to Displays\n\n\n\n\nDr. Benoit Dupont\, Marketing Director of Sensors and Display Business\n\n\n\n\n15:45 -16:15\n\n\n\n\nTower’s Design Enablement – Transforming Ideas into Products\, Rapidly and Accurately\n\n\n\n\nDr. Samir Chaudhry\, VP of Design Enablement\n\n\n\n\n16:15 – 16:45\n\n\n\n\nAerospace and Defense – Partner for R&D and Manufacturing Solutions\n\n\n\n\nDr. David Howard\, Executive Director & Fellow\n\n\n\n\n16:45 – 17:00\n\n\n\n\nClosing Remarks\n\n\n\n\n\n\n\n\n\n17:00 – 18:00\n\n\n\n\nCocktail\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tower-semiconductor-technical-global-symposium-2024/
LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Foundry,Semiconductor,Symposium
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Tower-November-20-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Amsterdam:20241119T080000
DTEND;TZID=Europe/Amsterdam:20241119T170000
DTSTAMP:20260407T072010
CREATED:20241106T192658Z
LAST-MODIFIED:20241106T193115Z
UID:8478-1732003200-1732035600@marketingeda.com
SUMMARY:2024 TSMC Europe OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for A16\, N2 and N3 processes\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization\nSuccessful\, real-life applications of design technologies\, IP solutions\, and cloud-based designs from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2024 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/2024-tsmc-europe-oip-ecosystem-forum/
LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-November-19-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Tokyo:20241025T093000
DTEND;TZID=Asia/Tokyo:20241025T173000
DTSTAMP:20260407T072010
CREATED:20241008T162227Z
LAST-MODIFIED:20241008T162227Z
UID:8394-1729848600-1729877400@marketingeda.com
SUMMARY:TSMC OIP Ecosystem Forum Japan 2024
DESCRIPTION:Learn About:\n\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization\nSuccessful\, real-life applications of design technologies\, IP solutions\, and cloud-based designs from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-oip-ecosystem-forum-japan-2024/
LOCATION:Grand Hyatt Tokyo\, 6-10-3\, Roppongi\, Minato-ku\, Tokyo\, Japan
CATEGORIES:Conference,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-OIP-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240925T093000
DTEND;TZID=America/Los_Angeles:20240925T180000
DTSTAMP:20260407T072010
CREATED:20240917T003541Z
LAST-MODIFIED:20240917T003907Z
UID:8337-1727256600-1727287200@marketingeda.com
SUMMARY:TSMC North America OIP Ecosystem Forum 2024
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for A16\, N2 and N3 processes\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization\nSuccessful\, real-life applications of design technologies\, IP solutions\, and cloud-based designs from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2024 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-north-america-oip-ecosystem-forum-2024/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:EDA,Forum,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240829T080000
DTEND;TZID=America/Los_Angeles:20240829T170000
DTSTAMP:20260407T072010
CREATED:20240729T162620Z
LAST-MODIFIED:20240729T162620Z
UID:8188-1724918400-1724950800@marketingeda.com
SUMMARY:GlobalFoundries Technology Summit 2024 - North America
DESCRIPTION:The annual GTS conference brings GF executives and technologists together with customers and partners to discuss the latest breakthroughs and innovations in the semiconductor industry. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/globalfoundries-technology-summit-2024-north-america/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GlobalFoundries-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20240618T080000
DTEND;TZID=Europe/Berlin:20240619T170000
DTSTAMP:20260407T072010
CREATED:20240417T180940Z
LAST-MODIFIED:20240417T180940Z
UID:7870-1718697600-1718816400@marketingeda.com
SUMMARY:GSA European Executive Forum 2024
DESCRIPTION:The GSA European Executive Forum\, our flagship event in Europe\, is BACK! Join us June 18th and 19th in Munich for the event of the summer! \nThis year\, in honor of GSA’s 30th anniversary\, we want to celebrate by bringing you the very best EEF ever: amazing speakers\, most thought provoking topics and the very best attendees. \nExpect a captivating combination of high-level discussions with forward looking technology trends: a masterful CEO fireside chat\, sessions ranging from genAI impact on the semiconductor industry\, to the future of networks\, to the emergence of a chiplet ecosystem\, to automotive\, sustainability\, and even on how tantalizing close we are to unlocking the world-changing promises of nuclear fusion and clean energy for all! \n  \nVIP Dinner capacity is strictly limited. \nThe GSA European Executive Forum is our flagship event in Europe which\, over two days\, always attracts the very top speakers and attendees: 300 senior decision makers\, the majority VP and C-level profiles. \nOver the past 20 years\, it has become the reference executive event for the semiconductor industry in the EMEA region. \nHotels in Munich are already very hard to find around the event date: PLEASE BOOK YOUR HOTEL ROOM NOW. \n  \n  \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/gsa-european-executive-forum-2024/
LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany
CATEGORIES:Forum,Foundry,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-June-18-19-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240612T080000
DTEND;TZID=America/Los_Angeles:20240613T170000
DTSTAMP:20260407T072010
CREATED:20240610T171842Z
LAST-MODIFIED:20240610T171842Z
UID:8085-1718179200-1718298000@marketingeda.com
SUMMARY:Samsung Foundry Forum & SAFE Forum 2024 U.S.
DESCRIPTION:June 12th\, 2024\n12:30 – 5:30 PM PDT \n\n\n01:35 – 01:50 PM\nSamsung Keynote\nSiyoung Choi\nPresident and GM\, Foundry Business Samsung Electronics\n\n\n\n\n01:50 – 02:05 PM\nThe Accelerated Compute Platform for the Age of AI\nRene Haas\nCEO\nARM\n\n\n\n\n02:05 – 02:20 PM\nGroq’s Transformation of Generative AI ComputeJonathan RossCEO and Founder\n\n\n\n02:20 – 02:55 PM\nSamsung AI Solutions\nTaeJoong Song\nVP\, Head of Business Development\nIndong Kim\nVP\, Head of DRAM Product Planning\nHee Joung Joun\nVP\, AVP Marketing & Strategy Group\nSamsung Electronics\n\n\n\n\n03:25 – 04:00 PM\nProcess Technology\nJa-Hum Ku\nEVP\, Head of Technology Development\nSamsung Electronics\n\n\n\n04:00 – 04:15 PM\nManufacturing Excellence\nSang Sup Jeong\nEVP\, Head of Foundry Manufacturing Technology Center\nSamsung Electronics\n\n\n\n\n04:15 – 04:30 PM\nDesign Platform\nJongwook Kye\nEVP\, Head of Design\nPlatform Development\nSamsung Electronics\n\n\n\n\n04:30 – 04:40 PM\nBusiness & Customers\nSang-Pil Sim\nEVP\, Head of Worldwide Sales and Marketing\nSamsung Electronics\n\nJune 13th\, 2024\n9:00AM-5:30 PM PDT \n\n\n10:00 – 10:15 AM\nWelcome Remarks\nJongwook Kye\nEVP\, Head of Design\nPlatform Development\nSamsung Electronics\n\n\n\n\n10:15 – 10:35 AM\nEnabling a New Era of Design\nMike EllowCEO\nSiemens EDA Silicon Systems\n\n\n\n10:35 – 10:55 AM\nDemand for Power Efficiency in the Age of AI\nBill EnCorporate Vice President\nAMD\n\n\n\n\n10:55 – 11:15 AM\nThe Photonic FabricTM\, Optical Compute Interconnect for Accelerated Computing\nDavid Lazovsky\nCEO and Founder\nCelestial AI\n\n\n\n11:15 – 11:35 AM\nTechnology & Business Update\nTaeJoong Song\nVP\, Head of Business Development\nSamsung Electronics\n\n\n\n\n1:00 – 4:30 PM\nTech Session Ⅰ:\nAdvanced Technology and Design Enablement\nSei Seung Yoon\nEVP\, Head of Library Development\nSungwook Moon\nMaster(VP of Technology)\,\nFoundry Design Service\nSamsung Electronics\n\n1:00 – 4:30 PMTech Session Ⅱ:\nDesign Solutions of AI\, for AI\, and by AI\nJongshin Shin\nEVP\, Head of Foundry IP Ecosystem\nSamsung Electronics \n\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/samsung-foundry-forum-safe-forum-2024-u-s/
LOCATION:Samsung Semiconductor US Campus\, 3655 N. First Street\, San Jose\, CA\, United States
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-SAFE-2024-US.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240528T090000
DTEND;TZID=Asia/Shanghai:20240528T160000
DTSTAMP:20260407T072010
CREATED:20240522T194800Z
LAST-MODIFIED:20240522T200534Z
UID:8030-1716886800-1716912000@marketingeda.com
SUMMARY:TSMC 2024 China Technology Symposium
DESCRIPTION:Get the latest on:\n\nTSMC’s industry-leading HPC\, smartphone\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and TSMC-SoIC®\nTSMC’s manufacturing excellence\, capacity expansion plans\, and green manufacturing achievements\nTSMC’s Open Innovation Platform Ecosystem to speed up time-to-design\n\nFor more information on the TSMC Technology Symposium\, e-mail us at: symposium@tsmc.com. \nWe look forward to seeing you at the 2024 TSMC Technology Symposium! \n\n\n\n09:00 – 10:00\nRegistration & Ecosystem Pavilion\n\n\n10:00 – 10:10\nWelcome & Opening Remarks\n\n\n10:10 – 10:30\nMarket Update and Outlook\n\n\n10:30 – 11:00\nTechnology Leadership\n\n\n11:00 – 11:25\nCoffee Break & Ecosystem Pavilion\n\n\n11:25 – 11:50\nManufacturing Excellence\n\n\n11:50 – 12:15\nAdvanced Technology Design Solutions\n\n\n12:15 – 13:25\nLunch & Ecosystem Pavilion\n\n\n13:25 – 13:45\nAdvanced Technology\n\n\n13:45 – 14:05\n3DFabric Technology\n\n\n14:05 – 14:40\nCoffee Break & Ecosystem Pavilion\n\n\n14:40 – 15:00\nAutomotive & eNVM Technology\n\n\n15:00 – 15:20\nIoT Technology\n\n\n15:20 – 15:40\nAdvanced RF and Analog Technology\n\n\n15:40 – 16:00\nLucky Draw\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2024-china-technology-symposium/
LOCATION:Shanghai International Convention Center\, No. 2727\, Riverside Avenue\, Shanghai\, China
CATEGORIES:EDA,Foundry,IP,Symposium
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024-North-America.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/London:20240514T080000
DTEND;TZID=Europe/London:20240514T170000
DTSTAMP:20260407T072010
CREATED:20240430T203151Z
LAST-MODIFIED:20240503T191344Z
UID:7935-1715673600-1715706000@marketingeda.com
SUMMARY:TSMC 2024 Technology Symposium - Europe
DESCRIPTION:Agenda\n\n\nEurope Technology Symposium\n*The agenda is subject to change\n\n\n\n08:30 – 09:30\n\nRegistration & Ecosystem Pavilion\n\n\n\n09:30 – 09:40\n\nWelcome & Opening Remarks\n\n\n\n09:40 – 10:20\n\nCEO Perspectives\n\n\n\n10:20 – 10:40\n\nMarket Update and Outlook\n\n\n\n10:40 – 11:10\n\nTechnology Leadership\n\n\n\n11:10 – 11:30\n\nCoffee Break & Ecosystem Pavilion\n\n\n\n11:30 – 11:55\n\nManufacturing Excellence\n\n\n\n11:55 – 12:20\n\nAdvanced Technology Design Solutions\n\n\n\n12:20 – 13:40\n\nLunch & Ecosystem Pavilion\n\n\n\n13:40 – 14:05\n\nHPC Platform – Advanced Technology and 3DFabric\n\n\n\n14:05 – 14:25\n\neNVM Technology Platform\n\n\n\n14:25 – 14:45\n\nAutomotive Platform\n\n\n\n14:45 – 15:15\n\nCoffee Break & Ecosystem Pavilion\n\n\n\n15:15 – 15:30\n\nAdvanced RF and Analog Technology Platform\n\n\n\n15:30 – 15:45\n\nIoT Technology Platform\n\n\n\n15:45 – 16:00\n\nHigh Voltage BCD/Power GaN Technology\n\n\n\n16:10 – 17:00\n\nSocial Hour\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2024-technology-symposium-europe/
LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands
CATEGORIES:Foundry,Symposium
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024-North-America.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240509T083000
DTEND;TZID=America/Los_Angeles:20240509T170000
DTSTAMP:20260407T072010
CREATED:20240415T181329Z
LAST-MODIFIED:20240415T181329Z
UID:7853-1715243400-1715274000@marketingeda.com
SUMMARY:TSMC Technology Workshop 2024 - Boston
DESCRIPTION:08:30 – 09:30\nRegistration & Partner Pavilion\n\n\n09:30 – 09:40\nWelcome & Opening Remarks\n\n\n09:40 – 10:00\nMarket Outlook – Powering AI Together\n\n\n10:00 – 10:30\nAdvanced Technology Leadership\n\n\n10:30 – 11:00\nCoffee Break & Ecosystem Pavilion\n\n\n11:00 – 11:25\nSpecialty Technology Leadership\n\n\n11:25 – 11:50\nManufacturing Excellence\n\n\n11:50 – 13:00\nLunch & Ecosystem Pavilion\n\n\n13:00 – 13:20\nAdvanced Technology Design Solutions\n\n\n13:20 – 13:40\nAdvanced Technology\n\n\n13:40 – 14:00\n3DFabric Technology\n\n\n14:00 – 14:30\nCoffee Break & Ecosystem Pavilion\n\n\n14:30 – 14:50\nAutomotive and eNVM Technology\n\n\n14:50 – 15:10\nIoT Technology\n\n\n15:10 – 15:30\nAdvanced RF and Analog Technology\n\n\n15:30 – 16:40\nSocial Hour\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-technology-workshop-2024-boston/
LOCATION:Boston Marriott Burlington\, One Burlington Mall Road\, Burlington\, MA\, 01803\, United States
CATEGORIES:EDA,Foundry,IP,Workshop
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024-North-America.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240507T080000
DTEND;TZID=America/Los_Angeles:20240508T170000
DTSTAMP:20260407T072010
CREATED:20240419T171240Z
LAST-MODIFIED:20240503T163652Z
UID:7877-1715068800-1715187600@marketingeda.com
SUMMARY:ChipEx 2024
DESCRIPTION:ChipEx2024\, the largest annual event of the Israeli semiconductor industry\, will be held on May 7-8\, 2024 in Tel Aviv\, Israel. ChipEx2024 showcases companies including manufacturers\, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world’s leading experts address the industry’s most relevant issues. \nThe event is produced by ASG Ltd. in cooperation with SIA\, Semiconductor Industry Association and with Semi\, the largest global industry association. \nThe goal of ChipEx2024 is to update all professionals involved with the Israeli semiconductor industry with the latest technological innovations and future directions of the industry. \nChipEx2024 target audience are all people involved with the semiconductor industry including engineers\, R&D managers\, industry experts\, senior executives in microelectronics related companies\, multinational design centers\, consultants\, venture capital managers as well as electrical/electronic/computer science students & professors from the various universities around Israel. \nChipEx2024 consists of three main parts: \nVendors’ Exhibition \nThe ChipEx exhibition includes booths in various sizes for presentations and demonstrations of new design and development tools. This year\, the ChipEx2024 exhibition will take place on May 7\, 2024 at the Tel-Aviv Expo Center and will include industry vendors\, service providers\, and manufacturers of electronic design tools\, components and manufacturing equipment from Israel and around the globe. These exhibitors will exhibit and update the visitors with the latest developments in tools and services for the semiconductor industry. \nTechnical Seminar \nTechnical lectures given by industry experts\, senior executives from the semiconductor industry\, vendors\, and university professors. The format of the sessions intends to cultivate and promote an instructive and productive interchange of ideas and solutions among industry developers and designers. The lectures are divided to various tracks in separate halls and address the major topics related to the microelectronics industry. This year\, the ChipEx2024 technical seminar will take place on May 7\, 2024 at the Tel-Aviv Expo Center. \nChipEx2024 Executive Summit \nThe Closing session of ChipEx2024 will take place on May 8\, 2024 at Peres Center for Peace and Innovation and will include top industry figures and will act as the Executive summit of ChipEx2024 targeting Industry leaders and top executives from Israel and around the globe. \nChipEx2024 is a great opportunity for any industry vendor or service provider to meet its target audience as well as interact with the decision makers in the various Israeli semiconductor companies. \nWe invite you to take part in ChipEx2024 as an exhibitor\, a speaker and/or as a sponsor. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/chipex-2024/
LOCATION:Tel Aviv Convention Center\, Rokach Boulevard 101\, Tel Aviv\, Israel
CATEGORIES:Conference,EDA,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ChipEx-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240502T083000
DTEND;TZID=America/Los_Angeles:20240502T173000
DTSTAMP:20260407T072010
CREATED:20240415T181052Z
LAST-MODIFIED:20240415T181052Z
UID:7850-1714638600-1714671000@marketingeda.com
SUMMARY:TSMC 2024 Technology Workshop – Austin
DESCRIPTION:08:30 – 09:30\nRegistration & Partner Pavilion\n\n\n09:30 – 09:40\nWelcome & Opening Remarks\n\n\n09:40 – 10:00\nMarket Outlook – Powering AI Together\n\n\n10:00 – 10:30\nAdvanced Technology Leadership\n\n\n10:30 – 11:00\nCoffee Break & Ecosystem Pavilion\n\n\n11:00 – 11:25\nSpecialty Technology Leadership\n\n\n11:25 – 11:50\nManufacturing Excellence\n\n\n11:50 – 13:00\nLunch & Ecosystem Pavilion\n\n\n13:00 – 13:20\nAdvanced Technology Design Solutions\n\n\n13:20 – 13:40\nAdvanced Technology\n\n\n13:40 – 14:00\n3DFabric Technology\n\n\n14:00 – 14:30\nCoffee Break & Ecosystem Pavilion\n\n\n14:30 – 14:50\nAutomotive and eNVM Technology\n\n\n14:50 – 15:10\nIoT Technology\n\n\n15:10 – 15:30\nAdvanced RF and Analog Technology\n\n\n15:30 – 16:40\nSocial Hour\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2024-technology-workshop-austin/
LOCATION:JW Marriott Austin\, 110 E 2nd St\, Austin\, TX\, United States
CATEGORIES:EDA,Foundry,IP,Semiconductor,Workshop
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024-North-America.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240424T080000
DTEND;TZID=America/Los_Angeles:20240424T170000
DTSTAMP:20260407T072010
CREATED:20240325T163321Z
LAST-MODIFIED:20240325T163321Z
UID:7759-1713945600-1713978000@marketingeda.com
SUMMARY:TSMC 2024 Technology Symposium - North America
DESCRIPTION:Learn about:\n\nTSMC’s industry-leading HPC\, smartphone\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and TSMC-SoIC®\nTSMC’s manufacturing excellence\, capacity expansion plans\, and green manufacturing achievements\nTSMC’s Open Innovation Platform® ecosystem to speed up time-to-design\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2024-technology-symposium-north-america/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Foundry,Symposium
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024-North-America.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240421T080000
DTEND;TZID=America/Los_Angeles:20240424T170000
DTSTAMP:20260407T072010
CREATED:20240419T164152Z
LAST-MODIFIED:20240419T164318Z
UID:7873-1713686400-1713978000@marketingeda.com
SUMMARY:CICC 2024
DESCRIPTION:The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations\, exhibits\, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design problems\, improve circuit design techniques\, get exposure to new technology areas\, and network with peers\, authors and industry experts. \nThere are 3 days of Technical Sessions that include lecture presentations addressing state of the art developments in integrated circuit design. The Educational Sessions are a full day of tutorials instructed by recognized invited speakers. The Panels\, and Forums are presented throughout the conference to enrich the learning experience of the attendees. The Panel Discussions and Forums are presented by leaders from the IC industry. CICC includes an Exhibits Hall that is open in the evenings where Semiconductor manufacturers\, software tool suppliers\, silicon IP providers\, design-service houses\, and technical book publishers offer displays and demonstrations of their products. CICC is sponsored by the IEEE Solid-State Circuits Society and technically co-sponsored by the IEEE Electron Devices Society. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/cicc-2024/
LOCATION:DoubleTree by Hilton Denver\, 3203 Quebec Street\, Denver\, CO\, United States
CATEGORIES:Conference,EDA,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CICC-2024.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20240221T080000
DTEND;TZID=America/Los_Angeles:20240221T180000
DTSTAMP:20260407T072010
CREATED:20240216T221430Z
LAST-MODIFIED:20240216T221430Z
UID:7637-1708502400-1708538400@marketingeda.com
SUMMARY:Intel Foundry Services (IFS) Direct Connect
DESCRIPTION:Join us virtually to hear Pat Gelsinger and Stu Pann discuss progress in delivering the world’s first Systems Foundry for the AI Era to meet the ever-expanding demands of the Siliconomy. The keynote will feature special appearances by U.S. Secretary of Commerce Gina M. Raimondo and Microsoft Chairman and CEO Satya Nadella. Be sure to stick around for a panel discussion\, including industry leaders Rene Haas (Arm)\, Yuan Xing Lee (Broadcom)\, and Eric Fisher (MediaTek). \n\n\n\nWhat to Expect\n\n\n\n\n\n\n\n\n\nAll times in PST\nWednesday\, February 21\, 2024\n\n\n\n\n7:30am – 8:30am\nRegistration\, Breakfast\, and Demo Showcase\n\n\n8:30am – 9:30am\nPat Gelsinger and Stu Pann: A Systems Foundry for the AI Era with special appearances by: \n\nGina M. Raimondo\, United States Secretary of Commerce\nSatya Nadella\, Chairman and CEO\, Microsoft\nRene Haas\, CEO\, Arm\n\n\n\n\n9:30am – 10:00am\nCustomer Fireside Chat featuring: \n\nYuan Xing Lee\, VP of Central Engineering\, Broadcom\nEric Fisher\, President\, MediaTek North America\n\n\n\n\n10:00am – 10:30am\nAM Break and Demo Showcase\n\n\n10:30am – 12:00pm\nEcosystem Spotlight featuring: \n\nAart de Geus\, Executive Chair and Founder\, Synopsys\nMike Ellow\, Executive Vice President\, Siemens Digital Industries Software\nJohn Lee\, General Manager and Vice President for Electronics\, Semiconductors and Optics BU\, Ansys\nAnirudh Devgan\, President and CEO\, Cadence Design System\n\n\n\n\n12:00pm – 1:00pm\nNetworking Lunch and Demo Showcase\n\n\n1:00pm – 2:15pm\nDr. Ann Kelleher and Dr. Gary Patton: Delivering the Present and Inventing the Future: A Look Beyond 5N4Y\n\n\n2:15pm – 3:00pm\nDr. Choon Lee: Advanced Packaging and Test Solutions\n\n\n3:00pm – 3:20pm\nPM Break and Demo Showcase\n\n\n3:20pm – 3:50pm\nKeyvan Esfarjani: Transforming Intel Manufacturing featuring: \n\nJason Wang\, President\, UMC\n\n\n\n\n3:50pm – 4:00pm\nStu Pann: Wrap Up\n\n\n4:00pm – 4:45pm\nFireside Chat featuring: \n\nSam Altman\, Co-founder and CEO\, OpenAI\n\n\n\n\n4:45pm – 6:15pm\nNetworking Reception and Demo Showcase\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/intel-foundry-services-ifs-direct-connect/
LOCATION:San Jose Convention Center\, 150 W San Carlos Street\, San Jose\, CA\, 95113\, United States
CATEGORIES:EDA,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IFS-Direct-Connect.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20231115T080000
DTEND;TZID=Asia/Shanghai:20231115T170000
DTSTAMP:20260407T072010
CREATED:20231108T013000Z
LAST-MODIFIED:20231108T013000Z
UID:7050-1700035200-1700067600@marketingeda.com
SUMMARY:TSMC 2023 Open Innovation Platform Ecosystem Forum - China
DESCRIPTION:Join us at the TSMC 2023 China OIP Ecosystem Forum!\nChina OIP Ecosystem Forum (In-Person Event)\nDate: November 15\, 2023 (Wednesday) \nTime: 9:30a.m. – 5:45p.m. \nVenue: Shangri-La Nanjing Hotel \n329 Zhongyang Road\, Gulou District\, Nanjing\, Jiangsu Province\, 210037 China \n  \nChina OIP Ecosystem Forum (Online VOD Event)\nDate: November 22\, 2023 (Wednesday) \nWebsite link to be provided in November. \nLearn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N2\, N3/N3E/N3P/N3AE\, N4/N4P\, N5/N5A\, N6/N6e/N6RF/N7\, N12e\, and N22\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem specific TSMC reference flow implementations\, P&R optimization\, machine learn-ing to improve design quality and productivity\, and cloud-based design solutions\nSuccessful \, real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform Ecosystem members and TSMC customers to speed up time-to-design and time-to-market\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: events@pl-marketing.biz. \nWe look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2023-open-innovation-platform-ecosystem-forum-china/
LOCATION:Shangri-La Nanjing Hotel\, 29 Zhongyang Road\, Gulou District\, Nanjing\, China
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-OIP-China.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Taipei:20231108T080000
DTEND;TZID=Asia/Taipei:20231108T170000
DTSTAMP:20260407T072010
CREATED:20230913T234027Z
LAST-MODIFIED:20230913T234027Z
UID:6800-1699430400-1699462800@marketingeda.com
SUMMARY:TSMC 2023 Taiwan OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N2\, N3/N3E/N3P/N3AE\, N4/N4P\, N5/N5A\, N6/N6e/N6RF/N7\, N12e\, and N22\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem specific TSMC reference flow implementations\, P&R optimization\, machine learn-ing to improve design quality and productivity\, and cloud-based design solutions\nSuccessful \, real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: events@pl-marketing.biz. \nWe look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2023-taiwan-oip-ecosystem-forum/
LOCATION:Ambassador Hotel Hsinchu\, 0F\, No.188\, Sec. 2\, Zhonghua Rd.\, Hsinchu City\, Taiwan
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20231019T080000
DTEND;TZID=Europe/Berlin:20231019T170000
DTSTAMP:20260407T072010
CREATED:20231017T164930Z
LAST-MODIFIED:20231017T164930Z
UID:6963-1697702400-1697734800@marketingeda.com
SUMMARY:Samsung Foundry Forum 2023 EMEA
DESCRIPTION:We’re inviting global partners and customers to our upcoming Samsung Foundry Forum (SFF) and Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2023. The events will provide opportunities to share insights and innovative technologies to build a strong foundry ecosystem to accelerate innovation beyond boundaries. Join us to experience the spirit and power of innovation. SFF & SAFE™ Forum 2023 will be held in several different countries around the world. Check the map below to see where our other forums will be held this year. \n  \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/samsung-foundry-forum-2023-emea/
LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-Foundry-Forum-2023-EMEA.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Tokyo:20231017T120000
DTEND;TZID=Asia/Tokyo:20231017T173000
DTSTAMP:20260407T072010
CREATED:20231012T003512Z
LAST-MODIFIED:20231012T003544Z
UID:6941-1697544000-1697563800@marketingeda.com
SUMMARY:Samsung Foundry Forum 2023 Tokyo\, Japan
DESCRIPTION:Welcoming Remarks\n\nSeishu Arai \nVP\, Head of Japan Office\, Samsung Electronics \n\nSamsung Keynote\n\nSiyoung Choi \nPresident and GM\, Foundry Business\, Samsung Electronics \nGuest Speech I\n\nJunichiro Makino \nProfessor\, Kobe University \nGuest Speech II\n\nSumiko Kanamori \nAutomotive HPC\, Analog & Power Solutions Gr. Digital Head of H/W Unit\, VP\, Renesas Electronics Corporation \nGuest Speech III\n\nKazuoki Matsugatani \nSenior Director\, R&D Center\, Denso Corporation \nProcess Technology\n\nJa-Hum Ku \nEVP\, Head of Technology Development\,Samsung Electronics \nDesign Platform\n\nJongwook Kye \nEVP\, Head of Foundry Design Platform Development\, Samsung Electronics \nManufacturing Excellence\n\nSang Sup Jeong \nEVP\, Head of Foundry Manufacturing Technology Center\, Samsung Electronics \nBusiness & Customers\n\nSang-Pil Sim \nEVP\, Head of Worldwide Sales and Marketing\, Samsung Electronics \nAutomotive and HPC Solutions\n\nJongshin Shin \nEVP\, Head of Foundry IP Ecosystem\, Samsung Electronics \nClosing Remarks\n\nSang-Pil Sim \nEVP\, Head of Worldwide Sales and Marketing\, Samsung Electronics \n\n\n\n\n\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/samsung-foundry-forum-2023-tokyo-japan/
LOCATION:Belle Salle Tokyo Nihonbashi\, 2-7-1 Nihombashi\, Chuo-ku\, Tokyo\, Japan
CATEGORIES:EDA,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-Foundry-Forum-2023-Tokyo.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Amsterdam:20231004T080000
DTEND;TZID=Europe/Amsterdam:20231004T170000
DTSTAMP:20260407T072010
CREATED:20230913T233730Z
LAST-MODIFIED:20230913T233730Z
UID:6798-1696406400-1696438800@marketingeda.com
SUMMARY:TSMC 2023 Europe OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N2\, N3/N3E/N3P/N3AE\, N4/N4P\, N5/N5A\, N6/N6e/N6RF/N7\, N12e\, and N22\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem specific TSMC reference flow implementations\, P&R optimization\, machine learn-ing to improve design quality and productivity\, and cloud-based design solutions\nSuccessful \, real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2023-europe-oip-ecosystem-forum/
LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20230927T090000
DTEND;TZID=America/Los_Angeles:20230927T170000
DTSTAMP:20260407T072010
CREATED:20230913T232432Z
LAST-MODIFIED:20230920T165423Z
UID:6795-1695805200-1695834000@marketingeda.com
SUMMARY:TSMC 2023 North America OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N2\, N3/N3E/N3P/N3AE\, N4/N4P\, N5/N5A\, N6/N6e/N6RF/N7\, N12e\, and N22\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem specific TSMC reference flow implementations\, P&R optimization\, machine learn-ing to improve design quality and productivity\, and cloud-based design solutions\nSuccessful \, real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2023 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2023-north-america-oip-ecosystem-forum/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20230927T080000
DTEND;TZID=Europe/Berlin:20230928T170000
DTSTAMP:20260407T072011
CREATED:20230923T041526Z
LAST-MODIFIED:20230923T041526Z
UID:6865-1695801600-1695920400@marketingeda.com
SUMMARY:GTS 2023 - Munich
DESCRIPTION:Register now and join us at GlobalFoundries Technology Summit 2023! \nGF Technology Summit (GTS) 2023 is our worldwide\, annual series of technology-focused events. GTS brings together leaders from the commercial\, business and research worlds to understand the latest technology challenges and opportunities\, and partner to create the most innovative applications and solutions. \nGTS 2023 Highlights \nThis year’s GTS will focus on GF’s industry and technology differentiation\, highlighted by three key areas of innovation: \n\nPower\, power\, power – Ultra-low power technology platforms and applications\, power management and power delivery solutions\nBest RF wins – RF and mmWave connectivity solutions for mobile and infrastructure applications\nIntelligence & security – Localized\, low-power intelligent applications with secure eNVM\n\nGF’s market-focused development includes partnerships across the broad electronics ecosystem – OEM\, fabless\, OSAT\, EDA and IP. The results of those collaborations will be seen and heard in the guest keynote addresses\, detailed technology roadmaps\, hardware and software demonstrations\, and leading applications for automotive\, IoT\, smart mobile\, datacenter and communications infrastructure markets. \nNew in 2023! GF Technology\, Business and Commercial teams will be at GTS to host 1:1 and small group meetings during the event. Please consider if there is someone you would like to meet with during your time in Munich – requests will be submitted during the registration process. \n  \nGTS Program Overview \nDay One Programming: 12:00 – 16:00 Networking Hour to follow \nCEO Dr. Thomas Caulfield\, joined by leaders in the fabless semiconductor and end-markets industries\, shares GF’s corporate vision and roadmap of manufacturing the essential chips we rely on for life\, work and connection. \nDay Two Programming: 9:00 – 14:00 with Networking Reception to follow \nGF’s technology and product management leaders share the company’s detailed technology and solutions roadmap\, joined by leaders in the semiconductor design and manufacturing ecosystem – working together to deliver a new era of more. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/gts-2023-munich/
LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany
CATEGORIES:EDA,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GTS-2023-Munich.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20230829T080000
DTEND;TZID=America/Los_Angeles:20230830T170000
DTSTAMP:20260407T072011
CREATED:20230822T171451Z
LAST-MODIFIED:20230822T171451Z
UID:6738-1693296000-1693414800@marketingeda.com
SUMMARY:GlobalFoundries Technology Summit 2023
DESCRIPTION:Register now and join us at GlobalFoundries Technology Summit 2023! \nGF Technology Summit (GTS) 2023 is our worldwide\, annual series of technology-focused events. GTS brings together leaders from the commercial\, business and research worlds to understand the latest technology challenges and opportunities\, and partner to create the most innovative applications and solutions. \nGTS 2023 Highlights \nThis year’s GTS will focus on GF’s industry and technology differentiation\, highlighted by three key areas of innovation: \n\nPower\, power\, power – Ultra-low power technology platforms and applications\, power management and power delivery solutions\nBest RF wins – RF and mmWave connectivity solutions for mobile and infrastructure applications\nIntelligence & security – Localized\, low-power intelligent applications with secure eNVM\n\nGF’s market-focused development includes partnerships across the broad electronics ecosystem – OEM\, fabless\, OSAT\, EDA and IP. The results of those collaborations will be seen and heard in the guest keynote addresses\, detailed technology roadmaps\, hardware and software demonstrations\, and leading applications for automotive\, IoT\, smart mobile\, datacenter and communications infrastructure markets. \nNew in 2023! GF Technology\, Business and Commercial teams will be at GTS to host 1:1 and small group meetings during the event. Please consider if there is someone you would like to meet with during your time in San Jose – requests will be submitted during the registration process. \n  \nGTS Program Overview \nDay One Programming: 12:00 pm – 4:00 pm PT with Networking Reception to follow \nCEO Dr. Thomas Caulfield\, joined by leaders in the fabless semiconductor and end-markets industries\, shares GF’s corporate vision and roadmap of manufacturing the essential chips we rely on for life\, work and connection. \nDay Two Programming: 9:00 am – 1:00 pm PT with Networking Reception to follow \nGF’s technology and product management leaders share the company’s detailed technology and solutions roadmap\, joined by leaders in the semiconductor design and manufacturing ecosystem – working together to deliver a new era of more. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/globalfoundries-technology-summit-2023/
LOCATION:San Jose Marriott\, 301 S Market Street\, San Jose\, CA\, United States
CATEGORIES:Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GTS-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20230720T080000
DTEND;TZID=America/Los_Angeles:20230720T090000
DTSTAMP:20260407T072011
CREATED:20230629T192722Z
LAST-MODIFIED:20230629T192722Z
UID:6565-1689840000-1689843600@marketingeda.com
SUMMARY:3D-IC Foundry Frameworks
DESCRIPTION:Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC\, Samsung\, and Intel and how Ansys simulation tools and workflows fit into those frameworks. \n\n\nAbout this Webinar\nSemiconductor applications such as Mobile (5G)\, Automotive\, and Datacenter (HPC\, AI) demand better scaling\, performance\, and lower power usage. Advanced packaging is moving towards 3DIC systems to address these needs\, as evidenced by the technology directions from TSMC\, Samsung\, and Intel. We’ll present a comprehensive overview of these technologies\, and the Ansys flows to address EMIR\, Thermal integrity\, and mechanical stress challenges posed by these 3DIC systems. \nWhat You Will Learn\n\nAdvanced 3DIC packaging trends and challenges faced by engineers\n3DIC system data flows from P&R to analysis tools\nEMIR and Thermal Integrity flows using RedHawk SCTM and RedHawk SC ElectroThermalTM\n\n\n\n\n\nSpeakers\nMallik Vusirikala\n\nMallik Vusirikala is a Director Product Specialist at Ansys\, responsible for strategic directions and deployment of the RedHawk product line for Power integrity and related solutions. He has been with Ansys for over 12 years. Prior to that he was with Texas instruments in the CAD flow/ methodology group developing multiple flows for standard cell library creation. He obtained his bachelor’s degree with Honors in Computer Science and Engineering from the National Institute of Technology\, Hamirpur (India). \nDr. Lang Lin\n\nDr. Lang Lin is a principal product manager of Ansys Inc. based in San Jose\, California. He is dedicated into developing 3D-IC multiphysics simulation and security verification methodologies to worldwide semiconductor customers. Before joining Ansys\, he worked for Intel Corp. as a design engineer. He has published 50+ technical papers and patents\, served as reviewer\, program committee or tutorial speaker of several IEEE conferences such as HOST\, ICCAD\, DAC and ASPDAC. \n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/3d-ic-foundry-frameworks/
CATEGORIES:EDA,Foundry,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Ansys-July-20-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Tokyo:20230630T080000
DTEND;TZID=Asia/Tokyo:20230630T170000
DTSTAMP:20260407T072011
CREATED:20230621T193324Z
LAST-MODIFIED:20230621T194040Z
UID:6557-1688112000-1688144400@marketingeda.com
SUMMARY:TSMC 2023 Technology Symposium - Japan
DESCRIPTION:Japan Technology Symposium\n\nDate\nFriday\, June 30\nTime\n9:30 a.m. – 5:20 p.m.\nVenue\nThe Yokohama Bay Hotel Tokyu\n2-3-7\, Minatomirai\, Nishi-ku\, Yokohama 220-8543\nRegistration will be closed on 6/21. Seats are limited.\n\nVoD (Video on Demand) will be available starting from 7/21.\nRegistration will close on 7/12. \nGet the latest on:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2023-technology-symposium-japan/
LOCATION:The Yokohama Bay Hotel Tokyu\, 2-3-7\, Minatomirai\, Nishi-ku\, Yokohama\, Japan
CATEGORIES:Foundry,Symposium
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Japan.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20230627T080000
DTEND;TZID=America/Los_Angeles:20230628T170000
DTSTAMP:20260407T072011
CREATED:20230620T180400Z
LAST-MODIFIED:20230620T180630Z
UID:6541-1687852800-1687971600@marketingeda.com
SUMMARY:SFF & SAFE™ Forum 2023 San Jose\, CA
DESCRIPTION:Day 1 June 27th\, 2023\n\n\n\n\n12:00 – 1:00pm PDT\nNetworking Lunch & Registration\n\n\n\n\n1:00 – 1:05pm PDT\nOpening\nJinman Han\nEVP\, Head of DSA Office\,\nSamsung Electronics\n\n\n\n\n1:05 – 1:20pm PDT\nSamsung Keynote\nSiyoung Choi\nPresident and GM\, Foundry Business\,\nSamsung Electronics\n\n\n\n\n1:20 – 1:35pm PDT\nAn Energy Efficient Future of AI\nJoe Macri\nSVP\, CTO of Computing & Graphics\,\nAMD\n\n\n\n\n1:35 – 1:50pm PDT\nMeeting System User Demands in a Slowing Moore’s Law Era\nChidi Chidambaram\nFellow\, Technology and Foundry Engineering\, Qualcomm\n\n\n\n\n1:50 – 2:05pm PDT\nBreak\n\n\n\n\n2:05 – 2:35pm PDT\nProcess Technology\nGitae Jeong\nEVP\, Head of Technology Development\,\nSamsung Electronics\nOhkyum Kwon\nVP\, Head of 8-inch Manufacturing Technology Team\,\nSamsung Electronics\n\n\n\n\n2:35 – 2:50pm PDT\nManufacturing Excellence\nSang Sup Jeong\nEVP\, Head of Foundry Manufacturing Technology Center\,\nSamsung Electronics\n\n\n\n\n2:50 – 3:10pm PDT\nDesign Platform\nJongwook Kye\nEVP\, Head of Foundry Design Platform Development\,\nSamsung Electronics\n\n\n\n\n3:10 – 3:25pm PDT\nSustainability\nClaire Hyun\nJung Seo\nVP\, DS Corporate Sustainability Management Office\,\nSamsung Electronics\n\n\n\n\n3:25 – 3:40pm PDT\nBreak\n\n\n\n\n3:40 – 3:55pm PDT\nRiscV\, AI and the Next Generation of Compute\nJim Keller\nPresident and CEO\,\nTenstorrent\n\n\n\n\n3:55 – 4:15pm PDT\nAdvanced Heterogeneous Integration\nMoonSoo Kang\nEVP\, Head of AVP Business Team\,\nSamsung Electronics\n\n\n\n\n4:15 – 4:35pm PDT\nBusiness & Customers\nSang-Pil Sim\nEVP\, Head of Foundry Worldwide Sales and Marketing\,\nSamsung Electronics\n\n\n\n\n4:35 – 4:40pm PDT\nClosing\nMarco Chisari\nEVP\, Head of U.S. Foundry and SSIC\,\nSamsung Electronics\n\n\n\n\n4:40 – 5:30pm PDT\nPartner Pavilion & Networking\n\nDay 2 June 28th\, 2023\n\n\n\n\n9:00 – 10:00am PDT\nRegistration\n\n\n\n\n10:00 – 10:05am PDT\nOpening\nJinman Han\nEVP\, Head of DSA Office\,\nSamsung Electronics\n\n\n\n\n10:05 – 10:15am PDT\nWelcoming Remarks\nJongwook Kye\nEVP\, Head of Foundry Design Platform Development\,\nSamsung Electronics\n\n\n\n\n10:15 – 10:35am PDT\nThe 3Ps of 3D-ICs\nAjei Gopal\nPresident and CEO\,\nAnsys\n\n\n\n\n10:35 – 10:55am PDT\nUnleashing a New Era of Compute with Chiplet-Powered Silicon\nTony E. Pialis\nPresident and CEO\,\nAlphawave Semi\n\n\n\n\n10:55 – 11:15am PDT\nHigh-Performance Design in Samsung Foundry\nLeon Stok\nVP\, EDA\, IBM Infrastructure\,\nIBM\n\n\n\n\n11:15 – 11:35am PDT\nSamsung Foundry Process & Business Update\nGibong Jeong\nEVP\, Head of Foundry Business Development Team\,\nSamsung Electronics\n\n\n\n\n11:35 – 12:45pm PDT\nLunch\n\n\n\n\n12:45 – 1:00pm PDT\nBreak\n\n\n\n\n1:00 – 4:15pm PDT\nTech Session I: Advanced Technology and Design Infrastructure\nSangyun Kim\n(Tech Talk) VP\, Head of Foundry Design Technology Team\,\nSamsung Electronics\nSynopsys\, ARM\, ADTechnology\, Cadence\, Ansys\n\n\n\n\n1:00 – 4:15pm PDT\nTech Session II: Advanced Design Solutions for HPC and Automotive\nJongshin Shin\n(Tech Talk) EVP\, Head of Foundry IP Ecosystem\,\nSamsung Electronics\nCadence\, Alphawave\, Samsung AVP\, CoAsia\, Siemens\, Synopsys\, SemiFive\n\n\n\n\n4:15 – 4:30pm PDT\nClosing\nMarco Chisari\nEVP\, Head of U.S. Foundry and SSIC\,\nSamsung Electronics\n\n\n\n\n4:30 – 5:30pm PDT\nPartner Pavilion & Networking\n\n\n\n\n\n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/sff-safe-forum-2023-san-jose-ca/
LOCATION:Signia by Hilton\, 170 S Market Street\, San Jose\, CA\, 95113\, United States
CATEGORIES:EDA,Forum,Foundry
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SAFE-San-Jose-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Karachi:20230108T080000
DTEND;TZID=Asia/Karachi:20230112T170000
DTSTAMP:20260407T072011
CREATED:20221122T174938Z
LAST-MODIFIED:20221122T174938Z
UID:5464-1673164800-1673542800@marketingeda.com
SUMMARY:VLSID 2023
DESCRIPTION:International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems\, is attended by over 2000 engineers\, students & faculty\, industry\, academia\, researchers\, bureaucrats and government bodies. \nSemiconductors are the intangible backbone of every industry across the globe. Silicon took the lion’s share over the past decades and remained the primary enabler for digitization of the world. With scaling reaching its fundamental limits\, it is time to look at addressing technological challenges at higher levels of abstraction in CMOS based design and at the same time\, look beyond Silicon for further performance enhancement. \nVLSID 2023 – the first physical conference post pandemic\, acts a platform for industry and academia alike to discuss\, deliberate and explore into the frontiers of semiconductor eco-system that could eventually enable disruptive technologies for global digitalization \nVLSID 2023 will be hosted in the best stand-alone convention center\, HICC Hyderabad. The city is home to some of the best universities\, top global companies in research and manufacturing\, strong defense sector and thriving start-ups. Hyderabad has a rich culture with numerous historic places to visit and world famous Hyderabad Biryani to cherish. We look forward to hosting and giving you the best experience at the conference. We encourage your participation to the conference and call you to be part of the exciting know-how’s of the industry and spend quality time exploring Hyderabad. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/vlsid-2023/
LOCATION:Hyderabad International Convention Cente\, Hyderabad\, Telangana\, India
CATEGORIES:Conference,EDA,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/VLSID-2023.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Amsterdam:20221108T090000
DTEND;TZID=Europe/Amsterdam:20221108T180000
DTSTAMP:20260407T072011
CREATED:20221104T201045Z
LAST-MODIFIED:20221104T201045Z
UID:5373-1667898000-1667930400@marketingeda.com
SUMMARY:TSMC 2022 EU OIP Ecosystem Forum
DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/tsmc-2022-eu-oip-ecosystem-forum/
LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands
CATEGORIES:Forum,Foundry,IP
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2022-EU.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20221101T080000
DTEND;TZID=America/Los_Angeles:20221102T170000
DTSTAMP:20260407T072011
CREATED:20221012T185511Z
LAST-MODIFIED:20221012T185511Z
UID:5300-1667289600-1667408400@marketingeda.com
SUMMARY:Linley Fall Processor Conference 2022
DESCRIPTION:TechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights – a Hybrid Event\, will be held in Santa Clara\, California on November 1-2\, 2022. If you cannot attend in person\, tune in to our virtual livestream or watch the presentations OnDemand at your convenience. \nPresentations will address processors and IP cores for AI applications\, embedded\, data-center\, automotive\, and server designs. In-person attendees will be able to hear presentations and interact with the speakers during Q&A\, lunch\, and the networking reception. \nAnalyst and Industry Keynotes\nLinley Gwennap\, principal analyst\, TechInsights\, will open the conference with an overview of the latest market\, technologies\, equipment-design\, and silicon trends. We will also feature a keynote from another industry leader. \nIn-Depth Technical Sessions\nUnlike many conferences\, we ensure that the presentations deliver real technical content\, not marketing hype. We are the conference of choice for many companies who announce new products or make technology disclosures. \nTechInsights analysts carefully select session topics and choose leading speakers who are experts in their fields. In addition\, the analysts ensure that the content of the presentations are full of insightful\, technical information that will help attendees select the right components and systems for their next project. The program will feature talks and panel discussions covering a broad range of topics that will be announced later. \nWhy Attend\nTechInsights Processor Conferences have been called the highest quality of their kind by previous attendees because they provide a unique opportunity to hear\, question\, and network with key providers of advanced technology products. \nThe Conferences analyze products and design strategies in a particular technology segment\, providing information that engineers can immediately use to improve their designs. The events feature in-depth technical presentations from our own analysts as well as leading technologists from the industry. This conference is intended for system designers\, chip designers\, software designers\, OEM/ODMs\, press\, and financial analysts. \nCovid-19 Policies and Precautions\nWe are working closely with the Hyatt Regency to reduce the risk of attending our in-person event. Individuals and their employers\, however\, must decide what level of risk is acceptable. For those unable to attend in person\, we offer our virtual livestream. \nAttendees will be required to provide proof of vaccination before receiving their conference badge. Consistent with local health orders\, masks are now recommended but not required. Policies are subject to change; we will update this page as needed. \nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...
URL:https://marketingeda.com/event/linley-fall-processor-conference-2022/
LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Conference,EDA,Foundry,IP
ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/Linley-Fall-2022.png
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