BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.15.20//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20200308T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20201101T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20210314T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20211107T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Karachi BEGIN:STANDARD TZOFFSETFROM:+0500 TZOFFSETTO:+0500 TZNAME:PKT DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Amsterdam BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Berlin BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Taipei BEGIN:STANDARD TZOFFSETFROM:+0800 TZOFFSETTO:+0800 TZNAME:CST DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Shanghai BEGIN:STANDARD TZOFFSETFROM:+0800 TZOFFSETTO:+0800 TZNAME:CST DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Jerusalem BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20210326T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20211030T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20220325T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20221029T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20230324T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20231028T230000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20200308T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20201101T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20210314T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20211107T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20220313T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20221106T060000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230720T080000 DTEND;TZID=America/Los_Angeles:20230720T090000 DTSTAMP:20260409T100310 CREATED:20230629T192722Z LAST-MODIFIED:20230629T192722Z UID:6565-1689840000-1689843600@marketingeda.com SUMMARY:3D-IC Foundry Frameworks DESCRIPTION:Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC\, Samsung\, and Intel and how Ansys simulation tools and workflows fit into those frameworks. \n\n\nAbout this Webinar\nSemiconductor applications such as Mobile (5G)\, Automotive\, and Datacenter (HPC\, AI) demand better scaling\, performance\, and lower power usage. Advanced packaging is moving towards 3DIC systems to address these needs\, as evidenced by the technology directions from TSMC\, Samsung\, and Intel. We’ll present a comprehensive overview of these technologies\, and the Ansys flows to address EMIR\, Thermal integrity\, and mechanical stress challenges posed by these 3DIC systems. \nWhat You Will Learn\n\nAdvanced 3DIC packaging trends and challenges faced by engineers\n3DIC system data flows from P&R to analysis tools\nEMIR and Thermal Integrity flows using RedHawk SCTM and RedHawk SC ElectroThermalTM\n\n\n\n\n\nSpeakers\nMallik Vusirikala\n\nMallik Vusirikala is a Director Product Specialist at Ansys\, responsible for strategic directions and deployment of the RedHawk product line for Power integrity and related solutions. He has been with Ansys for over 12 years. Prior to that he was with Texas instruments in the CAD flow/ methodology group developing multiple flows for standard cell library creation. He obtained his bachelor’s degree with Honors in Computer Science and Engineering from the National Institute of Technology\, Hamirpur (India). \nDr. Lang Lin\n\nDr. Lang Lin is a principal product manager of Ansys Inc. based in San Jose\, California. He is dedicated into developing 3D-IC multiphysics simulation and security verification methodologies to worldwide semiconductor customers. Before joining Ansys\, he worked for Intel Corp. as a design engineer. He has published 50+ technical papers and patents\, served as reviewer\, program committee or tutorial speaker of several IEEE conferences such as HOST\, ICCAD\, DAC and ASPDAC. \n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/3d-ic-foundry-frameworks/ CATEGORIES:EDA,Foundry,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Ansys-July-20-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20230630T080000 DTEND;TZID=Asia/Tokyo:20230630T170000 DTSTAMP:20260409T100310 CREATED:20230621T193324Z LAST-MODIFIED:20230621T194040Z UID:6557-1688112000-1688144400@marketingeda.com SUMMARY:TSMC 2023 Technology Symposium - Japan DESCRIPTION:Japan Technology Symposium\n\nDate\nFriday\, June 30\nTime\n9:30 a.m. – 5:20 p.m.\nVenue\nThe Yokohama Bay Hotel Tokyu\n2-3-7\, Minatomirai\, Nishi-ku\, Yokohama 220-8543\nRegistration will be closed on 6/21. Seats are limited.\n\nVoD (Video on Demand) will be available starting from 7/21.\nRegistration will close on 7/12. \nGet the latest on:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2023-technology-symposium-japan/ LOCATION:The Yokohama Bay Hotel Tokyu\, 2-3-7\, Minatomirai\, Nishi-ku\, Yokohama\, Japan CATEGORIES:Foundry,Symposium ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Japan.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230627T080000 DTEND;TZID=America/Los_Angeles:20230628T170000 DTSTAMP:20260409T100310 CREATED:20230620T180400Z LAST-MODIFIED:20230620T180630Z UID:6541-1687852800-1687971600@marketingeda.com SUMMARY:SFF & SAFE™ Forum 2023 San Jose\, CA DESCRIPTION:Day 1 June 27th\, 2023\n\n\n\n\n12:00 – 1:00pm PDT\nNetworking Lunch & Registration\n\n\n\n\n1:00 – 1:05pm PDT\nOpening\nJinman Han\nEVP\, Head of DSA Office\,\nSamsung Electronics\n\n\n\n\n1:05 – 1:20pm PDT\nSamsung Keynote\nSiyoung Choi\nPresident and GM\, Foundry Business\,\nSamsung Electronics\n\n\n\n\n1:20 – 1:35pm PDT\nAn Energy Efficient Future of AI\nJoe Macri\nSVP\, CTO of Computing & Graphics\,\nAMD\n\n\n\n\n1:35 – 1:50pm PDT\nMeeting System User Demands in a Slowing Moore’s Law Era\nChidi Chidambaram\nFellow\, Technology and Foundry Engineering\, Qualcomm\n\n\n\n\n1:50 – 2:05pm PDT\nBreak\n\n\n\n\n2:05 – 2:35pm PDT\nProcess Technology\nGitae Jeong\nEVP\, Head of Technology Development\,\nSamsung Electronics\nOhkyum Kwon\nVP\, Head of 8-inch Manufacturing Technology Team\,\nSamsung Electronics\n\n\n\n\n2:35 – 2:50pm PDT\nManufacturing Excellence\nSang Sup Jeong\nEVP\, Head of Foundry Manufacturing Technology Center\,\nSamsung Electronics\n\n\n\n\n2:50 – 3:10pm PDT\nDesign Platform\nJongwook Kye\nEVP\, Head of Foundry Design Platform Development\,\nSamsung Electronics\n\n\n\n\n3:10 – 3:25pm PDT\nSustainability\nClaire Hyun\nJung Seo\nVP\, DS Corporate Sustainability Management Office\,\nSamsung Electronics\n\n\n\n\n3:25 – 3:40pm PDT\nBreak\n\n\n\n\n3:40 – 3:55pm PDT\nRiscV\, AI and the Next Generation of Compute\nJim Keller\nPresident and CEO\,\nTenstorrent\n\n\n\n\n3:55 – 4:15pm PDT\nAdvanced Heterogeneous Integration\nMoonSoo Kang\nEVP\, Head of AVP Business Team\,\nSamsung Electronics\n\n\n\n\n4:15 – 4:35pm PDT\nBusiness & Customers\nSang-Pil Sim\nEVP\, Head of Foundry Worldwide Sales and Marketing\,\nSamsung Electronics\n\n\n\n\n4:35 – 4:40pm PDT\nClosing\nMarco Chisari\nEVP\, Head of U.S. Foundry and SSIC\,\nSamsung Electronics\n\n\n\n\n4:40 – 5:30pm PDT\nPartner Pavilion & Networking\n\nDay 2 June 28th\, 2023\n\n\n\n\n9:00 – 10:00am PDT\nRegistration\n\n\n\n\n10:00 – 10:05am PDT\nOpening\nJinman Han\nEVP\, Head of DSA Office\,\nSamsung Electronics\n\n\n\n\n10:05 – 10:15am PDT\nWelcoming Remarks\nJongwook Kye\nEVP\, Head of Foundry Design Platform Development\,\nSamsung Electronics\n\n\n\n\n10:15 – 10:35am PDT\nThe 3Ps of 3D-ICs\nAjei Gopal\nPresident and CEO\,\nAnsys\n\n\n\n\n10:35 – 10:55am PDT\nUnleashing a New Era of Compute with Chiplet-Powered Silicon\nTony E. Pialis\nPresident and CEO\,\nAlphawave Semi\n\n\n\n\n10:55 – 11:15am PDT\nHigh-Performance Design in Samsung Foundry\nLeon Stok\nVP\, EDA\, IBM Infrastructure\,\nIBM\n\n\n\n\n11:15 – 11:35am PDT\nSamsung Foundry Process & Business Update\nGibong Jeong\nEVP\, Head of Foundry Business Development Team\,\nSamsung Electronics\n\n\n\n\n11:35 – 12:45pm PDT\nLunch\n\n\n\n\n12:45 – 1:00pm PDT\nBreak\n\n\n\n\n1:00 – 4:15pm PDT\nTech Session I: Advanced Technology and Design Infrastructure\nSangyun Kim\n(Tech Talk) VP\, Head of Foundry Design Technology Team\,\nSamsung Electronics\nSynopsys\, ARM\, ADTechnology\, Cadence\, Ansys\n\n\n\n\n1:00 – 4:15pm PDT\nTech Session II: Advanced Design Solutions for HPC and Automotive\nJongshin Shin\n(Tech Talk) EVP\, Head of Foundry IP Ecosystem\,\nSamsung Electronics\nCadence\, Alphawave\, Samsung AVP\, CoAsia\, Siemens\, Synopsys\, SemiFive\n\n\n\n\n4:15 – 4:30pm PDT\nClosing\nMarco Chisari\nEVP\, Head of U.S. Foundry and SSIC\,\nSamsung Electronics\n\n\n\n\n4:30 – 5:30pm PDT\nPartner Pavilion & Networking\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/sff-safe-forum-2023-san-jose-ca/ LOCATION:Signia by Hilton\, 170 S Market Street\, San Jose\, CA\, 95113\, United States CATEGORIES:EDA,Forum,Foundry ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SAFE-San-Jose-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Karachi:20230108T080000 DTEND;TZID=Asia/Karachi:20230112T170000 DTSTAMP:20260409T100310 CREATED:20221122T174938Z LAST-MODIFIED:20221122T174938Z UID:5464-1673164800-1673542800@marketingeda.com SUMMARY:VLSID 2023 DESCRIPTION:International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems\, is attended by over 2000 engineers\, students & faculty\, industry\, academia\, researchers\, bureaucrats and government bodies. \nSemiconductors are the intangible backbone of every industry across the globe. Silicon took the lion’s share over the past decades and remained the primary enabler for digitization of the world. With scaling reaching its fundamental limits\, it is time to look at addressing technological challenges at higher levels of abstraction in CMOS based design and at the same time\, look beyond Silicon for further performance enhancement. \nVLSID 2023 – the first physical conference post pandemic\, acts a platform for industry and academia alike to discuss\, deliberate and explore into the frontiers of semiconductor eco-system that could eventually enable disruptive technologies for global digitalization \nVLSID 2023 will be hosted in the best stand-alone convention center\, HICC Hyderabad. The city is home to some of the best universities\, top global companies in research and manufacturing\, strong defense sector and thriving start-ups. Hyderabad has a rich culture with numerous historic places to visit and world famous Hyderabad Biryani to cherish. We look forward to hosting and giving you the best experience at the conference. We encourage your participation to the conference and call you to be part of the exciting know-how’s of the industry and spend quality time exploring Hyderabad. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/vlsid-2023/ LOCATION:Hyderabad International Convention Cente\, Hyderabad\, Telangana\, India CATEGORIES:Conference,EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/VLSID-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Amsterdam:20221108T090000 DTEND;TZID=Europe/Amsterdam:20221108T180000 DTSTAMP:20260409T100310 CREATED:20221104T201045Z LAST-MODIFIED:20221104T201045Z UID:5373-1667898000-1667930400@marketingeda.com SUMMARY:TSMC 2022 EU OIP Ecosystem Forum DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2022-eu-oip-ecosystem-forum/ LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands CATEGORIES:Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2022-EU.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221101T080000 DTEND;TZID=America/Los_Angeles:20221102T170000 DTSTAMP:20260409T100310 CREATED:20221012T185511Z LAST-MODIFIED:20221012T185511Z UID:5300-1667289600-1667408400@marketingeda.com SUMMARY:Linley Fall Processor Conference 2022 DESCRIPTION:TechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights – a Hybrid Event\, will be held in Santa Clara\, California on November 1-2\, 2022. If you cannot attend in person\, tune in to our virtual livestream or watch the presentations OnDemand at your convenience. \nPresentations will address processors and IP cores for AI applications\, embedded\, data-center\, automotive\, and server designs. In-person attendees will be able to hear presentations and interact with the speakers during Q&A\, lunch\, and the networking reception. \nAnalyst and Industry Keynotes\nLinley Gwennap\, principal analyst\, TechInsights\, will open the conference with an overview of the latest market\, technologies\, equipment-design\, and silicon trends. We will also feature a keynote from another industry leader. \nIn-Depth Technical Sessions\nUnlike many conferences\, we ensure that the presentations deliver real technical content\, not marketing hype. We are the conference of choice for many companies who announce new products or make technology disclosures. \nTechInsights analysts carefully select session topics and choose leading speakers who are experts in their fields. In addition\, the analysts ensure that the content of the presentations are full of insightful\, technical information that will help attendees select the right components and systems for their next project. The program will feature talks and panel discussions covering a broad range of topics that will be announced later. \nWhy Attend\nTechInsights Processor Conferences have been called the highest quality of their kind by previous attendees because they provide a unique opportunity to hear\, question\, and network with key providers of advanced technology products. \nThe Conferences analyze products and design strategies in a particular technology segment\, providing information that engineers can immediately use to improve their designs. The events feature in-depth technical presentations from our own analysts as well as leading technologists from the industry. This conference is intended for system designers\, chip designers\, software designers\, OEM/ODMs\, press\, and financial analysts. \nCovid-19 Policies and Precautions\nWe are working closely with the Hyatt Regency to reduce the risk of attending our in-person event. Individuals and their employers\, however\, must decide what level of risk is acceptable. For those unable to attend in person\, we offer our virtual livestream. \nAttendees will be required to provide proof of vaccination before receiving their conference badge. Consistent with local health orders\, masks are now recommended but not required. Policies are subject to change; we will update this page as needed. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/linley-fall-processor-conference-2022/ LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA,Foundry,IP ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/Linley-Fall-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221003T080000 DTEND;TZID=America/Los_Angeles:20221004T170000 DTSTAMP:20260409T100310 CREATED:20220831T201004Z LAST-MODIFIED:20220831T201004Z UID:5157-1664784000-1664902800@marketingeda.com SUMMARY:Samsung Foundry Forum & SAFE Forum 2022 - US DESCRIPTION:Through the various session programs\, clients\, partners\, and experts in each field will be able to meet again in person and prepare to go forth into the new future of the semiconductor market. \n  \nThe 2022 Samsung Foundry Forum and SAFE Forum are in-person events\, and will be held in San Jose in the U.S.\,Munich in Germany\, Tokyo in Japan\, and Seoul in South Korea. Check the locations for each event.※ Guests from China will be provided online access to the SFF & SAFE Forum 2022 starting October 21. \n  \nIntroducing the partners of Samsung Foundry’s reinforced SAFE ecosystem. Don’t miss the opportunity to expand your knowledge and gain innovative inspiration by networking with our various partners. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/samsung-foundry-forum-safe-forum-2022-us/ LOCATION:Signia by Hilton\, 170 S Market Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Forum,Foundry ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-October-03-04-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20220928T080000 DTEND;TZID=Europe/Berlin:20220929T170000 DTSTAMP:20260409T100310 CREATED:20220914T220520Z LAST-MODIFIED:20220914T220520Z UID:5202-1664352000-1664470800@marketingeda.com SUMMARY:Global Foundries Technology Summit - EMEA DESCRIPTION:DAY 1 \nWednesday\, September 28\, 2022\nDoors Open 3:00pm CET \n  \nDINNER \nRestaurant KULTURWIRTSCHAFT\, 7pm – 10pm \n  \nDAY 2 \nThursday\, September 29\, 2022\nDoors Open 8:30am CET \n  \nEVENT LOCATION\nGlobalFoundries FAB 1\nWilschdorfer Landstrasse 101\n01109 Dresden\, Germany \n  \nWe are thrilled to welcome you to GF Technology Summit 2022. \nThis exclusive\, invitation-only event is in-person again\, located in GF’s FAB 1 facility! \n\n(RE)CONNECT Join CEO Tom Caulfield\, the GF team\, partners and industry experts for lively\, interactive discussions\nLEARN See how GF’s differentiated solutions and technology roadmap is delivering a new era of more\nDELIVER Collaborate\, partner and invest with GF to drive transformation in your industry\n\nWe look forward to seeing you (in-person!) at GTS 2022 EMEA. \n  \n\nYour Host  \n\n\n\n\n\n\n\n\n\n\nRuth Hernandez\nPartnerships & Business Development\, EMEA\nGlobalFoundries \n\n\n\n\n\n\n\n\n\n\n \n\n\n\n\n“We look forward to seeing you at GF Technology Summit 2022 EMEA\, in-person in Dresden\, on September 28 and 29. Join us to connect\, build relationships and discover new ways of collaborating and innovating.” \n  \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/global-foundries-technology-summit-emea/ LOCATION:GlobalFoundries Fab 1\, Wilschdorfer Landstrasse 101\, Dresden\, 01109\, Germany CATEGORIES:EDA,Foundry,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GF-September-28-29-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220927T080000 DTEND;TZID=America/Los_Angeles:20220927T170000 DTSTAMP:20260409T100310 CREATED:20220705T205605Z LAST-MODIFIED:20220705T205605Z UID:4906-1664265600-1664298000@marketingeda.com SUMMARY:U.S. Executive Forum DESCRIPTION:The 2022 GSA U.S. Executive Forum is coming up on September 27 in Menlo Park\, California. USEF 2022 is one of the most anticipated GSA events of the year and attendance is filling up quickly. Make sure to secure your spot before it’s too late. \nIn this unique and exclusive gathering\, thought leaders\, visionaries and innovators will shed light on the leadership role that the semiconductor industry must embrace to lead the world to a brighter future. Our program features some of the biggest names in semis fostering discussions on the industry’s most pressing issues. We hope you’ll join us at USEF 2022 for a day of leadership\, networking and enrichment. \nTraditionally\, even as semiconductors have been at the core of technological innovation and have changed the world beyond any other technology\, they have often been seen as a commodity and rarely in the spotlight or getting noticed. \nThis has all changed with the acceleration of digital transformation across industries and digitalization of work and life styles. Semiconductors are enabling new technologies and applications\, such as AI and IoT\, that have sparked a new wave of innovation for the industry. \nIn addition\, the implementation of 5G networks coincides with the growing demand for faster high-performance computing devices in the cloud and at the edge. \nIt is time for the industry to step up and show leadership in not only the technology field but also as a responsible global industry in areas of social impact. Climate change\, digital inequality\, diversity\, are all areas that the industry impacts and can show leadership in change. \nIn this unique and exclusive gathering\, thought leaders\, visionaries\, and innovators will shed light on the leadership role that the semiconductor industry needs to embrace and lead the world for a brighter future. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/u-s-executive-forum/ CATEGORIES:EDA,Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA.-September-27-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Taipei:20220830T080000 DTEND;TZID=Asia/Taipei:20220830T170000 DTSTAMP:20260409T100310 CREATED:20220805T163241Z LAST-MODIFIED:20220805T163241Z UID:5014-1661846400-1661878800@marketingeda.com SUMMARY:TSMC Taiwan Technology Symposium DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-taiwan-technology-symposium/ LOCATION:TSMC\, Hsinchu\, Hsinchu\, Taiwan CATEGORIES:Foundry ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-August-30-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Shanghai:20220630T080000 DTEND;TZID=Asia/Shanghai:20220630T170000 DTSTAMP:20260409T100310 CREATED:20220519T155249Z LAST-MODIFIED:20220519T155249Z UID:4746-1656576000-1656608400@marketingeda.com SUMMARY:TSMC 2022 Technology Symposium - China\, Virtual DESCRIPTION:Date\nJune 30\, 2022 (Thursday)\nTime\nStarts at 9:00 a.m.\n\nWebsite link to be announced in June \nGet the latest on:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric® advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform Ecosystem to speed up time-to-design\n\nFor more information on the TSMC Technology Symposium\, e-mail us at: symposium@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC Technology Symposium! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2022-technology-symposium-china-virtual/ CATEGORIES:EDA,Foundry,IP,Symposium ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/TSMC-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Jerusalem:20220628T080000 DTEND;TZID=Asia/Jerusalem:20220628T170000 DTSTAMP:20260409T100310 CREATED:20220519T155026Z LAST-MODIFIED:20220519T155026Z UID:4743-1656403200-1656435600@marketingeda.com SUMMARY:TSMC 2022 Technology Symposium - Israel DESCRIPTION:Israel Technology Workshop (In-Person Event)\n\nDate\nJune 28\, 2022 (Tuesday)\nTime\n9:30a.m. – 4:30p.m.\nVenue\nDaniel Herzliya Hotel\nRamat Yam St 60\, Herzliya\, Israel\n\nEurope Technology Symposium (Online VOD Event)\n\nDate\nJune 30\, 2022 (Thursday)\n\nWebsite link to be announced in June \nGet the latest on:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric® advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nFor more information on the TSMC Technology Symposium\, e-mail us at symposium@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC Technology Symposium! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2022-technology-symposium-israel/ LOCATION:Daniel Herzliya Hotel\, Ramat Yam St 60\, Herzliya\, Israel CATEGORIES:EDA,Foundry,IP,Symposium ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/TSMC-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Amsterdam:20220620T080000 DTEND;TZID=Europe/Amsterdam:20220620T170000 DTSTAMP:20260409T100310 CREATED:20220519T154638Z LAST-MODIFIED:20220519T154700Z UID:4739-1655712000-1655744400@marketingeda.com SUMMARY:TSMC 2022 Technology Symposium - Europe DESCRIPTION:Europe Technology Symposium (In-Person Event)\n\nDate\nJune 20\, 2022 (Monday)\nTime\n8:30a.m. – 4:50p.m.\nVenue\nHilton Amsterdam Airport Schiphol\nSchiphol Boulevard 701Amsterdam\,1118BN Netherlands\n\nIsrael Technology Workshop (In-Person Event)\n\nDate\nJune 28\, 2022 (Tuesday)\nTime\n9:30a.m. – 4:30p.m.\nVenue\nDaniel Herzliya Hotel\nRamat Yam St 60\, Herzliya\, Israel\n\nEurope Technology Symposium (Online VOD Event)\n\nDate\nJune 30\, 2022 (Thursday)\n\nWebsite link to be announced in June \nGet the latest on:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric® advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nFor more information on the TSMC Technology Symposium\, e-mail us at symposium@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC Technology Symposium! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2022-technology-symposium-europe/ LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands CATEGORIES:EDA,Foundry,IP,Symposium ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/TSMC-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220616T080000 DTEND;TZID=America/Los_Angeles:20220616T170000 DTSTAMP:20260409T100310 CREATED:20220519T154250Z LAST-MODIFIED:20220519T154250Z UID:4736-1655366400-1655398800@marketingeda.com SUMMARY:TSMC 2022 Technology Symposium - North America DESCRIPTION:A Technology Symposium (In-Person Event)\nDate:\nJune 16\, 2022 (Thursday)\nTime:\n8:30a.m. – 5:05p.m.\nVenue:\nSanta Clara Convention Center\n5001 Great America Parkway\,\nSanta Clara\, CA 95054\n\n\nNA Technology Symposium (Online VOD Event)\nDate:\nJune 30\, 2022 (Thursday)\n\nWebsite link to be announced in June \nGet the latest on:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nFor more information on the TSMC Technology Symposium\, e-mail us at symposium@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC Technology Symposium! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2022-technology-symposium-north-america/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:EDA,Foundry,IP,Symposium ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/TSMC-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211202T090000 DTEND;TZID=America/Los_Angeles:20211202T100000 DTSTAMP:20260409T100310 CREATED:20211112T052726Z LAST-MODIFIED:20211112T052726Z UID:3718-1638435600-1638439200@marketingeda.com SUMMARY:How to Sign Off a 10 Billion+ Transistor Design in the Cloud DESCRIPTION:Advanced semiconductor applications such as artificial intelligence / machine learning (AI/ML) and graphic processing units (GPUs) fully leverage dense\, advanced-node technology to push the extreme limits of design size. To signoff such large designs\, engineers are increasingly relying on distributed compute methods to accelerate the signoff analysis. Furthermore\, given lack of scalability of on-premises compute resources\, designers are migrating towards cloud-based solutions to solve their peak compute demand and meet their aggressive tapeout schedules. \nIn this CadenceTECHTALK\, TSMC + Microsoft + Cadence will present a signoff methodology optimized for giga-scale class (10 billion+ transistor) designs and tailored for execution on cloud-based infrastructure. The talk will feature the Cadence® Tempus™ Timing Signoff Solution’s STA signoff tool and CloudBurst™ platform\, as well as Microsoft Azure’s latest offerings suited for EDA workloads. \n\n\n\n\n\nFeatured Speakers \n\n\n\n\n\n\n\n\n\n\nVivian Jiang & Kurt Chiang\,\nTechnical Managers\,\nTSMC \n\n\n\n\n\n\n\n\nBrandon Bautz\, Sr. Group Director Product Management\, Cadence \n\n\n\n\n\n\n\n\nPrashant Varshney\, Sr. Director Product Management\, Microsoft \n\n\n\n\n\n\n\n\nKetan Joshi\, Group Director\, Cloud Business Development\, Cadence \n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/how-to-sign-off-a-10-billion-transistor-design-in-the-cloud/ CATEGORIES:EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-December-2.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211117T100000 DTEND;TZID=America/Los_Angeles:20211117T170000 DTSTAMP:20260409T100310 CREATED:20211112T184020Z LAST-MODIFIED:20211112T184020Z UID:3735-1637143200-1637168400@marketingeda.com SUMMARY:Samsung SAFE Forum 2021 DESCRIPTION:Join us for Samsung Foundry’s annual SAFE™ Forum. \nWhat will you take away from Samsung Foundry’s ecosystem event? Bump your SoC PPA knowledge with the latest information on: \nHigh speed interconnect IPs for HPC and Data Center applications and foundational IPs\nHigh bandwidth memory subsystems\nKey IP trends for automotive and mobile applications\nFoundational Analog Mixed Signal IP for a variety of applications\nThere will also be an opportunity to network with experts in IP\, EDA\, Cloud\, Design Services and Packaging during the virtual partner pavilion. \nRegister today! Participate to join the raffle for exciting prizes! \n– SAFE Forum Team \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/samsung-safe-forum-2021/ CATEGORIES:Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SAFE-2021.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211006T080000 DTEND;TZID=America/Los_Angeles:20211008T170000 DTSTAMP:20260409T100310 CREATED:20210927T171838Z LAST-MODIFIED:20210928T210856Z UID:3440-1633507200-1633712400@marketingeda.com SUMMARY:Samsung Foundry Forum 2021 DESCRIPTION:Join now and become a member of the Samsung Foundry Forum 2021! \nSamsung Foundry would like to invite global customers and partners to the Samsung Foundry Forum 2021\, designed to share Samsung Foundry’s vision\, trends\, the latest technologies and solutions for various applications in order to strengthen our valuable partnerships. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/samsung-foundry-forum-2021/ CATEGORIES:Forum,Foundry ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-Foundry-Forum-2021.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20210915T110000 DTEND;TZID=America/New_York:20210915T153000 DTSTAMP:20260409T100310 CREATED:20210907T164541Z LAST-MODIFIED:20210907T164632Z UID:3282-1631703600-1631719800@marketingeda.com SUMMARY:GF Technology Summit 2021 DESCRIPTION:DELIVERING A NEW ERA OF MORE  \n\n\n\nSemiconductor chips are pervasive—inside everything from appliances to thermostats\, smartphones to automobiles\, and industrial equipment to medical devices. These incredibly complex feats of human ingenuity power our world\, fuel the global economy and enrich our lives. \n  \nThe GF Technology Summit offers an opportunity to discuss the challenges and opportunities in semiconductor design and manufacturing\, learn about new technologies and solutions\, and discover new ways to collaborate\, partner and invest so that together we can deliver more innovation\, more capabilities\, more intuitive interaction\, more intelligence\, and more feature-rich solutions. \n\n\n\n\n\n\n\nMORE INNOVATION  \nGain insight from industry experts about the latest innovations in smart mobile devices\, automotive\, personal computing\, communications infrastructure and datacenter\, home and industrial IoT and more. \n  \n\n\n\n\n\n\n\nMORE COLLABORATION   \nEnter a virtual lounge\, schedule a breakout room and visit the partner pavilion. There are lots of ways to network\, explore partnership opportunities and collaborate on your next IC design project. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nMORE GROWTH \nEngage with the GF team and ecosystem partners to learn how GF platforms and solutions\, design enablement and turnkey services\, coupled with industry leading IP offerings and EDA tools\, can help you accelerate your design cycle and speed your time-to-market. \n\n\n\n\n\n\n\n\n\n\n“I’m looking forward to welcoming you to our GF Technology Summit 2021 North America\, which will be delivered in a new live interactive\, virtual format. Join us to connect\, build relationships and discover new ways of collaborating and innovating together. I look forward to spending time with you on September 15th.” \n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gf-technology-summit-2021/ CATEGORIES:EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GF-Technology-Summit-2021.jpg END:VEVENT END:VCALENDAR