BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.15.20//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:Europe/Amsterdam BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20200308T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20201101T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20210314T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20211107T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20200308T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20201101T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20210314T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20211107T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20220313T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20221106T060000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=Europe/Amsterdam:20220620T080000 DTEND;TZID=Europe/Amsterdam:20220620T170000 DTSTAMP:20260411T020116 CREATED:20220519T154638Z LAST-MODIFIED:20220519T154700Z UID:4739-1655712000-1655744400@marketingeda.com SUMMARY:TSMC 2022 Technology Symposium - Europe DESCRIPTION:Europe Technology Symposium (In-Person Event)\n\nDate\nJune 20\, 2022 (Monday)\nTime\n8:30a.m. – 4:50p.m.\nVenue\nHilton Amsterdam Airport Schiphol\nSchiphol Boulevard 701Amsterdam\,1118BN Netherlands\n\nIsrael Technology Workshop (In-Person Event)\n\nDate\nJune 28\, 2022 (Tuesday)\nTime\n9:30a.m. – 4:30p.m.\nVenue\nDaniel Herzliya Hotel\nRamat Yam St 60\, Herzliya\, Israel\n\nEurope Technology Symposium (Online VOD Event)\n\nDate\nJune 30\, 2022 (Thursday)\n\nWebsite link to be announced in June \nGet the latest on:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric® advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nFor more information on the TSMC Technology Symposium\, e-mail us at symposium@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC Technology Symposium! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2022-technology-symposium-europe/ LOCATION:Hilton Amsterdam Airport Schiphol\, Schiphol Boulevard 701 Amsterdam\, Amsterdam\, Netherlands CATEGORIES:EDA,Foundry,IP,Symposium ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/TSMC-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220616T080000 DTEND;TZID=America/Los_Angeles:20220616T170000 DTSTAMP:20260411T020116 CREATED:20220519T154250Z LAST-MODIFIED:20220519T154250Z UID:4736-1655366400-1655398800@marketingeda.com SUMMARY:TSMC 2022 Technology Symposium - North America DESCRIPTION:A Technology Symposium (In-Person Event)\nDate:\nJune 16\, 2022 (Thursday)\nTime:\n8:30a.m. – 5:05p.m.\nVenue:\nSanta Clara Convention Center\n5001 Great America Parkway\,\nSanta Clara\, CA 95054\n\n\nNA Technology Symposium (Online VOD Event)\nDate:\nJune 30\, 2022 (Thursday)\n\nWebsite link to be announced in June \nGet the latest on:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nFor more information on the TSMC Technology Symposium\, e-mail us at symposium@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC Technology Symposium! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2022-technology-symposium-north-america/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:EDA,Foundry,IP,Symposium ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/TSMC-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211202T090000 DTEND;TZID=America/Los_Angeles:20211202T100000 DTSTAMP:20260411T020116 CREATED:20211112T052726Z LAST-MODIFIED:20211112T052726Z UID:3718-1638435600-1638439200@marketingeda.com SUMMARY:How to Sign Off a 10 Billion+ Transistor Design in the Cloud DESCRIPTION:Advanced semiconductor applications such as artificial intelligence / machine learning (AI/ML) and graphic processing units (GPUs) fully leverage dense\, advanced-node technology to push the extreme limits of design size. To signoff such large designs\, engineers are increasingly relying on distributed compute methods to accelerate the signoff analysis. Furthermore\, given lack of scalability of on-premises compute resources\, designers are migrating towards cloud-based solutions to solve their peak compute demand and meet their aggressive tapeout schedules. \nIn this CadenceTECHTALK\, TSMC + Microsoft + Cadence will present a signoff methodology optimized for giga-scale class (10 billion+ transistor) designs and tailored for execution on cloud-based infrastructure. The talk will feature the Cadence® Tempus™ Timing Signoff Solution’s STA signoff tool and CloudBurst™ platform\, as well as Microsoft Azure’s latest offerings suited for EDA workloads. \n\n\n\n\n\nFeatured Speakers \n\n\n\n\n\n\n\n\n\n\nVivian Jiang & Kurt Chiang\,\nTechnical Managers\,\nTSMC \n\n\n\n\n\n\n\n\nBrandon Bautz\, Sr. Group Director Product Management\, Cadence \n\n\n\n\n\n\n\n\nPrashant Varshney\, Sr. Director Product Management\, Microsoft \n\n\n\n\n\n\n\n\nKetan Joshi\, Group Director\, Cloud Business Development\, Cadence \n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/how-to-sign-off-a-10-billion-transistor-design-in-the-cloud/ CATEGORIES:EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-December-2.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211117T100000 DTEND;TZID=America/Los_Angeles:20211117T170000 DTSTAMP:20260411T020116 CREATED:20211112T184020Z LAST-MODIFIED:20211112T184020Z UID:3735-1637143200-1637168400@marketingeda.com SUMMARY:Samsung SAFE Forum 2021 DESCRIPTION:Join us for Samsung Foundry’s annual SAFE™ Forum. \nWhat will you take away from Samsung Foundry’s ecosystem event? Bump your SoC PPA knowledge with the latest information on: \nHigh speed interconnect IPs for HPC and Data Center applications and foundational IPs\nHigh bandwidth memory subsystems\nKey IP trends for automotive and mobile applications\nFoundational Analog Mixed Signal IP for a variety of applications\nThere will also be an opportunity to network with experts in IP\, EDA\, Cloud\, Design Services and Packaging during the virtual partner pavilion. \nRegister today! Participate to join the raffle for exciting prizes! \n– SAFE Forum Team \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/samsung-safe-forum-2021/ CATEGORIES:Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SAFE-2021.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211006T080000 DTEND;TZID=America/Los_Angeles:20211008T170000 DTSTAMP:20260411T020116 CREATED:20210927T171838Z LAST-MODIFIED:20210928T210856Z UID:3440-1633507200-1633712400@marketingeda.com SUMMARY:Samsung Foundry Forum 2021 DESCRIPTION:Join now and become a member of the Samsung Foundry Forum 2021! \nSamsung Foundry would like to invite global customers and partners to the Samsung Foundry Forum 2021\, designed to share Samsung Foundry’s vision\, trends\, the latest technologies and solutions for various applications in order to strengthen our valuable partnerships. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/samsung-foundry-forum-2021/ CATEGORIES:Forum,Foundry ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Samsung-Foundry-Forum-2021.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20210915T110000 DTEND;TZID=America/New_York:20210915T153000 DTSTAMP:20260411T020116 CREATED:20210907T164541Z LAST-MODIFIED:20210907T164632Z UID:3282-1631703600-1631719800@marketingeda.com SUMMARY:GF Technology Summit 2021 DESCRIPTION:DELIVERING A NEW ERA OF MORE  \n\n\n\nSemiconductor chips are pervasive—inside everything from appliances to thermostats\, smartphones to automobiles\, and industrial equipment to medical devices. These incredibly complex feats of human ingenuity power our world\, fuel the global economy and enrich our lives. \n  \nThe GF Technology Summit offers an opportunity to discuss the challenges and opportunities in semiconductor design and manufacturing\, learn about new technologies and solutions\, and discover new ways to collaborate\, partner and invest so that together we can deliver more innovation\, more capabilities\, more intuitive interaction\, more intelligence\, and more feature-rich solutions. \n\n\n\n\n\n\n\nMORE INNOVATION  \nGain insight from industry experts about the latest innovations in smart mobile devices\, automotive\, personal computing\, communications infrastructure and datacenter\, home and industrial IoT and more. \n  \n\n\n\n\n\n\n\nMORE COLLABORATION   \nEnter a virtual lounge\, schedule a breakout room and visit the partner pavilion. There are lots of ways to network\, explore partnership opportunities and collaborate on your next IC design project. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nMORE GROWTH \nEngage with the GF team and ecosystem partners to learn how GF platforms and solutions\, design enablement and turnkey services\, coupled with industry leading IP offerings and EDA tools\, can help you accelerate your design cycle and speed your time-to-market. \n\n\n\n\n\n\n\n\n\n\n“I’m looking forward to welcoming you to our GF Technology Summit 2021 North America\, which will be delivered in a new live interactive\, virtual format. Join us to connect\, build relationships and discover new ways of collaborating and innovating together. I look forward to spending time with you on September 15th.” \n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gf-technology-summit-2021/ CATEGORIES:EDA,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GF-Technology-Summit-2021.jpg END:VEVENT END:VCALENDAR