BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.15.19//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT 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TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20260329T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20261025T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Berlin BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20250330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20251026T010000 END:STANDARD END:VTIMEZONE 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TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20250330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20251026T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Istanbul BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0300 TZNAME:+03 DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20220313T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20221106T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20230312T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20231105T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20240310T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20241103T070000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20250220T080000 DTEND;TZID=America/Los_Angeles:20250220T190000 DTSTAMP:20260408T041832 CREATED:20241212T171448Z LAST-MODIFIED:20241212T171517Z UID:8572-1740038400-1740078000@marketingeda.com SUMMARY:GSA Mena Executive Summit DESCRIPTION:On February 20\, 2025 in Cairo\, Egypt\, we are hosting the GSA MENA Executive Summit to look beyond the current divisions and rather recognize the Middle East North Africa regional potential as a source of capital and destination for innovative tech developments. \nThis semiconductor and tech-focused exec forum will take place in a stunning brand-new venue: the Grand Egyptian Museum (GEM)\, an outstanding new destination for history and archeology lovers on par with the world’s very best museums\, near the Giza pyramid complex. \nBeside ample opportunities for networking\, including with government officials from the entire region\, we will cover topics including: \n\nthe state of the global semiconductor industry\nthe regional potential as a source of capital and destination for innovative tech development centers\nthe state of Entrepreneurship in the region\, with a moderated panel discussion of Venture Capital firms.\nProgress in Automotive\, as a crucial industry for the whole EMEA region\nkey technological updates\, on AI (GenAI\, Edge AI\, Cloud AI)\, New Chip Design Paradigms (Chiplets\, 3D packaging\, EDA advancements)\, Cybersecurity\, Quantum\, and more.\n\nThis event is hosted in cooperation with the Egyptian Information Technology Industry Development Agency (ITIDA) and the Egyptian Information & Communication Technology Association (EiTESAL). \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-mena-executive-summit/ LOCATION:Grand Egypian Museum\, Alexandria Desert Rd\, Kafr Nassar\, Al Haram\, Giza Governorate\, Cairo\, Egypt CATEGORIES:EDA,Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-February-20-2025.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/London:20250129T130000 DTEND;TZID=Europe/London:20250129T173000 DTSTAMP:20260408T041832 CREATED:20241220T033019Z LAST-MODIFIED:20241220T033019Z UID:8642-1738155600-1738171800@marketingeda.com SUMMARY:DVClub Europe - Mixed Signal Verification DESCRIPTION:Analog mixed signal chips continue to grow in both demand and complexity\, and a consistent efficient verification approach remains a key topic for concern. This DVClub will be held at the Futures Institute at the University of Edinburgh and the university students will be attending. The first half of the DVClub will focus concepts of digital and analog verification\, as well as an overview of the work the university is doing on AI in semiconductors through the APRIL hub\, focusing on the verification activities. \nIn the second half of this DVClub\, local companies will focus on challenges and solutions for mixed signal verification at SoC\, system and in safety-related applications. \nAgenda (GMT) \n13.00: Arrival and Registration with Coffee and Snacks \n\nmainly for students but local companies also welcome\n\n13:25: Mike: Welcome \n13.30: Introduction from the University \n14.00: Mike – Introduction to Digital Verification \n14:30: Peter/Graeme – Mixed Signal Verification Part I \n15.00: Break – Coffee and Snacks \n\n Delegates can also attend for 2nd half only if preferred\n\n15:30: Peter/Graeme – Mixed Signal Verification II \n16:00: Michael O’Sullivan & Marcel Ahmedzai\, Cadence Design Systems – SoC Verification \n16:30: System and Safety Verification: (TBC) \n17:00: Mike: wrap up and next steps for students/local companies to collaborate \n17:10: Drinks and Pizza\n \nAdditional Information\nFor additional information please visit the Tessolve DVClub webpage for this event. \nSponsors\nDVClub Europe\, Edinburgh is made possible through the generous support of our sponsors:  Cadence\, Partner: TechWorks \nTessolve reserves the right to cancel registration at its discretion. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/dvclub-europe-mixed-signal-verification/ LOCATION:Edinburgh City Centre\, Edinburgh\, United Kingdom CATEGORIES:EDA,Forum,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVClub-29-January-2025.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20250104T080000 DTEND;TZID=Asia/Kolkata:20250108T170000 DTSTAMP:20260408T041832 CREATED:20241203T180905Z LAST-MODIFIED:20250104T202845Z UID:8547-1735977600-1736355600@marketingeda.com SUMMARY:38th International Conference on VLSI Design DESCRIPTION:International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems\, is attended by over 2000 engineers\, students & faculty\, industry\, academia\, researchers\, bureaucrats and government bodies. \nVLSI Design Conference started as a simple idea in 1985: to sense the level of VLSI activities in India with a focus on engineering education & research. \nWith its global footprints VLSID is recognized as a ‘Sister Conference’ of Design Automation Conference. This conference is sponsored by VLSI Society of India (VSI) \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/38th-international-conference-on-vlsi-design/ LOCATION:The Leela Palace\, Bengaluru\, India CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/VLSID-2025-e1733248863710.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20241217T080000 DTEND;TZID=Asia/Kolkata:20241219T170000 DTSTAMP:20260408T041832 CREATED:20241207T004316Z LAST-MODIFIED:20241207T004316Z UID:8560-1734422400-1734627600@marketingeda.com SUMMARY:EDAPS 2024 DESCRIPTION:The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium\, a flagship event in the Asia-Pacific region\, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip\, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling\, design and simulation\, fabrication and characterization. This symposium consists of technical paper presentation\, poster sessions\, industry exhibits\, workshops and tutorials. \n  \nEDAPS is sponsored by the IEEE Electronic Packaging Society. \nEDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop\, to be held during December 17-19 at the Taj Yeshwantpur\, in Bangalore\, India. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/edaps-2024/ LOCATION:Taj Yeshawantpur\, 2275 Tumkur Road\, Yeshwantpur\, Bangalore\, India CATEGORIES:EDA,Semiconductor,Symposium ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241212T080000 DTEND;TZID=America/Los_Angeles:20241212T210000 DTSTAMP:20260408T041832 CREATED:20241112T204519Z LAST-MODIFIED:20241112T204519Z UID:8498-1733990400-1734037200@marketingeda.com SUMMARY:PDF Solutions - AI Executive Conference DESCRIPTION:This one-day Executive Conference will feature presentations from PDF Solutions executives\, industry thought leaders\, solutions partners and customers on the state of art and best practices to design\, deploy\, scale\, and manage trusted AI / ML solutions across the global semiconductor industry. \nSpeakers from: ADI\, Advantest\, Cerebras\, Intel\, Microsoft\, SAP\, Siemens\, TEL\, Teradyne\, Voltai\, Yurts and PDF Solutions. \n\n\n\nEvent Overview\n\n\n\n\n\n\n\n\n\n\n\n8:00am – 9:00am PT \n\n\n  REGISTRATION\n\n\n\n\n   9:00am – 5:30am PT \n\n\nCONFERENCE\n\n\n\n\n\n\n\n\n    5:30pm – 6:30pm PT \n\n\nCOCKTAIL HOUR\n\n\n\n\n6:30pm – 9:00pm PT \n\n\nDINNER & SPEAKER\n\n\n\nAGENDA PREVIEW\n\n\n\n\n\n\n\n\n\n\n\nKEYNOTE \n\n\nHow Analytics and AI are helping to transform a leading semiconductor company\n\n\nAziz Safa – VP and GM\, Intel \n\n\n\n\nKEYNOTE \n\n\nAI\, the next evolution of PDF Solutions portfolio\n\n\nJohn Kibarian – CEO\, PDF Solutions \n\n\n\n\nKEYNOTE \n\n\nSecure and scalable AI for the semiconductor industry is foremost a data and model infrastructure challenge\n\n\nSaid Akar – VP\, PDF Solutions \n\n\n\n\nPANELS & DEMOS \n\n\nGenAI for semiconductor: use cases\, solutions\, and demonstrations\n\n\nVoltai\, Yurts\, SAP\, PDF Solutions \n\n\n\n\nPanel Discussion \n\n\nAI for test in a world of hybrid 3D devices\n\n\nAdvantest\, Teradyne\, Siemens\, Fabless\, Foundry \n\n\n\n\nPRESENTATIONS \n\n\nAI to use semiconductor design information\n\n\nSiemens and PDF Solutions \n\n\n\n\n\n\n\n\nLive Demo \n\n\nPDF Solutions ModelOps\nThe AI infrastructure for the global semiconductor supply chain\n\n\nPDF Solutions \n\n\n\n\nPanel Discussion \n\n\nRevisiting the notion of trust in an AI solutions world\n\n\nPDF Solutions\, Yurts\, Enterprise Applications ISV \n\n\n\n\nPANEL DISCUSSION \n\n\nHow can semiconductor companies accelerate their digital transformation with AI IDMs\n\n\nSAP\, ADI\, PDF Solutions \n\n\n\n\nPANEL DISCUSSION \n\n\nAI-enabled digital twin for semiconductor manufacturing equipment\n\n\nTEL\, PDF Solutions \n\n\n\n\nPresentations \n\n\nStrategies to quickly increase available Analytics and AI skills across the semiconductor industry\n\n\nMIT\, Intel\, LIVE Institute\, PDF Solutions \n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/pdf-solutions-ai-executive-conference/ LOCATION:St. Regist Hotel\, 125 3rd Street\, San Francisco\, CA\, United States CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/PDF-Solutions-December-12-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241207T080000 DTEND;TZID=America/Los_Angeles:20241211T170000 DTSTAMP:20260408T041832 CREATED:20241008T155901Z LAST-MODIFIED:20241018T161813Z UID:8386-1733558400-1733936400@marketingeda.com SUMMARY:70th Annual IEEE International Electron Devices Meeting - IEDM 2024 DESCRIPTION:IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology\, design\, manufacturing\, physics\, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology\, advanced memory\, displays\, sensors\, MEMS devices\, novel quantum and nano-scale devices and phenomenology\, optoelectronics\, devices for power and energy harvesting\, high-speed devices\, as well as process technology and device modeling and simulation. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/70th-annual-ieee-international-electron-devices-meeting/ LOCATION:Hilton San Francisco Union Square\, 333 O'Farrell Street\, San Francisco\, 94102\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/70thiedmcolor.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241120T090000 DTEND;TZID=America/Los_Angeles:20241120T180000 DTSTAMP:20260408T041832 CREATED:20241113T213125Z LAST-MODIFIED:20241113T213239Z UID:8510-1732093200-1732125600@marketingeda.com SUMMARY:Tower Semiconductor - Technical Global Symposium 2024 DESCRIPTION:TGS offers a wonderful opportunity for networking\, learning\, and sharing\nthe latest technology developments with our community\, as well as\nmeeting with Tower’s executives and team of experts.\nWe invite you to join us! \n\n\nTime\n\n\n\n\nSession\n\n\n\n\nSpeaker\n\n\n\n\n9:00 – 10:00\n\n\n\n\nRegistration\n\n\n\n\n10:00 – 10:05\n\n\n\n\nOpening\n\n\n\n\nMr. Lei Qin\, SVP of Worldwide Sales\n\n\n\n\n10:05 – 10:40\n\n\n\n\nCEO Keynote\n\n\n\n\nMr. Russell Ellwanger\, CEO\n\n\n\n\n10:40 – 11:00\n\n\n\n\nWhy an Analog Foundry is Critical for AI\n\n\n\n\nDr. Avi Strum\, CTO\n\n\n\n\n11:00 – 11:30\n\n\n\n\nInvited Talk by Nvidia:\nIntegrated Optics Ecosystem for Future Gen AI Systems\n\n\n\n\nDr. Ashkan Seyedi\, Director\, LinkX Products\, Nvidia\n\n\n\n\n11:30 – 12:00\n\n\n\n\nMarket Megatrends and Tower’s Technology Solutions in RF Mobile\, Infrastructure\, Power\, and Sensors\n\n\n\n\nDr. Marco Racanelli\, President\n\n\n\n\n12:00 – 13:30\n\n\n\n\nLunch\n\n\n\n\n13:30 – 14:15\n\n\n\n\nTower’s RF and Silicon Photonics Technology Platforms – Advanced Solutions for High-speed Connectivity\n\n\n\n\nDr. Ed Preisler\, VP & Co-General Manager of RF Business Unit\n\n\n\n\n14:15 – 15:00\n\n\n\n\nTower’s Power 65nm BCD and 0.18um BCD Offering for Power Applications\n\n\n\n\nDr. David Mistele\, Director of Power Management R&D\n\n\n\n\n15:00 – 15:15\n\n\n\n\nCoffee Break\n\n\n\n\n15:15 – 15:45\n\n\n\n\nTechnologies for the Future of Digital Imaging\, from Sensors to Displays\n\n\n\n\nDr. Benoit Dupont\, Marketing Director of Sensors and Display Business\n\n\n\n\n15:45 -16:15\n\n\n\n\nTower’s Design Enablement – Transforming Ideas into Products\, Rapidly and Accurately\n\n\n\n\nDr. Samir Chaudhry\, VP of Design Enablement\n\n\n\n\n16:15 – 16:45\n\n\n\n\nAerospace and Defense – Partner for R&D and Manufacturing Solutions\n\n\n\n\nDr. David Howard\, Executive Director & Fellow\n\n\n\n\n16:45 – 17:00\n\n\n\n\nClosing Remarks\n\n\n\n\n\n\n\n\n\n17:00 – 18:00\n\n\n\n\nCocktail\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tower-semiconductor-technical-global-symposium-2024/ LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Foundry,Semiconductor,Symposium ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Tower-November-20-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241112T080000 DTEND;TZID=America/Los_Angeles:20241114T170000 DTSTAMP:20260408T041832 CREATED:20241030T174154Z LAST-MODIFIED:20241030T174154Z UID:8463-1731398400-1731603600@marketingeda.com SUMMARY:IEEE World Technology Summit - AI INFRASTRUCTURE DESCRIPTION:This event features top executives from around the world who describe the burning issues surrounding AI and how to solve our immediate problems\, focusing on these core areas: \n\nAI applications and their required infrastructure\nSilicon to support AI applications\nSystems to support AI applications\nSecurity and Standards\n\nAI is critical to our future. Please join us in California for the first-ever IEEE World Technology Summit\, where companies\, governments\, and researchers come together to solve the technical challenges involved in creating the latest competitive products and services. This is a pre-product examination of key technical issues and solutions. \nThe main focus of this conference is AI Infrastructure. \nTo deliver value we need the infrastructure for AI to work!!! This infrastructure includes software\, data storage\, computing\, communications\, power and energy\, standards\, and security. \nTo form an event to address the above issues\, we asked leaders in companies engaged in building this infrastructure to list the issues they saw as critical for the development of future products. These leaders helped provide the topics for IEEE WTS. And they are bringing senior speakers to address concerns\, challenges\, solutions\, and engagement during pre-product development. This cooperation should lead to stronger more effective infrastructure for AI\, which is critical to make AI work. \nCompanies are invited to sponsor\, engage\, and have employees attend this event. \nIf interested\, contact us at: wtscontact@ieee.org \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ieee-world-technology-summit-ai-infrastructure/ LOCATION:San Jose Convention Center\, 150 W San Carlos Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/WTS-November-12-14-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240926T080000 DTEND;TZID=America/Los_Angeles:20240926T170000 DTSTAMP:20260408T041832 CREATED:20240710T165347Z LAST-MODIFIED:20240710T165347Z UID:8121-1727337600-1727370000@marketingeda.com SUMMARY:GSA U.S. Executive Forum 2024 DESCRIPTION:THE JOURNEY TO A $1T GLOBAL INDUSTRY\n\n\n\n\n\n\n\nThe GSA US Executive Forum will delve into the semiconductor industry’s journey toward achieving the trillion-dollar milestone. The industry operates in a complex environment where global forces intersect with regional dynamics. Industry executives will explore the delicate balance between globalization and regionalization\, considering both opportunities and challenges while emphasizing sustainable growth\, innovation\, and strategic business practices. \nIndustry leaders will also provide thought leadership into the market forces and advancements that shape the industry’s growth trajectory and explore the key drivers propelling the industry for sustainable growth. \n\n\n\n\nThe US Executive Forum is GSA’s premier exclusive\, invitation-only event that brings together influential executives\, thought leaders\, and subject matter experts for thought exchange and collaborative dialogue on the dynamic landscape of the global semiconductor value chain. With technological advancements driving rapid change\, the US Executive Forum fosters a deep understanding of the industry’s future direction and identifies strategies for success in an era of innovation and collaboration.\n\n\n\n1:00 PM\n\nWelcome Remarks\n\nJodi Shelton // CEO // GSA\n \n\n\n\n\n\n\n1:10 PMPANEL\n\nFireside Chat\n\nJensen Huang // Co-founder\, President and CEO // Nvidia \n\n\n\n\n\n\n1:50 PMPRESENTATION\n\nGlobal Landscape Impacting the Industry\n\n\n\n\n\n2:10 PMKEYNOTE\n\nKeynote – Industry Outlook\n\nDave Mosley / CEO / Seagate\n\n\n\n\n\n\n2:40 PM\n\nNetworking Break\n\n\n\n\n\n3:10 PMPANEL\n\nDisruptors in AI\n\nJitendra Mohan / Co-founder and CEO / Astera Labs\nRodrigo Liang / Co-founder and CEO / SambaNova\n\n\n\n\n\n\n3:50 PMPRESENTATION\n\nAutomotive Supply Chain\n\n\n\n\n\n4:05 PMPANEL\n\nAutomotive Electrification Panel Discussion\n\nKarn Budhiraj / Vice President\, Supply Chain / Tesla\nSiva Sivaram / CEO / QuantumScape\n\n\n\n\n\n\n4:45 PM\n\nNetworking Break\n\n\n\n\n\n5:15 PMPANEL\n\nExecutive Panel Discussion\n\nTien Wu / CEO / ASE Group & USI\nSandra Rivera / CEO / Altera\, an Intel company\nRene Hass / CEO / Arm\n\n\n\n\n\n\n6:00 PMKEYNOTE\n\nClosing Keynote\n\n\n\n\n\n6:40 PM\n\nVIP Reception\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-u-s-executive-forum-2024/ LOCATION:Rosewood Sand Hill\, 2825 Sand Hill Road\, Menlo Park\, CA\, United States CATEGORIES:Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-US-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240909T080000 DTEND;TZID=America/Los_Angeles:20240912T170000 DTSTAMP:20260408T041832 CREATED:20240718T193601Z LAST-MODIFIED:20240718T193601Z UID:8164-1725868800-1726160400@marketingeda.com SUMMARY:AI Hardware & Edge AI Summit 2024 DESCRIPTION:The AI Hardware & Edge AI Summit is the ultimate destination for the entire AI and ML ecosystem\, with a collaborative mission to train\, deploy and scale machine learning systems that are fast\, affordable\, and efficient. \nWhether it’s forging new partnerships\, staying ahead of the ever-changing semi-conductor landscape\, learning how to build\, train\, and deploy efficient systems\, meeting peers\, learning from AI luminaries\, or simply gaining exposure to the world of AI infrastructure\, you’ll find over 1\,200 likeminded people at our event. \nTake it from the thousands of industry peers who have attended in the past\, if you’re in the AI infrastructure and semiconductor worlds\, this is one not to miss! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ai-hardware-edge-ai-summit-2024/ LOCATION:Signia by Hilton\, 170 S Market Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/AI-Hardware-Edge-AI-Summit-2024.jpg ORGANIZER;CN="Kisaco Research":MAILTO:events@kisacoresearch.com END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240806T080000 DTEND;TZID=America/Los_Angeles:20240808T170000 DTSTAMP:20260408T041832 CREATED:20240723T173747Z LAST-MODIFIED:20240729T183004Z UID:8167-1722931200-1723136400@marketingeda.com SUMMARY:Future of Memory and Storage - 2024 DESCRIPTION:FMS: the Future of Memory and Storage is an all-inclusive international memory and storage showcase. It is the event for the memory and storage industry. It is the one-stop place to catch up on the latest technologies\, see the hottest products\, and learn about what’s happening and where the latest trends are heading. FMS is now the largest memory and storage industry show with the most high-level keynoters from leading companies\, the largest exhibits\, and the most sessions covering everything from applications and architectures through enterprise storage\, controllers\, and new technologies. \nOur industry continues to thrive and grow with new technology and more applications than ever. FMS has expanded to an all- inclusive memory and storage summit welcoming all emerging memory and storage solutions. The scope of FMS will include DRAM\, DNA data storage\, UCIe chiplet interconnects\, Compute Express Link (CXL)\, wearables\, automotive\, AI/ML\, data centers\, and entertainment applications\, along with 3D flash\, NVMe\, ZNS\, and important industry announcements. As one past attendee put it\, “Flash is a big society and FMS is the right show.” \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/future-of-memory-and-storage-2024/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/FMS-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240715T080000 DTEND;TZID=America/Los_Angeles:20240719T170000 DTSTAMP:20260408T041832 CREATED:20240710T170314Z LAST-MODIFIED:20240710T171300Z UID:8125-1721030400-1721408400@marketingeda.com SUMMARY:IEEE SMC-IT/SCC 2024 DESCRIPTION:The International Conference on Space Mission Challenges for Information Technology (SMC-IT) and the Space Computing Conference (SCC) gather system designers\, engineers\, computer architects\, scientists\, practitioners\, and space explorers with the objective of advancing information technology\, and the computational capability and reliability of space missions. The forums will provide an excellent opportunity for fostering technical interchange on all hardware and software aspects of space missions. The joint conferences will focus on current systems practice and challenges as well as emerging hardware and software technologies with applicability for future space missions. \nSystems in all aspects of the space mission will be explored\, including flight systems\, ground systems\, science data processing\, engineering and development tools\, operations\, telecommunications\, radiation-tolerant computing devices\, reliable electronics\, space-qualifiable packaging technologies. The entire information systems lifecycle of the mission development will also be covered\, such as conceptual design\, engineering tools development\, integration and test\, operations\, science analysis\, quality control. \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ieee-smc-it-scc-2024/ LOCATION:Computer History Museum\, 1401 N. Shoreline Blvd\, Mountain View\, CA\, 94043\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEEE-SMC-ITSCC-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240709T080000 DTEND;TZID=America/Los_Angeles:20240711T170000 DTSTAMP:20260408T041832 CREATED:20240327T191111Z LAST-MODIFIED:20240327T191153Z UID:7778-1720512000-1720717200@marketingeda.com SUMMARY:Semicon West 2024 DESCRIPTION:SEMICON West 2024 is North America’s premier conference and exhibition that gathers the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and changes. Join industry leaders\, experts\, and visionaries at the Moscone Center\, San Francisco\, CA from July 9–11. \nJoin us to explore groundbreaking technologies transforming the microelectronics sector and enabling smart applications. This is the perfect opportunity for top minds and manufacturers to connect\, collaborate\, innovate\, and STRONGER TOGETHER we’ll unite in our journey towards the $1T milestone! \nPrograms + Events\n\n– CEO Summit/Keynotes\n– Market Trends & Data\n– Sustainability\n– TechTALKS\n– SEMI U—Workshops\n– Test Vision Symposium\n– Smart Manufacturing\, MedTech + Mobility\n– WFD—Workforce Development\n– FLEX Conference & Exhibition\nAnd much more! \nNetworking + Activations\n\n– Lively Receptions\n– Networking Lounges\n– Beer & Wine Garden\n– Award Ceremonies\n– SEMI Booth + SEMI U\n– Private Meeting Rooms\n– Taste of San Francisco\n– Food Truck Fare\n– Media Hub\nAnd much more! \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/semicon-west-2024/ LOCATION:Moscone Center\, 747 Howard Street\, San Francisco\, CA\, 94103\, United States CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Semicon-West-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20240618T080000 DTEND;TZID=Europe/Berlin:20240619T170000 DTSTAMP:20260408T041832 CREATED:20240417T180940Z LAST-MODIFIED:20240417T180940Z UID:7870-1718697600-1718816400@marketingeda.com SUMMARY:GSA European Executive Forum 2024 DESCRIPTION:The GSA European Executive Forum\, our flagship event in Europe\, is BACK! Join us June 18th and 19th in Munich for the event of the summer! \nThis year\, in honor of GSA’s 30th anniversary\, we want to celebrate by bringing you the very best EEF ever: amazing speakers\, most thought provoking topics and the very best attendees. \nExpect a captivating combination of high-level discussions with forward looking technology trends: a masterful CEO fireside chat\, sessions ranging from genAI impact on the semiconductor industry\, to the future of networks\, to the emergence of a chiplet ecosystem\, to automotive\, sustainability\, and even on how tantalizing close we are to unlocking the world-changing promises of nuclear fusion and clean energy for all! \n  \nVIP Dinner capacity is strictly limited. \nThe GSA European Executive Forum is our flagship event in Europe which\, over two days\, always attracts the very top speakers and attendees: 300 senior decision makers\, the majority VP and C-level profiles. \nOver the past 20 years\, it has become the reference executive event for the semiconductor industry in the EMEA region. \nHotels in Munich are already very hard to find around the event date: PLEASE BOOK YOUR HOTEL ROOM NOW. \n  \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-european-executive-forum-2024/ LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany CATEGORIES:Forum,Foundry,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-June-18-19-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240502T083000 DTEND;TZID=America/Los_Angeles:20240502T173000 DTSTAMP:20260408T041832 CREATED:20240415T181052Z LAST-MODIFIED:20240415T181052Z UID:7850-1714638600-1714671000@marketingeda.com SUMMARY:TSMC 2024 Technology Workshop – Austin DESCRIPTION:08:30 – 09:30\nRegistration & Partner Pavilion\n\n\n09:30 – 09:40\nWelcome & Opening Remarks\n\n\n09:40 – 10:00\nMarket Outlook – Powering AI Together\n\n\n10:00 – 10:30\nAdvanced Technology Leadership\n\n\n10:30 – 11:00\nCoffee Break & Ecosystem Pavilion\n\n\n11:00 – 11:25\nSpecialty Technology Leadership\n\n\n11:25 – 11:50\nManufacturing Excellence\n\n\n11:50 – 13:00\nLunch & Ecosystem Pavilion\n\n\n13:00 – 13:20\nAdvanced Technology Design Solutions\n\n\n13:20 – 13:40\nAdvanced Technology\n\n\n13:40 – 14:00\n3DFabric Technology\n\n\n14:00 – 14:30\nCoffee Break & Ecosystem Pavilion\n\n\n14:30 – 14:50\nAutomotive and eNVM Technology\n\n\n14:50 – 15:10\nIoT Technology\n\n\n15:10 – 15:30\nAdvanced RF and Analog Technology\n\n\n15:30 – 16:40\nSocial Hour\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2024-technology-workshop-austin/ LOCATION:JW Marriott Austin\, 110 E 2nd St\, Austin\, TX\, United States CATEGORIES:EDA,Foundry,IP,Semiconductor,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024-North-America.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20240425T110000 DTEND;TZID=America/New_York:20240425T120000 DTSTAMP:20260408T041832 CREATED:20240401T181039Z LAST-MODIFIED:20240401T181039Z UID:7800-1714042800-1714046400@marketingeda.com SUMMARY:Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions DESCRIPTION:Ansys Semiconductor Manufacturing Webinar Series: Part 1 of 3. \nJoin us on Thursday\, April 25th for an in-depth view of multi-physics simulation in the semiconductor fabrication process. \nOverview\nAccurate design and optimization of the semiconductor fabrication process/equipment for yield improvements and faster time-to-market require multiphysics simulation\, which can address various physical interactions and phenomena. By encompassing factors from contamination challenges to ensuring uniform product outcomes\, engineers can leverage such simulations to generate innovative ideas for optimized processes and cutting-edge solutions in semiconductor fabrication. \nThis webinar will demonstrate the practical application of Ansys tools in understanding the impact of various parameters on diverse wafer fabrication processes and fine-tuning them to improve yields and reduce wafer cycle time. \nWhat you will learn\n\nImportance of simulation in fabrication processes\nReduce wafer cycle time\nModel fabrication process with Ansys tools\nOptimize of fabrication processes\nSystem-level modeling of fabrication processes\n\nWho should attend\nEngineers and Engineering Managers/Directors\, Manufacturing teams\, Etch teams\, Deposition teams\, NPI teams and Aftermarket teams \nSpeaker\n\nNima Bohlooli\, Senior Application Engineer\, Ansys\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/improving-semiconductor-wafer-fabrication-process-efficiencies-using-ansys-solutions/ CATEGORIES:EDA,Semiconductor,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/April-25-2024-Ansys.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240425T080000 DTEND;TZID=America/Los_Angeles:20240425T114500 DTSTAMP:20260408T041832 CREATED:20240329T165734Z LAST-MODIFIED:20240329T165734Z UID:7790-1714032000-1714045500@marketingeda.com SUMMARY:AI Driving Fabs of the Future… People\, Technology\, Infrastructure DESCRIPTION:This is an incredibly exciting time for semiconductor manufacturing. After the supply chain disruption in the early 2020s\, companies are rapidly expanding and enhancing operations to meet market demands. Over the next few years\, many new fully automated 300mm fabs will bring major advancements to the industry. Get first-hand information—Join us in person or online. REGISTER TODAY. \nAttend the Pacific Northwest Breakfast Forum hosted at Analog Devices in Beaverton\, Oregon to hear experts discuss— \n\nKEYNOTE: The 5th Industrial Revolution: The Adjacent Possible of AI in Semiconductor Manufacturing—Analog Devices\nMacro Trends and Value Creation in the Semiconductor Industry—McKinsey & Company\nWhat Does It Mean for the Existing 200mm Legacy Fabs?—Microchip Technology\nSEMI Smart Manufacturing Initiative—Microchip Technology\nAI Use Cases in the Fab—Applied Materials\nEXECUTIVE PANEL: Discussion for Talent Acquisition\, Workforce Development\, Labor Shortage\n\nEXPERT SPEAKERS\nKEYNOTE\nDANIEL BURLINGAME\nANALOG DEVICES\n\n\nDAVID HANNY\nAPPLIED MATERIALS\n\n\n\nHENRY MARCIL\nMCKINSEY & COMPANY\n\n\n\nGARY STINSON\nMICROCHIP TECHNOLOGY\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ai-driving-fabs-of-the-future-people-technology-infrastructure/ LOCATION:Analog Devices\, 14320 SW Jenkins Road\, Beaverton\, OR\, 97005\, United States CATEGORIES:Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-April-25-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20240416T080000 DTEND;TZID=Europe/Brussels:20240417T170000 DTSTAMP:20260408T041832 CREATED:20240410T165555Z LAST-MODIFIED:20240410T165555Z UID:7826-1713254400-1713373200@marketingeda.com SUMMARY:CS Inernational Conference DESCRIPTION:he 14th CS International builds on the strengths of its predecessors\, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ensuring SiC’s Phenomenal Success; Expanding Horizons for Surface Emitters; Accelerating the Growth of GaN; Taking Power from the Photon; and New Frontiers for the LED. \nThose attending these sessions will be rewarded with greater insight into device technologies while learning of the latest opportunities and trends within the compound semiconductor industry. Delegates will also discover significant advances in tools and processes that enable enhanced yield and throughput. \nAttendees at this two-day conference will also meet a wide variety of key players within the community\, from investors and analysts to fab engineers and managers. \nCS International is part of AngelTech\, which delivers a portfolio of insightful\, informative\, highly valued chip-level conferences. Bringing together 3 conferences with more than 120 presentations\, more than 800 delegates and over 80 exhibitors\, AngelTech is the premier global event covering compound semiconductor\, photonic integrated circuit and power electronic technologies. With a significant overlap between the three conferences\, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/cs-inernational-conference/ LOCATION:Sheraton Brussels Airport Hotel\, Brussels\, Belgium CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CS-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240403T080000 DTEND;TZID=America/Los_Angeles:20240405T170000 DTSTAMP:20260408T041832 CREATED:20230918T162548Z LAST-MODIFIED:20240326T185839Z UID:6808-1712131200-1712336400@marketingeda.com SUMMARY:ISQED Symposium 2024 DESCRIPTION:A pioneer and leading interdisciplinary conference\, the 25thInternational Symposium on Quality Electronic Design (ISQED’24) accepts and promotes original and unpublished papers related to the topics shown below. \nISQED’24 theme is AI/ML& Electronic Design\, Hardware Security\, Quantum Computing\, 3D Integration\, and IoT. Authors are invited to submit papers in following topics (please visit the website for detail list of all tracks and subjects): \n\nHardware and System Security\nElectronic Design Automation Tools and Methodologies\nDesign for Test and Verification\nEmerging Device and Process Technologies and Applications\nCircuit Design\, 3D Integration and Advanced Packaging\nSystem-level Design and Methodologies\nCognitive Computing Hardware\n\nThis must-attend conference starts on Wednesday April 3\, and continues until the early afternoon of Friday April 5. The program includes keynote speeches\, embedded tutorials\, invited talks\, panel discussion\, and many peer-reviewed technical presentations. \nKeynote Speakers\n\nCross-Layer Optimization of Energy Harvesting and Storage\nDr. Naehyuck Chang\nExecutive Vice President\, Samsung SDI America\nWhy we did not have flying cars for 100 years\nJim Dukhovny\nCEO\, Alef Aeronautics\nReflections on Microelectronic and Microelectromechanical Technologies and the Challenges of Implementing Emerging Technologies\nClare D. Thiem\nAir Force Research Laboratory/RITB\n\nEmbedded Tutorials\n\nAdvanced Packaging for Heterogenous Integration\nDr. Tolga Acikalin\nIntel Labs\nSecuring Ubiquitous Devices with Lightweight Circuit Primitives\nProf. Kaiyuan Yang\nRice University\n\nPanel Discussion\n\nAI Hardware: Opportunities and Challenges\n\nTechnical Sessions\nTechnical program consists of over 20 technical sessions featuring over 100 peer-reviewed and invited technical presentations on various challenging topics related to AI/ML & Electronic Design\, Security\, IoT\, Quantum Computing\, etc. See the ISQED 2024 program for details. \nISQED Awards\nISQED best paper award ceremony will be held during plenary session on the morning of Wednesday April 3. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/isqed-symposium-2024/ LOCATION:Seven Hills Conference Center\, 800 Font Blvd\, San Francisco\, CA\, 94132\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISQED-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/London:20240313T080000 DTEND;TZID=Europe/London:20240314T170000 DTSTAMP:20260408T041832 CREATED:20240122T194453Z LAST-MODIFIED:20240122T194453Z UID:7549-1710316800-1710435600@marketingeda.com SUMMARY:GSA International Semiconductor Conference DESCRIPTION:Inaugural GSA event in partnership with the UK Government.  \nMeet senior business leaders\, investors\, and public policy officials from around the world. \nAcross two days\, join us for exciting discussions on semiconductor innovation for a NetZero economy\, with a view on the dramatically changing supply chain\, government interventions and industry outlook. \n  \nSemiconductor Innovation for NetZero (March 13-14) \n\nSupply Chain Resilience and national approaches to Semiconductor Policy\nDifferent government approaches to semiconductor policy\, supply chains and stimulating industry growth\nResource and talent development\, including raising the role of women in the industry\nCapital funding and IP strategies for start-ups and scale-ups\n\nWLI EMEA Kick-Off Event (March 13 morning) \n\nThe first GSA Women Leadership Initiative in Europe\nDiscuss the raising role of women in semiconductors\nHear lessons learned from women who have excelled in navigating a traditionally male-dominated industry\n\n\nTicket will cover both days\, all sections\nVIP Dinner will be held on the evening of March 13th: a separate ticket is required\, very limited seating available!\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-international-semiconductor-conference/ LOCATION:Here East\, 14 E Bay Lane\, London\, United Kingdom CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-March-13-14-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240225T080000 DTEND;TZID=America/Los_Angeles:20240229T180000 DTSTAMP:20260408T041832 CREATED:20240221T174208Z LAST-MODIFIED:20240221T174538Z UID:7659-1708848000-1709229600@marketingeda.com SUMMARY:SPIE Advanced Lithography + Patterning DESCRIPTION:Attend and hear research\, challenges\, and breakthroughs as you gather with colleagues in San Jose \nJoin other leading researchers who are solving challenges in optical and EUV lithography\, patterning technologies\, metrology\, and process integration for semiconductor manufacturing and adjacent applications. \nFive days of exciting content and connecting with your community\n\nPlenary talks\nTechnical presentations\nNetworking sessions\nCourse offerings\nExhibition\n\nCome to hear world-class speakers\nChan Hwang\n\nSamsung (Korea) \nAnn Kelleher\n\nIntel Corp. (United States) \nTodd Younkin\n\nSemiconductor Research Corporation (USA) \nExplore six great conferences\n\nOptical and EUV Nanolithography\nDTCO and Computational Patterning\nMetrology\, Inspection\, and Process Control\nNovel Patterning Technologies\nAdvances in Patterning Materials and Processes\nAdvanced Etch Technology and Process Integration for Nanopatterning\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/spie-advanced-lithography-patterning/ LOCATION:San Jose Convention Center\, 150 W San Carlos Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SPIE.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240218T080000 DTEND;TZID=America/Los_Angeles:20240222T170000 DTSTAMP:20260408T041832 CREATED:20231230T004304Z LAST-MODIFIED:20231230T004304Z UID:7483-1708243200-1708621200@marketingeda.com SUMMARY:ISSCC 2024 DESCRIPTION:The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency\, and to network with leading experts. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/isscc-2024/ LOCATION:San Francisco Marriot Marquis\, 780 Mission Street\, San Francisco\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISSCC-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20240206T090000 DTEND;TZID=America/New_York:20240206T180000 DTSTAMP:20260408T041832 CREATED:20240129T191342Z LAST-MODIFIED:20240129T191342Z UID:7559-1707210000-1707242400@marketingeda.com SUMMARY:Canada's Semiconductor Summit DESCRIPTION:Help build Canada’s role in North America’s integrated semiconductor supply chain.\n\n\nFeaturing key industry and government decision-makers from Canada\, the United States\, and international jurisdictions\, your insights at this by-invitation-only event will help us build an effective action plan. The summit will establish priorities and define opportunities to accelerate the growth\, development\, and competitiveness of Canada’s semiconductor sector. \n\nProgram\n\n\n9-9:10 AM Welcome & Introductory Remarks \nMC:  Ruth Rayman\, former Director General\, Advanced Electronics and Photonics Research Centre\, NRC \n\n\n\n\n\n9:10-9:30 AM An Unprecedented Global Recalibration \nSemiconductors are the backbone of the digital economy. As an integrated North American semiconductor supply chain takes shape\, Canada has the opportunity to transform existing\, discrete areas of expertise into a coherent offering\, forge new collaborations and maximize new markets. \nKey topics: \n\nLay of the land\, threats and opportunities etc.\n\nSpeaker: Dr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council \n\n\n\n\n\n9:30-10:45 AM Automotive\, EVs\, and Batteries: Amplifying Our Strengths \nCanada is creating a world class EV supply chain with OEMs and electrification sub-systems. Semiconductors lie at the heart of the 21st century automobile. How can Canada play a larger role in the semiconductor supply chain for EVs? What are the short and long-term opportunities? \nKey topics: \n\nWhat is the size of the automotive semiconductor market in Canada? What is its impact on the automotive manufacturing ecosystem in Canada?\nEV sub-systems: which is the best sub-system to target for Canada to grow the auto semiconductor ecosystem?\nHow can semiconductors complement the increasing investment in EV manufacturing in Canada in the future?\n\nModerator: Kirk Ouellette\,  Vice President\, Strategy Development and Strategic Marketing\, STMicroelectronics \nPanelists: \n\nAndrea Tranchida\, Vice President\, Global Automotive Solutions\, NXP Semiconductors\nBenoit Rousseau\, Vice President – GaN Automotive\, Infineon Technologies\nDaniel Boisvert\, Director of Business Development\, C-MAC Electronics Solutions\nMona Eghanian\, Assistant Vice President\, OVIN\n\n\n\n\n\n\n10:45-11 AM Break \nNetworking and refreshments. \n\n\n\n\n\n11 AM-12:15 PM Advanced Technologies: Leveraging Canadian Capabilities \nCanada needs to strategically leverage existing areas of strength and promising new advanced technologies to integrate with critical capabilities into the global semiconductor supply chain. What future-looking technologies are worth pursuing? What is the market telling us—and what criteria should guide our investments?  \nKey topics: \n\nPhotonics/RF\nAI\nSensors\nCompound semiconductors\nQuantum computing\n\nModerator: Duncan Stewart\, Partner\, Deep Tech Venture Fund\, BDC \nPanelists: \n\nJon Rogers\, Co-founder and SVP Engineering\, Alphawave Semi\nI-Cheng Chen\, Fellow\, Platform Architecture\, AMD Canada\nIgor Arsovski\, Head of Silicon\, Fellow\, Groq\nJim Hjartarson\, President and COO\, Inpho\n\n\n\n\n\n\n12:15-1:15 PM Catered buffet lunch with guest speaker \nSilicon Valley legend\, John East\, former CEO of Actel\, and veteran of AMD and Fairchild Semiconductor\, remembers those formative\, chaotic years in Silicon Valley—and the analogies in Canada today. \nSpeaker: John East\, Chairman of the Board\, SPARK Microsystems \n\n\n\n\n\n1:15-2:30 PM Building a Competitive Semiconductor Ecosystem: Harnessing an Economic Juggernaut \nSilicon Valley\, Taiwan\, South Korea\, Saxony\, IMEC\, Albany etc. Not every successful tech ecosystem has to adhere to the same model. What can Canada learn from successful semiconductor ecosystems? What relationships need to be established with key US hubs? How should the private sector\, academia and government collaborate? \nKey topics: \n\nEcosystem overview\nWhat gave the stimulus to get it off the ground?\nWhat’s the private/government split?\n\nModerator: Normand Bourbonnais\, Président Directeur Général\, Technum Québec \nPanelists: \n\nLode Lauwers\, SVP\, Business Development & Sales\, IMEC\nMarie-Josée Turgeon\, Présidente – Directrice générale\, C2MI\nLaMar Hill\, Director\, NY Creates\nCharles Sturman\, CEO\, TechWorks\n\n\n\n\n\n\n2:30-2:45 PM Break \nNetworking and refreshments. \n\n\n\n\n\n2:45-4PM The Talent Question: Building the Pipeline \nThe semiconductor workforce must double to an estimated half a million people to meet the demands of North American semiconductor reshoring. What mix of training\, apprenticeship programs\, immigration\, financial incentives\, and creative retention strategies will build the pipeline for Canada? \nKey topics: \n\nTraining programs\nImmigration\nFinancial incentives\nApprenticeship programs\nFunding university Chairs\nRetention\nBrain drain\n\nModerator: Dr. Tony Chan Carusone\, CTO\, Alphawave Semi \nPanelists: \n\nDino Toffolon\, SVP of Engineering-Interface IP\, Synopsys\nKate Alcott\, Director of Workforce Programs\, NY Creates\nSylvain Charbonneau\, Vice-President\, Research and Innovation\, University of Ottawa\nArvind Gupta\, Professor at Department of Computer Science\, University of Toronto\n\n\n\n\n\n\n4-5 PM Strategic Initiatives and Next Steps for 2024: Making It Happen \nCanada has a powerful opportunity to establish itself as new niches emerge across the North American corridor. But we need to act fast.  Regional hubs have formed this year and are actively forging new partnerships and market plays.  How can we  ensure Canadian technology and expertise accesses these burgeoning markets?   \nKey topics: \n\nCSC 2024 Federal Budget Proposal\nAnnounced proposals ie. CSC\, FABrIC\, SECTR etc.\nFinancing growth\nPrivate-public partnerships\n\nModerator: Chris Ouslis\, Industrial Technology Advisor\, NRC \nPanelists: \n\nGord Harling\, President & CEO\, CMC Microsystems\nClaude Jean\, Executive Vice President\, Strategy & Partnership\, Teledyne Digital\nVelko Tzolov\, Director General\, Canadian Photonics Fabrication Centre (CPFC)\nDr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council\n\n\n\n\n\n\n5-5:30 PM Wrap Up & Closing Remarks \nSpeaker: Dr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council \n\n\n\n\n\n5:30-6:30 PM Networking Reception \nNetworking and refreshments. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/canadas-semiconductor-summit/ LOCATION:Brookstreet Hotel\, 525 Leggett Drive\, Ottawa\, Canada CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Canada-Semi-Summit-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20231213T080000 DTEND;TZID=Asia/Kolkata:20231217T170000 DTSTAMP:20260408T041832 CREATED:20231101T195220Z LAST-MODIFIED:20231101T195305Z UID:7022-1702454400-1702832400@marketingeda.com SUMMARY:International Workshop on Physics of Semiconductor Devices - IWPSD 2023 DESCRIPTION:The XXII International Workshop on the Physics of Semiconductor Devices (IWPSD 2023) is being jointly organized by the Indian Institute of Technology Madras in collaboration with Society for Semiconductor Devices and Semiconductor Society (India). This series of biennial workshops\, started in 1981\, provides a global forum for interaction between scientists and technologists working in the area of semiconductor materials and devices. \nThe topics to be covered in the Workshop are\, but not limited to:\n\n2D Materials and Devices\nCrystal Growth and Epitaxy\nDevice Modelling and Simulation\nDevices for Quantum Technology\nII – VI and Oxide Semiconductors\nIII – V Semiconductors\nMemory and Logic Devices\nMEMS\, NEMS and Sensors\nOrganic and Flexible Electronics\nPhotovoltaics\nPower Semiconductor Devices\nOptoelectronics\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/international-workshop-on-physics-of-semiconductor-devices-iwpsd-2023/ LOCATION:Research Park\, IIT Madras\, Tamil Nadu 600036\, Chennai\, India CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IWPSD-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20231209T080000 DTEND;TZID=America/Los_Angeles:20231213T170000 DTSTAMP:20260408T041832 CREATED:20230920T171734Z LAST-MODIFIED:20231207T174511Z UID:6838-1702108800-1702486800@marketingeda.com SUMMARY:69th International Electron Devices Meeting - IEDM DESCRIPTION:IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology\, design\, manufacturing\, physics\, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology\, advanced memory\, displays\, sensors\, MEMS devices\, novel quantum and nano-scale devices and phenomenology\, optoelectronics\, devices for power and energy harvesting\, high-speed devices\, as well as process technology and device modeling and simulation. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/69th-international-electron-devices-meeting-iedm/ LOCATION:Hilton San Francisco Union Square\, 333 O'Farrell Street\, San Francisco\, 94102\, United States CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEDM-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Istanbul:20231204T080000 DTEND;TZID=Europe/Istanbul:20231207T170000 DTSTAMP:20260408T041832 CREATED:20230313T210903Z LAST-MODIFIED:20230313T211025Z UID:6124-1701676800-1701968400@marketingeda.com SUMMARY:IEEE 30th International Conference on Electronics\, Circuits and Systems (ICECS) DESCRIPTION:The IEEE 30th International Conference on Electronics\, Circuits and Systems (ICECS) will be held in Istanbul\, Turkey 4-7 December 2023. As the flagship conference of IEEE Circuits and Systems Society in Region 8 (Europe\, Middle East\, and Africa)\, ICECS 2023 will consist of tutorials\, plenary lectures\, regular\, special and poster sessions focusing on recent trends\, emerging technologies and advances. \n  \nTracks\n  \n\nAnalog/Mixed-Signal/Microwave Circuits\nBio-Medical\, Bio-Inspired Circuits/Systems\nEDA\, Test and Reliability\nDigital Circuits and Systems\nLinear and Non-Linear Circuits and Systems\nNon-Linear Devices\, Memristors\nLow-Power\, Low-Voltage Design\nEmbedded and Micro/Systems\nNeural Networks\, Machine/Deep Learning\nSensors and Sensing Systems\nSignal Processing\, Image and Video\nVLSI Systems and Applications\nSmart Systems for CAS Applications\n\n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ieee-30th-international-conference-on-electronics-circuits-and-systems-icecs/ LOCATION:Hilton Maslak\, Büyükdere Cd. No:233\, Istanbul\, Turkey CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ICECS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20231107T090000 DTEND;TZID=Asia/Kolkata:20231108T180000 DTSTAMP:20260408T041832 CREATED:20231103T191339Z LAST-MODIFIED:20231103T191339Z UID:7036-1699347600-1699466400@marketingeda.com SUMMARY:IESA AI Summit DESCRIPTION:Experience the unprecedented growth opportunities in the semiconductor and electronics industry\, fueled by rapid advancements in Artificial Intelligence (AI). Embrace the paradigm shift from software-centric approaches to hardware-centric solutions\, captivating emerging markets in the realm of AI.\nWitness the powerful convergence of breakthrough technologies like the Internet of Things (IoT) and AI\, igniting a renaissance in the electronics landscape. \nIn the dynamic realm of the Intelligent Electronics & Semiconductor ecosystem\, the India Electronics and Semiconductor Association (IESA) eagerly explores the immense potential of AI in the hardware sector. Unlock the limitless possibilities of AI and shape the future of the semiconductor industry. \nEmbrace cutting-edge technologies\, network with industry experts\, and drive innovation at the forefront of AI’s revolution in hardware. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/iesa-ai-summit/ LOCATION:Trident Hotel Hyderabad\, Hyderabad\, India CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IESA-AI-Summit-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Chicago:20231031T083000 DTEND;TZID=America/Chicago:20231031T170000 DTSTAMP:20260408T041832 CREATED:20231024T192233Z LAST-MODIFIED:20231024T192426Z UID:6991-1698741000-1698771600@marketingeda.com SUMMARY:STAC Summit DESCRIPTION:STAC Summits bring together CTOs and other industry leaders responsible for solution architecture\, infrastructure engineering\, application development\, machine learning/deep learning engineering\, data engineering\, and operational intelligence to discuss important technical challenges in trading and investment. \nWHEN\nTuesday\, October 31\, 2023\nSTAC Exchange (Exhibits) opens at 8:30am CDT\nConference starts at 9:00am CDT\nNetworking lunch at ~12:00pm CDT\nConference concludes at ~4:00pm CDT\nReception immediately following \nWHERE\nThe Metropolitan Club\nWillis Tower\n233 South Wacker Drive\n66th Floor\nChicago \n\n\n\n9:00am\nSTAC Update: Historical tick analytics\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will present the latest results in STAC-M3 (tick analytics).\n\n\n\n\n\n\n9:15am\nInnovation Roundup\n\n\n\n“How to maximize your GPU investment”\nJeff Chu\, Financial Services Sales\, Penguin Solutions\n\n\n\n“Using a vector database to unlock the power of your data”\nJosh Kalina\, Pre-Sales Engineer\, KX\n\n\n\n“Data at Scale: Overcoming Challenges in Generative AI and LLM Development”\nKeith Miller\, VP Technical Sales\, Services and Support\, DDN\n\n\n\n\n\n\n9:35am\nEnforcing the foundation: Improving data lineage      ;\n\n\n\n\n\nMarc Gale\, Director of Data Engineering\, OncoHealth; former Manager of Data Engineering\, Chicago Trading Company\nJosh Kalina\, Pre-Sales Engineer\, KX\nKeith Miller\, VP Technical Sales\, Services and Support\, DDN\n\nIt’s no secret that the automation of insights drives forward the financial industry. Both traditional quantitative analysis and newer AI models require a solid data foundation. Data engineers have to build this foundation from an ever-increasing universe of data sets\, which come from many sources with varying quality. Even worse\, today’s data could be corrected tomorrow\, next week\, or next year. For models to stay stable during rapid innovation\, data engineers must properly track\, maintain\, and leverage the data’s lineage. How should they track change sets\, version data\, and stay synchronized across the enterprise? How should licensing and permissions be taken into account? What are the best practices for maintaining metadata? How do storage architectures impact data lineage solutions? Join our panel of experts and add your questions to the mix.\n\n\n\n\n\n\n10:05am\nThe unbearable heaviness of data: Can modern approaches help?\n\n\n\n\n\nVrashank Jain\, Sr. Director of Product Management for Data Management Solutions\, Dell Technologies\n\nIt’s common for data architects and engineers to spend more time managing data than creating value from it. They have to deal with data-hungry end users\, capture real-time streams\, and manage multiple derivative data sets for historical research. AI adoption is piling on troves of model inputs and outputs that are required for explainability and fine tuning. And hybrid cloud infrastructures mean copies in multiple locations. How can architects and engineers enable new value from data rather than simply managing the inventory? Vrashank has seen financial firms greatly reduce the burden of data maintenance\, allowing technologists to focus on developing data products. Using Dell’s experience with an international bank as a guide\, he’ll show how applying an open data platform\, from edge to core to cloud\, can reduce data movement\, consolidate data intelligently\, and allow access to diverse tools and uses\, all while keeping data secure. Be sure to bring your questions for Vrashank as he covers best practices in data modernization and the benefits they can bring.\n\n\n\n\n\n\n10:30am\nBreak\n\n\n\n\n\n\n11:00am\nSTAC Update: Big compute\n\n\n\n\n\nBishop Brock\, Head of Research\, Strategic Technology Analysis Center\n\nBishop and Peter will present the latest STAC Benchmark Council activities compute critical workloads\, including STAC-A2 (complex deriviatives risk computation) and an update from the STAC-ML Working Group.\n\n\n\n\n\n\n11:10am\nWaste not\, want not: Avoiding idle GPUs\n\n\n\n\n\nTroy Kaster\, VP of AI\, Penguin Solutions\n\nMany financial firms are looking to large-scale GPU clusters to meet the demands of compute-hungry AI and HPC workloads in price discovery\, portfolio management\, and quantitative research. But once they fill the compute gap\, a knowledge gap remains. How should system engineers and admins best utilize these enormous investments and avoid the pitfalls that result in poor performance? Troy will help us understand how to ensure high availability and maximize the utilization of expensive computing platforms. Using Penguin’s experience bringing a 16k GPU cluster online for Meta\, he’ll walk us through some real-life issues encountered and solutions applied. Along the way he’ll cover best practices for designing\, building\, deploying\, and managing large-scale GPU clusters.\n\n\n\n\n\n\n11:35am\nInnovation Roundup\n\n\n\n“Build. Connect. Analyse. Beeks solves your colo and network visibility challenges.”\nMatthew Cretney\, Head of Product Management\, Beeks Group\n\n\n\n“Mechanics of Low Latency Capture”\nPramod Nayak\, Director of Product Management\, Low Latency\, Refinitiv\, an LSEG Business\n\n\n\n“The Smart Way to Configure a Tap Aggregator”\nKevin Formby\, VP Finance and Capital Markets\, Keysight Technologies\n\n\n\n\n\n\n11:50am\nEncrypting our markets: The impact of security on high-performance infrastructures\n\n\n\n\n\nVenkat Doddapuneni\, Senior Director of Software Engineering\, CME Group\nKevin Formby\, VP Finance and Capital Markets\, Keysight Technologies\nAdditional speakers to be announced\n\nSecurity has become a key component of the systemic risk conversation. Market oversight groups are discussing encrypted connections\, and at least one exchange has rolled them out. Encryption can provide a layer of protection\, helping prevent threats from moving horizontally through financial systems. But our markets benefit from high-performance\, low-friction connectivity. What conflicts can arise when security meets market access? Our panel of experts will discuss how to solve for security without exacerbating other tech risks. They’ll dive into important aspects\, including what concerns motivate a desire for higher security\, what should be in scope\, the impact on performance\, and how to maintain network-based risk\, compliance\, and data monitoring systems when encryption is a must. Bring your questions and join us to explore the impact of encryption on market connectivity.\n\n\n\n\n\n\n12:20pm\nNetworking Luncheon\n\n\n\n\n\n\n1:20pm\nSTAC Update: Network communications\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will present on the latest STACT Benchmark Council activities in network communications\, including recent test results on a high frequency radio link and benchmark development activities for cloud networking.\n\n\n\n\n\n\n1:35pm\nInnovation Roundup\n\n\n\n“Leveraging HATI for high resolution timing to FPGA’s.”\nCiaran Kennedy\, Sales\, Safran Timing & Navigation\n\n\n\n“Create a Better and Faster Consolidated View Across Markets Using FPGAs”\nCliff Maddox\, Director of Business Development\, NovaSparks\n\n\n\n“Cancel on Behalf is a Game Changer”\nJohn Hagerman\, VP Marketing and Business Development\, Algo-Logic\n\n\n\n“Using Equivalence Checking to Rapidly Evolve Your Design”\nMartin Rowe\, Sr. Application Engineer\, Siemens\n\n\n\n“Mastering Ultra-Low Latency: The Technical Blueprint of FPGA and Software Hybrid Solutions”\nJean-François Gagnon\, Ultra-Low Latency FPGA Solutions Architect\, Orthogone\n\n\n\n\n\n\n2:00pm\nTalent shortages in hardware verification: Can ML plug the gaps?\n\n\n\n\n\nAdam Sherer\, Verification Technology Executive\, Cadence\n\nAs discussed at recent STAC Summits\, financial firms suffer from a lack of verification engineers. They can achieve significant latency gains with properly designed and implemented hardware solutions\, but a shortage of experienced\, skilled personnel causes painful lead times and uncomfortable prioritization decisions. Adam thinks that\, given the proper setup\, advances in ML can provide some relief by increasing the productivity of current staff. He’ll dive into tasks that grind on an engineer’s time—like regression optimization\, failure triage analysis\, and bug localization—and explain how ML can ease the burden. Bring your questions and join him as he discusses using ML to accelerate your FPGA and ASIC verification.\n\n\n\n\n\n\n2:20pm\nBreak\n\n\n\n\n\n\n2:50pm\nSTAC Update: Fast data\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will discuss the latest test results for STAC-N1 (full stack networking).\n\n\n\n\n\n\n2:55pm\nInnovation Roundup\n\n\n\n“ÜberNIC can do… Can Yours?”\nAlex Stein\, Global Head Business Development\, Liquid-Markets-Solutions\n\n\n\n“Trading at the speed of light – Beyond ultra-low latency with Salience Labs”\nChris Porthouse\, Chief Product Officer\, Salience Labs\n\n\n\n“nxFramework update: Added features and improved latency for the Exegy FPGA development framework”\n Laurent de Barry\, Sr. Director\, Global Head of Solutions Consulting\, Exegy\n\n\n\n\n\n\n3:15pm\nDesigning the right hardware stack for FPGA\n\n\n\n\n\nMichael Gorbovitski\, Executive Director\, Morgan Stanley\nRobert DeWitt\, Director Product Marketing\, AMD\nDarrin Machay\, Principal Engineer\, Arista\n\nFGPAs are a go-to component for firms looking to improve their latencies\, whether by getting strategies as close to the network as possible or offloading critical workflows from the CPU. But as the best engineers know\, FPGAs are but one component of the custom hardware stack that affects performance. Given recent and upcoming changes in that stack\, designing the best systems requires answering a number of questions. How do on-board HBM3E and tiering impact memory-intensive applications? Do PCIe 5 and CXL change how we think about accessing compute\, memory\, and storage? Will new designs that pair ASIC with FPGA open new latency possibilities\, and what can we achieve with programmable switches? What’s the state of the art with FPGA sharing a fabric with CPU and other compute accelerators? Join our panel of experts as they explore these questions and yours.To kick off\, there will be some brief presentations:\n\n\n\n“Trade Smarter and Trade Faster with the New AMD FPGA accelerator for Ultra-Low Latency Trading”\n Hamid Reza Salehi\, Director Product Marketing\, AMD\n\n\n\n“Arista 7130 Update: Ultra Low Latency 25G”\n Darrin Machay\, Principal Engineer\, Arista\n\n\n\n\n\n\n~4:00pm\nNetworking Reception\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/stac-summit-2/ LOCATION:The Metropolitan Club\, 233 South Wacker Drive\, Chicago\, IL\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/STAC-October-31-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230827T080000 DTEND;TZID=America/Los_Angeles:20230829T170000 DTSTAMP:20260408T041832 CREATED:20230613T165859Z LAST-MODIFIED:20230613T165859Z UID:6490-1693123200-1693328400@marketingeda.com SUMMARY:Hot Chips 2023 DESCRIPTION:Hot Chips 2023 (advance program) will be held as a hybrid conference with in-person attendance at Stanford University from August 27 to 29\, 2023. \nConference Format\nHot Chips 2023 will be a hybrid conference. You may register to attend virtual or in-person. The conference venue is the Dinkelspiel Auditorium on the Stanford University Conference. \n\nSunday (August 27) is a Tutorial Day.\nMonday and Tuesday (August 28 and 29) are Conference Days.\n\nVirtual Conference: Includes full access to conference videos\, presentation PDFs and Slack Channels for both Tutuorial and Conference Days. All talks are transmitted in real time and are also recorded so that you also may view them at a time convenient for your time zone. Details are here. \nIn-Person Conference: You may register for Conference Days only or both Conference and Tutorial Days. In either case you will have full access to Videos\, presentation PDFs and Slack channels. The conference fee includes breakfast\, lunch\, coffee breaks and receptions. Details are here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/hot-chips-2023/ LOCATION:Stanford University\, 471 Lagunita Drive\, Stanford\, CA\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/14054931_10155065287553998_1856342906013349235_n.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230822T080000 DTEND;TZID=America/Los_Angeles:20230824T170000 DTSTAMP:20260408T041832 CREATED:20230802T171343Z LAST-MODIFIED:20230802T171343Z UID:6655-1692691200-1692896400@marketingeda.com SUMMARY:ERI 2.0 Summit DESCRIPTION:Watch as leaders from our government agencies\, the Defense Industrial Base\, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry\, national and economic security\, and future research directions. \nThe Electronics Resurgence Initiative (ERI)\, DARPA’s response to national-level microelectronics concerns\, is designed to ensure U.S. leadership in cross-functional\, next-generation microelectronics research\, development\, and manufacturing. The initiative\, aimed at both national security capabilities and commercial economic competitiveness and sustainability\, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry\, the defense industrial base\, and university researchers. \nDARPA expanded ERI’s focus with the announcement of ERI 2.0\, which seeks to reinvent domestic microelectronics manufacturing. ERI 2.0 will strengthen DARPA’s leadership in driving the next generation of microelectronics for national security by creating a national capability for 3DHI manufacturing and pursuing focused research in: \n\nManufacturing complex 3D systems\nDeveloping electronics for extreme environments\n\n…while maintaining the following thrust areas:\n  \n\nOptimizing design and test for complex circuits and prototypes\nOvercoming security threats across the entire hardware lifecycle\nIncreasing information processing density and efficiency\nAccelerating innovation in artificial intelligence hardware to make decisions at the edge faster\nSecuring communications\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/eri-2-0-summit/ LOCATION:Hyatt Regency Seattle\, 805 Howell Street\, Seattle\, WA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ERI-2.0.jpg END:VEVENT END:VCALENDAR