BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.15.20//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20250309T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20251102T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Berlin BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20250330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20251026T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20220313T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20221106T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20230312T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20231105T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20240310T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20241103T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20250309T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20251102T060000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20250330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20251026T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/London BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20241027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20250330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20251026T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Istanbul BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0300 TZNAME:+03 DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20220313T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20221106T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20230312T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20231105T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20240310T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20241103T070000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Vienna BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Jerusalem BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20220325T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20221029T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20230324T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20231028T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20240329T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20241026T230000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240709T080000 DTEND;TZID=America/Los_Angeles:20240711T170000 DTSTAMP:20260412T023433 CREATED:20240327T191111Z LAST-MODIFIED:20240327T191153Z UID:7778-1720512000-1720717200@marketingeda.com SUMMARY:Semicon West 2024 DESCRIPTION:SEMICON West 2024 is North America’s premier conference and exhibition that gathers the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and changes. Join industry leaders\, experts\, and visionaries at the Moscone Center\, San Francisco\, CA from July 9–11. \nJoin us to explore groundbreaking technologies transforming the microelectronics sector and enabling smart applications. This is the perfect opportunity for top minds and manufacturers to connect\, collaborate\, innovate\, and STRONGER TOGETHER we’ll unite in our journey towards the $1T milestone! \nPrograms + Events\n\n– CEO Summit/Keynotes\n– Market Trends & Data\n– Sustainability\n– TechTALKS\n– SEMI U—Workshops\n– Test Vision Symposium\n– Smart Manufacturing\, MedTech + Mobility\n– WFD—Workforce Development\n– FLEX Conference & Exhibition\nAnd much more! \nNetworking + Activations\n\n– Lively Receptions\n– Networking Lounges\n– Beer & Wine Garden\n– Award Ceremonies\n– SEMI Booth + SEMI U\n– Private Meeting Rooms\n– Taste of San Francisco\n– Food Truck Fare\n– Media Hub\nAnd much more! \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/semicon-west-2024/ LOCATION:Moscone Center\, 747 Howard Street\, San Francisco\, CA\, 94103\, United States CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Semicon-West-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20240618T080000 DTEND;TZID=Europe/Berlin:20240619T170000 DTSTAMP:20260412T023433 CREATED:20240417T180940Z LAST-MODIFIED:20240417T180940Z UID:7870-1718697600-1718816400@marketingeda.com SUMMARY:GSA European Executive Forum 2024 DESCRIPTION:The GSA European Executive Forum\, our flagship event in Europe\, is BACK! Join us June 18th and 19th in Munich for the event of the summer! \nThis year\, in honor of GSA’s 30th anniversary\, we want to celebrate by bringing you the very best EEF ever: amazing speakers\, most thought provoking topics and the very best attendees. \nExpect a captivating combination of high-level discussions with forward looking technology trends: a masterful CEO fireside chat\, sessions ranging from genAI impact on the semiconductor industry\, to the future of networks\, to the emergence of a chiplet ecosystem\, to automotive\, sustainability\, and even on how tantalizing close we are to unlocking the world-changing promises of nuclear fusion and clean energy for all! \n  \nVIP Dinner capacity is strictly limited. \nThe GSA European Executive Forum is our flagship event in Europe which\, over two days\, always attracts the very top speakers and attendees: 300 senior decision makers\, the majority VP and C-level profiles. \nOver the past 20 years\, it has become the reference executive event for the semiconductor industry in the EMEA region. \nHotels in Munich are already very hard to find around the event date: PLEASE BOOK YOUR HOTEL ROOM NOW. \n  \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-european-executive-forum-2024/ LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany CATEGORIES:Forum,Foundry,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-June-18-19-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240502T083000 DTEND;TZID=America/Los_Angeles:20240502T173000 DTSTAMP:20260412T023433 CREATED:20240415T181052Z LAST-MODIFIED:20240415T181052Z UID:7850-1714638600-1714671000@marketingeda.com SUMMARY:TSMC 2024 Technology Workshop – Austin DESCRIPTION:08:30 – 09:30\nRegistration & Partner Pavilion\n\n\n09:30 – 09:40\nWelcome & Opening Remarks\n\n\n09:40 – 10:00\nMarket Outlook – Powering AI Together\n\n\n10:00 – 10:30\nAdvanced Technology Leadership\n\n\n10:30 – 11:00\nCoffee Break & Ecosystem Pavilion\n\n\n11:00 – 11:25\nSpecialty Technology Leadership\n\n\n11:25 – 11:50\nManufacturing Excellence\n\n\n11:50 – 13:00\nLunch & Ecosystem Pavilion\n\n\n13:00 – 13:20\nAdvanced Technology Design Solutions\n\n\n13:20 – 13:40\nAdvanced Technology\n\n\n13:40 – 14:00\n3DFabric Technology\n\n\n14:00 – 14:30\nCoffee Break & Ecosystem Pavilion\n\n\n14:30 – 14:50\nAutomotive and eNVM Technology\n\n\n14:50 – 15:10\nIoT Technology\n\n\n15:10 – 15:30\nAdvanced RF and Analog Technology\n\n\n15:30 – 16:40\nSocial Hour\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2024-technology-workshop-austin/ LOCATION:JW Marriott Austin\, 110 E 2nd St\, Austin\, TX\, United States CATEGORIES:EDA,Foundry,IP,Semiconductor,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024-North-America.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20240425T110000 DTEND;TZID=America/New_York:20240425T120000 DTSTAMP:20260412T023433 CREATED:20240401T181039Z LAST-MODIFIED:20240401T181039Z UID:7800-1714042800-1714046400@marketingeda.com SUMMARY:Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions DESCRIPTION:Ansys Semiconductor Manufacturing Webinar Series: Part 1 of 3. \nJoin us on Thursday\, April 25th for an in-depth view of multi-physics simulation in the semiconductor fabrication process. \nOverview\nAccurate design and optimization of the semiconductor fabrication process/equipment for yield improvements and faster time-to-market require multiphysics simulation\, which can address various physical interactions and phenomena. By encompassing factors from contamination challenges to ensuring uniform product outcomes\, engineers can leverage such simulations to generate innovative ideas for optimized processes and cutting-edge solutions in semiconductor fabrication. \nThis webinar will demonstrate the practical application of Ansys tools in understanding the impact of various parameters on diverse wafer fabrication processes and fine-tuning them to improve yields and reduce wafer cycle time. \nWhat you will learn\n\nImportance of simulation in fabrication processes\nReduce wafer cycle time\nModel fabrication process with Ansys tools\nOptimize of fabrication processes\nSystem-level modeling of fabrication processes\n\nWho should attend\nEngineers and Engineering Managers/Directors\, Manufacturing teams\, Etch teams\, Deposition teams\, NPI teams and Aftermarket teams \nSpeaker\n\nNima Bohlooli\, Senior Application Engineer\, Ansys\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/improving-semiconductor-wafer-fabrication-process-efficiencies-using-ansys-solutions/ CATEGORIES:EDA,Semiconductor,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/April-25-2024-Ansys.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240425T080000 DTEND;TZID=America/Los_Angeles:20240425T114500 DTSTAMP:20260412T023433 CREATED:20240329T165734Z LAST-MODIFIED:20240329T165734Z UID:7790-1714032000-1714045500@marketingeda.com SUMMARY:AI Driving Fabs of the Future… People\, Technology\, Infrastructure DESCRIPTION:This is an incredibly exciting time for semiconductor manufacturing. After the supply chain disruption in the early 2020s\, companies are rapidly expanding and enhancing operations to meet market demands. Over the next few years\, many new fully automated 300mm fabs will bring major advancements to the industry. Get first-hand information—Join us in person or online. REGISTER TODAY. \nAttend the Pacific Northwest Breakfast Forum hosted at Analog Devices in Beaverton\, Oregon to hear experts discuss— \n\nKEYNOTE: The 5th Industrial Revolution: The Adjacent Possible of AI in Semiconductor Manufacturing—Analog Devices\nMacro Trends and Value Creation in the Semiconductor Industry—McKinsey & Company\nWhat Does It Mean for the Existing 200mm Legacy Fabs?—Microchip Technology\nSEMI Smart Manufacturing Initiative—Microchip Technology\nAI Use Cases in the Fab—Applied Materials\nEXECUTIVE PANEL: Discussion for Talent Acquisition\, Workforce Development\, Labor Shortage\n\nEXPERT SPEAKERS\nKEYNOTE\nDANIEL BURLINGAME\nANALOG DEVICES\n\n\nDAVID HANNY\nAPPLIED MATERIALS\n\n\n\nHENRY MARCIL\nMCKINSEY & COMPANY\n\n\n\nGARY STINSON\nMICROCHIP TECHNOLOGY\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ai-driving-fabs-of-the-future-people-technology-infrastructure/ LOCATION:Analog Devices\, 14320 SW Jenkins Road\, Beaverton\, OR\, 97005\, United States CATEGORIES:Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-April-25-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20240416T080000 DTEND;TZID=Europe/Brussels:20240417T170000 DTSTAMP:20260412T023433 CREATED:20240410T165555Z LAST-MODIFIED:20240410T165555Z UID:7826-1713254400-1713373200@marketingeda.com SUMMARY:CS Inernational Conference DESCRIPTION:he 14th CS International builds on the strengths of its predecessors\, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ensuring SiC’s Phenomenal Success; Expanding Horizons for Surface Emitters; Accelerating the Growth of GaN; Taking Power from the Photon; and New Frontiers for the LED. \nThose attending these sessions will be rewarded with greater insight into device technologies while learning of the latest opportunities and trends within the compound semiconductor industry. Delegates will also discover significant advances in tools and processes that enable enhanced yield and throughput. \nAttendees at this two-day conference will also meet a wide variety of key players within the community\, from investors and analysts to fab engineers and managers. \nCS International is part of AngelTech\, which delivers a portfolio of insightful\, informative\, highly valued chip-level conferences. Bringing together 3 conferences with more than 120 presentations\, more than 800 delegates and over 80 exhibitors\, AngelTech is the premier global event covering compound semiconductor\, photonic integrated circuit and power electronic technologies. With a significant overlap between the three conferences\, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/cs-inernational-conference/ LOCATION:Sheraton Brussels Airport Hotel\, Brussels\, Belgium CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CS-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240403T080000 DTEND;TZID=America/Los_Angeles:20240405T170000 DTSTAMP:20260412T023433 CREATED:20230918T162548Z LAST-MODIFIED:20240326T185839Z UID:6808-1712131200-1712336400@marketingeda.com SUMMARY:ISQED Symposium 2024 DESCRIPTION:A pioneer and leading interdisciplinary conference\, the 25thInternational Symposium on Quality Electronic Design (ISQED’24) accepts and promotes original and unpublished papers related to the topics shown below. \nISQED’24 theme is AI/ML& Electronic Design\, Hardware Security\, Quantum Computing\, 3D Integration\, and IoT. Authors are invited to submit papers in following topics (please visit the website for detail list of all tracks and subjects): \n\nHardware and System Security\nElectronic Design Automation Tools and Methodologies\nDesign for Test and Verification\nEmerging Device and Process Technologies and Applications\nCircuit Design\, 3D Integration and Advanced Packaging\nSystem-level Design and Methodologies\nCognitive Computing Hardware\n\nThis must-attend conference starts on Wednesday April 3\, and continues until the early afternoon of Friday April 5. The program includes keynote speeches\, embedded tutorials\, invited talks\, panel discussion\, and many peer-reviewed technical presentations. \nKeynote Speakers\n\nCross-Layer Optimization of Energy Harvesting and Storage\nDr. Naehyuck Chang\nExecutive Vice President\, Samsung SDI America\nWhy we did not have flying cars for 100 years\nJim Dukhovny\nCEO\, Alef Aeronautics\nReflections on Microelectronic and Microelectromechanical Technologies and the Challenges of Implementing Emerging Technologies\nClare D. Thiem\nAir Force Research Laboratory/RITB\n\nEmbedded Tutorials\n\nAdvanced Packaging for Heterogenous Integration\nDr. Tolga Acikalin\nIntel Labs\nSecuring Ubiquitous Devices with Lightweight Circuit Primitives\nProf. Kaiyuan Yang\nRice University\n\nPanel Discussion\n\nAI Hardware: Opportunities and Challenges\n\nTechnical Sessions\nTechnical program consists of over 20 technical sessions featuring over 100 peer-reviewed and invited technical presentations on various challenging topics related to AI/ML & Electronic Design\, Security\, IoT\, Quantum Computing\, etc. See the ISQED 2024 program for details. \nISQED Awards\nISQED best paper award ceremony will be held during plenary session on the morning of Wednesday April 3. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/isqed-symposium-2024/ LOCATION:Seven Hills Conference Center\, 800 Font Blvd\, San Francisco\, CA\, 94132\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISQED-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/London:20240313T080000 DTEND;TZID=Europe/London:20240314T170000 DTSTAMP:20260412T023433 CREATED:20240122T194453Z LAST-MODIFIED:20240122T194453Z UID:7549-1710316800-1710435600@marketingeda.com SUMMARY:GSA International Semiconductor Conference DESCRIPTION:Inaugural GSA event in partnership with the UK Government.  \nMeet senior business leaders\, investors\, and public policy officials from around the world. \nAcross two days\, join us for exciting discussions on semiconductor innovation for a NetZero economy\, with a view on the dramatically changing supply chain\, government interventions and industry outlook. \n  \nSemiconductor Innovation for NetZero (March 13-14) \n\nSupply Chain Resilience and national approaches to Semiconductor Policy\nDifferent government approaches to semiconductor policy\, supply chains and stimulating industry growth\nResource and talent development\, including raising the role of women in the industry\nCapital funding and IP strategies for start-ups and scale-ups\n\nWLI EMEA Kick-Off Event (March 13 morning) \n\nThe first GSA Women Leadership Initiative in Europe\nDiscuss the raising role of women in semiconductors\nHear lessons learned from women who have excelled in navigating a traditionally male-dominated industry\n\n\nTicket will cover both days\, all sections\nVIP Dinner will be held on the evening of March 13th: a separate ticket is required\, very limited seating available!\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-international-semiconductor-conference/ LOCATION:Here East\, 14 E Bay Lane\, London\, United Kingdom CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-March-13-14-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240225T080000 DTEND;TZID=America/Los_Angeles:20240229T180000 DTSTAMP:20260412T023433 CREATED:20240221T174208Z LAST-MODIFIED:20240221T174538Z UID:7659-1708848000-1709229600@marketingeda.com SUMMARY:SPIE Advanced Lithography + Patterning DESCRIPTION:Attend and hear research\, challenges\, and breakthroughs as you gather with colleagues in San Jose \nJoin other leading researchers who are solving challenges in optical and EUV lithography\, patterning technologies\, metrology\, and process integration for semiconductor manufacturing and adjacent applications. \nFive days of exciting content and connecting with your community\n\nPlenary talks\nTechnical presentations\nNetworking sessions\nCourse offerings\nExhibition\n\nCome to hear world-class speakers\nChan Hwang\n\nSamsung (Korea) \nAnn Kelleher\n\nIntel Corp. (United States) \nTodd Younkin\n\nSemiconductor Research Corporation (USA) \nExplore six great conferences\n\nOptical and EUV Nanolithography\nDTCO and Computational Patterning\nMetrology\, Inspection\, and Process Control\nNovel Patterning Technologies\nAdvances in Patterning Materials and Processes\nAdvanced Etch Technology and Process Integration for Nanopatterning\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/spie-advanced-lithography-patterning/ LOCATION:San Jose Convention Center\, 150 W San Carlos Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SPIE.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240218T080000 DTEND;TZID=America/Los_Angeles:20240222T170000 DTSTAMP:20260412T023433 CREATED:20231230T004304Z LAST-MODIFIED:20231230T004304Z UID:7483-1708243200-1708621200@marketingeda.com SUMMARY:ISSCC 2024 DESCRIPTION:The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency\, and to network with leading experts. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/isscc-2024/ LOCATION:San Francisco Marriot Marquis\, 780 Mission Street\, San Francisco\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISSCC-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20240206T090000 DTEND;TZID=America/New_York:20240206T180000 DTSTAMP:20260412T023433 CREATED:20240129T191342Z LAST-MODIFIED:20240129T191342Z UID:7559-1707210000-1707242400@marketingeda.com SUMMARY:Canada's Semiconductor Summit DESCRIPTION:Help build Canada’s role in North America’s integrated semiconductor supply chain.\n\n\nFeaturing key industry and government decision-makers from Canada\, the United States\, and international jurisdictions\, your insights at this by-invitation-only event will help us build an effective action plan. The summit will establish priorities and define opportunities to accelerate the growth\, development\, and competitiveness of Canada’s semiconductor sector. \n\nProgram\n\n\n9-9:10 AM Welcome & Introductory Remarks \nMC:  Ruth Rayman\, former Director General\, Advanced Electronics and Photonics Research Centre\, NRC \n\n\n\n\n\n9:10-9:30 AM An Unprecedented Global Recalibration \nSemiconductors are the backbone of the digital economy. As an integrated North American semiconductor supply chain takes shape\, Canada has the opportunity to transform existing\, discrete areas of expertise into a coherent offering\, forge new collaborations and maximize new markets. \nKey topics: \n\nLay of the land\, threats and opportunities etc.\n\nSpeaker: Dr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council \n\n\n\n\n\n9:30-10:45 AM Automotive\, EVs\, and Batteries: Amplifying Our Strengths \nCanada is creating a world class EV supply chain with OEMs and electrification sub-systems. Semiconductors lie at the heart of the 21st century automobile. How can Canada play a larger role in the semiconductor supply chain for EVs? What are the short and long-term opportunities? \nKey topics: \n\nWhat is the size of the automotive semiconductor market in Canada? What is its impact on the automotive manufacturing ecosystem in Canada?\nEV sub-systems: which is the best sub-system to target for Canada to grow the auto semiconductor ecosystem?\nHow can semiconductors complement the increasing investment in EV manufacturing in Canada in the future?\n\nModerator: Kirk Ouellette\,  Vice President\, Strategy Development and Strategic Marketing\, STMicroelectronics \nPanelists: \n\nAndrea Tranchida\, Vice President\, Global Automotive Solutions\, NXP Semiconductors\nBenoit Rousseau\, Vice President – GaN Automotive\, Infineon Technologies\nDaniel Boisvert\, Director of Business Development\, C-MAC Electronics Solutions\nMona Eghanian\, Assistant Vice President\, OVIN\n\n\n\n\n\n\n10:45-11 AM Break \nNetworking and refreshments. \n\n\n\n\n\n11 AM-12:15 PM Advanced Technologies: Leveraging Canadian Capabilities \nCanada needs to strategically leverage existing areas of strength and promising new advanced technologies to integrate with critical capabilities into the global semiconductor supply chain. What future-looking technologies are worth pursuing? What is the market telling us—and what criteria should guide our investments?  \nKey topics: \n\nPhotonics/RF\nAI\nSensors\nCompound semiconductors\nQuantum computing\n\nModerator: Duncan Stewart\, Partner\, Deep Tech Venture Fund\, BDC \nPanelists: \n\nJon Rogers\, Co-founder and SVP Engineering\, Alphawave Semi\nI-Cheng Chen\, Fellow\, Platform Architecture\, AMD Canada\nIgor Arsovski\, Head of Silicon\, Fellow\, Groq\nJim Hjartarson\, President and COO\, Inpho\n\n\n\n\n\n\n12:15-1:15 PM Catered buffet lunch with guest speaker \nSilicon Valley legend\, John East\, former CEO of Actel\, and veteran of AMD and Fairchild Semiconductor\, remembers those formative\, chaotic years in Silicon Valley—and the analogies in Canada today. \nSpeaker: John East\, Chairman of the Board\, SPARK Microsystems \n\n\n\n\n\n1:15-2:30 PM Building a Competitive Semiconductor Ecosystem: Harnessing an Economic Juggernaut \nSilicon Valley\, Taiwan\, South Korea\, Saxony\, IMEC\, Albany etc. Not every successful tech ecosystem has to adhere to the same model. What can Canada learn from successful semiconductor ecosystems? What relationships need to be established with key US hubs? How should the private sector\, academia and government collaborate? \nKey topics: \n\nEcosystem overview\nWhat gave the stimulus to get it off the ground?\nWhat’s the private/government split?\n\nModerator: Normand Bourbonnais\, Président Directeur Général\, Technum Québec \nPanelists: \n\nLode Lauwers\, SVP\, Business Development & Sales\, IMEC\nMarie-Josée Turgeon\, Présidente – Directrice générale\, C2MI\nLaMar Hill\, Director\, NY Creates\nCharles Sturman\, CEO\, TechWorks\n\n\n\n\n\n\n2:30-2:45 PM Break \nNetworking and refreshments. \n\n\n\n\n\n2:45-4PM The Talent Question: Building the Pipeline \nThe semiconductor workforce must double to an estimated half a million people to meet the demands of North American semiconductor reshoring. What mix of training\, apprenticeship programs\, immigration\, financial incentives\, and creative retention strategies will build the pipeline for Canada? \nKey topics: \n\nTraining programs\nImmigration\nFinancial incentives\nApprenticeship programs\nFunding university Chairs\nRetention\nBrain drain\n\nModerator: Dr. Tony Chan Carusone\, CTO\, Alphawave Semi \nPanelists: \n\nDino Toffolon\, SVP of Engineering-Interface IP\, Synopsys\nKate Alcott\, Director of Workforce Programs\, NY Creates\nSylvain Charbonneau\, Vice-President\, Research and Innovation\, University of Ottawa\nArvind Gupta\, Professor at Department of Computer Science\, University of Toronto\n\n\n\n\n\n\n4-5 PM Strategic Initiatives and Next Steps for 2024: Making It Happen \nCanada has a powerful opportunity to establish itself as new niches emerge across the North American corridor. But we need to act fast.  Regional hubs have formed this year and are actively forging new partnerships and market plays.  How can we  ensure Canadian technology and expertise accesses these burgeoning markets?   \nKey topics: \n\nCSC 2024 Federal Budget Proposal\nAnnounced proposals ie. CSC\, FABrIC\, SECTR etc.\nFinancing growth\nPrivate-public partnerships\n\nModerator: Chris Ouslis\, Industrial Technology Advisor\, NRC \nPanelists: \n\nGord Harling\, President & CEO\, CMC Microsystems\nClaude Jean\, Executive Vice President\, Strategy & Partnership\, Teledyne Digital\nVelko Tzolov\, Director General\, Canadian Photonics Fabrication Centre (CPFC)\nDr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council\n\n\n\n\n\n\n5-5:30 PM Wrap Up & Closing Remarks \nSpeaker: Dr. C. Paul Slaby\, Managing Director\, Canada’s Semiconductor Council \n\n\n\n\n\n5:30-6:30 PM Networking Reception \nNetworking and refreshments. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/canadas-semiconductor-summit/ LOCATION:Brookstreet Hotel\, 525 Leggett Drive\, Ottawa\, Canada CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Canada-Semi-Summit-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20231213T080000 DTEND;TZID=Asia/Kolkata:20231217T170000 DTSTAMP:20260412T023433 CREATED:20231101T195220Z LAST-MODIFIED:20231101T195305Z UID:7022-1702454400-1702832400@marketingeda.com SUMMARY:International Workshop on Physics of Semiconductor Devices - IWPSD 2023 DESCRIPTION:The XXII International Workshop on the Physics of Semiconductor Devices (IWPSD 2023) is being jointly organized by the Indian Institute of Technology Madras in collaboration with Society for Semiconductor Devices and Semiconductor Society (India). This series of biennial workshops\, started in 1981\, provides a global forum for interaction between scientists and technologists working in the area of semiconductor materials and devices. \nThe topics to be covered in the Workshop are\, but not limited to:\n\n2D Materials and Devices\nCrystal Growth and Epitaxy\nDevice Modelling and Simulation\nDevices for Quantum Technology\nII – VI and Oxide Semiconductors\nIII – V Semiconductors\nMemory and Logic Devices\nMEMS\, NEMS and Sensors\nOrganic and Flexible Electronics\nPhotovoltaics\nPower Semiconductor Devices\nOptoelectronics\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/international-workshop-on-physics-of-semiconductor-devices-iwpsd-2023/ LOCATION:Research Park\, IIT Madras\, Tamil Nadu 600036\, Chennai\, India CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IWPSD-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20231209T080000 DTEND;TZID=America/Los_Angeles:20231213T170000 DTSTAMP:20260412T023433 CREATED:20230920T171734Z LAST-MODIFIED:20231207T174511Z UID:6838-1702108800-1702486800@marketingeda.com SUMMARY:69th International Electron Devices Meeting - IEDM DESCRIPTION:IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology\, design\, manufacturing\, physics\, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology\, advanced memory\, displays\, sensors\, MEMS devices\, novel quantum and nano-scale devices and phenomenology\, optoelectronics\, devices for power and energy harvesting\, high-speed devices\, as well as process technology and device modeling and simulation. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/69th-international-electron-devices-meeting-iedm/ LOCATION:Hilton San Francisco Union Square\, 333 O'Farrell Street\, San Francisco\, 94102\, United States CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEDM-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Istanbul:20231204T080000 DTEND;TZID=Europe/Istanbul:20231207T170000 DTSTAMP:20260412T023433 CREATED:20230313T210903Z LAST-MODIFIED:20230313T211025Z UID:6124-1701676800-1701968400@marketingeda.com SUMMARY:IEEE 30th International Conference on Electronics\, Circuits and Systems (ICECS) DESCRIPTION:The IEEE 30th International Conference on Electronics\, Circuits and Systems (ICECS) will be held in Istanbul\, Turkey 4-7 December 2023. As the flagship conference of IEEE Circuits and Systems Society in Region 8 (Europe\, Middle East\, and Africa)\, ICECS 2023 will consist of tutorials\, plenary lectures\, regular\, special and poster sessions focusing on recent trends\, emerging technologies and advances. \n  \nTracks\n  \n\nAnalog/Mixed-Signal/Microwave Circuits\nBio-Medical\, Bio-Inspired Circuits/Systems\nEDA\, Test and Reliability\nDigital Circuits and Systems\nLinear and Non-Linear Circuits and Systems\nNon-Linear Devices\, Memristors\nLow-Power\, Low-Voltage Design\nEmbedded and Micro/Systems\nNeural Networks\, Machine/Deep Learning\nSensors and Sensing Systems\nSignal Processing\, Image and Video\nVLSI Systems and Applications\nSmart Systems for CAS Applications\n\n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ieee-30th-international-conference-on-electronics-circuits-and-systems-icecs/ LOCATION:Hilton Maslak\, Büyükdere Cd. No:233\, Istanbul\, Turkey CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ICECS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20231107T090000 DTEND;TZID=Asia/Kolkata:20231108T180000 DTSTAMP:20260412T023433 CREATED:20231103T191339Z LAST-MODIFIED:20231103T191339Z UID:7036-1699347600-1699466400@marketingeda.com SUMMARY:IESA AI Summit DESCRIPTION:Experience the unprecedented growth opportunities in the semiconductor and electronics industry\, fueled by rapid advancements in Artificial Intelligence (AI). Embrace the paradigm shift from software-centric approaches to hardware-centric solutions\, captivating emerging markets in the realm of AI.\nWitness the powerful convergence of breakthrough technologies like the Internet of Things (IoT) and AI\, igniting a renaissance in the electronics landscape. \nIn the dynamic realm of the Intelligent Electronics & Semiconductor ecosystem\, the India Electronics and Semiconductor Association (IESA) eagerly explores the immense potential of AI in the hardware sector. Unlock the limitless possibilities of AI and shape the future of the semiconductor industry. \nEmbrace cutting-edge technologies\, network with industry experts\, and drive innovation at the forefront of AI’s revolution in hardware. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/iesa-ai-summit/ LOCATION:Trident Hotel Hyderabad\, Hyderabad\, India CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IESA-AI-Summit-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Chicago:20231031T083000 DTEND;TZID=America/Chicago:20231031T170000 DTSTAMP:20260412T023433 CREATED:20231024T192233Z LAST-MODIFIED:20231024T192426Z UID:6991-1698741000-1698771600@marketingeda.com SUMMARY:STAC Summit DESCRIPTION:STAC Summits bring together CTOs and other industry leaders responsible for solution architecture\, infrastructure engineering\, application development\, machine learning/deep learning engineering\, data engineering\, and operational intelligence to discuss important technical challenges in trading and investment. \nWHEN\nTuesday\, October 31\, 2023\nSTAC Exchange (Exhibits) opens at 8:30am CDT\nConference starts at 9:00am CDT\nNetworking lunch at ~12:00pm CDT\nConference concludes at ~4:00pm CDT\nReception immediately following \nWHERE\nThe Metropolitan Club\nWillis Tower\n233 South Wacker Drive\n66th Floor\nChicago \n\n\n\n9:00am\nSTAC Update: Historical tick analytics\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will present the latest results in STAC-M3 (tick analytics).\n\n\n\n\n\n\n9:15am\nInnovation Roundup\n\n\n\n“How to maximize your GPU investment”\nJeff Chu\, Financial Services Sales\, Penguin Solutions\n\n\n\n“Using a vector database to unlock the power of your data”\nJosh Kalina\, Pre-Sales Engineer\, KX\n\n\n\n“Data at Scale: Overcoming Challenges in Generative AI and LLM Development”\nKeith Miller\, VP Technical Sales\, Services and Support\, DDN\n\n\n\n\n\n\n9:35am\nEnforcing the foundation: Improving data lineage      ;\n\n\n\n\n\nMarc Gale\, Director of Data Engineering\, OncoHealth; former Manager of Data Engineering\, Chicago Trading Company\nJosh Kalina\, Pre-Sales Engineer\, KX\nKeith Miller\, VP Technical Sales\, Services and Support\, DDN\n\nIt’s no secret that the automation of insights drives forward the financial industry. Both traditional quantitative analysis and newer AI models require a solid data foundation. Data engineers have to build this foundation from an ever-increasing universe of data sets\, which come from many sources with varying quality. Even worse\, today’s data could be corrected tomorrow\, next week\, or next year. For models to stay stable during rapid innovation\, data engineers must properly track\, maintain\, and leverage the data’s lineage. How should they track change sets\, version data\, and stay synchronized across the enterprise? How should licensing and permissions be taken into account? What are the best practices for maintaining metadata? How do storage architectures impact data lineage solutions? Join our panel of experts and add your questions to the mix.\n\n\n\n\n\n\n10:05am\nThe unbearable heaviness of data: Can modern approaches help?\n\n\n\n\n\nVrashank Jain\, Sr. Director of Product Management for Data Management Solutions\, Dell Technologies\n\nIt’s common for data architects and engineers to spend more time managing data than creating value from it. They have to deal with data-hungry end users\, capture real-time streams\, and manage multiple derivative data sets for historical research. AI adoption is piling on troves of model inputs and outputs that are required for explainability and fine tuning. And hybrid cloud infrastructures mean copies in multiple locations. How can architects and engineers enable new value from data rather than simply managing the inventory? Vrashank has seen financial firms greatly reduce the burden of data maintenance\, allowing technologists to focus on developing data products. Using Dell’s experience with an international bank as a guide\, he’ll show how applying an open data platform\, from edge to core to cloud\, can reduce data movement\, consolidate data intelligently\, and allow access to diverse tools and uses\, all while keeping data secure. Be sure to bring your questions for Vrashank as he covers best practices in data modernization and the benefits they can bring.\n\n\n\n\n\n\n10:30am\nBreak\n\n\n\n\n\n\n11:00am\nSTAC Update: Big compute\n\n\n\n\n\nBishop Brock\, Head of Research\, Strategic Technology Analysis Center\n\nBishop and Peter will present the latest STAC Benchmark Council activities compute critical workloads\, including STAC-A2 (complex deriviatives risk computation) and an update from the STAC-ML Working Group.\n\n\n\n\n\n\n11:10am\nWaste not\, want not: Avoiding idle GPUs\n\n\n\n\n\nTroy Kaster\, VP of AI\, Penguin Solutions\n\nMany financial firms are looking to large-scale GPU clusters to meet the demands of compute-hungry AI and HPC workloads in price discovery\, portfolio management\, and quantitative research. But once they fill the compute gap\, a knowledge gap remains. How should system engineers and admins best utilize these enormous investments and avoid the pitfalls that result in poor performance? Troy will help us understand how to ensure high availability and maximize the utilization of expensive computing platforms. Using Penguin’s experience bringing a 16k GPU cluster online for Meta\, he’ll walk us through some real-life issues encountered and solutions applied. Along the way he’ll cover best practices for designing\, building\, deploying\, and managing large-scale GPU clusters.\n\n\n\n\n\n\n11:35am\nInnovation Roundup\n\n\n\n“Build. Connect. Analyse. Beeks solves your colo and network visibility challenges.”\nMatthew Cretney\, Head of Product Management\, Beeks Group\n\n\n\n“Mechanics of Low Latency Capture”\nPramod Nayak\, Director of Product Management\, Low Latency\, Refinitiv\, an LSEG Business\n\n\n\n“The Smart Way to Configure a Tap Aggregator”\nKevin Formby\, VP Finance and Capital Markets\, Keysight Technologies\n\n\n\n\n\n\n11:50am\nEncrypting our markets: The impact of security on high-performance infrastructures\n\n\n\n\n\nVenkat Doddapuneni\, Senior Director of Software Engineering\, CME Group\nKevin Formby\, VP Finance and Capital Markets\, Keysight Technologies\nAdditional speakers to be announced\n\nSecurity has become a key component of the systemic risk conversation. Market oversight groups are discussing encrypted connections\, and at least one exchange has rolled them out. Encryption can provide a layer of protection\, helping prevent threats from moving horizontally through financial systems. But our markets benefit from high-performance\, low-friction connectivity. What conflicts can arise when security meets market access? Our panel of experts will discuss how to solve for security without exacerbating other tech risks. They’ll dive into important aspects\, including what concerns motivate a desire for higher security\, what should be in scope\, the impact on performance\, and how to maintain network-based risk\, compliance\, and data monitoring systems when encryption is a must. Bring your questions and join us to explore the impact of encryption on market connectivity.\n\n\n\n\n\n\n12:20pm\nNetworking Luncheon\n\n\n\n\n\n\n1:20pm\nSTAC Update: Network communications\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will present on the latest STACT Benchmark Council activities in network communications\, including recent test results on a high frequency radio link and benchmark development activities for cloud networking.\n\n\n\n\n\n\n1:35pm\nInnovation Roundup\n\n\n\n“Leveraging HATI for high resolution timing to FPGA’s.”\nCiaran Kennedy\, Sales\, Safran Timing & Navigation\n\n\n\n“Create a Better and Faster Consolidated View Across Markets Using FPGAs”\nCliff Maddox\, Director of Business Development\, NovaSparks\n\n\n\n“Cancel on Behalf is a Game Changer”\nJohn Hagerman\, VP Marketing and Business Development\, Algo-Logic\n\n\n\n“Using Equivalence Checking to Rapidly Evolve Your Design”\nMartin Rowe\, Sr. Application Engineer\, Siemens\n\n\n\n“Mastering Ultra-Low Latency: The Technical Blueprint of FPGA and Software Hybrid Solutions”\nJean-François Gagnon\, Ultra-Low Latency FPGA Solutions Architect\, Orthogone\n\n\n\n\n\n\n2:00pm\nTalent shortages in hardware verification: Can ML plug the gaps?\n\n\n\n\n\nAdam Sherer\, Verification Technology Executive\, Cadence\n\nAs discussed at recent STAC Summits\, financial firms suffer from a lack of verification engineers. They can achieve significant latency gains with properly designed and implemented hardware solutions\, but a shortage of experienced\, skilled personnel causes painful lead times and uncomfortable prioritization decisions. Adam thinks that\, given the proper setup\, advances in ML can provide some relief by increasing the productivity of current staff. He’ll dive into tasks that grind on an engineer’s time—like regression optimization\, failure triage analysis\, and bug localization—and explain how ML can ease the burden. Bring your questions and join him as he discusses using ML to accelerate your FPGA and ASIC verification.\n\n\n\n\n\n\n2:20pm\nBreak\n\n\n\n\n\n\n2:50pm\nSTAC Update: Fast data\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will discuss the latest test results for STAC-N1 (full stack networking).\n\n\n\n\n\n\n2:55pm\nInnovation Roundup\n\n\n\n“ÜberNIC can do… Can Yours?”\nAlex Stein\, Global Head Business Development\, Liquid-Markets-Solutions\n\n\n\n“Trading at the speed of light – Beyond ultra-low latency with Salience Labs”\nChris Porthouse\, Chief Product Officer\, Salience Labs\n\n\n\n“nxFramework update: Added features and improved latency for the Exegy FPGA development framework”\n Laurent de Barry\, Sr. Director\, Global Head of Solutions Consulting\, Exegy\n\n\n\n\n\n\n3:15pm\nDesigning the right hardware stack for FPGA\n\n\n\n\n\nMichael Gorbovitski\, Executive Director\, Morgan Stanley\nRobert DeWitt\, Director Product Marketing\, AMD\nDarrin Machay\, Principal Engineer\, Arista\n\nFGPAs are a go-to component for firms looking to improve their latencies\, whether by getting strategies as close to the network as possible or offloading critical workflows from the CPU. But as the best engineers know\, FPGAs are but one component of the custom hardware stack that affects performance. Given recent and upcoming changes in that stack\, designing the best systems requires answering a number of questions. How do on-board HBM3E and tiering impact memory-intensive applications? Do PCIe 5 and CXL change how we think about accessing compute\, memory\, and storage? Will new designs that pair ASIC with FPGA open new latency possibilities\, and what can we achieve with programmable switches? What’s the state of the art with FPGA sharing a fabric with CPU and other compute accelerators? Join our panel of experts as they explore these questions and yours.To kick off\, there will be some brief presentations:\n\n\n\n“Trade Smarter and Trade Faster with the New AMD FPGA accelerator for Ultra-Low Latency Trading”\n Hamid Reza Salehi\, Director Product Marketing\, AMD\n\n\n\n“Arista 7130 Update: Ultra Low Latency 25G”\n Darrin Machay\, Principal Engineer\, Arista\n\n\n\n\n\n\n~4:00pm\nNetworking Reception\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/stac-summit-2/ LOCATION:The Metropolitan Club\, 233 South Wacker Drive\, Chicago\, IL\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/STAC-October-31-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230827T080000 DTEND;TZID=America/Los_Angeles:20230829T170000 DTSTAMP:20260412T023433 CREATED:20230613T165859Z LAST-MODIFIED:20230613T165859Z UID:6490-1693123200-1693328400@marketingeda.com SUMMARY:Hot Chips 2023 DESCRIPTION:Hot Chips 2023 (advance program) will be held as a hybrid conference with in-person attendance at Stanford University from August 27 to 29\, 2023. \nConference Format\nHot Chips 2023 will be a hybrid conference. You may register to attend virtual or in-person. The conference venue is the Dinkelspiel Auditorium on the Stanford University Conference. \n\nSunday (August 27) is a Tutorial Day.\nMonday and Tuesday (August 28 and 29) are Conference Days.\n\nVirtual Conference: Includes full access to conference videos\, presentation PDFs and Slack Channels for both Tutuorial and Conference Days. All talks are transmitted in real time and are also recorded so that you also may view them at a time convenient for your time zone. Details are here. \nIn-Person Conference: You may register for Conference Days only or both Conference and Tutorial Days. In either case you will have full access to Videos\, presentation PDFs and Slack channels. The conference fee includes breakfast\, lunch\, coffee breaks and receptions. Details are here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/hot-chips-2023/ LOCATION:Stanford University\, 471 Lagunita Drive\, Stanford\, CA\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/14054931_10155065287553998_1856342906013349235_n.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230822T080000 DTEND;TZID=America/Los_Angeles:20230824T170000 DTSTAMP:20260412T023433 CREATED:20230802T171343Z LAST-MODIFIED:20230802T171343Z UID:6655-1692691200-1692896400@marketingeda.com SUMMARY:ERI 2.0 Summit DESCRIPTION:Watch as leaders from our government agencies\, the Defense Industrial Base\, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry\, national and economic security\, and future research directions. \nThe Electronics Resurgence Initiative (ERI)\, DARPA’s response to national-level microelectronics concerns\, is designed to ensure U.S. leadership in cross-functional\, next-generation microelectronics research\, development\, and manufacturing. The initiative\, aimed at both national security capabilities and commercial economic competitiveness and sustainability\, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry\, the defense industrial base\, and university researchers. \nDARPA expanded ERI’s focus with the announcement of ERI 2.0\, which seeks to reinvent domestic microelectronics manufacturing. ERI 2.0 will strengthen DARPA’s leadership in driving the next generation of microelectronics for national security by creating a national capability for 3DHI manufacturing and pursuing focused research in: \n\nManufacturing complex 3D systems\nDeveloping electronics for extreme environments\n\n…while maintaining the following thrust areas:\n  \n\nOptimizing design and test for complex circuits and prototypes\nOvercoming security threats across the entire hardware lifecycle\nIncreasing information processing density and efficiency\nAccelerating innovation in artificial intelligence hardware to make decisions at the edge faster\nSecuring communications\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/eri-2-0-summit/ LOCATION:Hyatt Regency Seattle\, 805 Howell Street\, Seattle\, WA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ERI-2.0.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Vienna:20230807T080000 DTEND;TZID=Europe/Vienna:20230808T170000 DTSTAMP:20260412T023433 CREATED:20230207T013618Z LAST-MODIFIED:20230207T013618Z UID:5914-1691395200-1691514000@marketingeda.com SUMMARY:ISPLED 2023 DESCRIPTION:The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design\, ranging from process technologies and analog/digital circuits\, simulation and synthesis tools\, system-level design and optimization\, to system software and applications. \n  \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ispled-2023/ LOCATION:TU Wien\, Gußhausstraße 27-29/384\, Vienna\, Austria CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISLPED-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20230614T080000 DTEND;TZID=Europe/Berlin:20230615T170000 DTSTAMP:20260412T023433 CREATED:20230313T202424Z LAST-MODIFIED:20230612T171200Z UID:6114-1686729600-1686848400@marketingeda.com SUMMARY:GSA 2023 European Executive Forum DESCRIPTION:Dealing with Uncertainty\nThe global economy is sending mixed messages\, and with every new data release comes a new batch of upbeat or defeatist headlines. \nUncertainty remains if inflation is fully under control and how quickly economic growth will pick up strongly again. On one side the labor market seems healthier than it’s been in years\, on the other all major tech companies have announced significant layoffs.  The chip shortage is not over yet in some segments\, but in some others there is excess supply. Our new multipolar world order will enforce structural changes to the economy\, such as the need to rebuild reliable supply chains closer to home\, which often comes at higher prices. \nDespite these uncertainties\, innovation in our industry remains as strong as ever\, with relentless growth driven by automotive\, 5G and next generation connectivity\, new silicon design paradigms including RISC-V and chiplets\, big trends towards decarbonization and new materials like SiC\, the positive effects of increased diversity and inclusion. And large amounts of government money is made available globally to support this growth\, through “chips acts” and “green deals”. \nThere is therefore a strong belief that tech innovation and growth will continue to prevail and\, with a little more positive international cooperation\, deal with the apparent challenges altogether. \n\n\n\n\n\n\n\n\n\n\nThe GSA European Executive Forum is our flagship event in Europe which\, over two days\, always attracts the very top speakers and attendees: close to 300 senior decision makers\, the majority VP and C-level profiles. \nOver the past 20 years\, it has become the reference executive event for the semiconductor industry in the EMEA region. \n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-2023-european-executive-forum/ LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany CATEGORIES:EDA,Forum,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-June-14-15-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20230531T083000 DTEND;TZID=America/New_York:20230531T170000 DTSTAMP:20260412T023433 CREATED:20230530T203817Z LAST-MODIFIED:20230530T203817Z UID:6438-1685521800-1685552400@marketingeda.com SUMMARY:STAC Summit DESCRIPTION:STAC Summits bring together CTOs and other industry leaders responsible for solution architecture\, infrastructure engineering\, application development\, machine learning/deep learning engineering\, data engineering\, and operational intelligence to discuss important technical challenges in trading and investment. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/stac-summit/ LOCATION:New York Marriott Marquis\, 1535 Broadway\, New York City\, NY\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/STAC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230516T080000 DTEND;TZID=Europe/Brussels:20230517T170000 DTSTAMP:20260412T023433 CREATED:20230414T161617Z LAST-MODIFIED:20230414T161617Z UID:6275-1684224000-1684342800@marketingeda.com SUMMARY:ITF World 2023 DESCRIPTION:Imec’s flagship event on semiconductor advances & deep-tech solutions\n\n\nformerly known as Future Summits.\n\n\n\n\nSemiconductors have become increasingly instrumental – and often even dominant – for the future of industries and application domains worldwide. \nFor many decades\, imec has played a major role in the global semiconductor industry. Our expertise and partnerships now also progress Chips Act initiatives around the globe. \nITF World aims to bring together all the different players. \n\nITF World features: \n\nA program clearly centered around semiconductor technologies & system scaling\nAn important focus on deep-tech venturing\, featuring inspiring cases\nInsights that highlight imec’s role & activities to progress Chips Act initiatives worldwide\n\nIn conjunction with ITF World\, we also organize ITF Flanders\, a dedicated event for Flemish companies and stakeholders. \nThis one-of-a-kind experience is marked by: \n\nKeynotes by world-renowned tech experts and industry leaders\nDemos showcasing state-of-the-art technologies and innovative solutions in a wide array of application domains\nExchange with key players from the global semiconductor and deep-tech scenes and innovators from various application domains\nAn onsite networking dinner\n\nITF World welcomes 2\,000 attendees from around the globe – ranging from industry experts and business leaders to policy makers\, futurists\, technology gurus\, entrepreneurs from start-ups to scale-ups\, analysts and investors. \n\n\n\n\n\n\nITF World is a 1.5-day event taking place at the majestic Flanders Meeting & Convention Center in the heart of Antwerp\, Belgium. Our event is widely valued for its dynamic and vibrant atmosphere. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nExtend your experience with a half-day participation in ITF Flanders if you’re interested in: \n\nThe role of nano & digital technologies to accelerate Flemish economy and society\nDedicated tracks on Health\, Energy\, Mobility\, and Sustainable industries\nNetworking with policy makers & entrepreneurs from Belgium’s strong economic region\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/itf-world-2023/ LOCATION:Flanders Meeting & Convention Center Antwerp\, Antwerp\, Belgium CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITF-World-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20230509T083000 DTEND;TZID=America/New_York:20230509T164000 DTSTAMP:20260412T023433 CREATED:20230404T200716Z LAST-MODIFIED:20230404T200716Z UID:6236-1683621000-1683650400@marketingeda.com SUMMARY:TSMC - Boston Technology Workshop DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-boston-technology-workshop/ LOCATION:Boston Marriott Burlington\, One Burlington Mall Road\, Burlington\, MA\, 01803\, United States CATEGORIES:EDA,IP,Semiconductor,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Technology-Symposium.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Jerusalem:20230508T080000 DTEND;TZID=Asia/Jerusalem:20230509T170000 DTSTAMP:20260412T023433 CREATED:20230331T183459Z LAST-MODIFIED:20230331T183459Z UID:6212-1683532800-1683651600@marketingeda.com SUMMARY:ChipEx 2023 DESCRIPTION:The major annual event of the Israeli semiconductor industry \nChipEx2023\, the largest annual event of the Israeli semiconductor industry\, will be held on May 9\, 2023 in Tel Aviv\, Israel. ChipEx2023 showcases companies including manufacturers\, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world’s leading experts address the industry’s most relevant issues. \nThe event is produced by ASG Ltd. in cooperation with SIA\, Semiconductor Industry Association and with Semi\, the largest global industry association. \nThe goal of ChipEx2023 is to update all professionals involved with the Israeli semiconductor industry with the latest technological innovations and future directions of the industry. \nChipEx2023 target audience are all people involved with the semiconductor industry including engineers\, R&D managers\, industry experts\, senior executives in microelectronics related companies\, multinational design centers\, consultants\, venture capital managers as well as electrical/electronic/computer science students & professors from the various universities around Israel. \nChipEx2023 consists of three main parts: \nVendors’ Exhibition \nThe ChipEx exhibition includes booths in various sizes for presentations and demonstrations of new design and development tools. This year\, the ChipEx2023 exhibition will take place on May 9\, 2023 at the Tel-Aviv Expo Center and will include industry vendors\, service providers\, and manufacturers of electronic design tools\, components and manufacturing equipment from Israel and around the globe. These exhibitors will exhibit and update the visitors with the latest developments in tools and services for the semiconductor industry. \nTechnical Seminar \nTechnical lectures given by industry experts\, senior executives from the semiconductor industry\, vendors\, and university professors. The format of the sessions intends to cultivate and promote an instructive and productive interchange of ideas and solutions among industry developers and designers. The lectures are divided to various tracks in separate halls and address the major topics related to the microelectronics industry. This year\, the ChipEx2023 technical seminar will take place on May 9\, 2023 at the Tel-Aviv Expo Center. \n  \nChipEx2023 Executive Summit \n  \nThe opening session of ChipEx2023 will take place on May 8\, 2023 at Hilton Hotel Tel-aviv and will include top industry figures and will act as the Executive summit of ChipEx2023 targeting Industry leaders and top executives from Israel and around the globe. \n  \nChipEx2023 is a great opportunity for any industry vendor or service provider to meet its target audience as well as interact with the decision makers in the various Israeli semiconductor companies. \n  \nWe invite you to take part in ChipEx2023 as an exhibitor\, a speaker and/or as a sponsor. \n  \nFor more details please contact us at:\nPhone: +972-9-7454007\nFax: +972-9-7748858\ninfo@chiportal.co.il\nwww.chipex.co.il \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/chipex-2023/ LOCATION:Hilton Hotel Tel-aviv\, HaYarkon St 205\, Tel aviv\, Israel CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ChipEx-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230503T083000 DTEND;TZID=America/Los_Angeles:20230503T164000 DTSTAMP:20260412T023433 CREATED:20230404T200249Z LAST-MODIFIED:20230404T200249Z UID:6233-1683102600-1683132000@marketingeda.com SUMMARY:TSMC - Austin Technology Workshop DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-austin-technology-workshop/ LOCATION:Omni Barton Creek Resort & Spa\, 8312 Barton Club Drive\, Austin\, TX\, United States CATEGORIES:EDA,IP,Semiconductor,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Technology-Symposium.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230426T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20260412T023433 CREATED:20230404T195733Z LAST-MODIFIED:20230404T195733Z UID:6230-1682496000-1682528400@marketingeda.com SUMMARY:TSMC - North America Technology Symposium DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-north-america-technology-symposium/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Semiconductor,Symposium ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Technology-Symposium.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230423T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20260412T023433 CREATED:20221121T190016Z LAST-MODIFIED:20221121T190016Z UID:5423-1682236800-1682528400@marketingeda.com SUMMARY:CICC 2023 DESCRIPTION:Sponsored by IEEE and SSCS\, the IEEE Custom Integrated Circuits Conference – CICC –  is a premier conference devoted to IC development. The conference program is a blend of oral presentations\, exhibits\, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design problems\, improve circuit design techniques\, get exposure to new technology areas\, and network with peers\, authors and industry experts. \nThere are 3 days of Technical Sessions that include lecture presentations addressing state of the art developments in integrated circuit design. The Educational Sessions are a full day of tutorials instructed by recognized invited speakers. The Panels\, and Forums are presented throughout the conference to enrich the learning experience of the attendees. The Panel Discussions and Forums are presented by leaders from the IC industry. CICC includes an Exhibits Hall that is open in the evenings where Semiconductor manufacturers\, software tool suppliers\, silicon IP providers\, design-service houses\, and technical book publishers offer displays and demonstrations of their products. CICC is sponsored by the IEEE Solid-State Circuits Society and technically co-sponsored by the IEEE Electron Devices Society. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/cicc-2023/ CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CICC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230331T080000 DTEND;TZID=America/Los_Angeles:20230402T170000 DTSTAMP:20260412T023433 CREATED:20230122T015307Z LAST-MODIFIED:20230222T174957Z UID:5871-1680249600-1680454800@marketingeda.com SUMMARY:Latch-Up 2023 DESCRIPTION:The FOSSi Foundation is proud to announce Latch-Up\, a conference dedicated to free and open source silicon to be held over the weekend of Friday\, March 31 to Sunday\, April 2\, 2023 in Santa Barbara\, California\, USA. \nLatch-Up is a weekend of presentations and networking for the open source digital design community\, much like its European sister conference ORConf. \nSo save the date\, register to attend\, and we encourage you to submit a presentation or proposal if you have a project or idea on the topic to share! \n  \nQuestions? Ping the organizers via @LatchUpConf or email. \nPrevious Latch-Ups: 2019 Portland \nSubmit a talk\n\nWe encourage anybody involved in the open source semiconductor engineering space to come along and share your work or experience. Presentations slots as short as 3 minute lightning-talks and up to 30 minute talks including Q and A are available. \nSo if you’ve designed\, worked on or even just used open source IP cores and/or management systems\, verification IP\, build flows\, SoCs\, simulators\, synthesis tools\, FPGA and ASIC implementation tools\, languages and DSLs\, compilers\, or anything related we’d love to have you join us to share your experience. \nPresentations are submitted through the registration process and we will let you know if your presentation was accepted. \nRegistration\n\nAttendance of Latch-Up is free. To help us organizing the event\, you are required to register using the button below or via the EventBrite link. \nProfessional Tickets\nAttendees who are joining us at Latch-Up on behalf of their company and/or can claim the conference as professional training expense are encouraged to purchase a professional ticket. These ticket sales help us provide all that we do at Latch-Up and keep the event accessible to all members of the community. Professional ticket holders are able to get their company name printed on their name badge and receive a special treat. You can buy professional tickets using the button below or via the EventBrite link. \nWe ask all Latch-Up participants to adhere to the the FOSSi Foundation code of conduct throughout the event. \nSponsorship and Volunteering at Latch-Up\n\nLatch-Up is free to attend\, but we aim to provide catering and the like during the event. Latch-Up is also a great way to get your company or brand in front of lots of engineers and hackers on the day\, and thousands more through recordings of the event. So please get in touch if you’d like to explore sponsorship opportunities. \nLatch-Up is organized by volunteers on behalf of the FOSSi Foundation. We are currently looking for more people to help out with arrangements and putting on the event\, so please do email us if you would like to volunteer for during the event with setup\, AV\, or even just local knowledge so we can plan the weekend better. \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/latch-up-2023/ LOCATION:University of California\, Santa Barbara\, Santa Barbara\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Latch-Up-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230328T070000 DTEND;TZID=America/Los_Angeles:20230328T080000 DTSTAMP:20260412T023433 CREATED:20230316T184842Z LAST-MODIFIED:20230316T184842Z UID:6176-1679986800-1679990400@marketingeda.com SUMMARY:Maximizing yields through collaboration DESCRIPTION:Semiconductor companies have long recognized the importance of yield management and having the right support in place to maximize results. In this 30-minute webinar brought to you by yieldHUB and SemiWiki\, attendees will learn about a key to success in the world of yield management (and something that can be underestimated) – collaboration. This is crucial today when different teams and departments work together from around the world. \nDuring this online event\, yieldHUB’s experts will explore why and how collaboration can make a difference\, and speak about some real examples. The webinar will end with a 15-minute Q&A session\, where attendees’ questions will be answered and more. Whether you work for a startup or a large-scale semiconductor company\, this webinar is a must-attend event! Register now to secure your spot before it’s too late. \nSpeaker Bios: \nJohn O’Donnell is an Irish entrepreneur\, having founded yieldHUB back in 2005 when he saw a gap in the market for a reliable and modern hosted yield management solution. yieldHUB is based in Ireland and has grown to become a global leader in the market. The company has a reputation for innovation in the industry with new developments in the field\, including its unique collaboration capabilities. \nAlso joining this webinar is Kevin Robinson\, VP of Operations at yieldHUB. John and Kevin have a combined 60 years of experience working in the semiconductor industry. \nThis webinar is in partnership with SemiWiki and yieldHUB \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/maximizing-yields-through-collaboration/ CATEGORIES:EDA,Semiconductor,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/yieldHUB-March-28-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230320T080000 DTEND;TZID=America/Los_Angeles:20230323T170000 DTSTAMP:20260412T023433 CREATED:20230307T044258Z LAST-MODIFIED:20230307T044258Z UID:6073-1679299200-1679590800@marketingeda.com SUMMARY:GOMACTech 2023 DESCRIPTION:GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \n\nDear 2023 Attendees: \nThis year’s conference is titled “Microelectronics – the Engine to Keep the US Moving Forward\,” and our robust technical program supports this theme with topics including Advanced Silicon-Based RF\, Alternative Computing Paradigms\, Counterfeit Detection and Avoidance\, GaN Power Electronics\, and much\, much more. \nThe conference kicks off on Monday\, 20 March\, with our annual Trusted Suppliers Industry Day\, created with the objective of promoting discussion among members of industry and government agencies that represent the interests of integrated-circuit and electronics producers who serve defense and aerospace applications. We have seen tremendous change since last year’s Industry Day\, not only with the enactment and funding of the CHIPS and Science Act but also with the increasing uncertainty regarding China’s intentions with Taiwan. To provide insight into these issues\, Dr. Tai Ming Cheung\, recipient of multiple DoD Minerva Research Initiative awards and director of the University of California Institute on Global Conflict and Cooperation (IGCC)\, is scheduled to deliver the keynote address on the emergence of the Chinese techno-security state. Monday also features four workshops/tutorials: Advanced GaN Modeling\, JFAC Hardware Assurance\, GEEGAH Fab Capabilities & PDK for Acoustoelectric Devices\, and AKOUSTIS Fab Capabilities & PDK for AIN/ScAIN. \nOur Monday programming will conclude with a reception on the resort’s Flamingo Lawn\, which is open to all registered attendees. Please join us! \nGOMACTech-23 formally opens on Tuesday\, 21 March\, with an outstanding morning Plenary Session that includes the keynote address “3DHI and the Coming Inflection Point in Microelectronics Manufacture” by Dr. Mark Rosker\, director of DARPA’s Microsystems Technology Office. Rosker will be followed by Ezra Hall\, senior director of Global Aerospace and Defense Business at GlobalFoundries\, whose talk is titled “Aligning Defense Microelectronics Technologies with Industry Needs: Fueling U.S. Success.” \nThe keynotes will be followed by the Jack S. Kilby Lecture Series\, with presentations from Dr. Waleed Khalil\, professor of electrical and computer engineering at Ohio State University and the ElectroScience Lab\, who will speak on “Analog Hardware Security: What We Don’t Know Will Hurt Us\,” and Krystal Puga\, Lunar Mission Architect for the Space Systems Sector at Northrop Grumman Corp.\, with the presentation\, “James Webb Space Telescope Development and Latest Discoveries.” \nThis year\, we are also hosting three panel discussions: “Chips and Science Act Impact to DoD\,” on Monday\, 20 March; “Perspectives on Computational Methods for Radiation Hardness Qualification;” on Wednesday\, 22 March; and “Sifting Through the Chaos: Are Best Practices Achievable?” on Thursday\, 23 March. \nThe plenary\, technical\, and topical sessions are the major venues for information exchange at the conference. Other opportunities for technical interaction are provided by the exhibits program\, which includes major IC manufacturers and commercial vendors of devices\, equipment\, systems\, and services for nearly every facet of the electronics business. The exhibition opens on Tuesday\, 21 March\, at noon\, and runs through Wednesday\, 22 March\, at 4:00 pm. On Tuesday evening\, all attendees can network in a relaxing atmosphere during the Exhibitors’ Reception. \nWednesday evening features the Evening Social\, held this year at the San Diego Zoo\, one of the country’s premier zoos. A buffet-style dinner will be included\, and we will have the opportunity to meet some of the animals “up close and personal.” This is a ticketed event with an attendance cap\, so if you’re planning on attending\, buy your ticket before Wednesday. \nOn Thursday morning\, 23 March\, a poster session that includes our annual student poster competition will take place. \nGOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and to provide a forum for government reviews. \nThe GOMACTech Conference is an Unclassified\, Export-Controlled event that requires participants to be U.S. Citizens or legal U.S. Permanent Residents. All registrants must provide proof of U.S. Citizenship or Permanent Resident status prior to being permitted entry into the conference. Additionally\, a signed Non-Disclosure Statement will be required. \nGOMACTech-23 provides a forum for discussing and demonstrating advanced microelectronics and microsystems that can provide the means to develop confidence in transformational\, leap-ahead technologies\, and capabilities. GOMACTech is the premier forum for reporting on government-funded microcircuit research and other research efforts that focus on the technology needs of government systems. \nThis year’s technical program is a result of the hard work and enthusiasm of the GOMACTech-23 Technical Program Committee. The committee members discussed and collaborated on the topics and presentations. The quality of the conference reflects this comprehensive team effort. We hope that you find GOMACTech-23 an enlightening\, rewarding\, and enjoyable experience. Thank you for your active participation. \n  \n\n\n\nDr. Morgan Thoma\nU.S. Army Research Laboratory\nDefense Microelectronics CFT\nGeneral Chair\nLuciano Boglione\nNaval Research Laboratory\nTechnical Program Chair\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gomactech-2023/ LOCATION:Town and Country San Diego Hotel\, 500 Hotel Circle North\, San Diego\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GOMACTech-2023.jpg END:VEVENT END:VCALENDAR