BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.15.20//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20210314T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20211107T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Istanbul BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0300 TZNAME:+03 DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20220313T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20221106T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20230312T080000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 TZNAME:CST DTSTART:20231105T070000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 TZNAME:CDT DTSTART:20240310T080000 END:DAYLIGHT BEGIN:STANDARD 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DTSTART:20231105T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20240310T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20241103T060000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Brussels BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Jerusalem BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20220325T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20221029T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20230324T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20231028T230000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0200 TZOFFSETTO:+0300 TZNAME:IDT DTSTART:20240329T000000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0300 TZOFFSETTO:+0200 TZNAME:IST DTSTART:20241026T230000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Phoenix BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0700 TZNAME:MST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20231209T080000 DTEND;TZID=America/Los_Angeles:20231213T170000 DTSTAMP:20260416T061936 CREATED:20230920T171734Z LAST-MODIFIED:20231207T174511Z UID:6838-1702108800-1702486800@marketingeda.com SUMMARY:69th International Electron Devices Meeting - IEDM DESCRIPTION:IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology\, design\, manufacturing\, physics\, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology\, advanced memory\, displays\, sensors\, MEMS devices\, novel quantum and nano-scale devices and phenomenology\, optoelectronics\, devices for power and energy harvesting\, high-speed devices\, as well as process technology and device modeling and simulation. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/69th-international-electron-devices-meeting-iedm/ LOCATION:Hilton San Francisco Union Square\, 333 O'Farrell Street\, San Francisco\, 94102\, United States CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEDM-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Istanbul:20231204T080000 DTEND;TZID=Europe/Istanbul:20231207T170000 DTSTAMP:20260416T061936 CREATED:20230313T210903Z LAST-MODIFIED:20230313T211025Z UID:6124-1701676800-1701968400@marketingeda.com SUMMARY:IEEE 30th International Conference on Electronics\, Circuits and Systems (ICECS) DESCRIPTION:The IEEE 30th International Conference on Electronics\, Circuits and Systems (ICECS) will be held in Istanbul\, Turkey 4-7 December 2023. As the flagship conference of IEEE Circuits and Systems Society in Region 8 (Europe\, Middle East\, and Africa)\, ICECS 2023 will consist of tutorials\, plenary lectures\, regular\, special and poster sessions focusing on recent trends\, emerging technologies and advances. \n  \nTracks\n  \n\nAnalog/Mixed-Signal/Microwave Circuits\nBio-Medical\, Bio-Inspired Circuits/Systems\nEDA\, Test and Reliability\nDigital Circuits and Systems\nLinear and Non-Linear Circuits and Systems\nNon-Linear Devices\, Memristors\nLow-Power\, Low-Voltage Design\nEmbedded and Micro/Systems\nNeural Networks\, Machine/Deep Learning\nSensors and Sensing Systems\nSignal Processing\, Image and Video\nVLSI Systems and Applications\nSmart Systems for CAS Applications\n\n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ieee-30th-international-conference-on-electronics-circuits-and-systems-icecs/ LOCATION:Hilton Maslak\, Büyükdere Cd. No:233\, Istanbul\, Turkey CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ICECS-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20231107T090000 DTEND;TZID=Asia/Kolkata:20231108T180000 DTSTAMP:20260416T061936 CREATED:20231103T191339Z LAST-MODIFIED:20231103T191339Z UID:7036-1699347600-1699466400@marketingeda.com SUMMARY:IESA AI Summit DESCRIPTION:Experience the unprecedented growth opportunities in the semiconductor and electronics industry\, fueled by rapid advancements in Artificial Intelligence (AI). Embrace the paradigm shift from software-centric approaches to hardware-centric solutions\, captivating emerging markets in the realm of AI.\nWitness the powerful convergence of breakthrough technologies like the Internet of Things (IoT) and AI\, igniting a renaissance in the electronics landscape. \nIn the dynamic realm of the Intelligent Electronics & Semiconductor ecosystem\, the India Electronics and Semiconductor Association (IESA) eagerly explores the immense potential of AI in the hardware sector. Unlock the limitless possibilities of AI and shape the future of the semiconductor industry. \nEmbrace cutting-edge technologies\, network with industry experts\, and drive innovation at the forefront of AI’s revolution in hardware. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/iesa-ai-summit/ LOCATION:Trident Hotel Hyderabad\, Hyderabad\, India CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IESA-AI-Summit-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Chicago:20231031T083000 DTEND;TZID=America/Chicago:20231031T170000 DTSTAMP:20260416T061936 CREATED:20231024T192233Z LAST-MODIFIED:20231024T192426Z UID:6991-1698741000-1698771600@marketingeda.com SUMMARY:STAC Summit DESCRIPTION:STAC Summits bring together CTOs and other industry leaders responsible for solution architecture\, infrastructure engineering\, application development\, machine learning/deep learning engineering\, data engineering\, and operational intelligence to discuss important technical challenges in trading and investment. \nWHEN\nTuesday\, October 31\, 2023\nSTAC Exchange (Exhibits) opens at 8:30am CDT\nConference starts at 9:00am CDT\nNetworking lunch at ~12:00pm CDT\nConference concludes at ~4:00pm CDT\nReception immediately following \nWHERE\nThe Metropolitan Club\nWillis Tower\n233 South Wacker Drive\n66th Floor\nChicago \n\n\n\n9:00am\nSTAC Update: Historical tick analytics\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will present the latest results in STAC-M3 (tick analytics).\n\n\n\n\n\n\n9:15am\nInnovation Roundup\n\n\n\n“How to maximize your GPU investment”\nJeff Chu\, Financial Services Sales\, Penguin Solutions\n\n\n\n“Using a vector database to unlock the power of your data”\nJosh Kalina\, Pre-Sales Engineer\, KX\n\n\n\n“Data at Scale: Overcoming Challenges in Generative AI and LLM Development”\nKeith Miller\, VP Technical Sales\, Services and Support\, DDN\n\n\n\n\n\n\n9:35am\nEnforcing the foundation: Improving data lineage      ;\n\n\n\n\n\nMarc Gale\, Director of Data Engineering\, OncoHealth; former Manager of Data Engineering\, Chicago Trading Company\nJosh Kalina\, Pre-Sales Engineer\, KX\nKeith Miller\, VP Technical Sales\, Services and Support\, DDN\n\nIt’s no secret that the automation of insights drives forward the financial industry. Both traditional quantitative analysis and newer AI models require a solid data foundation. Data engineers have to build this foundation from an ever-increasing universe of data sets\, which come from many sources with varying quality. Even worse\, today’s data could be corrected tomorrow\, next week\, or next year. For models to stay stable during rapid innovation\, data engineers must properly track\, maintain\, and leverage the data’s lineage. How should they track change sets\, version data\, and stay synchronized across the enterprise? How should licensing and permissions be taken into account? What are the best practices for maintaining metadata? How do storage architectures impact data lineage solutions? Join our panel of experts and add your questions to the mix.\n\n\n\n\n\n\n10:05am\nThe unbearable heaviness of data: Can modern approaches help?\n\n\n\n\n\nVrashank Jain\, Sr. Director of Product Management for Data Management Solutions\, Dell Technologies\n\nIt’s common for data architects and engineers to spend more time managing data than creating value from it. They have to deal with data-hungry end users\, capture real-time streams\, and manage multiple derivative data sets for historical research. AI adoption is piling on troves of model inputs and outputs that are required for explainability and fine tuning. And hybrid cloud infrastructures mean copies in multiple locations. How can architects and engineers enable new value from data rather than simply managing the inventory? Vrashank has seen financial firms greatly reduce the burden of data maintenance\, allowing technologists to focus on developing data products. Using Dell’s experience with an international bank as a guide\, he’ll show how applying an open data platform\, from edge to core to cloud\, can reduce data movement\, consolidate data intelligently\, and allow access to diverse tools and uses\, all while keeping data secure. Be sure to bring your questions for Vrashank as he covers best practices in data modernization and the benefits they can bring.\n\n\n\n\n\n\n10:30am\nBreak\n\n\n\n\n\n\n11:00am\nSTAC Update: Big compute\n\n\n\n\n\nBishop Brock\, Head of Research\, Strategic Technology Analysis Center\n\nBishop and Peter will present the latest STAC Benchmark Council activities compute critical workloads\, including STAC-A2 (complex deriviatives risk computation) and an update from the STAC-ML Working Group.\n\n\n\n\n\n\n11:10am\nWaste not\, want not: Avoiding idle GPUs\n\n\n\n\n\nTroy Kaster\, VP of AI\, Penguin Solutions\n\nMany financial firms are looking to large-scale GPU clusters to meet the demands of compute-hungry AI and HPC workloads in price discovery\, portfolio management\, and quantitative research. But once they fill the compute gap\, a knowledge gap remains. How should system engineers and admins best utilize these enormous investments and avoid the pitfalls that result in poor performance? Troy will help us understand how to ensure high availability and maximize the utilization of expensive computing platforms. Using Penguin’s experience bringing a 16k GPU cluster online for Meta\, he’ll walk us through some real-life issues encountered and solutions applied. Along the way he’ll cover best practices for designing\, building\, deploying\, and managing large-scale GPU clusters.\n\n\n\n\n\n\n11:35am\nInnovation Roundup\n\n\n\n“Build. Connect. Analyse. Beeks solves your colo and network visibility challenges.”\nMatthew Cretney\, Head of Product Management\, Beeks Group\n\n\n\n“Mechanics of Low Latency Capture”\nPramod Nayak\, Director of Product Management\, Low Latency\, Refinitiv\, an LSEG Business\n\n\n\n“The Smart Way to Configure a Tap Aggregator”\nKevin Formby\, VP Finance and Capital Markets\, Keysight Technologies\n\n\n\n\n\n\n11:50am\nEncrypting our markets: The impact of security on high-performance infrastructures\n\n\n\n\n\nVenkat Doddapuneni\, Senior Director of Software Engineering\, CME Group\nKevin Formby\, VP Finance and Capital Markets\, Keysight Technologies\nAdditional speakers to be announced\n\nSecurity has become a key component of the systemic risk conversation. Market oversight groups are discussing encrypted connections\, and at least one exchange has rolled them out. Encryption can provide a layer of protection\, helping prevent threats from moving horizontally through financial systems. But our markets benefit from high-performance\, low-friction connectivity. What conflicts can arise when security meets market access? Our panel of experts will discuss how to solve for security without exacerbating other tech risks. They’ll dive into important aspects\, including what concerns motivate a desire for higher security\, what should be in scope\, the impact on performance\, and how to maintain network-based risk\, compliance\, and data monitoring systems when encryption is a must. Bring your questions and join us to explore the impact of encryption on market connectivity.\n\n\n\n\n\n\n12:20pm\nNetworking Luncheon\n\n\n\n\n\n\n1:20pm\nSTAC Update: Network communications\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will present on the latest STACT Benchmark Council activities in network communications\, including recent test results on a high frequency radio link and benchmark development activities for cloud networking.\n\n\n\n\n\n\n1:35pm\nInnovation Roundup\n\n\n\n“Leveraging HATI for high resolution timing to FPGA’s.”\nCiaran Kennedy\, Sales\, Safran Timing & Navigation\n\n\n\n“Create a Better and Faster Consolidated View Across Markets Using FPGAs”\nCliff Maddox\, Director of Business Development\, NovaSparks\n\n\n\n“Cancel on Behalf is a Game Changer”\nJohn Hagerman\, VP Marketing and Business Development\, Algo-Logic\n\n\n\n“Using Equivalence Checking to Rapidly Evolve Your Design”\nMartin Rowe\, Sr. Application Engineer\, Siemens\n\n\n\n“Mastering Ultra-Low Latency: The Technical Blueprint of FPGA and Software Hybrid Solutions”\nJean-François Gagnon\, Ultra-Low Latency FPGA Solutions Architect\, Orthogone\n\n\n\n\n\n\n2:00pm\nTalent shortages in hardware verification: Can ML plug the gaps?\n\n\n\n\n\nAdam Sherer\, Verification Technology Executive\, Cadence\n\nAs discussed at recent STAC Summits\, financial firms suffer from a lack of verification engineers. They can achieve significant latency gains with properly designed and implemented hardware solutions\, but a shortage of experienced\, skilled personnel causes painful lead times and uncomfortable prioritization decisions. Adam thinks that\, given the proper setup\, advances in ML can provide some relief by increasing the productivity of current staff. He’ll dive into tasks that grind on an engineer’s time—like regression optimization\, failure triage analysis\, and bug localization—and explain how ML can ease the burden. Bring your questions and join him as he discusses using ML to accelerate your FPGA and ASIC verification.\n\n\n\n\n\n\n2:20pm\nBreak\n\n\n\n\n\n\n2:50pm\nSTAC Update: Fast data\n\n\n\n\n\nPeter Nabicht\, President\, Strategic Technology Analysis Center\n\nPeter will discuss the latest test results for STAC-N1 (full stack networking).\n\n\n\n\n\n\n2:55pm\nInnovation Roundup\n\n\n\n“ÜberNIC can do… Can Yours?”\nAlex Stein\, Global Head Business Development\, Liquid-Markets-Solutions\n\n\n\n“Trading at the speed of light – Beyond ultra-low latency with Salience Labs”\nChris Porthouse\, Chief Product Officer\, Salience Labs\n\n\n\n“nxFramework update: Added features and improved latency for the Exegy FPGA development framework”\n Laurent de Barry\, Sr. Director\, Global Head of Solutions Consulting\, Exegy\n\n\n\n\n\n\n3:15pm\nDesigning the right hardware stack for FPGA\n\n\n\n\n\nMichael Gorbovitski\, Executive Director\, Morgan Stanley\nRobert DeWitt\, Director Product Marketing\, AMD\nDarrin Machay\, Principal Engineer\, Arista\n\nFGPAs are a go-to component for firms looking to improve their latencies\, whether by getting strategies as close to the network as possible or offloading critical workflows from the CPU. But as the best engineers know\, FPGAs are but one component of the custom hardware stack that affects performance. Given recent and upcoming changes in that stack\, designing the best systems requires answering a number of questions. How do on-board HBM3E and tiering impact memory-intensive applications? Do PCIe 5 and CXL change how we think about accessing compute\, memory\, and storage? Will new designs that pair ASIC with FPGA open new latency possibilities\, and what can we achieve with programmable switches? What’s the state of the art with FPGA sharing a fabric with CPU and other compute accelerators? Join our panel of experts as they explore these questions and yours.To kick off\, there will be some brief presentations:\n\n\n\n“Trade Smarter and Trade Faster with the New AMD FPGA accelerator for Ultra-Low Latency Trading”\n Hamid Reza Salehi\, Director Product Marketing\, AMD\n\n\n\n“Arista 7130 Update: Ultra Low Latency 25G”\n Darrin Machay\, Principal Engineer\, Arista\n\n\n\n\n\n\n~4:00pm\nNetworking Reception\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/stac-summit-2/ LOCATION:The Metropolitan Club\, 233 South Wacker Drive\, Chicago\, IL\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/STAC-October-31-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230827T080000 DTEND;TZID=America/Los_Angeles:20230829T170000 DTSTAMP:20260416T061936 CREATED:20230613T165859Z LAST-MODIFIED:20230613T165859Z UID:6490-1693123200-1693328400@marketingeda.com SUMMARY:Hot Chips 2023 DESCRIPTION:Hot Chips 2023 (advance program) will be held as a hybrid conference with in-person attendance at Stanford University from August 27 to 29\, 2023. \nConference Format\nHot Chips 2023 will be a hybrid conference. You may register to attend virtual or in-person. The conference venue is the Dinkelspiel Auditorium on the Stanford University Conference. \n\nSunday (August 27) is a Tutorial Day.\nMonday and Tuesday (August 28 and 29) are Conference Days.\n\nVirtual Conference: Includes full access to conference videos\, presentation PDFs and Slack Channels for both Tutuorial and Conference Days. All talks are transmitted in real time and are also recorded so that you also may view them at a time convenient for your time zone. Details are here. \nIn-Person Conference: You may register for Conference Days only or both Conference and Tutorial Days. In either case you will have full access to Videos\, presentation PDFs and Slack channels. The conference fee includes breakfast\, lunch\, coffee breaks and receptions. Details are here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/hot-chips-2023/ LOCATION:Stanford University\, 471 Lagunita Drive\, Stanford\, CA\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/14054931_10155065287553998_1856342906013349235_n.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230822T080000 DTEND;TZID=America/Los_Angeles:20230824T170000 DTSTAMP:20260416T061936 CREATED:20230802T171343Z LAST-MODIFIED:20230802T171343Z UID:6655-1692691200-1692896400@marketingeda.com SUMMARY:ERI 2.0 Summit DESCRIPTION:Watch as leaders from our government agencies\, the Defense Industrial Base\, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry\, national and economic security\, and future research directions. \nThe Electronics Resurgence Initiative (ERI)\, DARPA’s response to national-level microelectronics concerns\, is designed to ensure U.S. leadership in cross-functional\, next-generation microelectronics research\, development\, and manufacturing. The initiative\, aimed at both national security capabilities and commercial economic competitiveness and sustainability\, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry\, the defense industrial base\, and university researchers. \nDARPA expanded ERI’s focus with the announcement of ERI 2.0\, which seeks to reinvent domestic microelectronics manufacturing. ERI 2.0 will strengthen DARPA’s leadership in driving the next generation of microelectronics for national security by creating a national capability for 3DHI manufacturing and pursuing focused research in: \n\nManufacturing complex 3D systems\nDeveloping electronics for extreme environments\n\n…while maintaining the following thrust areas:\n  \n\nOptimizing design and test for complex circuits and prototypes\nOvercoming security threats across the entire hardware lifecycle\nIncreasing information processing density and efficiency\nAccelerating innovation in artificial intelligence hardware to make decisions at the edge faster\nSecuring communications\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/eri-2-0-summit/ LOCATION:Hyatt Regency Seattle\, 805 Howell Street\, Seattle\, WA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ERI-2.0.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Vienna:20230807T080000 DTEND;TZID=Europe/Vienna:20230808T170000 DTSTAMP:20260416T061936 CREATED:20230207T013618Z LAST-MODIFIED:20230207T013618Z UID:5914-1691395200-1691514000@marketingeda.com SUMMARY:ISPLED 2023 DESCRIPTION:The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design\, ranging from process technologies and analog/digital circuits\, simulation and synthesis tools\, system-level design and optimization\, to system software and applications. \n  \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/ispled-2023/ LOCATION:TU Wien\, Gußhausstraße 27-29/384\, Vienna\, Austria CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISLPED-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20230614T080000 DTEND;TZID=Europe/Berlin:20230615T170000 DTSTAMP:20260416T061936 CREATED:20230313T202424Z LAST-MODIFIED:20230612T171200Z UID:6114-1686729600-1686848400@marketingeda.com SUMMARY:GSA 2023 European Executive Forum DESCRIPTION:Dealing with Uncertainty\nThe global economy is sending mixed messages\, and with every new data release comes a new batch of upbeat or defeatist headlines. \nUncertainty remains if inflation is fully under control and how quickly economic growth will pick up strongly again. On one side the labor market seems healthier than it’s been in years\, on the other all major tech companies have announced significant layoffs.  The chip shortage is not over yet in some segments\, but in some others there is excess supply. Our new multipolar world order will enforce structural changes to the economy\, such as the need to rebuild reliable supply chains closer to home\, which often comes at higher prices. \nDespite these uncertainties\, innovation in our industry remains as strong as ever\, with relentless growth driven by automotive\, 5G and next generation connectivity\, new silicon design paradigms including RISC-V and chiplets\, big trends towards decarbonization and new materials like SiC\, the positive effects of increased diversity and inclusion. And large amounts of government money is made available globally to support this growth\, through “chips acts” and “green deals”. \nThere is therefore a strong belief that tech innovation and growth will continue to prevail and\, with a little more positive international cooperation\, deal with the apparent challenges altogether. \n\n\n\n\n\n\n\n\n\n\nThe GSA European Executive Forum is our flagship event in Europe which\, over two days\, always attracts the very top speakers and attendees: close to 300 senior decision makers\, the majority VP and C-level profiles. \nOver the past 20 years\, it has become the reference executive event for the semiconductor industry in the EMEA region. \n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-2023-european-executive-forum/ LOCATION:Sofitel Munich Bayerpost\, Bayerstrasse 12\, Munich\, 80335\, Germany CATEGORIES:EDA,Forum,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-June-14-15-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20230531T083000 DTEND;TZID=America/New_York:20230531T170000 DTSTAMP:20260416T061936 CREATED:20230530T203817Z LAST-MODIFIED:20230530T203817Z UID:6438-1685521800-1685552400@marketingeda.com SUMMARY:STAC Summit DESCRIPTION:STAC Summits bring together CTOs and other industry leaders responsible for solution architecture\, infrastructure engineering\, application development\, machine learning/deep learning engineering\, data engineering\, and operational intelligence to discuss important technical challenges in trading and investment. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/stac-summit/ LOCATION:New York Marriott Marquis\, 1535 Broadway\, New York City\, NY\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/STAC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Brussels:20230516T080000 DTEND;TZID=Europe/Brussels:20230517T170000 DTSTAMP:20260416T061936 CREATED:20230414T161617Z LAST-MODIFIED:20230414T161617Z UID:6275-1684224000-1684342800@marketingeda.com SUMMARY:ITF World 2023 DESCRIPTION:Imec’s flagship event on semiconductor advances & deep-tech solutions\n\n\nformerly known as Future Summits.\n\n\n\n\nSemiconductors have become increasingly instrumental – and often even dominant – for the future of industries and application domains worldwide. \nFor many decades\, imec has played a major role in the global semiconductor industry. Our expertise and partnerships now also progress Chips Act initiatives around the globe. \nITF World aims to bring together all the different players. \n\nITF World features: \n\nA program clearly centered around semiconductor technologies & system scaling\nAn important focus on deep-tech venturing\, featuring inspiring cases\nInsights that highlight imec’s role & activities to progress Chips Act initiatives worldwide\n\nIn conjunction with ITF World\, we also organize ITF Flanders\, a dedicated event for Flemish companies and stakeholders. \nThis one-of-a-kind experience is marked by: \n\nKeynotes by world-renowned tech experts and industry leaders\nDemos showcasing state-of-the-art technologies and innovative solutions in a wide array of application domains\nExchange with key players from the global semiconductor and deep-tech scenes and innovators from various application domains\nAn onsite networking dinner\n\nITF World welcomes 2\,000 attendees from around the globe – ranging from industry experts and business leaders to policy makers\, futurists\, technology gurus\, entrepreneurs from start-ups to scale-ups\, analysts and investors. \n\n\n\n\n\n\nITF World is a 1.5-day event taking place at the majestic Flanders Meeting & Convention Center in the heart of Antwerp\, Belgium. Our event is widely valued for its dynamic and vibrant atmosphere. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nExtend your experience with a half-day participation in ITF Flanders if you’re interested in: \n\nThe role of nano & digital technologies to accelerate Flemish economy and society\nDedicated tracks on Health\, Energy\, Mobility\, and Sustainable industries\nNetworking with policy makers & entrepreneurs from Belgium’s strong economic region\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/itf-world-2023/ LOCATION:Flanders Meeting & Convention Center Antwerp\, Antwerp\, Belgium CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ITF-World-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20230509T083000 DTEND;TZID=America/New_York:20230509T164000 DTSTAMP:20260416T061936 CREATED:20230404T200716Z LAST-MODIFIED:20230404T200716Z UID:6236-1683621000-1683650400@marketingeda.com SUMMARY:TSMC - Boston Technology Workshop DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-boston-technology-workshop/ LOCATION:Boston Marriott Burlington\, One Burlington Mall Road\, Burlington\, MA\, 01803\, United States CATEGORIES:EDA,IP,Semiconductor,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Technology-Symposium.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Jerusalem:20230508T080000 DTEND;TZID=Asia/Jerusalem:20230509T170000 DTSTAMP:20260416T061936 CREATED:20230331T183459Z LAST-MODIFIED:20230331T183459Z UID:6212-1683532800-1683651600@marketingeda.com SUMMARY:ChipEx 2023 DESCRIPTION:The major annual event of the Israeli semiconductor industry \nChipEx2023\, the largest annual event of the Israeli semiconductor industry\, will be held on May 9\, 2023 in Tel Aviv\, Israel. ChipEx2023 showcases companies including manufacturers\, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world’s leading experts address the industry’s most relevant issues. \nThe event is produced by ASG Ltd. in cooperation with SIA\, Semiconductor Industry Association and with Semi\, the largest global industry association. \nThe goal of ChipEx2023 is to update all professionals involved with the Israeli semiconductor industry with the latest technological innovations and future directions of the industry. \nChipEx2023 target audience are all people involved with the semiconductor industry including engineers\, R&D managers\, industry experts\, senior executives in microelectronics related companies\, multinational design centers\, consultants\, venture capital managers as well as electrical/electronic/computer science students & professors from the various universities around Israel. \nChipEx2023 consists of three main parts: \nVendors’ Exhibition \nThe ChipEx exhibition includes booths in various sizes for presentations and demonstrations of new design and development tools. This year\, the ChipEx2023 exhibition will take place on May 9\, 2023 at the Tel-Aviv Expo Center and will include industry vendors\, service providers\, and manufacturers of electronic design tools\, components and manufacturing equipment from Israel and around the globe. These exhibitors will exhibit and update the visitors with the latest developments in tools and services for the semiconductor industry. \nTechnical Seminar \nTechnical lectures given by industry experts\, senior executives from the semiconductor industry\, vendors\, and university professors. The format of the sessions intends to cultivate and promote an instructive and productive interchange of ideas and solutions among industry developers and designers. The lectures are divided to various tracks in separate halls and address the major topics related to the microelectronics industry. This year\, the ChipEx2023 technical seminar will take place on May 9\, 2023 at the Tel-Aviv Expo Center. \n  \nChipEx2023 Executive Summit \n  \nThe opening session of ChipEx2023 will take place on May 8\, 2023 at Hilton Hotel Tel-aviv and will include top industry figures and will act as the Executive summit of ChipEx2023 targeting Industry leaders and top executives from Israel and around the globe. \n  \nChipEx2023 is a great opportunity for any industry vendor or service provider to meet its target audience as well as interact with the decision makers in the various Israeli semiconductor companies. \n  \nWe invite you to take part in ChipEx2023 as an exhibitor\, a speaker and/or as a sponsor. \n  \nFor more details please contact us at:\nPhone: +972-9-7454007\nFax: +972-9-7748858\ninfo@chiportal.co.il\nwww.chipex.co.il \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/chipex-2023/ LOCATION:Hilton Hotel Tel-aviv\, HaYarkon St 205\, Tel aviv\, Israel CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ChipEx-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230503T083000 DTEND;TZID=America/Los_Angeles:20230503T164000 DTSTAMP:20260416T061936 CREATED:20230404T200249Z LAST-MODIFIED:20230404T200249Z UID:6233-1683102600-1683132000@marketingeda.com SUMMARY:TSMC - Austin Technology Workshop DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-austin-technology-workshop/ LOCATION:Omni Barton Creek Resort & Spa\, 8312 Barton Club Drive\, Austin\, TX\, United States CATEGORIES:EDA,IP,Semiconductor,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Technology-Symposium.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230426T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20260416T061936 CREATED:20230404T195733Z LAST-MODIFIED:20230404T195733Z UID:6230-1682496000-1682528400@marketingeda.com SUMMARY:TSMC - North America Technology Symposium DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-north-america-technology-symposium/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Semiconductor,Symposium ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Technology-Symposium.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230423T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20260416T061936 CREATED:20221121T190016Z LAST-MODIFIED:20221121T190016Z UID:5423-1682236800-1682528400@marketingeda.com SUMMARY:CICC 2023 DESCRIPTION:Sponsored by IEEE and SSCS\, the IEEE Custom Integrated Circuits Conference – CICC –  is a premier conference devoted to IC development. The conference program is a blend of oral presentations\, exhibits\, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design problems\, improve circuit design techniques\, get exposure to new technology areas\, and network with peers\, authors and industry experts. \nThere are 3 days of Technical Sessions that include lecture presentations addressing state of the art developments in integrated circuit design. The Educational Sessions are a full day of tutorials instructed by recognized invited speakers. The Panels\, and Forums are presented throughout the conference to enrich the learning experience of the attendees. The Panel Discussions and Forums are presented by leaders from the IC industry. CICC includes an Exhibits Hall that is open in the evenings where Semiconductor manufacturers\, software tool suppliers\, silicon IP providers\, design-service houses\, and technical book publishers offer displays and demonstrations of their products. CICC is sponsored by the IEEE Solid-State Circuits Society and technically co-sponsored by the IEEE Electron Devices Society. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/cicc-2023/ LOCATION:IL CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CICC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230331T080000 DTEND;TZID=America/Los_Angeles:20230402T170000 DTSTAMP:20260416T061936 CREATED:20230122T015307Z LAST-MODIFIED:20230222T174957Z UID:5871-1680249600-1680454800@marketingeda.com SUMMARY:Latch-Up 2023 DESCRIPTION:The FOSSi Foundation is proud to announce Latch-Up\, a conference dedicated to free and open source silicon to be held over the weekend of Friday\, March 31 to Sunday\, April 2\, 2023 in Santa Barbara\, California\, USA. \nLatch-Up is a weekend of presentations and networking for the open source digital design community\, much like its European sister conference ORConf. \nSo save the date\, register to attend\, and we encourage you to submit a presentation or proposal if you have a project or idea on the topic to share! \n  \nQuestions? Ping the organizers via @LatchUpConf or email. \nPrevious Latch-Ups: 2019 Portland \nSubmit a talk\n\nWe encourage anybody involved in the open source semiconductor engineering space to come along and share your work or experience. Presentations slots as short as 3 minute lightning-talks and up to 30 minute talks including Q and A are available. \nSo if you’ve designed\, worked on or even just used open source IP cores and/or management systems\, verification IP\, build flows\, SoCs\, simulators\, synthesis tools\, FPGA and ASIC implementation tools\, languages and DSLs\, compilers\, or anything related we’d love to have you join us to share your experience. \nPresentations are submitted through the registration process and we will let you know if your presentation was accepted. \nRegistration\n\nAttendance of Latch-Up is free. To help us organizing the event\, you are required to register using the button below or via the EventBrite link. \nProfessional Tickets\nAttendees who are joining us at Latch-Up on behalf of their company and/or can claim the conference as professional training expense are encouraged to purchase a professional ticket. These ticket sales help us provide all that we do at Latch-Up and keep the event accessible to all members of the community. Professional ticket holders are able to get their company name printed on their name badge and receive a special treat. You can buy professional tickets using the button below or via the EventBrite link. \nWe ask all Latch-Up participants to adhere to the the FOSSi Foundation code of conduct throughout the event. \nSponsorship and Volunteering at Latch-Up\n\nLatch-Up is free to attend\, but we aim to provide catering and the like during the event. Latch-Up is also a great way to get your company or brand in front of lots of engineers and hackers on the day\, and thousands more through recordings of the event. So please get in touch if you’d like to explore sponsorship opportunities. \nLatch-Up is organized by volunteers on behalf of the FOSSi Foundation. We are currently looking for more people to help out with arrangements and putting on the event\, so please do email us if you would like to volunteer for during the event with setup\, AV\, or even just local knowledge so we can plan the weekend better. \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/latch-up-2023/ LOCATION:University of California\, Santa Barbara\, Santa Barbara\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Latch-Up-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230328T070000 DTEND;TZID=America/Los_Angeles:20230328T080000 DTSTAMP:20260416T061936 CREATED:20230316T184842Z LAST-MODIFIED:20230316T184842Z UID:6176-1679986800-1679990400@marketingeda.com SUMMARY:Maximizing yields through collaboration DESCRIPTION:Semiconductor companies have long recognized the importance of yield management and having the right support in place to maximize results. In this 30-minute webinar brought to you by yieldHUB and SemiWiki\, attendees will learn about a key to success in the world of yield management (and something that can be underestimated) – collaboration. This is crucial today when different teams and departments work together from around the world. \nDuring this online event\, yieldHUB’s experts will explore why and how collaboration can make a difference\, and speak about some real examples. The webinar will end with a 15-minute Q&A session\, where attendees’ questions will be answered and more. Whether you work for a startup or a large-scale semiconductor company\, this webinar is a must-attend event! Register now to secure your spot before it’s too late. \nSpeaker Bios: \nJohn O’Donnell is an Irish entrepreneur\, having founded yieldHUB back in 2005 when he saw a gap in the market for a reliable and modern hosted yield management solution. yieldHUB is based in Ireland and has grown to become a global leader in the market. The company has a reputation for innovation in the industry with new developments in the field\, including its unique collaboration capabilities. \nAlso joining this webinar is Kevin Robinson\, VP of Operations at yieldHUB. John and Kevin have a combined 60 years of experience working in the semiconductor industry. \nThis webinar is in partnership with SemiWiki and yieldHUB \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/maximizing-yields-through-collaboration/ LOCATION:IL CATEGORIES:EDA,Semiconductor,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/yieldHUB-March-28-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230320T080000 DTEND;TZID=America/Los_Angeles:20230323T170000 DTSTAMP:20260416T061936 CREATED:20230307T044258Z LAST-MODIFIED:20230307T044258Z UID:6073-1679299200-1679590800@marketingeda.com SUMMARY:GOMACTech 2023 DESCRIPTION:GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \n\nDear 2023 Attendees: \nThis year’s conference is titled “Microelectronics – the Engine to Keep the US Moving Forward\,” and our robust technical program supports this theme with topics including Advanced Silicon-Based RF\, Alternative Computing Paradigms\, Counterfeit Detection and Avoidance\, GaN Power Electronics\, and much\, much more. \nThe conference kicks off on Monday\, 20 March\, with our annual Trusted Suppliers Industry Day\, created with the objective of promoting discussion among members of industry and government agencies that represent the interests of integrated-circuit and electronics producers who serve defense and aerospace applications. We have seen tremendous change since last year’s Industry Day\, not only with the enactment and funding of the CHIPS and Science Act but also with the increasing uncertainty regarding China’s intentions with Taiwan. To provide insight into these issues\, Dr. Tai Ming Cheung\, recipient of multiple DoD Minerva Research Initiative awards and director of the University of California Institute on Global Conflict and Cooperation (IGCC)\, is scheduled to deliver the keynote address on the emergence of the Chinese techno-security state. Monday also features four workshops/tutorials: Advanced GaN Modeling\, JFAC Hardware Assurance\, GEEGAH Fab Capabilities & PDK for Acoustoelectric Devices\, and AKOUSTIS Fab Capabilities & PDK for AIN/ScAIN. \nOur Monday programming will conclude with a reception on the resort’s Flamingo Lawn\, which is open to all registered attendees. Please join us! \nGOMACTech-23 formally opens on Tuesday\, 21 March\, with an outstanding morning Plenary Session that includes the keynote address “3DHI and the Coming Inflection Point in Microelectronics Manufacture” by Dr. Mark Rosker\, director of DARPA’s Microsystems Technology Office. Rosker will be followed by Ezra Hall\, senior director of Global Aerospace and Defense Business at GlobalFoundries\, whose talk is titled “Aligning Defense Microelectronics Technologies with Industry Needs: Fueling U.S. Success.” \nThe keynotes will be followed by the Jack S. Kilby Lecture Series\, with presentations from Dr. Waleed Khalil\, professor of electrical and computer engineering at Ohio State University and the ElectroScience Lab\, who will speak on “Analog Hardware Security: What We Don’t Know Will Hurt Us\,” and Krystal Puga\, Lunar Mission Architect for the Space Systems Sector at Northrop Grumman Corp.\, with the presentation\, “James Webb Space Telescope Development and Latest Discoveries.” \nThis year\, we are also hosting three panel discussions: “Chips and Science Act Impact to DoD\,” on Monday\, 20 March; “Perspectives on Computational Methods for Radiation Hardness Qualification;” on Wednesday\, 22 March; and “Sifting Through the Chaos: Are Best Practices Achievable?” on Thursday\, 23 March. \nThe plenary\, technical\, and topical sessions are the major venues for information exchange at the conference. Other opportunities for technical interaction are provided by the exhibits program\, which includes major IC manufacturers and commercial vendors of devices\, equipment\, systems\, and services for nearly every facet of the electronics business. The exhibition opens on Tuesday\, 21 March\, at noon\, and runs through Wednesday\, 22 March\, at 4:00 pm. On Tuesday evening\, all attendees can network in a relaxing atmosphere during the Exhibitors’ Reception. \nWednesday evening features the Evening Social\, held this year at the San Diego Zoo\, one of the country’s premier zoos. A buffet-style dinner will be included\, and we will have the opportunity to meet some of the animals “up close and personal.” This is a ticketed event with an attendance cap\, so if you’re planning on attending\, buy your ticket before Wednesday. \nOn Thursday morning\, 23 March\, a poster session that includes our annual student poster competition will take place. \nGOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and to provide a forum for government reviews. \nThe GOMACTech Conference is an Unclassified\, Export-Controlled event that requires participants to be U.S. Citizens or legal U.S. Permanent Residents. All registrants must provide proof of U.S. Citizenship or Permanent Resident status prior to being permitted entry into the conference. Additionally\, a signed Non-Disclosure Statement will be required. \nGOMACTech-23 provides a forum for discussing and demonstrating advanced microelectronics and microsystems that can provide the means to develop confidence in transformational\, leap-ahead technologies\, and capabilities. GOMACTech is the premier forum for reporting on government-funded microcircuit research and other research efforts that focus on the technology needs of government systems. \nThis year’s technical program is a result of the hard work and enthusiasm of the GOMACTech-23 Technical Program Committee. The committee members discussed and collaborated on the topics and presentations. The quality of the conference reflects this comprehensive team effort. We hope that you find GOMACTech-23 an enlightening\, rewarding\, and enjoyable experience. Thank you for your active participation. \n  \n\n\n\nDr. Morgan Thoma\nU.S. Army Research Laboratory\nDefense Microelectronics CFT\nGeneral Chair\nLuciano Boglione\nNaval Research Laboratory\nTechnical Program Chair\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gomactech-2023/ LOCATION:Town and Country San Diego Hotel\, 500 Hotel Circle North\, San Diego\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GOMACTech-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230316T083000 DTEND;TZID=America/Los_Angeles:20230316T113000 DTSTAMP:20260416T061936 CREATED:20230217T231519Z LAST-MODIFIED:20230217T231519Z UID:6002-1678955400-1678966200@marketingeda.com SUMMARY:Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession DESCRIPTION:Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes\, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers. \nJoin us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term\, including regional and global economies\, and the Chips Act. \nSpeakers will discuss strategies for mitigating the impact and how to capture value. \nTopics include: \n\nMarket Trends & Forecast & Outlook\nAccessing Chips Act Funding and Roll out of Incentives\nGeopolitical Impact\nAdvanced Packaging & Chiplets\nEmerging and Expanding Markets\n\n  \nThis Virtual Forum is 8:30–11:00am Pacific Time\, 11:30am–2:00pm Eastern Time \nAGENDA\n\nVirtual Forum | Thursday\, March 16\, 2023 | Pacific Time\n\n\n8:30 am – 8:35 am\n\n\n\nEd Sperling\nEditor-in-Chief\nSemiconductor Engineering\n\n\n\nWelcome Remarks\n\nBiography \n\n\n\n\n\n8:35 am – 8:55 am\n\n\n\nJohn Cooney\nVice President\, Global Public Policy & Advocacy\nSEMI\n\n\n\nAn Update on the CHIPS Act and How to Apply for Funding\n\nBiography \n\n\n\n\n\n8:55 am – 9:20 am\n\n\n\nJay Vleeschhouwer\nSoftware Research\nGriffin Securities\n\n\n\nThe State of EDA: A View from Wall Street\n\nBiography \n\n\n\n\n\n9:20 am – 9:45 am\n\n\n\nDan Hutcheson\nVice Chair\nTechInsights\n\n\n\nNew Perspectives in Semiconductors: Cycles & Outlooks\n\nBiography \n\n\n\n\n\n9:45 am – 10:10 am\n\n\n\nJean-Christophe Eloy\nPresident and CEO\nYole Développement\n\n\n\nStatus of the Advanced Packaging Industry: How the Chiplet Revolution is Impacting the Industry?\n\nBiography \n\n\n\n\n\n10:10 am – 10:35 am\n\n\n\nPaul McLellan\nEditor of Breakfast Bytes\nCadence\n\n\n\nThree Things to Watch: 3DIC\, Supply Chain Disaggregation\, and Intel\n\nBiography \n\n\n\n\n\n10:35 am – 10:55 am\n\n\n\nLita Shon-Roy\nPresident/CEO\nTECHCET\n\n\n\nThe Impact on Supply-Chains – Materials & Equipment Consumables\n\nBiography \n\n\n\n\n\n10:55 am – 11:00 am\n\n\n\nEd Sperling\nEditor-in-Chief\nSemiconductor Engineering\n\n\n\nClosing Remarks\n\nBiography \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/semiconductor-outlook-navigating-through-turbulent-times-and-the-impact-of-the-recession/ LOCATION:IL CATEGORIES:EDA,Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-March-16-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Phoenix:20230313T080000 DTEND;TZID=America/Phoenix:20230316T170000 DTSTAMP:20260416T061936 CREATED:20230307T194359Z LAST-MODIFIED:20230307T194359Z UID:6087-1678694400-1678986000@marketingeda.com SUMMARY:19th International Conference & Exhibition on Device Packaging DESCRIPTION:The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills\, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16\, 2023\, at the WeKoPa Conference Center. This esteemed event brings together industry engineers\, researchers and top experts participating in a multi-faceted technical program and unique networking events. \nFull Conference registrations include:  (excludes exhibit only\, pdc only\, or visitor pass registration types) \n\n3-track program with 80+ speakers\nPoster presentations\n4 keynote speakers from Qualcomm\, Samsung\, General Motors\, and Lightmatter\nPanels covering both business and social value topics\nGBC Business plenary session: Building the Ecosystem: Transitioning from Research to Manufacturing\nSold-out exhibit hall with 66 booths\nNetworking opportunities: welcome reception\, exhibit hall reception\, poster session happy hour\, and group lunches\nPost-conference golf scramble and guided hike fund raisers\n\nFirst day add-ons: 12 Professional Development Courses\, a great learning opportunity for those new to the industry or looking to enhance their skills and knowledge. \nIn 2022\, DPC was held in person with more than 500 participants\, despite continued pandemic restrictions at that time. Given the strength of the technical program and exhibition this year\, it is anticipated that the 2023 DPC will welcome a record number of participants! \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/19th-international-conference-exhibition-on-device-packaging/ LOCATION:We-Ko-Pa Resort & Conference Center\, 10438 Wekopa Way\, Fort McDowell\, AZ\, 85264\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Device-Packaging-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230307T090000 DTEND;TZID=America/Los_Angeles:20230307T100000 DTSTAMP:20260416T061936 CREATED:20230306T180513Z LAST-MODIFIED:20230306T180513Z UID:6066-1678179600-1678183200@marketingeda.com SUMMARY:THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION DESCRIPTION:The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production.\nJoin us on Tuesday\, March 7\, 2023\, for this 1-hour panel discussion with industry experts from Qualcomm\, Microsoft Azure and Advantest as we discuss how data analytics and product insights can accelerate time to market and improve performance\, yield and quality. \nTopics covered:  \n\nOvercoming data silos\nProcessing massive amounts of data\nUsing machine learning and advanced data analytics\nUncovering data insights and actionable intelligence\n\nPanel will be moderated by Nitza Basoco\, VP of Business Development at proteanTecs. Nitza has a broad background in management\, test development\, product engineering\, supply chain and operations. In her current role\, she focuses on partnership strategies and ecosystem growth\, positioning proteanTecs as the common data language to the full value chain. Before joining proteanTecs\, she was VP of Operations at Synaptics and held engineering and leadership positions at Teradyne\, Broadcom and MaxLinear. Nitza earned a BSEE and MEEE from MIT. \nMeet Our Panelists\nMichael Campbell is Senior Vice President of Engineering for Qualcomm CDMA Technologies\, responsible for product and test\, failure analysis\, test automation and yield. Mike joined Qualcomm in 1996 and has led multiple teams. In his current role\, he is working to streamline all processes impacting time-to-market\, new process node enablement\, and revolutionize product test engineering (PTE) tasks by driving machine learning as a 21st century requirement. Prior to joining Qualcomm\, Mike worked at Mostek\, INMOS and Honeywell. He holds a BSEE/CE from Clarkson University. \nPreeth Chengappa is Head of Industry for the EDA and Semiconductor segment at Azure. Since joining Microsoft in 2018\, he has worked with customers and partners across the semiconductor ecosystem to leverage cloud capabilities for all aspects of design\, manufacturing\, testing and lifecycle management. Preeth co-founded SiCAD in 2011\, a startup that pioneered the use of cloud computing for chip design. Previously\, Preeth held business development and sales management roles at Xilinx\, Altran and Falcon Computing. He holds a BS in engineering from NITK\, India. \nIra Leventhal is the Vice President of Applied Research & Technology at Advantest America\, Inc. He has over 25 years of experience in semiconductor testing\, including memory\, SoC\, wireless device\, and system-level test. Ira has led the design and development of multiple generations of ATE systems\, and holds patents in a variety of test-related technologies. In his current role\, Ira is focusing on how artificial intelligence\, cloud\, and data analytics technologies can be catalysts for major advances in semiconductor test products and methodologies. Ira is a BSEE graduate of MIT. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/the-data-revolution-of-semiconductor-production/ LOCATION:IL CATEGORIES:EDA,Semiconductor,Webinar ATTACH;FMTTYPE=image/webp:https://marketingeda.com/wp-content/uploads/proteacnTecs-March-7-2023.webp END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230219T080000 DTEND;TZID=America/Los_Angeles:20230223T170000 DTSTAMP:20260416T061936 CREATED:20221128T190714Z LAST-MODIFIED:20221128T190714Z UID:5472-1676793600-1677171600@marketingeda.com SUMMARY:ISSCC 2023 DESCRIPTION:ISSCC 2023 is planned as a fully in-person event. On-demand access to ISSCC papers and educational material will be possible for people who cannot travel to San Francisco\, but the conference will be optimized for an in-person experience. We keep monitoring the COVID-19 pandemic and we will promptly inform you should any change in our program be needed. Looking forward to seeing you again in San Francisco! \nEugenio Cantatore – Conference Chair \nPiet Wambacq – Program Committee Chair \n\n\n2023 Plenary Sessions\n\n\n\n\n\n\nInnovation for the Next Decade of High-Performance Computing \nLisa Su\, Chair and Chief Executive Officer\, AMD\, Austin\, Texas \nShape the World with Mixed-Signal Integrated Circuits – Past\, Present\, and Future \nAkira Matsuzawa\, Professor Emeritus of Tokyo Institute of Technology and CEO of Tech Idea\, Kawasaki\, Japan \nEU Chips Act drives pan-European full-stack innovation partnerships \nJo De Boeck\, Executive Vice President and Chief Strategy Officer\, imec and KU Leuven\, Leuven\, Belgium \n5G drives exponential increase in processing needs across all industries \nErik Ekudden\, Senior Vice President\, Chief Technology Officer\, Ericsson\, Kista\, Sweden \n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/isscc-2023/ LOCATION:Marriott Marquis\, 780 Mission Street\, San Francisco\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISSCC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221215T080000 DTEND;TZID=America/Los_Angeles:20221215T170000 DTSTAMP:20260416T061936 CREATED:20221130T191032Z LAST-MODIFIED:20221130T191032Z UID:5487-1671091200-1671123600@marketingeda.com SUMMARY:CHIPS Alliance\, Fall Technology Update DESCRIPTION:Join us in-person for our second biannual technology update featuring informative\, technical talks on open source hardware collaborative development\, hosted by Google and including speakers from Microsoft\, Google\, Intel\, Antmicro\, Efabless and others. \nCHIPS’ Thursday event follows the main RISC-V Summit days (Tuesday-Wednesday) to allow easy participation for open source hardware professionals traveling to the Bay Area for the Summit\, and is free to attend (registration required). \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/chips-alliance-fall-technology-update/ LOCATION:IL CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CHIPS-Alliance-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20221214T080000 DTEND;TZID=Asia/Tokyo:20221216T170000 DTSTAMP:20260416T061936 CREATED:20221122T173702Z LAST-MODIFIED:20221122T173702Z UID:5460-1671004800-1671210000@marketingeda.com SUMMARY:SEMICON Japan + Advanced Packaging and Chiplet Summit DESCRIPTION:SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights\, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently\, bringing together top players in the semiconductor packaging and PCB mounting fields \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/semicon-japan-advanced-packaging-and-chiplet-summit/ LOCATION:Tokyo Big Sight\, 3 Choe-11-1 Ariake\, Tokyo\, Japan CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMICON-Japan-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221208T160000 DTEND;TZID=America/Los_Angeles:20221208T210000 DTSTAMP:20260416T061936 CREATED:20221011T171424Z LAST-MODIFIED:20221011T171424Z UID:5288-1670515200-1670533200@marketingeda.com SUMMARY:GSA Awards Celebration DESCRIPTION:GSA recognizes semiconductor companies that have demonstrated excellence through their success\, vision\, strategy and future opportunities in the industry at its annual Awards Dinner Celebration. It is an honor to be selected as a nominee and an even more distinguished achievement to win a GSA Award. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/gsa-awards-celebration/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Award,Semiconductor ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/Screen-Shot-2022-10-11-at-10.13.07-AM.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221205T080000 DTEND;TZID=Europe/Berlin:20221205T203000 DTSTAMP:20260416T061936 CREATED:20221116T201152Z LAST-MODIFIED:20221116T201152Z UID:5407-1670227200-1670272200@marketingeda.com SUMMARY:The 26262 Club - Technical Conference DESCRIPTION:MEET US AT THE 26262 CLUB TECHNICAL CONFERENCE THIS COMING DECEMBER 5\, 2022\nIn this edition\, the 26262 club continues the discussion on the anticipated third edition and the emerging role of ISO 26262 within the evolving standards ecosystem. We bring on stage key global players from WG8 alongside authors of the most prominent upcoming standards and share must-have insights from the global standardisation community. Goal of the day is to facilitate collaboration and open discussion between different groups and practitioners and present applicable case studies and lessons learnt to take back with you. \nWHO WILL YOU MEET\nThe expert speaker line up includes 20 international experts from the ISO 26262 WGs and international members of Germany\, UK\, France\, Italy\, Austria\, USA – together we welcome experts from WGs of SOTIF\, IEEE\, Accellera\, ISO 21434 among other. Presenting companies include OEMS\, Tier 1s\, Semiconductor and notable solution providers. Meet our expert speaker panel here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/the-26262-club-technical-conference/ LOCATION:Holiday Inn Munich – City Centre\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/The-26262-Club.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221115T080000 DTEND;TZID=Europe/Berlin:20221118T170000 DTSTAMP:20260416T061936 CREATED:20221017T181636Z LAST-MODIFIED:20221017T181636Z UID:5312-1668499200-1668790800@marketingeda.com SUMMARY:Semicon Europa DESCRIPTION:SEMICON Europa 2022 is co-located with electronica in Munich\, Germany creating the strongest single event for electronics manufacturing in Europe\, and broadening the range of attendees across the electronics chain. \n– Top-notch Keynotes\n– Market Trends\n– Exhibition\n– Networking\n– Advanced Packaging Forum / Fab Management Forum\n– ITF Beyond 5G -powered by imec\n– Smart Manufacturing / Mobility / MedTech\n– Workforce Development and many more! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/semicon-europa/ LOCATION:Messe Munchen\, Messegelände\, Munich\, 81823\, Germany CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DB580CC6-16B1-4DBA-A5A3-38C39181F164-e1666030379723.jpeg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221103T080000 DTEND;TZID=America/Los_Angeles:20221103T113000 DTSTAMP:20260416T061936 CREATED:20221013T202008Z LAST-MODIFIED:20221013T202008Z UID:5306-1667462400-1667475000@marketingeda.com SUMMARY:THE FUTURE OF MORE THAN MOORE—Chiplets\, Advanced Packaging\, and More DESCRIPTION:Presented by the SEMI\nPacific Northwest and Silicon Valley Chapters \nHow can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology\, economics\, and new opportunities in the semiconductor supply chain. \nJoin us at the Forum on Thursday\, November 3\, 2022\, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person\, Virtual\, and On-Demand for your convenience. \nSpeakers\nASE\nMark Gerber\nSr. Director\, Engineering & Technical Marketing \nAdvanced Packaging: Enabling a New Generation of Silicon Systems\n\n\nFORMFACTOR\nAmy Leong\nSVP\, CMO\, GM Emerging Growth/M&A \nStrategy for Wafer Probe in a Chiplet World \nGARTNER\nBob Johnson\nVice President\,\nAnalyst \nSemiconductor Market Outlook: Change in the Midst of Uncertainty \n\nGOOGLE\nMartin Dixon\nDirector of\nEngineering \n[KEYNOTE] Open Chiplets to Enable a New Era of Silicon\n\n\nINTEL CORPORATION\nMartha Dudek\, PhD\nSr. Director\, Assembly Materials Global Supply Chain \n[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging \n\n\n\nBIAMP SYSTEMS\nJoe Andrulis\nExecutive Vice President\,\nCorporate Development \n[HOST] Welcome &\nTour of Biamp \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/the-future-of-more-than-moore-chiplets-advanced-packaging-and-more/ LOCATION:Biamp Systems\, 9300 SW Gemini Dr.\, Beaverton\, OR\, United States CATEGORIES:Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-November-3-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221026T090000 DTEND;TZID=America/Los_Angeles:20221026T183000 DTSTAMP:20260416T061936 CREATED:20221013T003013Z LAST-MODIFIED:20221013T003013Z UID:5303-1666774800-1666809000@marketingeda.com SUMMARY:TSMC 2022 OIP - California DESCRIPTION:Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges! \nRegister Now\n\n\n\n\nLearn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nYour health and safety are important to us. TSMC continues to monitor guidelines for health safety measures from the Centers for Disease Control and Prevention\, California Department of Public Health\, and the Santa Clara County Department of Public Health. TSMC will follow applicable federal\, state and local laws\, then adapt TSMC plans accordingly and share updates with you. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/tsmc-2022-oip-california/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:EDA,Forum,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-OIP-2022-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20220928T080000 DTEND;TZID=Europe/Berlin:20220929T170000 DTSTAMP:20260416T061936 CREATED:20220914T220520Z LAST-MODIFIED:20220914T220520Z UID:5202-1664352000-1664470800@marketingeda.com SUMMARY:Global Foundries Technology Summit - EMEA DESCRIPTION:DAY 1 \nWednesday\, September 28\, 2022\nDoors Open 3:00pm CET \n  \nDINNER \nRestaurant KULTURWIRTSCHAFT\, 7pm – 10pm \n  \nDAY 2 \nThursday\, September 29\, 2022\nDoors Open 8:30am CET \n  \nEVENT LOCATION\nGlobalFoundries FAB 1\nWilschdorfer Landstrasse 101\n01109 Dresden\, Germany \n  \nWe are thrilled to welcome you to GF Technology Summit 2022. \nThis exclusive\, invitation-only event is in-person again\, located in GF’s FAB 1 facility! \n\n(RE)CONNECT Join CEO Tom Caulfield\, the GF team\, partners and industry experts for lively\, interactive discussions\nLEARN See how GF’s differentiated solutions and technology roadmap is delivering a new era of more\nDELIVER Collaborate\, partner and invest with GF to drive transformation in your industry\n\nWe look forward to seeing you (in-person!) at GTS 2022 EMEA. \n  \n\nYour Host  \n\n\n\n\n\n\n\n\n\n\nRuth Hernandez\nPartnerships & Business Development\, EMEA\nGlobalFoundries \n\n\n\n\n\n\n\n\n\n\n \n\n\n\n\n“We look forward to seeing you at GF Technology Summit 2022 EMEA\, in-person in Dresden\, on September 28 and 29. Join us to connect\, build relationships and discover new ways of collaborating and innovating.” \n  \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading... URL:https://marketingeda.com/event/global-foundries-technology-summit-emea/ LOCATION:GlobalFoundries Fab 1\, Wilschdorfer Landstrasse 101\, Dresden\, 01109\, Germany CATEGORIES:EDA,Foundry,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GF-September-28-29-2022.jpg END:VEVENT END:VCALENDAR