BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.16.4.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Marketing EDA X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20200308T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20201101T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20210314T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20211107T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20220313T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20221106T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/Phoenix BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0700 TZNAME:MST DTSTART:20220101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20210101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Berlin BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Rome BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Madrid BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20210328T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20211031T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20220327T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20221030T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20200308T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20201101T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20210314T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20211107T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20220313T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20221106T060000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230503T083000 DTEND;TZID=America/Los_Angeles:20230503T164000 DTSTAMP:20230404T200249Z CREATED:20230404T200249Z LAST-MODIFIED:20230404T200249Z UID:6233-1683102600-1683132000@marketingeda.com SUMMARY:TSMC - Austin Technology Workshop DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tsmc-austin-technology-workshop/ LOCATION:Omni Barton Creek Resort & Spa\, 8312 Barton Club Drive\, Austin\, TX\, United States CATEGORIES:EDA,IP,Semiconductor,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Technology-Symposium.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230426T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20230404T195733Z CREATED:20230404T195733Z LAST-MODIFIED:20230404T195733Z UID:6230-1682496000-1682528400@marketingeda.com SUMMARY:TSMC - North America Technology Symposium DESCRIPTION:Join us and learn about:\n\nTSMC’s smartphone\, HPC\, IoT\, and automotive platform solutions\nTSMC’s advanced technology progress on 5nm\, 4nm\, 3nm\, 2nm processes and beyond\nTSMC’s specialty technology breakthroughs on ultra-low power\, RF\, embedded memory\, power management\, sensor technologies\, and more\nTSMC 3DFabric™ advanced packaging technology advancement on InFO\, CoWoS®\, and SoIC\nTSMC’s manufacturing excellence\, capacity expansion plan\, and green manufacturing achievement\nTSMC’s Open Innovation Platform® Ecosystem to speed up time-to-design\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tsmc-north-america-technology-symposium/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Semiconductor,Symposium ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2023-Technology-Symposium.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230423T080000 DTEND;TZID=America/Los_Angeles:20230426T170000 DTSTAMP:20221121T190016Z CREATED:20221121T190016Z LAST-MODIFIED:20221121T190016Z UID:5423-1682236800-1682528400@marketingeda.com SUMMARY:CICC 2023 DESCRIPTION:Sponsored by IEEE and SSCS\, the IEEE Custom Integrated Circuits Conference – CICC –  is a premier conference devoted to IC development. The conference program is a blend of oral presentations\, exhibits\, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design problems\, improve circuit design techniques\, get exposure to new technology areas\, and network with peers\, authors and industry experts. \nThere are 3 days of Technical Sessions that include lecture presentations addressing state of the art developments in integrated circuit design. The Educational Sessions are a full day of tutorials instructed by recognized invited speakers. The Panels\, and Forums are presented throughout the conference to enrich the learning experience of the attendees. The Panel Discussions and Forums are presented by leaders from the IC industry. CICC includes an Exhibits Hall that is open in the evenings where Semiconductor manufacturers\, software tool suppliers\, silicon IP providers\, design-service houses\, and technical book publishers offer displays and demonstrations of their products. CICC is sponsored by the IEEE Solid-State Circuits Society and technically co-sponsored by the IEEE Electron Devices Society. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cicc-2023/ CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CICC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230331T080000 DTEND;TZID=America/Los_Angeles:20230402T170000 DTSTAMP:20230222T174957Z CREATED:20230122T015307Z LAST-MODIFIED:20230222T174957Z UID:5871-1680249600-1680454800@marketingeda.com SUMMARY:Latch-Up 2023 DESCRIPTION:The FOSSi Foundation is proud to announce Latch-Up\, a conference dedicated to free and open source silicon to be held over the weekend of Friday\, March 31 to Sunday\, April 2\, 2023 in Santa Barbara\, California\, USA. \nLatch-Up is a weekend of presentations and networking for the open source digital design community\, much like its European sister conference ORConf. \nSo save the date\, register to attend\, and we encourage you to submit a presentation or proposal if you have a project or idea on the topic to share! \n  \nQuestions? Ping the organizers via @LatchUpConf or email. \nPrevious Latch-Ups: 2019 Portland \nSubmit a talk\n\nWe encourage anybody involved in the open source semiconductor engineering space to come along and share your work or experience. Presentations slots as short as 3 minute lightning-talks and up to 30 minute talks including Q and A are available. \nSo if you’ve designed\, worked on or even just used open source IP cores and/or management systems\, verification IP\, build flows\, SoCs\, simulators\, synthesis tools\, FPGA and ASIC implementation tools\, languages and DSLs\, compilers\, or anything related we’d love to have you join us to share your experience. \nPresentations are submitted through the registration process and we will let you know if your presentation was accepted. \nRegistration\n\nAttendance of Latch-Up is free. To help us organizing the event\, you are required to register using the button below or via the EventBrite link. \nProfessional Tickets\nAttendees who are joining us at Latch-Up on behalf of their company and/or can claim the conference as professional training expense are encouraged to purchase a professional ticket. These ticket sales help us provide all that we do at Latch-Up and keep the event accessible to all members of the community. Professional ticket holders are able to get their company name printed on their name badge and receive a special treat. You can buy professional tickets using the button below or via the EventBrite link. \nWe ask all Latch-Up participants to adhere to the the FOSSi Foundation code of conduct throughout the event. \nSponsorship and Volunteering at Latch-Up\n\nLatch-Up is free to attend\, but we aim to provide catering and the like during the event. Latch-Up is also a great way to get your company or brand in front of lots of engineers and hackers on the day\, and thousands more through recordings of the event. So please get in touch if you’d like to explore sponsorship opportunities. \nLatch-Up is organized by volunteers on behalf of the FOSSi Foundation. We are currently looking for more people to help out with arrangements and putting on the event\, so please do email us if you would like to volunteer for during the event with setup\, AV\, or even just local knowledge so we can plan the weekend better. \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/latch-up-2023/ LOCATION:University of California\, Santa Barbara\, Santa Barbara\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Latch-Up-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230328T070000 DTEND;TZID=America/Los_Angeles:20230328T080000 DTSTAMP:20230316T184842Z CREATED:20230316T184842Z LAST-MODIFIED:20230316T184842Z UID:6176-1679986800-1679990400@marketingeda.com SUMMARY:Maximizing yields through collaboration DESCRIPTION:Semiconductor companies have long recognized the importance of yield management and having the right support in place to maximize results. In this 30-minute webinar brought to you by yieldHUB and SemiWiki\, attendees will learn about a key to success in the world of yield management (and something that can be underestimated) – collaboration. This is crucial today when different teams and departments work together from around the world. \nDuring this online event\, yieldHUB’s experts will explore why and how collaboration can make a difference\, and speak about some real examples. The webinar will end with a 15-minute Q&A session\, where attendees’ questions will be answered and more. Whether you work for a startup or a large-scale semiconductor company\, this webinar is a must-attend event! Register now to secure your spot before it’s too late. \nSpeaker Bios: \nJohn O’Donnell is an Irish entrepreneur\, having founded yieldHUB back in 2005 when he saw a gap in the market for a reliable and modern hosted yield management solution. yieldHUB is based in Ireland and has grown to become a global leader in the market. The company has a reputation for innovation in the industry with new developments in the field\, including its unique collaboration capabilities. \nAlso joining this webinar is Kevin Robinson\, VP of Operations at yieldHUB. John and Kevin have a combined 60 years of experience working in the semiconductor industry. \nThis webinar is in partnership with SemiWiki and yieldHUB \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/maximizing-yields-through-collaboration/ CATEGORIES:EDA,Semiconductor,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/yieldHUB-March-28-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230320T080000 DTEND;TZID=America/Los_Angeles:20230323T170000 DTSTAMP:20230307T044258Z CREATED:20230307T044258Z LAST-MODIFIED:20230307T044258Z UID:6073-1679299200-1679590800@marketingeda.com SUMMARY:GOMACTech 2023 DESCRIPTION:GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \n\nDear 2023 Attendees: \nThis year’s conference is titled “Microelectronics – the Engine to Keep the US Moving Forward\,” and our robust technical program supports this theme with topics including Advanced Silicon-Based RF\, Alternative Computing Paradigms\, Counterfeit Detection and Avoidance\, GaN Power Electronics\, and much\, much more. \nThe conference kicks off on Monday\, 20 March\, with our annual Trusted Suppliers Industry Day\, created with the objective of promoting discussion among members of industry and government agencies that represent the interests of integrated-circuit and electronics producers who serve defense and aerospace applications. We have seen tremendous change since last year’s Industry Day\, not only with the enactment and funding of the CHIPS and Science Act but also with the increasing uncertainty regarding China’s intentions with Taiwan. To provide insight into these issues\, Dr. Tai Ming Cheung\, recipient of multiple DoD Minerva Research Initiative awards and director of the University of California Institute on Global Conflict and Cooperation (IGCC)\, is scheduled to deliver the keynote address on the emergence of the Chinese techno-security state. Monday also features four workshops/tutorials: Advanced GaN Modeling\, JFAC Hardware Assurance\, GEEGAH Fab Capabilities & PDK for Acoustoelectric Devices\, and AKOUSTIS Fab Capabilities & PDK for AIN/ScAIN. \nOur Monday programming will conclude with a reception on the resort’s Flamingo Lawn\, which is open to all registered attendees. Please join us! \nGOMACTech-23 formally opens on Tuesday\, 21 March\, with an outstanding morning Plenary Session that includes the keynote address “3DHI and the Coming Inflection Point in Microelectronics Manufacture” by Dr. Mark Rosker\, director of DARPA’s Microsystems Technology Office. Rosker will be followed by Ezra Hall\, senior director of Global Aerospace and Defense Business at GlobalFoundries\, whose talk is titled “Aligning Defense Microelectronics Technologies with Industry Needs: Fueling U.S. Success.” \nThe keynotes will be followed by the Jack S. Kilby Lecture Series\, with presentations from Dr. Waleed Khalil\, professor of electrical and computer engineering at Ohio State University and the ElectroScience Lab\, who will speak on “Analog Hardware Security: What We Don’t Know Will Hurt Us\,” and Krystal Puga\, Lunar Mission Architect for the Space Systems Sector at Northrop Grumman Corp.\, with the presentation\, “James Webb Space Telescope Development and Latest Discoveries.” \nThis year\, we are also hosting three panel discussions: “Chips and Science Act Impact to DoD\,” on Monday\, 20 March; “Perspectives on Computational Methods for Radiation Hardness Qualification;” on Wednesday\, 22 March; and “Sifting Through the Chaos: Are Best Practices Achievable?” on Thursday\, 23 March. \nThe plenary\, technical\, and topical sessions are the major venues for information exchange at the conference. Other opportunities for technical interaction are provided by the exhibits program\, which includes major IC manufacturers and commercial vendors of devices\, equipment\, systems\, and services for nearly every facet of the electronics business. The exhibition opens on Tuesday\, 21 March\, at noon\, and runs through Wednesday\, 22 March\, at 4:00 pm. On Tuesday evening\, all attendees can network in a relaxing atmosphere during the Exhibitors’ Reception. \nWednesday evening features the Evening Social\, held this year at the San Diego Zoo\, one of the country’s premier zoos. A buffet-style dinner will be included\, and we will have the opportunity to meet some of the animals “up close and personal.” This is a ticketed event with an attendance cap\, so if you’re planning on attending\, buy your ticket before Wednesday. \nOn Thursday morning\, 23 March\, a poster session that includes our annual student poster competition will take place. \nGOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and to provide a forum for government reviews. \nThe GOMACTech Conference is an Unclassified\, Export-Controlled event that requires participants to be U.S. Citizens or legal U.S. Permanent Residents. All registrants must provide proof of U.S. Citizenship or Permanent Resident status prior to being permitted entry into the conference. Additionally\, a signed Non-Disclosure Statement will be required. \nGOMACTech-23 provides a forum for discussing and demonstrating advanced microelectronics and microsystems that can provide the means to develop confidence in transformational\, leap-ahead technologies\, and capabilities. GOMACTech is the premier forum for reporting on government-funded microcircuit research and other research efforts that focus on the technology needs of government systems. \nThis year’s technical program is a result of the hard work and enthusiasm of the GOMACTech-23 Technical Program Committee. The committee members discussed and collaborated on the topics and presentations. The quality of the conference reflects this comprehensive team effort. We hope that you find GOMACTech-23 an enlightening\, rewarding\, and enjoyable experience. Thank you for your active participation. \n  \n\n\n\nDr. Morgan Thoma\nU.S. Army Research Laboratory\nDefense Microelectronics CFT\nGeneral Chair\nLuciano Boglione\nNaval Research Laboratory\nTechnical Program Chair\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gomactech-2023/ LOCATION:Town and Country San Diego Hotel\, 500 Hotel Circle North\, San Diego\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GOMACTech-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230316T083000 DTEND;TZID=America/Los_Angeles:20230316T113000 DTSTAMP:20230217T231519Z CREATED:20230217T231519Z LAST-MODIFIED:20230217T231519Z UID:6002-1678955400-1678966200@marketingeda.com SUMMARY:Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession DESCRIPTION:Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes\, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers. \nJoin us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term\, including regional and global economies\, and the Chips Act. \nSpeakers will discuss strategies for mitigating the impact and how to capture value. \nTopics include: \n\nMarket Trends & Forecast & Outlook\nAccessing Chips Act Funding and Roll out of Incentives\nGeopolitical Impact\nAdvanced Packaging & Chiplets\nEmerging and Expanding Markets\n\n  \nThis Virtual Forum is 8:30–11:00am Pacific Time\, 11:30am–2:00pm Eastern Time \nAGENDA\n\nVirtual Forum | Thursday\, March 16\, 2023 | Pacific Time\n\n\n8:30 am – 8:35 am\n\n\n\nEd Sperling\nEditor-in-Chief\nSemiconductor Engineering\n\n\n\nWelcome Remarks\n\nBiography \n\n\n\n\n\n8:35 am – 8:55 am\n\n\n\nJohn Cooney\nVice President\, Global Public Policy & Advocacy\nSEMI\n\n\n\nAn Update on the CHIPS Act and How to Apply for Funding\n\nBiography \n\n\n\n\n\n8:55 am – 9:20 am\n\n\n\nJay Vleeschhouwer\nSoftware Research\nGriffin Securities\n\n\n\nThe State of EDA: A View from Wall Street\n\nBiography \n\n\n\n\n\n9:20 am – 9:45 am\n\n\n\nDan Hutcheson\nVice Chair\nTechInsights\n\n\n\nNew Perspectives in Semiconductors: Cycles & Outlooks\n\nBiography \n\n\n\n\n\n9:45 am – 10:10 am\n\n\n\nJean-Christophe Eloy\nPresident and CEO\nYole Développement\n\n\n\nStatus of the Advanced Packaging Industry: How the Chiplet Revolution is Impacting the Industry?\n\nBiography \n\n\n\n\n\n10:10 am – 10:35 am\n\n\n\nPaul McLellan\nEditor of Breakfast Bytes\nCadence\n\n\n\nThree Things to Watch: 3DIC\, Supply Chain Disaggregation\, and Intel\n\nBiography \n\n\n\n\n\n10:35 am – 10:55 am\n\n\n\nLita Shon-Roy\nPresident/CEO\nTECHCET\n\n\n\nThe Impact on Supply-Chains – Materials & Equipment Consumables\n\nBiography \n\n\n\n\n\n10:55 am – 11:00 am\n\n\n\nEd Sperling\nEditor-in-Chief\nSemiconductor Engineering\n\n\n\nClosing Remarks\n\nBiography \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semiconductor-outlook-navigating-through-turbulent-times-and-the-impact-of-the-recession/ CATEGORIES:EDA,Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-March-16-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Phoenix:20230313T080000 DTEND;TZID=America/Phoenix:20230316T170000 DTSTAMP:20230307T194359Z CREATED:20230307T194359Z LAST-MODIFIED:20230307T194359Z UID:6087-1678694400-1678986000@marketingeda.com SUMMARY:19th International Conference & Exhibition on Device Packaging DESCRIPTION:The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills\, Arizona.  The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16\, 2023\, at the WeKoPa Conference Center. This esteemed event brings together industry engineers\, researchers and top experts participating in a multi-faceted technical program and unique networking events. \nFull Conference registrations include:  (excludes exhibit only\, pdc only\, or visitor pass registration types) \n\n3-track program with 80+ speakers\nPoster presentations\n4 keynote speakers from Qualcomm\, Samsung\, General Motors\, and Lightmatter\nPanels covering both business and social value topics\nGBC Business plenary session: Building the Ecosystem: Transitioning from Research to Manufacturing\nSold-out exhibit hall with 66 booths\nNetworking opportunities: welcome reception\, exhibit hall reception\, poster session happy hour\, and group lunches\nPost-conference golf scramble and guided hike fund raisers\n\nFirst day add-ons: 12 Professional Development Courses\, a great learning opportunity for those new to the industry or looking to enhance their skills and knowledge. \nIn 2022\, DPC was held in person with more than 500 participants\, despite continued pandemic restrictions at that time. Given the strength of the technical program and exhibition this year\, it is anticipated that the 2023 DPC will welcome a record number of participants! \n  \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/19th-international-conference-exhibition-on-device-packaging/ LOCATION:We-Ko-Pa Resort & Conference Center\, 10438 Wekopa Way\, Fort McDowell\, AZ\, 85264\, United States CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Device-Packaging-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230307T090000 DTEND;TZID=America/Los_Angeles:20230307T100000 DTSTAMP:20230306T180513Z CREATED:20230306T180513Z LAST-MODIFIED:20230306T180513Z UID:6066-1678179600-1678183200@marketingeda.com SUMMARY:THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION DESCRIPTION:The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production.\nJoin us on Tuesday\, March 7\, 2023\, for this 1-hour panel discussion with industry experts from Qualcomm\, Microsoft Azure and Advantest as we discuss how data analytics and product insights can accelerate time to market and improve performance\, yield and quality. \nTopics covered:  \n\nOvercoming data silos\nProcessing massive amounts of data\nUsing machine learning and advanced data analytics\nUncovering data insights and actionable intelligence\n\nPanel will be moderated by Nitza Basoco\, VP of Business Development at proteanTecs. Nitza has a broad background in management\, test development\, product engineering\, supply chain and operations. In her current role\, she focuses on partnership strategies and ecosystem growth\, positioning proteanTecs as the common data language to the full value chain. Before joining proteanTecs\, she was VP of Operations at Synaptics and held engineering and leadership positions at Teradyne\, Broadcom and MaxLinear. Nitza earned a BSEE and MEEE from MIT. \nMeet Our Panelists\nMichael Campbell is Senior Vice President of Engineering for Qualcomm CDMA Technologies\, responsible for product and test\, failure analysis\, test automation and yield. Mike joined Qualcomm in 1996 and has led multiple teams. In his current role\, he is working to streamline all processes impacting time-to-market\, new process node enablement\, and revolutionize product test engineering (PTE) tasks by driving machine learning as a 21st century requirement. Prior to joining Qualcomm\, Mike worked at Mostek\, INMOS and Honeywell. He holds a BSEE/CE from Clarkson University. \nPreeth Chengappa is Head of Industry for the EDA and Semiconductor segment at Azure. Since joining Microsoft in 2018\, he has worked with customers and partners across the semiconductor ecosystem to leverage cloud capabilities for all aspects of design\, manufacturing\, testing and lifecycle management. Preeth co-founded SiCAD in 2011\, a startup that pioneered the use of cloud computing for chip design. Previously\, Preeth held business development and sales management roles at Xilinx\, Altran and Falcon Computing. He holds a BS in engineering from NITK\, India. \nIra Leventhal is the Vice President of Applied Research & Technology at Advantest America\, Inc. He has over 25 years of experience in semiconductor testing\, including memory\, SoC\, wireless device\, and system-level test. Ira has led the design and development of multiple generations of ATE systems\, and holds patents in a variety of test-related technologies. In his current role\, Ira is focusing on how artificial intelligence\, cloud\, and data analytics technologies can be catalysts for major advances in semiconductor test products and methodologies. Ira is a BSEE graduate of MIT. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/the-data-revolution-of-semiconductor-production/ CATEGORIES:EDA,Semiconductor,Webinar ATTACH;FMTTYPE=image/webp:https://marketingeda.com/wp-content/uploads/proteacnTecs-March-7-2023.webp END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20230219T080000 DTEND;TZID=America/Los_Angeles:20230223T170000 DTSTAMP:20221128T190714Z CREATED:20221128T190714Z LAST-MODIFIED:20221128T190714Z UID:5472-1676793600-1677171600@marketingeda.com SUMMARY:ISSCC 2023 DESCRIPTION:ISSCC 2023 is planned as a fully in-person event. On-demand access to ISSCC papers and educational material will be possible for people who cannot travel to San Francisco\, but the conference will be optimized for an in-person experience. We keep monitoring the COVID-19 pandemic and we will promptly inform you should any change in our program be needed. Looking forward to seeing you again in San Francisco! \nEugenio Cantatore – Conference Chair \nPiet Wambacq – Program Committee Chair \n\n\n2023 Plenary Sessions\n\n\n\n\n\n\nInnovation for the Next Decade of High-Performance Computing \nLisa Su\, Chair and Chief Executive Officer\, AMD\, Austin\, Texas \nShape the World with Mixed-Signal Integrated Circuits – Past\, Present\, and Future \nAkira Matsuzawa\, Professor Emeritus of Tokyo Institute of Technology and CEO of Tech Idea\, Kawasaki\, Japan \nEU Chips Act drives pan-European full-stack innovation partnerships \nJo De Boeck\, Executive Vice President and Chief Strategy Officer\, imec and KU Leuven\, Leuven\, Belgium \n5G drives exponential increase in processing needs across all industries \nErik Ekudden\, Senior Vice President\, Chief Technology Officer\, Ericsson\, Kista\, Sweden \n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/isscc-2023/ LOCATION:Marriott Marquis\, 780 Mission Street\, San Francisco\, CA\, United States CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ISSCC-2023.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221215T080000 DTEND;TZID=America/Los_Angeles:20221215T170000 DTSTAMP:20221130T191032Z CREATED:20221130T191032Z LAST-MODIFIED:20221130T191032Z UID:5487-1671091200-1671123600@marketingeda.com SUMMARY:CHIPS Alliance\, Fall Technology Update DESCRIPTION:Join us in-person for our second biannual technology update featuring informative\, technical talks on open source hardware collaborative development\, hosted by Google and including speakers from Microsoft\, Google\, Intel\, Antmicro\, Efabless and others. \nCHIPS’ Thursday event follows the main RISC-V Summit days (Tuesday-Wednesday) to allow easy participation for open source hardware professionals traveling to the Bay Area for the Summit\, and is free to attend (registration required). \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/chips-alliance-fall-technology-update/ CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/CHIPS-Alliance-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20221214T080000 DTEND;TZID=Asia/Tokyo:20221216T170000 DTSTAMP:20221122T173702Z CREATED:20221122T173702Z LAST-MODIFIED:20221122T173702Z UID:5460-1671004800-1671210000@marketingeda.com SUMMARY:SEMICON Japan + Advanced Packaging and Chiplet Summit DESCRIPTION:SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights\, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently\, bringing together top players in the semiconductor packaging and PCB mounting fields \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semicon-japan-advanced-packaging-and-chiplet-summit/ LOCATION:Tokyo Big Sight\, 3 Choe-11-1 Ariake\, Tokyo\, Japan CATEGORIES:Conference,EDA,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMICON-Japan-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221208T160000 DTEND;TZID=America/Los_Angeles:20221208T210000 DTSTAMP:20221011T171424Z CREATED:20221011T171424Z LAST-MODIFIED:20221011T171424Z UID:5288-1670515200-1670533200@marketingeda.com SUMMARY:GSA Awards Celebration DESCRIPTION:GSA recognizes semiconductor companies that have demonstrated excellence through their success\, vision\, strategy and future opportunities in the industry at its annual Awards Dinner Celebration. It is an honor to be selected as a nominee and an even more distinguished achievement to win a GSA Award. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gsa-awards-celebration/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Award,Semiconductor ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/Screen-Shot-2022-10-11-at-10.13.07-AM.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221205T080000 DTEND;TZID=Europe/Berlin:20221205T203000 DTSTAMP:20221116T201152Z CREATED:20221116T201152Z LAST-MODIFIED:20221116T201152Z UID:5407-1670227200-1670272200@marketingeda.com SUMMARY:The 26262 Club - Technical Conference DESCRIPTION:MEET US AT THE 26262 CLUB TECHNICAL CONFERENCE THIS COMING DECEMBER 5\, 2022\nIn this edition\, the 26262 club continues the discussion on the anticipated third edition and the emerging role of ISO 26262 within the evolving standards ecosystem. We bring on stage key global players from WG8 alongside authors of the most prominent upcoming standards and share must-have insights from the global standardisation community. Goal of the day is to facilitate collaboration and open discussion between different groups and practitioners and present applicable case studies and lessons learnt to take back with you. \nWHO WILL YOU MEET\nThe expert speaker line up includes 20 international experts from the ISO 26262 WGs and international members of Germany\, UK\, France\, Italy\, Austria\, USA – together we welcome experts from WGs of SOTIF\, IEEE\, Accellera\, ISO 21434 among other. Presenting companies include OEMS\, Tier 1s\, Semiconductor and notable solution providers. Meet our expert speaker panel here. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/the-26262-club-technical-conference/ LOCATION:Holiday Inn Munich – City Centre\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/The-26262-Club.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20221115T080000 DTEND;TZID=Europe/Berlin:20221118T170000 DTSTAMP:20221017T181636Z CREATED:20221017T181636Z LAST-MODIFIED:20221017T181636Z UID:5312-1668499200-1668790800@marketingeda.com SUMMARY:Semicon Europa DESCRIPTION:SEMICON Europa 2022 is co-located with electronica in Munich\, Germany creating the strongest single event for electronics manufacturing in Europe\, and broadening the range of attendees across the electronics chain. \n– Top-notch Keynotes\n– Market Trends\n– Exhibition\n– Networking\n– Advanced Packaging Forum / Fab Management Forum\n– ITF Beyond 5G -powered by imec\n– Smart Manufacturing / Mobility / MedTech\n– Workforce Development and many more! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/semicon-europa/ LOCATION:Messe Munchen\, Messegelände\, Munich\, 81823\, Germany CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DB580CC6-16B1-4DBA-A5A3-38C39181F164-e1666030379723.jpeg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221103T080000 DTEND;TZID=America/Los_Angeles:20221103T113000 DTSTAMP:20221013T202008Z CREATED:20221013T202008Z LAST-MODIFIED:20221013T202008Z UID:5306-1667462400-1667475000@marketingeda.com SUMMARY:THE FUTURE OF MORE THAN MOORE—Chiplets\, Advanced Packaging\, and More DESCRIPTION:Presented by the SEMI\nPacific Northwest and Silicon Valley Chapters \nHow can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology\, economics\, and new opportunities in the semiconductor supply chain. \nJoin us at the Forum on Thursday\, November 3\, 2022\, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person\, Virtual\, and On-Demand for your convenience. \nSpeakers\nASE\nMark Gerber\nSr. Director\, Engineering & Technical Marketing \nAdvanced Packaging: Enabling a New Generation of Silicon Systems\n\n\nFORMFACTOR\nAmy Leong\nSVP\, CMO\, GM Emerging Growth/M&A \nStrategy for Wafer Probe in a Chiplet World \nGARTNER\nBob Johnson\nVice President\,\nAnalyst \nSemiconductor Market Outlook: Change in the Midst of Uncertainty \n\nGOOGLE\nMartin Dixon\nDirector of\nEngineering \n[KEYNOTE] Open Chiplets to Enable a New Era of Silicon\n\n\nINTEL CORPORATION\nMartha Dudek\, PhD\nSr. Director\, Assembly Materials Global Supply Chain \n[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging \n\n\n\nBIAMP SYSTEMS\nJoe Andrulis\nExecutive Vice President\,\nCorporate Development \n[HOST] Welcome &\nTour of Biamp \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/the-future-of-more-than-moore-chiplets-advanced-packaging-and-more/ LOCATION:Biamp Systems\, 9300 SW Gemini Dr.\, Beaverton\, OR\, United States CATEGORIES:Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-November-3-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20221026T090000 DTEND;TZID=America/Los_Angeles:20221026T183000 DTSTAMP:20221013T003013Z CREATED:20221013T003013Z LAST-MODIFIED:20221013T003013Z UID:5303-1666774800-1666809000@marketingeda.com SUMMARY:TSMC 2022 OIP - California DESCRIPTION:Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges! \nRegister Now\n\n\n\n\nLearn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nYour health and safety are important to us. TSMC continues to monitor guidelines for health safety measures from the Centers for Disease Control and Prevention\, California Department of Public Health\, and the Santa Clara County Department of Public Health. TSMC will follow applicable federal\, state and local laws\, then adapt TSMC plans accordingly and share updates with you. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tsmc-2022-oip-california/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:EDA,Forum,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-OIP-2022-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20220928T080000 DTEND;TZID=Europe/Berlin:20220929T170000 DTSTAMP:20220914T220520Z CREATED:20220914T220520Z LAST-MODIFIED:20220914T220520Z UID:5202-1664352000-1664470800@marketingeda.com SUMMARY:Global Foundries Technology Summit - EMEA DESCRIPTION:DAY 1 \nWednesday\, September 28\, 2022\nDoors Open 3:00pm CET \n  \nDINNER \nRestaurant KULTURWIRTSCHAFT\, 7pm – 10pm \n  \nDAY 2 \nThursday\, September 29\, 2022\nDoors Open 8:30am CET \n  \nEVENT LOCATION\nGlobalFoundries FAB 1\nWilschdorfer Landstrasse 101\n01109 Dresden\, Germany \n  \nWe are thrilled to welcome you to GF Technology Summit 2022. \nThis exclusive\, invitation-only event is in-person again\, located in GF’s FAB 1 facility! \n\n(RE)CONNECT Join CEO Tom Caulfield\, the GF team\, partners and industry experts for lively\, interactive discussions\nLEARN See how GF’s differentiated solutions and technology roadmap is delivering a new era of more\nDELIVER Collaborate\, partner and invest with GF to drive transformation in your industry\n\nWe look forward to seeing you (in-person!) at GTS 2022 EMEA. \n  \n\nYour Host  \n\n\n\n\n\n\n\n\n\n\nRuth Hernandez\nPartnerships & Business Development\, EMEA\nGlobalFoundries \n\n\n\n\n\n\n\n\n\n\n \n\n\n\n\n“We look forward to seeing you at GF Technology Summit 2022 EMEA\, in-person in Dresden\, on September 28 and 29. Join us to connect\, build relationships and discover new ways of collaborating and innovating.” \n  \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/global-foundries-technology-summit-emea/ LOCATION:GlobalFoundries Fab 1\, Wilschdorfer Landstrasse 101\, Dresden\, 01109\, Germany CATEGORIES:EDA,Foundry,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GF-September-28-29-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Rome:20220919T080000 DTEND;TZID=Europe/Rome:20220922T170000 DTSTAMP:20220919T015335Z CREATED:20220919T015335Z LAST-MODIFIED:20220919T015335Z UID:5213-1663574400-1663866000@marketingeda.com SUMMARY:ESSCIRC 2022 DESCRIPTION:The aim of ESSDERC and ESSCIRC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on- chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore\, more than ever before\, a deeper interaction among technologists\, device experts\, IC designers and system designers is necessary. \nWhile keeping separate Technical Program Committees\, ESSDERC and ESSCIRC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both communities. Attendees registered for either conference are encouraged to attend any of the scheduled parallel sessions\, regardless to which conference they belong. \n\n​ \nCONFERENCE HIGHLIGHTS \n\n\n4 joint keynote presentations \n\n\n3 ESSDERC keynote presentations \n\n\n3 ESSCIRC keynote presentations \n\n\nInvited papers with overall coverage of all aspects of advanced devices and circuits \n\n\nPresentation of IEEE and ESSDERC/ESSCIRC Awards \n\n\nESSDERC/ESSCIRC Welcome Reception on Tuesday\, September 20\, 2022 \n\n\nESSDERC/ESSCIRC Gala Dinner on Wednesday\, September 21\, 2022 \n\n\nTutorials and workshops \n\n\n\nThe venue of the conference events\, including workshops and tutorials\, will be at the University of Milan-Bicocca (Milan\, IT)\, that is well connected (metro\, bus\, train with Milan downtown). \nThe working language of the conference is English. \n​ \n​ \nBEST PAPER AWARDS \nPapers presented at the conference will be considered for the ”Best Paper Award” and ”Best Young Scientist Paper Award”. \nThe selection will be based on the results of the paper selection process and the judgment of the conference participants. \nThe 2022 Award Ceremony will take place during ESSDERC/ESSCIRC 2023. \n\n​ \nCONFERENCE TARGET AND EVOLUTION \nESSDERC and ESSCIRC have evolved over the last years to follow recent R&D device\, circuit and system fast-growing topics. Besides the traditional ESSDERC and ESSCIRC tracks\, a number of JOINT tracks have been introduced\, to encourage and facilitate interactions between circuit\, system and device researchers. \n\nESSDERC/ESSCIRC encourages submissions in all areas of solid-state devices\, circuits and systems\, with special emphasis on: \n\n\nAnalog\, Power and RF Devices \n\n\nElectron Device Simulation and Modeling \n\n\nAdvanced Technology\, Processes and Materials \n\n\nNeuromorphic Computing\, Advanced Memories\, Al Accelerators\, in-Memory-Computing\, Security \n\n\nAdvanced Computing Devices and Circuits: Advanced CMOS\, Post-CMOS\, Quantum Computing \n\n\nSensors\, MEMS\, Bioelectronics\, Biomedical Electronics\, Optoelectronics\, Display and Imaging \n\n\nAnalog Circuits \n\n\nData Converters \n\n\nRF and mm-Wave Circuits \n\n\nFrequency Generation \n\n\nWireless and Wireline Interfaces \n\n\nIntegrated Power Electronics and Power Management \n\n\nDigital Circuits & Systems \n\n\n\nStudent papers are welcome and encouraged. \n\n​ \nPAPERS SUBMISSION \nPapers submitted for review must clearly state: \n\n\nThe purpose of the work \n\n\nHow and to what extent it advances the state-of-the art \n\n\nSpecific results and their impact \n\n\nOnly material that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference. \nManuscript guidelines\, as well as instructions on how to electronically submit papers will be available in the 1st Call for Papers and on this website. \nPapers must not exceed four A4 pages with all illustrations and references included. \n\nPapers submission deadline: April\, 12\, 2022 \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/esscirc-2022/ LOCATION:Università degli Studi di MILANO – BICOCCA\, Viale Piero e Alberto Pirelli\, 22\, Milano\, 20126\, Italy CATEGORIES:Conference,EDA,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ESSCIRC-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220913T080000 DTEND;TZID=America/Los_Angeles:20220913T170000 DTSTAMP:20220617T174824Z CREATED:20220617T174824Z LAST-MODIFIED:20220617T174824Z UID:4860-1663056000-1663088400@marketingeda.com SUMMARY:2022 WLI Women In Semiconductor Hardware (WISH) Conference DESCRIPTION:The annual Women in Semiconductor Hardware (WISH) Conference is GSA WLI’s flagship event bringing together industry luminaries\, entrepreneurs\, and university women in STEM. WISH showcases the changing face of technology and offers awards celebrating the women who have helped to break the glass ceiling and those who are following in their footsteps. \nIn support of WISH\, we are accepting abstracts from female engineers in the following categories: \n\nProcess Technology\nSystem Technology\nDesign Technology\nValidation/Test\nPackaging/Assembly\n\nA total of three papers per session track will be chosen. Each speaker will have 20 minutes to present her paper. If you would like to be considered for a paper session\, please see our WISH Call for Papers. Presenters will be determined by our Technical Steering Committee. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/2022-wli-women-in-semiconductor-hardware-wish-conference/ CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-Sep-13-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220816T090000 DTEND;TZID=America/Los_Angeles:20220816T100000 DTSTAMP:20220802T163344Z CREATED:20220802T163344Z LAST-MODIFIED:20220802T163344Z UID:4998-1660640400-1660644000@marketingeda.com SUMMARY:Sustainability for Semiconductors DESCRIPTION:Don’t miss your chance to join this important conversation with industry leaders that are making an impact on the reduction of the semiconductor carbon footprint. \nDonna Yasay Senior Leader\, Solutions Architecture at Amazon Web Services (AWS) \nDonna Yasay leads a solution architecture team for the Bay Area semiconductor segment at Amazon Web Services (AWS). Her team is responsible for building solutions in the semiconductor ecosystem that span Fabless/System IC suppliers\, FAB/IC Foundries\, IDM’s (Integrated Device Manufacturers) and IP Designers\, to help AWS semiconductor customers achieve their cloud adoption journey such as Cloud EDA.  Previous to AWS\, she spent over two decades in the Semiconductor industry leading product\, sales and engineering teams at major semiconductor companies such as Marvell\, Xilinx\, and Qualcomm. \nKT Moore\, VP Corporate Marketing & Business Development\, Cadence \nKT Moore joined Cadence in August 2012 and is currently responsible for Corporate Marketing.  He previously held other management positions leading product marketing and business development for Cadence’s Custom IC\, PCB\, Systems Design and Analysis\, and full flow Digital IC design solutions.​ Prior to joining Cadence\, KT spent 12 years with Magma Design Automation.  During that time he served 6 years as a Global Account Director\, and 6 years as a Vice President of Product Marketing\, where he was responsible for business development and marketing for all Magma products.  Before joining Magma KT also held various sales positions with EPIC Design Technology and Valid Logic Systems.  Prior to his career in EDA\, KT spent several years as a logic designer for Texas Instruments. KT received a Bachelor of Science degree in Electrical Engineering and Applied Physics from Case Western Reserve University in Cleveland\, OH in 1985. \nNebabie Kebebew\, Senior Product Manager for Analog and Mixed-Signal Verification Products\, Siemens EDA \nNebabie Kebebew is a Senior Product Manager for Analog and Mixed-Signal verification products at Siemens EDA. She has extensive experience in the semiconductor and the EDA industry. Prior to Siemens she spent over a decade managing and developing EDA products for the design and verification of ICs at Cadence and Synopsys. Before her journey in EDA\, Nebabie was the lead design architect at Raytheon\, for radar data processor ICs in avionics applications. Kebebew has served as a co-chair for the Women’s Impact Network group at Siemens. She is a passionate advocate for girls in STEM. Nebabie holds an MSEE from the University of Southern California and a BSEE from California Polytechnic University. \nErika Varga McEnroe\, Senior Vice President and Deputy General Counsel\, Synopsys \nErika Varga McEnroe is senior vice president and deputy general counsel at Synopsys. Ms. McEnroe and her team are responsible for corporate legal matters\, including corporate governance\, ethics and compliance\, securities\, and mergers & acquisitions. She and her team also lead the company’s Corporate Social Responsibility program\, which drives how Synopsys manages its operational impact and how Synopsys influences others to create a better world. She recently served on the executive committee and board of directors of Watermark\, an organization focused on empowering women to make their mark in their companies\, careers\, and communities. Ms. McEnroe holds a JD degree from the University of California\, Hastings College of the Law. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/sustainability-for-semiconductors/ CATEGORIES:EDA,Semiconductor,Webinar ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/GSA-August-16-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Madrid:20220704T080000 DTEND;TZID=Europe/Madrid:20220708T170000 DTSTAMP:20220616T163128Z CREATED:20220616T163128Z LAST-MODIFIED:20220616T163128Z UID:4847-1656921600-1657299600@marketingeda.com SUMMARY:22nd IEEE Nano DESCRIPTION:The 22nd IEEE International Conference on Nanotechnology (IEEE-NANO 2022) will be held from 4th to 8th of July\, 2022\, at the Campus of Balearic Islands University (UIB) in Palma\, the capital of Balearic Islands\, Spain. \nIEEE-NANO is the flagship IEEE international conference on Nanotechnology\, which has been a successful annual conference since 2001. Recent conferences were held in Montreal (2021)\, on-line (2020)\, Macau (2019)\, Cork (2018)\, Pittsburgh (2017)\, Sendai (2016)\, Rome (2015)\, and Toronto (2014). \nThe conference scope spans both nanoscience and nanotechnology including: Developing new nanomaterials matter and nanometre length scale\, Studying the fundamental physical\, chemical or biological properties of these nanomaterials and nanostructures\, Manipulating nanomaterials and nanostructures  to create nanosensors\, nanoactuators and nanoelectronic/nanophotonic devices. \nContributions from both academic and industry-based researchers. Listed below the more specific topics that IEEE-NANO 2022 will focus on: \n\n\n\n\n\n\n\n✓ Nanorobotics and nanomanufacturing (T1)\n✓ Nano-Biomedicine (T2)\n\n\n✓ Nanofabrication (T3)\n✓ Nano-Optics\, Nanophotonics and Nano-Optoelectronics (T4)\n\n\n✓ Spintronics (T5)\n✓ Nanoelectronics (T6)\n\n\n✓ Nanosensors and nanoactuators (T7)\n✓ Nano-materials (T8)\n\n\n✓ Nano-Metrology and Characterization (T9)\n✓ Modeling and Simulation (T10)\n\n\n✓ Nanopackaging (T11)\n✓ Nanomagnetics (T12)\n\n\n✓ Nano Energy\, Environment and Safety (T13)\n✓ Nanoscale Communications (T14)\n\n\n✓ Nano-acoustic devices\, Processes and Materials (T15)\n✓ Quantum\, Neuromorphic\, and Unconventional Computing (T16)\n\n\n✓ Emerging Plasma Nanotechnologies (T17)\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/22nd-ieee-nano/ LOCATION:Edificio Gaspar Melchor de Jovellanos\, Carrer Eivissa\, s/n\, 07120 Palma\, Illes Balears\, Spain CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEEE-Nano-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220522T000000 DTEND;TZID=America/Los_Angeles:20220525T000000 DTSTAMP:20220518T165053Z CREATED:20220518T165053Z LAST-MODIFIED:20220518T165053Z UID:4722-1653177600-1653436800@marketingeda.com SUMMARY:IEEE ISPSD 2022 DESCRIPTION:The IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) is the premier forum for technical discussions in all areas of power semiconductor devices and power integrated circuits. Topics include\, but not limited to\, device physics\, modelling\, design\, fabrication\, materials\, packaging and integration\, device reliability\, and device/circuit interactions. \nThe conference venue rotates annually through regions of the world and this year marks a return to Canada after an absence of more than 20 years. IEEE ISPSD 2022 will be held in hybrid format\, with the in-person portion hosted in Vancouver\, Canada at the waterfront Marriott Pinnacle Downtown Hotel. \nCradled amid snowcapped mountains and sparkling ocean\, Vancouver is one of the world’s premier meeting and convention destinations. World-renowned cuisine and a great venue all add up to an unforgettable conference experience. Conference participants will have the chance to explore a modern\, cosmopolitan city that blends upbeat culture and breath-taking landscape. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ieee-ispsd-2022/ LOCATION:Marriott Pinnacle Downtown Hotel\, Vancouver\, BC\, Canada CATEGORIES:Conference,Semiconductor ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/ISPSD-2022.png END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20220328T080000 DTEND;TZID=America/Los_Angeles:20220330T170000 DTSTAMP:20220128T183820Z CREATED:20220128T183820Z LAST-MODIFIED:20220128T183820Z UID:4241-1648454400-1648659600@marketingeda.com SUMMARY:tinyML Summit 2022 DESCRIPTION:Registration will open by January 31 \nWhat seemed like a dream a few years ago is quickly turning into reality. Problems which used to require Gigabytes to solve\, became Megabytes and then Kilobytes. Join us at the tinyML Summit 2022 to take part in the sharing\, learning\, and celebrating tinyML. \nWith ever more pervasive advances in technology and algorithms\, tinyML is rapidly becoming a reality. In the tinyML community\, we stand on the shoulders of giants. It is the incredibly open and collaborative nature of ML technology which allows this field to advance so quickly. From its inception in 2019\, the tinyML community has grown tremendously and has benefited greatly by supporting one another. We all hold unique pieces of the puzzle\, but it is through leveraging the collective knowledge of the community that we can move together more quickly. \nIn conjunction with the Summit\, the tinyML Research Symposium 2022 will be held on Monday\, March 28. \n\n\n\n\n\nVenue\n\n\nHyatt Regency San Francisco Airport\n\n1333 Bayshore Highway\, Burlingame\, CA 94010. \n\nRoom Booking\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nVENUE & ACCOMMODATIONS \nHyatt Regency San Francisco Airport \nRoom Booking \nThe cut-off date is Monday\, March 7th\, 2022.  After March 7 rooms may still be available but may have a higher prevailing rate. \nPROGRAM PREVIEW\n \nFive sessions have been planned focusing on several different areas related to tinyML. You will be hearing from selectively invited speakers from each area: \nTalk to Me! TinyML opportunities in smart audio\nSession Leader: Chris Rowen\, Cisco \nAudio is a uniquely attractive target for Tiny machine learning. On one hand\, audio\, especially speech\, hosts richly layered information on communication intent\, identity\, location\, emotion and events. On the other hand\, it is densely encoded so this rich diversity of information is surprisingly hard to extract and interpret. Machine Learning methods prove remarkably effective\, opening up countless applications in speech recognition\, event detection\, voice trigger\, speech transformation and generation. The relatively low bit-rates for audio make it possible to capture and process audio in small power budgets\, and the privacy and latency concerns often make it necessary to concentrate audio processing at the edge – a perfect storm for tinyML audio opportunity. \ntinyML Vision: Efficient design of tiny vision models for IoT devices\nSession Leader: Song Han\, MIT \nComputer vision is popular application for tiny machine learning. Many vision applications require real-time\, low-latency processing\, and privacy is a big priority\, thus recognizing the images/videos locally on tiny edge devices has a lot of opportunity. However\, the large computation and memory footprint poses a challenge on these low-power devices\, which goes worse as the resolution requirement gets larger. Opportunities including model compression and neural network and accelerator co-design opens up a larger design space for tiny machine learning for vision\, which has a large market in smart home\, smart factory\, smart driving\, smart healthcare\, and more. \n\n\n\n\ntinySensing: Scaling tinyML solutions with optimized edge sensing capabilities\nSession Leader: Steve Whalley\, tinyML Board of Directors member \nAs more is done on the edge with less power\, code and real estate\, what does this mean for sensor requirements to stay aligned with the explosive tinyML growth? Going beyond popular tinyML applications in camera sensing for vision and MEMS microphones for audio\, will traditional inertial\, environmental\, medical sensing\, etc. capabilities suffice? What new innovations and ‘smart capabilities’ be required to squeeze more performance\, bandwidth\, lower power\, memory\, analog and ASIC capability into edge sensing solutions? Will changes in Machine Learning methods and tools be needed? Will printed sensing\, with the promise of tiny footprints and power\, be the future darling of tinyML? This session will delve into some of the opportunities\, challenges and trends in the tinySensing world and provide a rigorous dialog on what is needed. \ntinyHardware – there’s plenty of room at the bottom\nSession Leader: Francesco Conti\, University of Bologna \ntinyHardware stands at the crossroads between algorithm\, technology\, and architecture. Aggressive algorithmic optimizations such as quantization\, pruning\, and analog computation do not destroy Machine Learning’s capability to decode and interpret information – rather\, they introduce smooth degradations that can often be tolerated. On the other hand\, these optimizations offer a large “attack surface” for emerging technology such as non-volatile memory\, analog in-memory computing\, and innovative chip-to-chip links – as well as for novel architecture in terms of dataflow choices\, sparsity support\, core/memory coupling and caching schemes. Altogether\, these opportunities define a huge design space spanning from low-bitwidth ISA extensions to multi-chip systolic arrays to System-on-Chips with core-coupled in-memory accelerators – a space that we have just started to navigate in the quest to raise system-level energy efficiency of tinyML applications while enabling more complex Tiny applications. \ntinySW/Tools: Enabling tiny experiences for the real-world\nSession Leader: Alessandro Grande\, Edge Impulse \nSoftware and tools specifically designed for tiny machine learning (tinyML) are empowering researchers\, data scientists and embedded engineers to pave the way for a whole new class of experiences. Whereas the focus was initially on creating software and tools to make each step of the process possible — on one hand enabling data scientists to create datasets\, train and optimize models able to run on resource-constrained devices\, on the other hand helping embedded engineers use the models to develop applications capable of efficiently performing inference on the microcontrollers themselves — we are now starting to see a shift towards software and tools that allow scientists and engineers to leverage tinyML in real-world use cases. Opportunities lie in tightly integrated end-to-end platforms\, new data augmentation methods\, performance analysis tools\, as well as optimization tool techniques. This tinySW/Tools session will explore some of the recent advancements in the field\, while uncovering some of the challenges we are facing as an industry. \nAutoTinyML design\nSession Leader: Danilo Pau\, STMicroelectronics \nLatest generation microcontrollers\, sensors\, digital signal processors\, and ultra-low power accelerometers are opening numerous possibilities in compact machine learning (ML) applications with limited storage and power consumption. Now\, the over 10 million C developers of the embedded community are calling for useful productivity tools to support ML pipeline design from the earliest concept and design phases. The tools should automate ML topology design and optimize configuration without requiring developers to craft new solutions for each issue. \nThis session will focus on tools for Automated Tiny ML design and Hyper Parameter Search. Industrial and university experts will discuss the current and next-generation tools for embedding ML in small\, everyday applications. This is an excellent opportunity for attendees to learn how to deploy their models in tiny devices and ramp up ML design productivity. \n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tinyml-summit-2022/ LOCATION:Hyatt Regecy San Francisco Airport\, 1333 Bayshore Highway\, Burlingame\, CA\, 94010\, United States CATEGORIES:Conference,IP,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/tinyML-Summit-2022.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211105T080000 DTEND;TZID=America/Los_Angeles:20211105T113000 DTSTAMP:20210916T040745Z CREATED:20210916T040745Z LAST-MODIFIED:20210916T040745Z UID:3345-1636099200-1636111800@marketingeda.com SUMMARY:Wafers to Wall Street—The Road Forward: Look at Technology and the Emerging Trends Affecting Growth DESCRIPTION:A Look at Technology and the Emerging Trends Affecting Growth\nOver the past year\, we have seen major companies continue to make significant\, impactful investments in their operations as they look to meet market demand. Join Industry and Wall Street Experts for an in-person forum to discuss the various facets driving current growth\, semiconductors’ future outlook\, and the latest technology trends that are likely to continue. Topics include: \n\nWafer Chip Shortage\nStrengthening US Manufacturing\nEconomic and Geopolitical Factors Affecting Growth\nOpportunities and Challenges in this Fierce Market\nEmerging Technologies and Drivers\nPost-Pandemic Changes\nMergers and Acquisitions\nAnd more\n\nNow that gathering restrictions have been lifted\, the SEMI Pacific Northwest Breakfast Forum is an excellent opportunity to network\, engage\, and share how these topics will impact your business. \n\nEVENT CONTACT \nLin Tso\nSr. Program Manager\nltso@semi.org \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/wafers-to-wall-street-the-road-forward-look-at-technology-and-the-emerging-trends-affecting-growth/ LOCATION:Biamp Systems\, 9300 SW Gemini Dr.\, Beaverton\, OR\, United States CATEGORIES:Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/November-5.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20211028T100000 DTEND;TZID=America/New_York:20211028T120000 DTSTAMP:20210916T041035Z CREATED:20210916T040213Z LAST-MODIFIED:20210916T041035Z UID:3343-1635415200-1635422400@marketingeda.com SUMMARY:Future Infrastructure—The Impact on the Semiconductor Industry (Northeast Forum) DESCRIPTION:The SEMI Northeast Forum will bring together industry leaders from along the semiconductor supply chain to discuss their vision of the impact the post-pandemic infrastructure will have on the semiconductor industry. \nThe semiconductor industry has generally fared well during the recent pandemic\, at least in part because it has supplied the technology that has allowed many other industries to adapt. For example\, the effectiveness of working from home yet being able to continue to collaborate with colleagues via the web has many companies re-thinking their future infrastructure. Some are reducing their office footprint and re-thinking the location of current and new employees. For semiconductor manufacturing\, though\, it may not be as simple as taking a laptop home given the need for equipment\, whether on the factory floor or in the lab. Still\, companies are adapting\, and many of the changes may become part of the future infrastructure. \nOther factors\, such as 5G\, autonomous vehicles\, AI\, and improving the energy infrastructure have also played a part. While not directly related to the pandemic\, it may have accelerated some of the plans already in place. \nJoin business professionals on Oct 28 as industry experts outline a new playbook for innovation that can propel the industry into the next wave of growth. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/future-infrastructure-the-impact-on-the-semiconductor-industry-northeast-forum/ CATEGORIES:Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/October-28.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20211022T083000 DTEND;TZID=America/Los_Angeles:20211022T110000 DTSTAMP:20210916T041415Z CREATED:20210916T035924Z LAST-MODIFIED:20210916T041415Z UID:3339-1634891400-1634900400@marketingeda.com SUMMARY:Wafers to Wall Street—A Semiconductor Outlook: Emerging Markets & Technologies Driving Significant Investment Globally DESCRIPTION:Major investments are developing in semiconductor fab capacity expansion globally and North America. Join industry colleagues online Friday\, October 22\, for a thought-provoking\, VIRTUAL forum on the outlook\, competitive environment\, market\, and technology trends driving fab expansion investment in the semiconductor industry. The discussion includes an analysis of the opportunities and challenges presented by end market drivers. \nHear our panel of industry and Wall Street experts discuss the latest technology trends\, the global competitive environment\, and the decision-making process for regional and state-level investments. Topics include: \n\nMarket and Technology Trends Driving New Investment\nEmerging Technologies\, Integration Schemes\, and Manufacturing Processes\nEconomic\, Geopolitical\, and the Global Competitive Environment (includes US-China Tensions)\nFactors that Influence Global and State-Level Decisions on Where Fab Investment Occurs\nVenture Capitalism in the Industry and Growth Trends\nSemiconductor Chip Shortage\nAnd more\n\nExplore industry trends from the economic\, market\, technology\, and manufacturing perspectives\, plus valuable information from the viewpoint of each speaker. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/wafers-to-wall-street-a-semiconductor-outlook-emerging-markets-technologies-driving-significant-investment-globally/ CATEGORIES:Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Silicon-Valley-Forum.jpg END:VEVENT END:VCALENDAR