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BEGIN:DAYLIGHT
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TZNAME:EDT
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DTSTART:20210314T070000
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DTSTART:20211107T060000
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20221208T160000
DTEND;TZID=America/Los_Angeles:20221208T210000
DTSTAMP:20221011T171424Z
CREATED:20221011T171424Z
LAST-MODIFIED:20221011T171424Z
UID:5288-1670515200-1670533200@marketingeda.com
SUMMARY:GSA Awards Celebration
DESCRIPTION:GSA recognizes semiconductor companies that have demonstrated excellence through their success\, vision\, strategy and future opportunities in the industry at its annual Awards Dinner Celebration. It is an honor to be selected as a nominee and an even more distinguished achievement to win a GSA Award.
URL:https://marketingeda.com/event/gsa-awards-celebration/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Award,Semiconductor
ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/Screen-Shot-2022-10-11-at-10.13.07-AM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20221205T080000
DTEND;TZID=Europe/Berlin:20221205T203000
DTSTAMP:20221116T201152Z
CREATED:20221116T201152Z
LAST-MODIFIED:20221116T201152Z
UID:5407-1670227200-1670272200@marketingeda.com
SUMMARY:The 26262 Club - Technical Conference
DESCRIPTION:MEET US AT THE 26262 CLUB TECHNICAL CONFERENCE THIS COMING DECEMBER 5\, 2022\nIn this edition\, the 26262 club continues the discussion on the anticipated third edition and the emerging role of ISO 26262 within the evolving standards ecosystem. We bring on stage key global players from WG8 alongside authors of the most prominent upcoming standards and share must-have insights from the global standardisation community. Goal of the day is to facilitate collaboration and open discussion between different groups and practitioners and present applicable case studies and lessons learnt to take back with you. \nWHO WILL YOU MEET\nThe expert speaker line up includes 20 international experts from the ISO 26262 WGs and international members of Germany\, UK\, France\, Italy\, Austria\, USA – together we welcome experts from WGs of SOTIF\, IEEE\, Accellera\, ISO 21434 among other. Presenting companies include OEMS\, Tier 1s\, Semiconductor and notable solution providers. Meet our expert speaker panel here.
URL:https://marketingeda.com/event/the-26262-club-technical-conference/
LOCATION:Holiday Inn Munich – City Centre\, Hochstraße 3\, Munich\, 81669\, Germany
CATEGORIES:Conference,EDA,IP,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/The-26262-Club.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20221115T080000
DTEND;TZID=Europe/Berlin:20221118T170000
DTSTAMP:20221017T181636Z
CREATED:20221017T181636Z
LAST-MODIFIED:20221017T181636Z
UID:5312-1668499200-1668790800@marketingeda.com
SUMMARY:Semicon Europa
DESCRIPTION:SEMICON Europa 2022 is co-located with electronica in Munich\, Germany creating the strongest single event for electronics manufacturing in Europe\, and broadening the range of attendees across the electronics chain. \n– Top-notch Keynotes\n– Market Trends\n– Exhibition\n– Networking\n– Advanced Packaging Forum / Fab Management Forum\n– ITF Beyond 5G -powered by imec\n– Smart Manufacturing / Mobility / MedTech\n– Workforce Development and many more!
URL:https://marketingeda.com/event/semicon-europa/
LOCATION:Messe Munchen\, Messegelände\, Munich\, 81823\, Germany
CATEGORIES:Conference,EDA,IP,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DB580CC6-16B1-4DBA-A5A3-38C39181F164-e1666030379723.jpeg
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20221103T080000
DTEND;TZID=America/Los_Angeles:20221103T113000
DTSTAMP:20221013T202008Z
CREATED:20221013T202008Z
LAST-MODIFIED:20221013T202008Z
UID:5306-1667462400-1667475000@marketingeda.com
SUMMARY:THE FUTURE OF MORE THAN MOORE—Chiplets\, Advanced Packaging\, and More
DESCRIPTION:Presented by the SEMI\nPacific Northwest and Silicon Valley Chapters \nHow can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology\, economics\, and new opportunities in the semiconductor supply chain. \nJoin us at the Forum on Thursday\, November 3\, 2022\, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person\, Virtual\, and On-Demand for your convenience. \nSpeakers\nASE\nMark Gerber\nSr. Director\, Engineering & Technical Marketing \nAdvanced Packaging: Enabling a New Generation of Silicon Systems\n\n\nFORMFACTOR\nAmy Leong\nSVP\, CMO\, GM Emerging Growth/M&A \nStrategy for Wafer Probe in a Chiplet World \nGARTNER\nBob Johnson\nVice President\,\nAnalyst \nSemiconductor Market Outlook: Change in the Midst of Uncertainty \n\nGOOGLE\nMartin Dixon\nDirector of\nEngineering \n[KEYNOTE] Open Chiplets to Enable a New Era of Silicon\n\n\nINTEL CORPORATION\nMartha Dudek\, PhD\nSr. Director\, Assembly Materials Global Supply Chain \n[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging \n\n\n\nBIAMP SYSTEMS\nJoe Andrulis\nExecutive Vice President\,\nCorporate Development \n[HOST] Welcome &\nTour of Biamp
URL:https://marketingeda.com/event/the-future-of-more-than-moore-chiplets-advanced-packaging-and-more/
LOCATION:Biamp Systems\, 9300 SW Gemini Dr.\, Beaverton\, OR\, United States
CATEGORIES:Forum,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SEMI-November-3-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20221026T090000
DTEND;TZID=America/Los_Angeles:20221026T183000
DTSTAMP:20221013T003013Z
CREATED:20221013T003013Z
LAST-MODIFIED:20221013T003013Z
UID:5303-1666774800-1666809000@marketingeda.com
SUMMARY:TSMC 2022 OIP - California
DESCRIPTION:Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges! \nRegister Now\n\n\n\n\nLearn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E\, N4/N4P\, N5/N5A\, N6/N7\, N12e\, N22\, and 28eF technologies\nLatest 3DIC chip stacking and advanced packaging processes\, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications\nUpdated design solutions for specialty technologies enabling ultra-low voltage\, analog migration\, mmWave RF\, and automotive designs targeting automotive and IoT designs\nEcosystem-specific TSMC reference flow implementations\, P& R optimization\, machine learning to improve design quality and productivity\, and cloud-based design solutions\nSuccessful\, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum! \nYour health and safety are important to us. TSMC continues to monitor guidelines for health safety measures from the Centers for Disease Control and Prevention\, California Department of Public Health\, and the Santa Clara County Department of Public Health. TSMC will follow applicable federal\, state and local laws\, then adapt TSMC plans accordingly and share updates with you.
URL:https://marketingeda.com/event/tsmc-2022-oip-california/
LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:EDA,Forum,IP,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-OIP-2022-1.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Berlin:20220928T080000
DTEND;TZID=Europe/Berlin:20220929T170000
DTSTAMP:20220914T220520Z
CREATED:20220914T220520Z
LAST-MODIFIED:20220914T220520Z
UID:5202-1664352000-1664470800@marketingeda.com
SUMMARY:Global Foundries Technology Summit - EMEA
DESCRIPTION:DAY 1 \nWednesday\, September 28\, 2022\nDoors Open 3:00pm CET \n  \nDINNER \nRestaurant KULTURWIRTSCHAFT\, 7pm – 10pm \n  \nDAY 2 \nThursday\, September 29\, 2022\nDoors Open 8:30am CET \n  \nEVENT LOCATION\nGlobalFoundries FAB 1\nWilschdorfer Landstrasse 101\n01109 Dresden\, Germany \n  \nWe are thrilled to welcome you to GF Technology Summit 2022. \nThis exclusive\, invitation-only event is in-person again\, located in GF’s FAB 1 facility! \n\n(RE)CONNECT Join CEO Tom Caulfield\, the GF team\, partners and industry experts for lively\, interactive discussions\nLEARN See how GF’s differentiated solutions and technology roadmap is delivering a new era of more\nDELIVER Collaborate\, partner and invest with GF to drive transformation in your industry\n\nWe look forward to seeing you (in-person!) at GTS 2022 EMEA. \n  \n\nYour Host  \n\n\n\n\n\n\n\n\n\n\nRuth Hernandez\nPartnerships & Business Development\, EMEA\nGlobalFoundries \n\n\n\n\n\n\n\n\n\n\n \n\n\n\n\n“We look forward to seeing you at GF Technology Summit 2022 EMEA\, in-person in Dresden\, on September 28 and 29. Join us to connect\, build relationships and discover new ways of collaborating and innovating.” \n 
URL:https://marketingeda.com/event/global-foundries-technology-summit-emea/
LOCATION:GlobalFoundries Fab 1\, Wilschdorfer Landstrasse 101\, Dresden\, 01109\, Germany
CATEGORIES:EDA,Foundry,IP,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GF-September-28-29-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Rome:20220919T080000
DTEND;TZID=Europe/Rome:20220922T170000
DTSTAMP:20220919T015335Z
CREATED:20220919T015335Z
LAST-MODIFIED:20220919T015335Z
UID:5213-1663574400-1663866000@marketingeda.com
SUMMARY:ESSCIRC 2022
DESCRIPTION:The aim of ESSDERC and ESSCIRC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on- chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore\, more than ever before\, a deeper interaction among technologists\, device experts\, IC designers and system designers is necessary. \nWhile keeping separate Technical Program Committees\, ESSDERC and ESSCIRC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both communities. Attendees registered for either conference are encouraged to attend any of the scheduled parallel sessions\, regardless to which conference they belong. \n\n​ \nCONFERENCE HIGHLIGHTS \n\n\n4 joint keynote presentations \n\n\n3 ESSDERC keynote presentations \n\n\n3 ESSCIRC keynote presentations \n\n\nInvited papers with overall coverage of all aspects of advanced devices and circuits \n\n\nPresentation of IEEE and ESSDERC/ESSCIRC Awards \n\n\nESSDERC/ESSCIRC Welcome Reception on Tuesday\, September 20\, 2022 \n\n\nESSDERC/ESSCIRC Gala Dinner on Wednesday\, September 21\, 2022 \n\n\nTutorials and workshops \n\n\n\nThe venue of the conference events\, including workshops and tutorials\, will be at the University of Milan-Bicocca (Milan\, IT)\, that is well connected (metro\, bus\, train with Milan downtown). \nThe working language of the conference is English. \n​ \n​ \nBEST PAPER AWARDS \nPapers presented at the conference will be considered for the ”Best Paper Award” and ”Best Young Scientist Paper Award”. \nThe selection will be based on the results of the paper selection process and the judgment of the conference participants. \nThe 2022 Award Ceremony will take place during ESSDERC/ESSCIRC 2023. \n\n​ \nCONFERENCE TARGET AND EVOLUTION \nESSDERC and ESSCIRC have evolved over the last years to follow recent R&D device\, circuit and system fast-growing topics. Besides the traditional ESSDERC and ESSCIRC tracks\, a number of JOINT tracks have been introduced\, to encourage and facilitate interactions between circuit\, system and device researchers. \n\nESSDERC/ESSCIRC encourages submissions in all areas of solid-state devices\, circuits and systems\, with special emphasis on: \n\n\nAnalog\, Power and RF Devices \n\n\nElectron Device Simulation and Modeling \n\n\nAdvanced Technology\, Processes and Materials \n\n\nNeuromorphic Computing\, Advanced Memories\, Al Accelerators\, in-Memory-Computing\, Security \n\n\nAdvanced Computing Devices and Circuits: Advanced CMOS\, Post-CMOS\, Quantum Computing \n\n\nSensors\, MEMS\, Bioelectronics\, Biomedical Electronics\, Optoelectronics\, Display and Imaging \n\n\nAnalog Circuits \n\n\nData Converters \n\n\nRF and mm-Wave Circuits \n\n\nFrequency Generation \n\n\nWireless and Wireline Interfaces \n\n\nIntegrated Power Electronics and Power Management \n\n\nDigital Circuits & Systems \n\n\n\nStudent papers are welcome and encouraged. \n\n​ \nPAPERS SUBMISSION \nPapers submitted for review must clearly state: \n\n\nThe purpose of the work \n\n\nHow and to what extent it advances the state-of-the art \n\n\nSpecific results and their impact \n\n\nOnly material that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference. \nManuscript guidelines\, as well as instructions on how to electronically submit papers will be available in the 1st Call for Papers and on this website. \nPapers must not exceed four A4 pages with all illustrations and references included. \n\nPapers submission deadline: April\, 12\, 2022
URL:https://marketingeda.com/event/esscirc-2022/
LOCATION:Università degli Studi di MILANO – BICOCCA\, Viale Piero e Alberto Pirelli\, 22\, Milano\, 20126\, Italy
CATEGORIES:Conference,EDA,IP,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/ESSCIRC-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220913T080000
DTEND;TZID=America/Los_Angeles:20220913T170000
DTSTAMP:20220617T174824Z
CREATED:20220617T174824Z
LAST-MODIFIED:20220617T174824Z
UID:4860-1663056000-1663088400@marketingeda.com
SUMMARY:2022 WLI Women In Semiconductor Hardware (WISH) Conference
DESCRIPTION:The annual Women in Semiconductor Hardware (WISH) Conference is GSA WLI’s flagship event bringing together industry luminaries\, entrepreneurs\, and university women in STEM. WISH showcases the changing face of technology and offers awards celebrating the women who have helped to break the glass ceiling and those who are following in their footsteps. \nIn support of WISH\, we are accepting abstracts from female engineers in the following categories: \n\nProcess Technology\nSystem Technology\nDesign Technology\nValidation/Test\nPackaging/Assembly\n\nA total of three papers per session track will be chosen. Each speaker will have 20 minutes to present her paper. If you would like to be considered for a paper session\, please see our WISH Call for Papers. Presenters will be determined by our Technical Steering Committee.
URL:https://marketingeda.com/event/2022-wli-women-in-semiconductor-hardware-wish-conference/
CATEGORIES:Conference,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-Sep-13-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220816T090000
DTEND;TZID=America/Los_Angeles:20220816T100000
DTSTAMP:20220802T163344Z
CREATED:20220802T163344Z
LAST-MODIFIED:20220802T163344Z
UID:4998-1660640400-1660644000@marketingeda.com
SUMMARY:Sustainability for Semiconductors
DESCRIPTION:Don’t miss your chance to join this important conversation with industry leaders that are making an impact on the reduction of the semiconductor carbon footprint. \nDonna Yasay Senior Leader\, Solutions Architecture at Amazon Web Services (AWS) \nDonna Yasay leads a solution architecture team for the Bay Area semiconductor segment at Amazon Web Services (AWS). Her team is responsible for building solutions in the semiconductor ecosystem that span Fabless/System IC suppliers\, FAB/IC Foundries\, IDM’s (Integrated Device Manufacturers) and IP Designers\, to help AWS semiconductor customers achieve their cloud adoption journey such as Cloud EDA.  Previous to AWS\, she spent over two decades in the Semiconductor industry leading product\, sales and engineering teams at major semiconductor companies such as Marvell\, Xilinx\, and Qualcomm. \nKT Moore\, VP Corporate Marketing & Business Development\, Cadence \nKT Moore joined Cadence in August 2012 and is currently responsible for Corporate Marketing.  He previously held other management positions leading product marketing and business development for Cadence’s Custom IC\, PCB\, Systems Design and Analysis\, and full flow Digital IC design solutions.​ Prior to joining Cadence\, KT spent 12 years with Magma Design Automation.  During that time he served 6 years as a Global Account Director\, and 6 years as a Vice President of Product Marketing\, where he was responsible for business development and marketing for all Magma products.  Before joining Magma KT also held various sales positions with EPIC Design Technology and Valid Logic Systems.  Prior to his career in EDA\, KT spent several years as a logic designer for Texas Instruments. KT received a Bachelor of Science degree in Electrical Engineering and Applied Physics from Case Western Reserve University in Cleveland\, OH in 1985. \nNebabie Kebebew\, Senior Product Manager for Analog and Mixed-Signal Verification Products\, Siemens EDA \nNebabie Kebebew is a Senior Product Manager for Analog and Mixed-Signal verification products at Siemens EDA. She has extensive experience in the semiconductor and the EDA industry. Prior to Siemens she spent over a decade managing and developing EDA products for the design and verification of ICs at Cadence and Synopsys. Before her journey in EDA\, Nebabie was the lead design architect at Raytheon\, for radar data processor ICs in avionics applications. Kebebew has served as a co-chair for the Women’s Impact Network group at Siemens. She is a passionate advocate for girls in STEM. Nebabie holds an MSEE from the University of Southern California and a BSEE from California Polytechnic University. \nErika Varga McEnroe\, Senior Vice President and Deputy General Counsel\, Synopsys \nErika Varga McEnroe is senior vice president and deputy general counsel at Synopsys. Ms. McEnroe and her team are responsible for corporate legal matters\, including corporate governance\, ethics and compliance\, securities\, and mergers & acquisitions. She and her team also lead the company’s Corporate Social Responsibility program\, which drives how Synopsys manages its operational impact and how Synopsys influences others to create a better world. She recently served on the executive committee and board of directors of Watermark\, an organization focused on empowering women to make their mark in their companies\, careers\, and communities. Ms. McEnroe holds a JD degree from the University of California\, Hastings College of the Law.
URL:https://marketingeda.com/event/sustainability-for-semiconductors/
CATEGORIES:EDA,Semiconductor,Webinar
ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/GSA-August-16-2022.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Madrid:20220704T080000
DTEND;TZID=Europe/Madrid:20220708T170000
DTSTAMP:20220616T163128Z
CREATED:20220616T163128Z
LAST-MODIFIED:20220616T163128Z
UID:4847-1656921600-1657299600@marketingeda.com
SUMMARY:22nd IEEE Nano
DESCRIPTION:The 22nd IEEE International Conference on Nanotechnology (IEEE-NANO 2022) will be held from 4th to 8th of July\, 2022\, at the Campus of Balearic Islands University (UIB) in Palma\, the capital of Balearic Islands\, Spain. \nIEEE-NANO is the flagship IEEE international conference on Nanotechnology\, which has been a successful annual conference since 2001. Recent conferences were held in Montreal (2021)\, on-line (2020)\, Macau (2019)\, Cork (2018)\, Pittsburgh (2017)\, Sendai (2016)\, Rome (2015)\, and Toronto (2014). \nThe conference scope spans both nanoscience and nanotechnology including: Developing new nanomaterials matter and nanometre length scale\, Studying the fundamental physical\, chemical or biological properties of these nanomaterials and nanostructures\, Manipulating nanomaterials and nanostructures  to create nanosensors\, nanoactuators and nanoelectronic/nanophotonic devices. \nContributions from both academic and industry-based researchers. Listed below the more specific topics that IEEE-NANO 2022 will focus on: \n\n\n\n\n\n\n\n✓ Nanorobotics and nanomanufacturing (T1)\n✓ Nano-Biomedicine (T2)\n\n\n✓ Nanofabrication (T3)\n✓ Nano-Optics\, Nanophotonics and Nano-Optoelectronics (T4)\n\n\n✓ Spintronics (T5)\n✓ Nanoelectronics (T6)\n\n\n✓ Nanosensors and nanoactuators (T7)\n✓ Nano-materials (T8)\n\n\n✓ Nano-Metrology and Characterization (T9)\n✓ Modeling and Simulation (T10)\n\n\n✓ Nanopackaging (T11)\n✓ Nanomagnetics (T12)\n\n\n✓ Nano Energy\, Environment and Safety (T13)\n✓ Nanoscale Communications (T14)\n\n\n✓ Nano-acoustic devices\, Processes and Materials (T15)\n✓ Quantum\, Neuromorphic\, and Unconventional Computing (T16)\n\n\n✓ Emerging Plasma Nanotechnologies (T17)
URL:https://marketingeda.com/event/22nd-ieee-nano/
LOCATION:Edificio Gaspar Melchor de Jovellanos\, Carrer Eivissa\, s/n\, 07120 Palma\, Illes Balears\, Spain
CATEGORIES:Conference,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IEEE-Nano-2022.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220522T000000
DTEND;TZID=America/Los_Angeles:20220525T000000
DTSTAMP:20220518T165053Z
CREATED:20220518T165053Z
LAST-MODIFIED:20220518T165053Z
UID:4722-1653177600-1653436800@marketingeda.com
SUMMARY:IEEE ISPSD 2022
DESCRIPTION:The IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) is the premier forum for technical discussions in all areas of power semiconductor devices and power integrated circuits. Topics include\, but not limited to\, device physics\, modelling\, design\, fabrication\, materials\, packaging and integration\, device reliability\, and device/circuit interactions. \nThe conference venue rotates annually through regions of the world and this year marks a return to Canada after an absence of more than 20 years. IEEE ISPSD 2022 will be held in hybrid format\, with the in-person portion hosted in Vancouver\, Canada at the waterfront Marriott Pinnacle Downtown Hotel. \nCradled amid snowcapped mountains and sparkling ocean\, Vancouver is one of the world’s premier meeting and convention destinations. World-renowned cuisine and a great venue all add up to an unforgettable conference experience. Conference participants will have the chance to explore a modern\, cosmopolitan city that blends upbeat culture and breath-taking landscape.
URL:https://marketingeda.com/event/ieee-ispsd-2022/
LOCATION:Marriott Pinnacle Downtown Hotel\, Vancouver\, BC\, Canada
CATEGORIES:Conference,Semiconductor
ATTACH;FMTTYPE=image/png:https://marketingeda.com/wp-content/uploads/ISPSD-2022.png
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20220328T080000
DTEND;TZID=America/Los_Angeles:20220330T170000
DTSTAMP:20220128T183820Z
CREATED:20220128T183820Z
LAST-MODIFIED:20220128T183820Z
UID:4241-1648454400-1648659600@marketingeda.com
SUMMARY:tinyML Summit 2022
DESCRIPTION:Registration will open by January 31 \nWhat seemed like a dream a few years ago is quickly turning into reality. Problems which used to require Gigabytes to solve\, became Megabytes and then Kilobytes. Join us at the tinyML Summit 2022 to take part in the sharing\, learning\, and celebrating tinyML. \nWith ever more pervasive advances in technology and algorithms\, tinyML is rapidly becoming a reality. In the tinyML community\, we stand on the shoulders of giants. It is the incredibly open and collaborative nature of ML technology which allows this field to advance so quickly. From its inception in 2019\, the tinyML community has grown tremendously and has benefited greatly by supporting one another. We all hold unique pieces of the puzzle\, but it is through leveraging the collective knowledge of the community that we can move together more quickly. \nIn conjunction with the Summit\, the tinyML Research Symposium 2022 will be held on Monday\, March 28. \n\n\n\n\n\nVenue\n\n\nHyatt Regency San Francisco Airport\n\n1333 Bayshore Highway\, Burlingame\, CA 94010. \n\nRoom Booking\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nVENUE & ACCOMMODATIONS \nHyatt Regency San Francisco Airport \nRoom Booking \nThe cut-off date is Monday\, March 7th\, 2022.  After March 7 rooms may still be available but may have a higher prevailing rate. \nPROGRAM PREVIEW\n \nFive sessions have been planned focusing on several different areas related to tinyML. You will be hearing from selectively invited speakers from each area: \nTalk to Me! TinyML opportunities in smart audio\nSession Leader: Chris Rowen\, Cisco \nAudio is a uniquely attractive target for Tiny machine learning. On one hand\, audio\, especially speech\, hosts richly layered information on communication intent\, identity\, location\, emotion and events. On the other hand\, it is densely encoded so this rich diversity of information is surprisingly hard to extract and interpret. Machine Learning methods prove remarkably effective\, opening up countless applications in speech recognition\, event detection\, voice trigger\, speech transformation and generation. The relatively low bit-rates for audio make it possible to capture and process audio in small power budgets\, and the privacy and latency concerns often make it necessary to concentrate audio processing at the edge – a perfect storm for tinyML audio opportunity. \ntinyML Vision: Efficient design of tiny vision models for IoT devices\nSession Leader: Song Han\, MIT \nComputer vision is popular application for tiny machine learning. Many vision applications require real-time\, low-latency processing\, and privacy is a big priority\, thus recognizing the images/videos locally on tiny edge devices has a lot of opportunity. However\, the large computation and memory footprint poses a challenge on these low-power devices\, which goes worse as the resolution requirement gets larger. Opportunities including model compression and neural network and accelerator co-design opens up a larger design space for tiny machine learning for vision\, which has a large market in smart home\, smart factory\, smart driving\, smart healthcare\, and more. \n\n\n\n\ntinySensing: Scaling tinyML solutions with optimized edge sensing capabilities\nSession Leader: Steve Whalley\, tinyML Board of Directors member \nAs more is done on the edge with less power\, code and real estate\, what does this mean for sensor requirements to stay aligned with the explosive tinyML growth? Going beyond popular tinyML applications in camera sensing for vision and MEMS microphones for audio\, will traditional inertial\, environmental\, medical sensing\, etc. capabilities suffice? What new innovations and ‘smart capabilities’ be required to squeeze more performance\, bandwidth\, lower power\, memory\, analog and ASIC capability into edge sensing solutions? Will changes in Machine Learning methods and tools be needed? Will printed sensing\, with the promise of tiny footprints and power\, be the future darling of tinyML? This session will delve into some of the opportunities\, challenges and trends in the tinySensing world and provide a rigorous dialog on what is needed. \ntinyHardware – there’s plenty of room at the bottom\nSession Leader: Francesco Conti\, University of Bologna \ntinyHardware stands at the crossroads between algorithm\, technology\, and architecture. Aggressive algorithmic optimizations such as quantization\, pruning\, and analog computation do not destroy Machine Learning’s capability to decode and interpret information – rather\, they introduce smooth degradations that can often be tolerated. On the other hand\, these optimizations offer a large “attack surface” for emerging technology such as non-volatile memory\, analog in-memory computing\, and innovative chip-to-chip links – as well as for novel architecture in terms of dataflow choices\, sparsity support\, core/memory coupling and caching schemes. Altogether\, these opportunities define a huge design space spanning from low-bitwidth ISA extensions to multi-chip systolic arrays to System-on-Chips with core-coupled in-memory accelerators – a space that we have just started to navigate in the quest to raise system-level energy efficiency of tinyML applications while enabling more complex Tiny applications. \ntinySW/Tools: Enabling tiny experiences for the real-world\nSession Leader: Alessandro Grande\, Edge Impulse \nSoftware and tools specifically designed for tiny machine learning (tinyML) are empowering researchers\, data scientists and embedded engineers to pave the way for a whole new class of experiences. Whereas the focus was initially on creating software and tools to make each step of the process possible — on one hand enabling data scientists to create datasets\, train and optimize models able to run on resource-constrained devices\, on the other hand helping embedded engineers use the models to develop applications capable of efficiently performing inference on the microcontrollers themselves — we are now starting to see a shift towards software and tools that allow scientists and engineers to leverage tinyML in real-world use cases. Opportunities lie in tightly integrated end-to-end platforms\, new data augmentation methods\, performance analysis tools\, as well as optimization tool techniques. This tinySW/Tools session will explore some of the recent advancements in the field\, while uncovering some of the challenges we are facing as an industry. \nAutoTinyML design\nSession Leader: Danilo Pau\, STMicroelectronics \nLatest generation microcontrollers\, sensors\, digital signal processors\, and ultra-low power accelerometers are opening numerous possibilities in compact machine learning (ML) applications with limited storage and power consumption. Now\, the over 10 million C developers of the embedded community are calling for useful productivity tools to support ML pipeline design from the earliest concept and design phases. The tools should automate ML topology design and optimize configuration without requiring developers to craft new solutions for each issue. \nThis session will focus on tools for Automated Tiny ML design and Hyper Parameter Search. Industrial and university experts will discuss the current and next-generation tools for embedding ML in small\, everyday applications. This is an excellent opportunity for attendees to learn how to deploy their models in tiny devices and ramp up ML design productivity.
URL:https://marketingeda.com/event/tinyml-summit-2022/
LOCATION:Hyatt Regecy San Francisco Airport\, 1333 Bayshore Highway\, Burlingame\, CA\, 94010\, United States
CATEGORIES:Conference,IP,Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/tinyML-Summit-2022.jpg
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20211105T080000
DTEND;TZID=America/Los_Angeles:20211105T113000
DTSTAMP:20210916T040745Z
CREATED:20210916T040745Z
LAST-MODIFIED:20210916T040745Z
UID:3345-1636099200-1636111800@marketingeda.com
SUMMARY:Wafers to Wall Street—The Road Forward: Look at Technology and the Emerging Trends Affecting Growth
DESCRIPTION:A Look at Technology and the Emerging Trends Affecting Growth\nOver the past year\, we have seen major companies continue to make significant\, impactful investments in their operations as they look to meet market demand. Join Industry and Wall Street Experts for an in-person forum to discuss the various facets driving current growth\, semiconductors’ future outlook\, and the latest technology trends that are likely to continue. Topics include: \n\nWafer Chip Shortage\nStrengthening US Manufacturing\nEconomic and Geopolitical Factors Affecting Growth\nOpportunities and Challenges in this Fierce Market\nEmerging Technologies and Drivers\nPost-Pandemic Changes\nMergers and Acquisitions\nAnd more\n\nNow that gathering restrictions have been lifted\, the SEMI Pacific Northwest Breakfast Forum is an excellent opportunity to network\, engage\, and share how these topics will impact your business. \n\nEVENT CONTACT \nLin Tso\nSr. Program Manager\nltso@semi.org
URL:https://marketingeda.com/event/wafers-to-wall-street-the-road-forward-look-at-technology-and-the-emerging-trends-affecting-growth/
LOCATION:Biamp Systems\, 9300 SW Gemini Dr.\, Beaverton\, OR\, United States
CATEGORIES:Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/November-5.jpg
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BEGIN:VEVENT
DTSTART;TZID=America/New_York:20211028T100000
DTEND;TZID=America/New_York:20211028T120000
DTSTAMP:20210916T041035Z
CREATED:20210916T040213Z
LAST-MODIFIED:20210916T041035Z
UID:3343-1635415200-1635422400@marketingeda.com
SUMMARY:Future Infrastructure—The Impact on the Semiconductor Industry (Northeast Forum)
DESCRIPTION:The SEMI Northeast Forum will bring together industry leaders from along the semiconductor supply chain to discuss their vision of the impact the post-pandemic infrastructure will have on the semiconductor industry. \nThe semiconductor industry has generally fared well during the recent pandemic\, at least in part because it has supplied the technology that has allowed many other industries to adapt. For example\, the effectiveness of working from home yet being able to continue to collaborate with colleagues via the web has many companies re-thinking their future infrastructure. Some are reducing their office footprint and re-thinking the location of current and new employees. For semiconductor manufacturing\, though\, it may not be as simple as taking a laptop home given the need for equipment\, whether on the factory floor or in the lab. Still\, companies are adapting\, and many of the changes may become part of the future infrastructure. \nOther factors\, such as 5G\, autonomous vehicles\, AI\, and improving the energy infrastructure have also played a part. While not directly related to the pandemic\, it may have accelerated some of the plans already in place. \nJoin business professionals on Oct 28 as industry experts outline a new playbook for innovation that can propel the industry into the next wave of growth.
URL:https://marketingeda.com/event/future-infrastructure-the-impact-on-the-semiconductor-industry-northeast-forum/
CATEGORIES:Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/October-28.jpg
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BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20211022T083000
DTEND;TZID=America/Los_Angeles:20211022T110000
DTSTAMP:20210916T041415Z
CREATED:20210916T035924Z
LAST-MODIFIED:20210916T041415Z
UID:3339-1634891400-1634900400@marketingeda.com
SUMMARY:Wafers to Wall Street—A Semiconductor Outlook: Emerging Markets & Technologies Driving Significant Investment Globally
DESCRIPTION:Major investments are developing in semiconductor fab capacity expansion globally and North America. Join industry colleagues online Friday\, October 22\, for a thought-provoking\, VIRTUAL forum on the outlook\, competitive environment\, market\, and technology trends driving fab expansion investment in the semiconductor industry. The discussion includes an analysis of the opportunities and challenges presented by end market drivers. \nHear our panel of industry and Wall Street experts discuss the latest technology trends\, the global competitive environment\, and the decision-making process for regional and state-level investments. Topics include: \n\nMarket and Technology Trends Driving New Investment\nEmerging Technologies\, Integration Schemes\, and Manufacturing Processes\nEconomic\, Geopolitical\, and the Global Competitive Environment (includes US-China Tensions)\nFactors that Influence Global and State-Level Decisions on Where Fab Investment Occurs\nVenture Capitalism in the Industry and Growth Trends\nSemiconductor Chip Shortage\nAnd more\n\nExplore industry trends from the economic\, market\, technology\, and manufacturing perspectives\, plus valuable information from the viewpoint of each speaker.
URL:https://marketingeda.com/event/wafers-to-wall-street-a-semiconductor-outlook-emerging-markets-technologies-driving-significant-investment-globally/
CATEGORIES:Semiconductor
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Silicon-Valley-Forum.jpg
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END:VCALENDAR