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The UCIe™ 1.1 Specification: Future Applications of Chiplets
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable improvements to the chiplet ecosystem, extending reliability mechanisms to more protocols and supporting broader usage models. This webinar will provide… The UCIe™ 1.1 Specification: Future Applications of Chiplets
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IEEE 32nd Asian Test Symposium
With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems, incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. The Asian Test Symposium (ATS)… IEEE 32nd Asian Test Symposium
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EPEPS 2023
Sonesta San Jose - Milpitas 777 Bellew Drive, Milpitas, CA, United StatesEPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave… EPEPS 2023
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DVClub Europe – AI/ML in Verification
This is to inform you that the next DVClub Europe meeting takes place on Tuesday 17th October with a theme of "AI/ML in Verification". This DVClub consider how we can save time and effort whilst improving time-to-market through the application of AI/ML to verification. Agenda (BST) 12:00 Welcome and Introduction - Mike Bartley, Senior Vice President -… DVClub Europe – AI/ML in Verification
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Samsung Foundry Forum 2023 Tokyo, Japan
Belle Salle Tokyo Nihonbashi 2-7-1 Nihombashi, Chuo-ku, Tokyo, JapanWelcoming Remarks Seishu Arai VP, Head of Japan Office, Samsung Electronics Samsung Keynote Siyoung Choi President and GM, Foundry Business, Samsung Electronics Guest Speech I Junichiro Makino Professor, Kobe University Guest Speech II Sumiko Kanamori Automotive HPC, Analog & Power Solutions Gr. Digital Head of H/W Unit, VP, Renesas Electronics Corporation Guest Speech III Kazuoki… Samsung Foundry Forum 2023 Tokyo, Japan
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Jasper User Group 2023
Ready to share and discuss the latest design and verification best practices with your peers from around the world? It’s time for our annual CadenceCONNECT: Jasper™ User Group Conference, held on October 18 and 19 at the Cadence San Jose campus. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around… Jasper User Group 2023
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Soar to New Heights of Productivity using Cadence Managed Cloud Services
Date: Wednesday, October 18, 2023 Time: 8:30am PT | 10:30am CT | 11:30am ET Join us for this 45-minute webinar to learn how the Cadence-managed, EDA-optimized, ready-to-use, and secure ISO-certified cloud platform delivers a fully integrated and proven environment to jump-start product design, verification, and implementation. See the platform in action as we demo the productivity features… Soar to New Heights of Productivity using Cadence Managed Cloud Services
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The Race is On!
Brazos Hall East 4th Street, Austin, TX, United StatesEvent Overview Date: Wednesday, October 18, 2023 Time: 8:30am – 4:00pm, followed by an exclusive networking event Location: Brazos Hall, Austin, TX There is an unprecedented demand for advanced-node chip design that pushes beyond traditional boundaries. Computing power, security, reliability, and other multifaceted requirements have surpassed the basic performance, power consumption, and area constraints of traditional chip design. The… The Race is On!
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System-Level Thermal Signoff from Chips Through to Racks
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent. In this webinar, we will look at an electrothermal co-simulation solution for the full hierarchy of electronic systems… System-Level Thermal Signoff from Chips Through to Racks
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Samsung Foundry Forum 2023 EMEA
Sofitel Munich Bayerpost Bayerstrasse 12, Munich, GermanyWe're inviting global partners and customers to our upcoming Samsung Foundry Forum (SFF) and Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2023. The events will provide opportunities to share insights and innovative technologies to build a strong foundry ecosystem to accelerate innovation beyond boundaries. Join us to experience the spirit and power of innovation. SFF &… Samsung Foundry Forum 2023 EMEA
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High Reliability and Functional Safety Applications for FPGA
When designing any new system, safety and reliability are key factors in determining if a system is safe for real-world deployment and if there are sufficient contingency plans for worst case scenarios. This is no different for the designs targeted for FPGAs based deployments. Today, FPGA based designs are utilized in many safety critical systems in the… High Reliability and Functional Safety Applications for FPGA
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SemIsrael Expo 2023
Avenue Convention Center Airport City, IsraelSemIsrael Expo 2023 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields and aspects of the semiconductor industry. The Expo will host some 750 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups, local R&D offices of multinationals and IDMs, foundries,… SemIsrael Expo 2023
12 events found.