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  • A Beginner’s Guide to RTL-to-GDSII Front-End Flow

    In this Training Webinar, explore the concepts of RTL design, design verification, and coverage analysis while unveiling the exciting world of front-end design flow. Walk through the essential steps in creating integrated circuits, the building blocks of modern electronics. This webinar provides practical knowledge, making it your gateway to understanding the magic behind RTL-to-GDSII front-end… A Beginner’s Guide to RTL-to-GDSII Front-End Flow

  • FPGA Front Runner: FPGA Verification Strategies

    Rolls Royce Control Systems 5000 Solihull Parkway, Birmingham, United Kingdom

    Time Speaker Details 09.30 Arrival and Registration 10.00 Dave Sanders, Rolls-Royce Overview of Rolls Royce @ Solihull Presentation Title - Rolls-Royce… the past, the present and the future Abstract - Rolls-Royce has come a long way since its inception as a car manufacturer at the start of the twentieth century, for starters it doesn’t make cars anymore!… FPGA Front Runner: FPGA Verification Strategies

  • SISPAD 2024

    The Westin San Jose 302 S Market Street, San Jose, CA, United States

    The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.… SISPAD 2024

  • TSMC North America OIP Ecosystem Forum 2024

    Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

    Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… TSMC North America OIP Ecosystem Forum 2024

  • GSA U.S. Executive Forum 2024

    Rosewood Sand Hill 2825 Sand Hill Road, Menlo Park, CA, United States

    THE JOURNEY TO A $1T GLOBAL INDUSTRY The GSA US Executive Forum will delve into the semiconductor industry’s journey toward achieving the trillion-dollar milestone. The industry operates in a complex environment where global forces intersect with regional dynamics. Industry executives will explore the delicate balance between globalization and regionalization, considering both opportunities and challenges while… GSA U.S. Executive Forum 2024

  • Learn How to Simulate 2D-TMD-Channel FETs with Atomistic Precision

    Are 2D-TMD-channel transistors suitable candidates for the replacement of silicon ? Considering the extreme scaling down to a few atomic layers of the FET channel, only an atomistic solution looks viable. In this context, we show how the Victory Atomistic tool can answer this essential question thanks to quantum mechanics, offering valuable support for the… Learn How to Simulate 2D-TMD-Channel FETs with Atomistic Precision

  • Memory Users Conference 2024

    Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges.  … Memory Users Conference 2024

  • Interactive SPICE Model Verification Platform ME-Pro

    ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise, ME-Pro™ features… Interactive SPICE Model Verification Platform ME-Pro

  • Memory Users Conference 2024 – China, Taiwan

    Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges.  … Memory Users Conference 2024 – China, Taiwan

  • VC Formal Special Interest Group

    Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United States

    Register for the Synopsys VC Formal Special Interest Group (SIG) event today. This event provides an opportunity for users, managers, and enthusiasts to stay connected with the latest formal verification innovations, techniques and methodologies. Industry leaders such as Amazon, Black Sesame, Microsoft, NVIDIA, Samsung, and Untether AI will share their experiences with the latest formal… VC Formal Special Interest Group

  • Signoff Special Interest Group

    Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United States

    Join us at this year’s Synopsys Signoff SIG (Special Interest Group) event. Signoff is a critical quality control checkpoint in the chip development process, but design complexity and advance process nodes are pushing the boundaries of what is expected of signoff solutions. Meeting these scaling challenges is becoming more difficult. At this year’s Synopsys Signoff… Signoff Special Interest Group