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Deep Dive into the UVM Register Layer: User-Defined Doors, Predictors, and Callbacks
This webinar focuses on three specific aspects of the UVM register layer that will help you to model in UVM some of the less obvious ways in which registers can… Deep Dive into the UVM Register Layer: User-Defined Doors, Predictors, and Callbacks
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CMOS Circuit Techniques for Wireline Transmitters Part I
Synopsys Webinar – Part I In this 3-part Synopsys webinar series, we will present how hyperscale data centers are going through a paradigm shift with the advent of technologies like… CMOS Circuit Techniques for Wireline Transmitters Part I
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CHIPS Alliance – FuseSOC: Package manager and build abstraction tool for FPGA/ASIC development
Google 237 Moffett Park Drive, Sunnyvale, CA, United StatesIP share and reuse is fundamental for efficient chip design. But in order to do this efficiently we need tools and methods. On the software side, the concept of package… CHIPS Alliance – FuseSOC: Package manager and build abstraction tool for FPGA/ASIC development
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Ways to run cocotb: makefiles, cocotb-test, or your custom setup
cocotb enables Python-based hardware verification, and it integrates into your simulator of choice, such as Aldec's Riviera-PRO and executes Python testbenches in that context. In this webinar, we will look… Ways to run cocotb: makefiles, cocotb-test, or your custom setup
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Elevating Consumer Electronics Design Through Cloud-Based Simulation
Electronics design engineering teams are under incredible pressure to quickly deliver innovative new product designs to meet skyrocketing market demand. Sign up for this webinar to learn more about designing… Elevating Consumer Electronics Design Through Cloud-Based Simulation
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Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems
Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as… Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems
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ISTFA 2023
Phoenix Convention Center 100 North Third Street, Phoenix, AZ, United StatesSaving global resources by increasing energy efficiency is among the most significant problems that global society must address today. To achieve this, a major target is developing efficient and reliable… ISTFA 2023
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CadenceCONNECT: The Race Is On!
Cadence San Jose, CA, United StatesEvent Overview Date: Monday, November 13, 2023 Time: 8:30am – 4:00pm, followed by an exclusive networking event Location: Cadence Headquarters, San Jose, CA There is an unprecedented demand for advanced-node chip design that… CadenceCONNECT: The Race Is On!
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PCB Design Best Practices: Design Automation
re you harnessing the full power of your PCB design software? In this live discussion, experts Stephen Chavez and Ray Macias will discuss the benefits of using PCB design automation, and… PCB Design Best Practices: Design Automation
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DVCon Europe 2023
Holiday Inn Munich - City Centre Hochstraße 3, Munich, GermanyThe Design and Verification Conference & Exhibition Europe (DVCon Europe) is the premier European technical conference on system, software, design, verification, validation and integration. It is a place where the… DVCon Europe 2023
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Automated Constraints Promotion Methodology from IP to SoC for Complex Designs
IP cores require integration into top-level subsystems and/or SoCs. Writing constraints manually for top level design is prone to errors and difficult to verify and manage. This Synopsys webinar will… Automated Constraints Promotion Methodology from IP to SoC for Complex Designs
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Leverage Certified RISC-V IP to Craft ASIL ISO 26262 Grade Automotive Chips
As semiconductor industry leaders, Bosch, Infineon, Nordic Semiconductor, NXP, and Qualcomm collaborate to drive the acceleration of automotive RISC-V semiconductors, join us for an insightful webinar on how you too… Leverage Certified RISC-V IP to Craft ASIL ISO 26262 Grade Automotive Chips
12 events found.