BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Marketing EDA - ECPv6.17.1//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-ORIGINAL-URL:https://marketingeda.com X-WR-CALDESC:Events for Marketing EDA REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20230312T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20231105T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20240310T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20241103T090000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0800 TZOFFSETTO:-0700 TZNAME:PDT DTSTART:20250309T100000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0700 TZOFFSETTO:-0800 TZNAME:PST DTSTART:20251102T090000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Berlin BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20250330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20251026T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/London BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20241027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0000 TZOFFSETTO:+0100 TZNAME:BST DTSTART:20250330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0100 TZOFFSETTO:+0000 TZNAME:GMT DTSTART:20251026T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Europe/Madrid BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20230326T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20231029T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20240331T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20241027T010000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:+0100 TZOFFSETTO:+0200 TZNAME:CEST DTSTART:20250330T010000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:+0200 TZOFFSETTO:+0100 TZNAME:CET DTSTART:20251026T010000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Taipei BEGIN:STANDARD TZOFFSETFROM:+0800 TZOFFSETTO:+0800 TZNAME:CST DTSTART:20230101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20230312T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20231105T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20240310T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20241103T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20250309T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20251102T060000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Kolkata BEGIN:STANDARD TZOFFSETFROM:+0530 TZOFFSETTO:+0530 TZNAME:IST DTSTART:20230101T000000 END:STANDARD END:VTIMEZONE BEGIN:VTIMEZONE TZID:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:20230101T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241023T090000 DTEND;TZID=America/Los_Angeles:20241023T100000 DTSTAMP:20241009T193236Z CREATED:20241009T193236Z LAST-MODIFIED:20241009T193236Z UID:8402-1729674000-1729677600@marketingeda.com SUMMARY:Hardware Verification using VirtuaLAB DESCRIPTION:VirtuaLAB protocol solutions offer a full-stack testing environment with seamless connectivity and stimulus traffic generation for designs under test. It operates autonomously\, adapting to scenarios without requiring protocol knowledge from the user. VirtuaLAB significantly reduces test and compliance suite regression times\, running at high emulation speeds\, integrated with Protocol Analyzer for complete protocol visibility and performance metrics. Supporting any scenario\, it enables users to focus on their design’s unique value while ensuring reliable standard protocol interactions. \nWho Should Attend: \n\nEngineers and Managers responsible for System Design Verification of complex SoCs\nEngineers and Managers responsible for design performance verification\n\nWhat you will learn: \n\nAttendees will learn how VirtuaLAB protocol solutions provide a full stack from the physical to the application layer to connect to your design under test and create stimulus traffic as a host\, or respond to commands in the form of a compliant device.\nAttendees will learn the ease of bring-up of a VirtuaLAB environment with no testbench required\, but how to use real-world software to create workloads exactly matching the end-user of your silicon.\nAttendees will see a demonstration of VirtuaLAB running a back-to-back UFS4 host model and RTL SSD model DUT\, running the LLAMA 3.1 LLM\, and providing query responses in real-time.\n\nSpeaker:\n\n\n\n\n\n\nBen Whitehead\nDirector of Product Management\, Siemens EDA\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/hardware-verification-using-virtualab/ LOCATION:CA CATEGORIES:EDA,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Siemens-October-23-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241022T080000 DTEND;TZID=America/Los_Angeles:20241023T170000 DTSTAMP:20240805T221745Z CREATED:20240805T221455Z LAST-MODIFIED:20240805T221745Z UID:8202-1729584000-1729702800@marketingeda.com SUMMARY:RISC-V Summit - North America 2024 DESCRIPTION:RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped\, powering new innovations in AI/ML\, wireless\, automotive. data center\, space\, IoT\, embedded and more. Each day\, thousands of engineers around the world collaborate and contribute to advance RISC-V. The RISC-V community shares the technical investment and helps shape the architecture’s strategic future so everyone may create more rapidly\, enjoy a new level of design freedom\, and substantially reduce the cost of innovation. Anyone\, anywhere can benefit from these contributions. \nThis October\, the global RISC-V community – including technical\, industry\, domain\, ecosystem and special interest groups who define the architecture’s specifications – will meet in Santa Clara\, California to share technology breakthroughs\, industry milestones\, and case studies\, as well as to network and build relationships. Come be part of the RISC-V movement. \n\n\n\nThe festivities kick off with RISC-V Member Day\, where technical and industry working groups meet in person to share updates on the status of various efforts.\nNext\, the RISC-V Summit North America features two days of compelling technical and industry keynotes and conference sessions\, paired with an expo featuring dozens of community members showcasing their the latest solutions.\n\nIt’s community-curated content\, research and innovation driving the next wave of growth for RISC-V. \nLearn about software\, systems\, development tools\, security\, the latest use cases in key markets and more. It’s all here. \nDefine the future. Build your knowledge and expertise. Grow your network. It’s all during RISC-V Summit North America. Come join us! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/risc-v-summit-north-america-2024/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/RISC-V-Summit-US-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241022T080000 DTEND;TZID=America/Los_Angeles:20241023T170000 DTSTAMP:20240725T182818Z CREATED:20240725T182742Z LAST-MODIFIED:20240725T182818Z UID:8184-1729584000-1729702800@marketingeda.com SUMMARY:Jasper User Group San Jose 2024 DESCRIPTION:The CadenceCONNECT: Jasper User Group San Jose will be held in person on October 22 – 23 at the Cadence San Jose campus. This interactive\, in-depth technical conference connects designers\, verification engineers\, and engineering managers from around the world to share the latest design and verification practices based on Cadence’s Jasper formal verification technologies and methodologies. \nShare Your Story\nWe’re seeking your unique perspectives on using Jasper technologies and methodologies to achieve better results. If your presentation is accepted\, you can: \n\nIncrease industry visibility for you and your team’s field of expertise\nImprove and fine-tune your methods with insights from colleagues across the industry\nEarn wide acclaim with a Best Presentation Award nomination\n\n  \nPlease visit the website for further information. Accepted authors are expected to attend the conference and present in person. The deadline for abstract submission is 5:00pm PDT on Monday\, August 26\, 2024. \nConference registration will open at the end of August. We look forward to meeting you at Jasper User Group San Jose 2024! \nQuestions? Please email us. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/jasper-user-group-san-jose/ LOCATION:Cadence Design Systems\, Bldg 10\, 2655 Seeley Avenue\, San Jose\, CA\, United States CATEGORIES:EDA,User Group ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Jasper-October-22-23-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241017T110000 DTEND;TZID=America/Los_Angeles:20241017T120000 DTSTAMP:20241014T214312Z CREATED:20241014T214312Z LAST-MODIFIED:20241014T214312Z UID:8416-1729162800-1729166400@marketingeda.com SUMMARY:Static and Dynamic CDC Verification of AXI4 Stream-based IPs DESCRIPTION:The AXI4 Stream protocol is used as a standard interface to exchange data between connected IPs within FPGA designs. For crossing clock domains\, the AXI4 Stream interconnect is based on switches capable of transferring data to another asynchronous clock domain. The alternative solution is a dual-port AXI4 Stream IP\, capable of changing clock domains when packet routing is not required. \nStatic and dynamic clock domain crossing (CDC) verification methods complement each other to ensure flawless operation of multi-clock designs. ALDEC_CDC rules plugin contains 58 rules for checking design quality\, design constraints\, and clock and reset trees. It is also used for validating design synchronization circuits. However\, static CDC verification methods alone may not guarantee the completeness of the CDC verification task. Dynamic CDC verification is crucial. The two main methods for dynamic CDC verification are checking with CDC assertions and modeling of random delay insertion on clock domain crossings.\n\nIn this webinar\, we will introduce both static and dynamic verification methods for CDC verification of AXI4 Stream-based IPs. We will discuss the CDC assertions that are auto-generated from ALINT-PRO\, and we will also demonstrate the design and usage of the synchronizer models with random delay insertion.\n\nAgenda:\n\nCDC verification process overview\n\nStatic CDC verification checks\nAssertions usage in CDC verification\nThe concept of delay randomization at CDC crossing in functional simulation\n\n\nAXI Stream protocol overview\nAXI CDC Port Verification\n\nRunning CDC static checks with ALINT-PRO\nGeneration SV Assertion with ALINT-PRO\nDeveloping the testbench for AXI CDC Port dynamic verification\nSimulating design with generated CDC assertions\nSimulating design with random delay insertion in synchronizer models\n\n\nConclusion\nQ&A\n\n\nWebinar Duration\n\n45 min presentation/live demo\n\nBio: \nAlex Gnusin\, Aldec’s ALINT-PRO Product Manager \nAlex accumulated 27 years of hands-on experience in various aspects of ASIC and FPGA design and verification. As a verification prime for a multi-million gates project in companies such as IBM\, Nortel\, Ericsson and Synopsys Inc\, he combined various verification methods such as static linting\, formal property checking\, dynamic simulation and hardware-assisted acceleration to efficiently achieve design verification goals. He received his M.S. in Electronics from Technion\, Israel Institute of Technology. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/static-and-dynamic-cdc-verification-of-axi4-stream-based-ips/ LOCATION:CA CATEGORIES:EDA,IP,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Aldec-October-17-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241017T080000 DTEND;TZID=America/Los_Angeles:20241017T170000 DTSTAMP:20240806T194900Z CREATED:20240806T194900Z LAST-MODIFIED:20240806T194900Z UID:8209-1729152000-1729184400@marketingeda.com SUMMARY:OSMOSIS 2024 DESCRIPTION:Elevate your success with osmosis 2024\nThe annual osmosis event is a dynamic platform for exchanging successes achieved through applying formal techniques to overcome verification challenges. It offers a unique opportunity to connect and engage with our accomplished research and development (R&D) experts and participants. If you possess a compelling achievement narrative\, we invite you to unveil it at osmosis. \nYou will benefit from increased industry visibility as a subject matter expert\, and the conversations that follow may help you and others improve formal-based verification solutions. \n\n\nAbstract guidelines\nCraft a concise narrative outlining the essential bits of your success story\, encompassing: \n\nthe intricate problem you addressed\nrationale for employing formal technology-based solutions\ntangible outcomes\, ideally quantifiable\nkey learnings and findings\n\nFor utmost impact\, please limit your abstract to a single page\, front and back. \nInclude diagrams and code examples if desired. \nIf you have questions or need guidance in refining your narrative\, please reach out to us at osmosis.sisw@siemens.com \n\n\nSchedules and processes\nThe deadline for abstract submissions is 6 p.m. Central EU time on Mon.\, Sept. 23\, 2024. \nSubmissions will be evaluated as they are received. As we select abstracts\, we will begin working with the authors on their presentations. If we fill the agenda early\, we’ll close submissions. \n\n\nWe look forward to receiving your abstracts and seeing you in Munich! \n\n\nOn-demand presentations\nCheck out past\, on-demand presentations. \n\nOsmosis Aerospace and Defense – April 2024\nOsmosis Aerospace and Defense – 2023\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/osmosis-2024/ LOCATION:Holiday Inn City Center\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:EDA,User Group ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/OSMOSIS-2024-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241015T100000 DTEND;TZID=America/Los_Angeles:20241015T110000 DTSTAMP:20241008T164139Z CREATED:20241008T164139Z LAST-MODIFIED:20241008T164139Z UID:8399-1728986400-1728990000@marketingeda.com SUMMARY:ARM corelink\, Arteris NoC\, UCIe\, Bunch-of-wires\, CXL and PCIe- Designing the interconnect is not for the weak-hearted DESCRIPTION:There are so many options for Network-on-Chip: ARM-Corelink CMN700\, Arteris FlexNoC\, open-source NoC interconnect\, and of course developing home-grown fully customized solutions. Where does each solution fit? Where do we use it- backplane vs inside domains? How does AMBA AXI or PCIe or CXL fit in the mix? With the advent of chiplet\, do we go with UCIe or bunch-of-wires. Where do we locate the DRAM and the task scheduler? Lots of questions need to be answered before the SoC or chiplets can be implemented. \nIn this Webinar\, we will take the mystery out of these architecture decisions by demonstrating how system modeling can provide quantitative metrics to validate and optimize these requirements. For this purpose we will use the mapping of a CNN- Resnet 50 on an AI processor\, Open Architecture Management (OAM) system\, heterogeneous compute SoC-FPGA and development of a custom NoC. \nTo measure the quality of the design\, we will show the running of standard and synthetic workloads. Quantitative metrics generated will include latency\, throughput\, buffer occupancy\, peak power consumed\, heat generated\, cache hit-miss and memory bandwidth. We will also show how the source of bottlenecks can be identified. The design can be experimented with different routing schemes\, schedulers\, buffer size\, clock speeds\, flits\, clock domains\, flow control credit and quality-of-service. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/arm-corelink-arteris-noc-ucie-bunch-of-wires-cxl-and-pcie-designing-the-interconnect-is-not-for-the-weak-hearted/ LOCATION:CA CATEGORIES:EDA,IP,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Mirabilis-October-15-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241015T080000 DTEND;TZID=America/Los_Angeles:20241017T170000 DTSTAMP:20241014T202014Z CREATED:20241014T202014Z LAST-MODIFIED:20241014T202014Z UID:8413-1728979200-1729184400@marketingeda.com SUMMARY:2024 OCP Global Summit DESCRIPTION:The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights\, foster partnerships and showcase cutting-edge advancements in open hardware and software. \nThe 2024 OCP Global Summit theme is “From Ideas to Impact”. This encapsulates the transformative journey at the heart of the Open Compute Project. This year’s theme reflects OCP’s commitment to fostering innovation that transcends theoretical discussions and manifests into real-world solutions. As the pace of technological evolution accelerates and development cycles shorten\, our industry is forced to rapidly respond to emerging trends and needs. By harnessing the collective expertise of our global community\, we turn visionary ideas into groundbreaking technologies that drive openness\, efficiency\, sustainability\, scalability and growth in the data center industry. Our focus honors the relentless pursuit of progress and the profound impact that OCP’s community-driven innovation can achieve. OCP transforms concepts into impactful advancements. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/2024-ocp-global-summit/ LOCATION:San Jose Convention Center\, 150 W San Carlos Street\, San Jose\, CA\, 95113\, United States CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/2024-OCP-Global-Summit.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Berlin:20241015T080000 DTEND;TZID=Europe/Berlin:20241016T170000 DTSTAMP:20240130T165521Z CREATED:20240130T165521Z LAST-MODIFIED:20240130T165521Z UID:7564-1728979200-1729098000@marketingeda.com SUMMARY:DVCon Europe 2024 DESCRIPTION:The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages\, tools\, and intellectual property for the design and verification of electronic systems and integrated circuits. Sponsored by Accellera Systems Initiative\, DVCon Europe brings chip architects\, design and verification engineers\, and IP integrators the latest methodologies\, techniques\, applications\, and demonstrations for the practical use of EDA solutions for electronic design. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-europe-2024/ LOCATION:Holiday Inn Munich – City Centre\, Hochstraße 3\, Munich\, 81669\, Germany CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-Europe-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241010T110000 DTEND;TZID=America/Los_Angeles:20241010T120000 DTSTAMP:20241007T181311Z CREATED:20241007T181311Z LAST-MODIFIED:20241007T181311Z UID:8383-1728558000-1728561600@marketingeda.com SUMMARY:The Development and Evolution of Verilog & SystemVerilog DESCRIPTION:Abstract: \nSystemVerilog is a super next-generation Verilog with a fancy marketing name. SystemVerilog leveraged many of its features from other languages and methodologies. Class-based capabilities\, constrained random testing (CRT)\, and functional coverage were all features that were added to SystemVerilog and incorporated into the Universal Verification Methodology (UVM). UVM has become the most dominant and powerful verification methodology used to verify designs by engineers today. \nCliff Cummings has been a member of the Verilog & SystemVerilog Standards Groups since 1994 and will offer his unique and historical perspective on how features were added to SystemVerilog\, why the features were added\, and the origins of many of those features.\n\nAgenda:\n\nVerilog HDL and Its Ancestors and Descendants (reference paper)\nBrief History of Verilog & SystemVerilog\nHILO\, Verilog\, C\, PLI\nSDF\, Synthesis\, VHDL\, VPI\nSuperlog\, IHDL (Intel)\, SystemC\, Vera\nOOP\, e-Specman\, SystemVerilog\, C++\nOVL\, PSL\, SVA\nOVM / UVM history\nSimulation & Functional Coverage\nQ&A\n\n\nWebinar Duration\n\n45 min presentation/live demo\n15 min Q&A\n\nBio: \nClifford E. Cummings\, \nVice President of Training at Paradigm Works and Founder of Sunburst Design \nCliff Cummings is Vice President of Training at Paradigm Works and Founder of Sunburst Design. Cliff teaches world-class SystemVerilog\, UVM\, CDC and synthesis training classes. Cliff has 42 years of ASIC\, FPGA and system design experience and 32 years of combined Verilog\, SystemVerilog\, UVM verification\, synthesis\, and methodology training experience.  Cliff has taught expert Verilog\, SystemVerilog\, Design Synthesis\, CDC and UVM Verification to thousands of engineers world-wide and has presented more than 50 papers on these topics.  Cliff holds a BSEE from Brigham Young University and an MSEE from Oregon State University. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/the-development-and-evolution-of-verilog-systemverilog/ LOCATION:CA CATEGORIES:EDA,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Aldec-October-10-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/London:20241008T120000 DTEND;TZID=Europe/London:20241008T130000 DTSTAMP:20240911T161307Z CREATED:20240911T161307Z LAST-MODIFIED:20240911T161307Z UID:8325-1728388800-1728392400@marketingeda.com SUMMARY:Cocotb 2.0: Modernize your testbenches for even more productivity DESCRIPTION:Cocotb 2.0 is the latest major version of cocotb\, ironing out many quirks that have accumulated over the years. With only small changes to your testbenches\, you can benefit from improved typing and less surprising corner cases. In this talk\, we’ll show what’s new in cocotb 2.0\, and how you can modernize your code bases to make best use of it.  We also have a presentation from a cocotb user performing HDL simulation with python cocotb\, with a Transaction Level Modelling (TLM) approach with a completely free and open source chain (GHDL simulator and WSL Linux). \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nAgenda (BST):\n\n\n\n\n\n\n\nTime\nSession Description\nSlides\nVideos\n\n\n12.00 BST\nWelcome and Introduction \nMike Bartley\,Tessolve\n\n\n\n\n12.00 BST\nSimple yet powerful: Open-source HDL simulation with Cocotb \nHayder Al-Hakeem ( Wärtsilä Finland)\n\n\n\n\n12.30 BST\nCocotb 2.0: Modernize your testbenches for even more productivity \nPhilipp Wagner ( FOSSi Foundation)\n\n\n\n\n13.00 BST\n  \nClose\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nAbout DVClub\n\n\n\n\nThe principal goal of each DVCLUB meeting is to have fun while helping build the European verification community through regular educational and networking events. Attendance at DVClub Europe meetings is free and is open to all non-service provider semiconductor professionals. Each meeting addresses a specific issue faced by the design and verification community and whatever your speciality provides an excellent opportunity for updating knowledge as well as share experiences\, insights and issues with other members of the verification community. \n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/cocotb-2-0-modernize-your-testbenches-for-even-more-productivity/ LOCATION:CA CATEGORIES:EDA,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-Europe-October-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241008T100000 DTEND;TZID=America/Los_Angeles:20241008T150000 DTSTAMP:20240917T161235Z CREATED:20240917T161235Z LAST-MODIFIED:20240917T161235Z UID:8340-1728381600-1728399600@marketingeda.com SUMMARY:Accelerating DFT verification sign-off with the Questa DFT Verification Platform DESCRIPTION:Accelerating DFT verification sign-off with the Questa DFT Verification Platform \nThis seminar will update you on technologies and techniques you can adopt to increase your DFT verification productivity today. Specifically\, we will cover:\n‌\nNavigating the Growing Complexity of Design-for-Test and Evolving Verification Challenges\nRevolutionizing Test Strategies to deliver reliable products into HPC\, Automotive\, Aerospace\, Medical\, and beyond\n‌ \nAgenda: \n10:00 am – 10:25 am\nRegistration and check-in\nCoffee and networking with your peers.\n‌\n10:25 am – 10:30 am\nWelcome/Intro\nHarsh Patel | Sr. AE Manager\, Functional Verification\n‌\n10:30 am -11:15 am\nUnderstanding and navigating the new challenges in Design-for-Test\nLee Harrison | Director of Product Marketing -Tessent\n‌\n11:15 am – 12:00 noon\nAccelerating verification closure with Siemens DFT tailored verification solutions\nJake Wiltgen | Director\, IC Verification Solutions\n‌\n12:00 noon – 12:30 pm\nLunch and networking\n‌\n12:30 pm – 1:15 pm\nEmbracing a New Era in DFT: Addressing High Defect Coverage\, Silent Data Errors\, and Emerging Challenges\nLee Harrison | Director of Product Marketing -Tessent\n‌\n1:15 pm – 2:00 pm\nIncreasing fault coverage with Siemens Functional Fault Grading solutions\nAnn Keffer | Product Manager\n‌\n2:00 pm – 3:00 pm\nWrap-up and networking \nWe look forward to seeing you!\n‌\nSiemens Advanced Functional Verification Team \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/accelerating-dft-verification-sign-off-with-the-questa-dft-verification-platform/ LOCATION:Siemens EDA\, 46871 Bayside Parkway\, Building B\, Fremont\, CA\, United States CATEGORIES:EDA,Workshop ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Siemens-October-8-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241008T080000 DTEND;TZID=America/Los_Angeles:20241011T170000 DTSTAMP:20240926T000653Z CREATED:20240906T174011Z LAST-MODIFIED:20240926T000653Z UID:8301-1728374400-1728666000@marketingeda.com SUMMARY:PCB West 2024 DESCRIPTION:For more than 30 years PCB West has trained designers\, engineers\, fabricators and\, lately\, assemblers on making printed circuit boards for every product or use imaginable. More than 2\,000 designers\, fabricators\, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables\, there’s something for everyone involved in the electronics supply chain. This is one show you cannot afford to miss. \nBrought to you by PCEA: Engineering Tomorrow’s Electronics! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/pcb-west-2024/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/PCB-West-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/Madrid:20241008T080000 DTEND;TZID=Europe/Madrid:20241010T170000 DTSTAMP:20240923T170650Z CREATED:20240923T170650Z LAST-MODIFIED:20240923T170650Z UID:8345-1728374400-1728579600@marketingeda.com SUMMARY:AutoSens Europe 2024 DESCRIPTION:Join us as we embark on an exciting new journey in the vibrant city of Barcelona!\n\n\n\n\nFrom 8-10 October 2024\, we will unite the AutoSens community at the Palau de Congressos in Barcelona to shape the future of ADAS and AV. \nExpect over 60 expert speakers\, engaging panels\, technical case studies\, and exploration of 12 key themes. Dive into an exhibition with cutting-edge demos from sensor and computer vision leaders. \nDon’t miss AutoSens Europe 2024 in Barcelona – the future of sensing tech awaits! \n\n\nDiscover the latest technology\n\n\n\n\nFrom innovative start-ups to industry giants\, the AutoSens exhibition floor is where our community comes together to make key connections over coffee\, have critical conversations in our igloo meeting pods\, and negotiate new partnerships over drinks at our networking sessions. \nRegister now to make the most of:\n\n\n\nAccess to an expert community of over 500 experts and engineers \n\n\n\n\n\nExtensive exhibition with over 50 stands showcasing the latest technology\n\n\n\n\n\n\n\nVehicle demos from leading Tier 1 and systems companies\n\n\n\n\n\n\n\nHigh quality technical presentations from genuine experts\n\n\n\n\n\n\n\nThought-leader panel discussions that shape the industry’s future direction\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/autosens-europe-2024/ LOCATION:Palau de Congressos\, Av. de la Reina Maria Cristina\, Barcelona\, Spain CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/AutoSense-Europe-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241003T113000 DTEND;TZID=America/Los_Angeles:20241003T170000 DTSTAMP:20240827T163546Z CREATED:20240827T163546Z LAST-MODIFIED:20240827T163546Z UID:8283-1727955000-1727974800@marketingeda.com SUMMARY:Signoff Special Interest Group DESCRIPTION:Join us at this year’s Synopsys Signoff SIG (Special Interest Group) event. \nSignoff is a critical quality control checkpoint in the chip development process\, but design complexity and advance process nodes are pushing the boundaries of what is expected of signoff solutions. Meeting these scaling challenges is becoming more difficult. At this year’s Synopsys Signoff SIG event\, we’ll explore how signoff can help meet these scalability challenges. We’ll here from several industry-leading companies how they are using the latest technology advances in timing\, power\, extraction\, and eco to realize the full PPA potential of their designs with the fastest path to design closure. \n\n\n\n\n\n\n\n\nAgenda\n\n\nMore details coming soon. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nThu. October 03\, 2024\n11:30 – 12:30 PM PDT\n\n\nRegistration Check in & Lunch\n\n\nBadge pick-up begins at 11:30. Lunch will be served\, come early for a chance to eat and network before sessions begin. \nRead Less \n\n\n\n\n\n\n\n\n\n\n\nThu. October 03\, 2024\n12:30 – 01:15 PM PDT\n\n\nKeynote\n\n\n\n\n\n\n\n\n\n\n\n\n\nThu. October 03\, 2024\n01:15 – 04:05 PM PDT\n\n\nTechnical Sessions\n\n\n\n\n\n\n\n\n\n\n\n\n\nThu. October 03\, 2024\n04:05 – 05:00 PM PDT\n\n\nNetworking Reception\n\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/signoff-special-interest-group/ LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States CATEGORIES:EDA,Seminar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Synopsys-October-3-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241003T090000 DTEND;TZID=America/Los_Angeles:20241003T170000 DTSTAMP:20240911T225246Z CREATED:20240911T225059Z LAST-MODIFIED:20240911T225246Z UID:8328-1727946000-1727974800@marketingeda.com SUMMARY:VC Formal Special Interest Group DESCRIPTION:Register for the Synopsys VC Formal Special Interest Group (SIG) event today. This event provides an opportunity for users\, managers\, and enthusiasts to stay connected with the latest formal verification innovations\, techniques and methodologies. \nIndustry leaders such as Amazon\, Black Sesame\, Microsoft\, NVIDIA\, Samsung\, and Untether AI will share their experiences with the latest formal verification technologies. Topics that will be covered include strategies for achieving formal convergence\, exploring formal methodologies used for RISC-V verification\, and the integration of VC Formal with generative AI functionalities – which offer the potential to automate the creation of formal verification testbenches. \nKeynote Session \n\nThe Impact of LLMs on Formal Verification \nExplore how LLMs can transform formal verification\, reducing manual effort and improving results. We’ll discuss current benchmarks and future goals for deploying LLMs to enhance formal verification processes. \nPresented by Syed Suhaib\, NVIDIA \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/vc-formal-special-interest-group/ LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, CA\, 95054\, United States CATEGORIES:EDA,User Group ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/VC-Formal-SIG-October-3-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241003T080000 DTEND;TZID=America/Los_Angeles:20241004T170000 DTSTAMP:20241004T174051Z CREATED:20241002T224220Z LAST-MODIFIED:20241004T174051Z UID:8372-1727942400-1728061200@marketingeda.com SUMMARY:Electronic Design Process Symposium (EDPS) - 2024 DESCRIPTION:EDPS 2024 is now taking shape. The place to be is once again SEMI\, in Milpitas\, and the dates are Thursday and Friday\, Oct 3rd and 4th\, 2024. \nRegistration is now open: https://2024-ieee-edps.eventbrite.com. Who needs to register? Please see the Registration page. \nTalks from EDPS 2023 and the last 24 years of EDPS\, are are available and searchable\, on the Prior Years page. \nDay 1\, Thursday 9:00am; Session 1\n9:05am\n\nEnergy and Thermal Management of Chips\, Systems and Datacenters Necessitates a Return to Fundamentals\nChandrakant Patel\nHP\n\n  \nThe latter part of 20th century witnessed the rise of the compute utility made up of large-scale data centers housing densely packed compute\, storage and networking equipment. The cyber age data centers became modern day factories requiring megawatts of power for the information technology (IT) equipment much like the process equipment in a factory of the machine age. Electrical energy supplied to the chips and systems in the data centers turned into multi-megawatts of heat energy which in turn required heat removal means. The active heat removal means also required power. While many innovative measures have been used for heat removal and energy management in data centers\, there is a substantial gap in application of fundamentals of engineering when compared to the approaches taken by the contributors of the 19th and early 20th century machine age. As an example\, machine age contributors performed exergy (2nd law of thermodynamics) analysis and deemed it necessary to build a hydro-electric plant as part of the design of an Aluminum factory. Indeed\, majority of data centers today rely on the power infrastructure built by our predecessors. Given the inexorable trajectory of data centers strongly driven by AI\, and associated demands on available energy\, it is time we returned to such fundamentals particularly given the environmental challenges. \nIn my talk\, I will present a holistic approach that traces the energy flow from a power plant to a chip\, and from the chip core to the cooling tower. \n10:00am\n\nEnabling Effortless Machine Learning for Embedded Edge Applications\nGopal Hegde\nSiMa.ai\n\n  \nMachine Learning is a game changing technology of our generation and similar Internet in the 1990s\, will impact every aspect of our life. While Machine Learning use cases and applications are well established in the cloud & IoT devices\, in the embedded edge market\, its usage is in its infancy. We at SiMa.ai are focused on disrupting this market by turbo charging embedded compute with the addition of machine learning. Embedded edge has space and power constraints and has a huge expertise gap relative to cloud computing when it comes to machine learning. The presentation covers market requirements\, key challenges and our unique software first approach to machine learning at embedded edge. We will discuss key market segments\, their unique requirements and how our silicon and software solutions provide a way for our customers to easily develop and deploy machine learning solutions that address their use cases and applications. \n10:35am\n\nAI: Trailblazing the Next Generation of Semiconductor Innovation\nVishal Khandewal\nSynopsys\n\n  \nWith AI-based applications coming pervasively mainstream through ChatGPT\, digital healthcare\, and almost everything else we do with our devices daily\, digital chip design is seeing an exponential push towards complexity\, performance\, power\, and time-to market. EDA tool flows are becoming mission critical to meet the demands of a hardware-led 4th industrial revolution that is driving everything towards being intelligent\, connected\, monitored and data-driven. In this talk we go into the details of how hardware design and EDA tools are evolving to deliver the next generation of performance\, power\, and productivity (PP&P) boost. Even with exponential growth in design productivity in the past decade\, overall design cycle is not meeting its intended targets. The technical complexity of advanced node design with new dominant effects like thermal and IR\, are leading to highly complex tool/methodology flows. This is where at Synopsys\, we have taken a full tool-stack approach to build pervasive AI into our tools to deliver unprecedented PP&P boost. We will share examples of applications ranging from design implementation\, verification\, test\, and analog/manufacturing to showcase the potential of this technology and how it is reshaping chip design workflows. Many of these technologies are taking us closer to the no-human-in-the-loop goal for chip design. With serious talent shortage and increase in solution complexity beyond human expertise\, AI-augmented solutions for chip design are the way forward. \n11:10am\n\nHarnessing LLMs for Advanced EDA Platforms: Code Generation and Beyond\nAkhilesh Kumar\nAnsys\n\n  \nLarge Language Models (LLMs) such as GPT-4\, Gemini\, Llama etc.\, have demonstrated astounding capabilities in a range of tasks such as knowledge extraction\, Q&A\, summarization\, code generation\, contextual problem solving etc. The LLMs can also be adapted to specific applications through a variety of methods such as fine tuning\, in-context learning\, RAG\, agent-based systems etc.\, making them quite versatile. \nModern EDA platforms\, such as Ansys SeaScape\, have sophisticated workflows\, hundreds of user APIs\, complex input data requirements\, and require deep domain knowledge and expertise for efficiently using the platform. This talk will discuss how LLMs can greatly improve the productivity and user experiences for such EDA platforms. The talk presents an overview of code generation techniques using LLMs and will discuss our experience in developing an LLM-based code generation solution for the Ansys SeaScape platform. Going beyond the code generation\, this presentation will discuss creating an LLM agent-based copilot for providing intuitive assistance to the users of the Ansys SeaScape platform for a variety of operational modalities. \n12:45pm\n\nThe Application of AI to Chip Design\nMark Ren\nNVidia\n\n  \nThe applications of AI in chip design undergo an evolutionary path. \nInspired by the success of AlphaGO\, Reinforcement Learning techniques were deployed to a number of design problems\, achieving results showing the potential of AI. \nThe advancement of Large Language Models further enabled the application of AI in a much broader set of design activities. \nLLM-based copilots can improve design productivity by providing knowledge and coding assistance; agents can provide further assistance in key design tasks such as analysis\, debugging\, and optimization. \nThe evolution of AI will continue\, and we will discuss critical challenges to realizing its revolutionary potential in the chip design process \n1:35pm\n\nHow AI is changing every aspect of EDA\, starting from transistor-level simulation\nSathishkumar Balasubramanian\nSiemens\n\n  \nThere is a lot of hype in the industry around AI\, but behind the hype there is the reality. That reality is that AI really is impacting virtually every aspect of semiconductor design. However\, its not as simple as taking general purpose AI solutions and hoping they work for EDA\, the risks are too high and when dealing with parts per billion (or trillion) in acceptable errors\, hallucinations are not acceptable. What is needed are Verifiable AI solutions that deliver results that users can trust and that reduce the overall resources needed to complete a task. At Siemens EDA we have been able to leverage Verifiable AI to accelerate virtually every aspect of the design and verification process. \nIn this presentation we will explore the requirements for\, and state of the art of\, AI in EDA application. We will explore AI’s impact on every aspect of design starting from transistor-level simulation. \n2:10pm\n\nTest\, Repair and Reliability Challenges of Chip-let Interconnects\nSreejit Chakravarty\nAmpere Computing\n\n  \nChip-let based design\, fueled by various advanced packaging technologies\, is projected to revolutionize the semiconductor industry. This brings along with it associated challenges to achieve adequate yield and aging related reliability issues. This talk will present manufacturing defect profiles associated with advanced packaging; the test and repair requirement\, during high volume manufacturing\, to achieve adequate yield; and challenges associated with latent defects leading to aging related field failures. RAS solutions required to address such reliability issues are highlighted. \n2:45pm\n\nArtificial Intelligence and Machine Learning for RF and Microwave Design\nJianjun Xu\nKeysight\n\n  \nThis talk reviews some powerful and practical Artificial Intelligence and Machine Learning (AI/ML) technologies for applications in traditional RF and Microwave design and beyond. After a very brief overview of the AI/ML landscape\, we focus on Artificial Neural Networks (ANNs) and provide several key examples of modern ANN applications to electronic\, electro-thermal\, and electro-chemical device modeling\, and behavioral modeling to illustrate the substantial benefits and generality of present techniques. \nThe talk concludes with a discussion of the potential of AI/ML technologies to address and solve future challenging and important RF and Microwave design problems\, e.g.\, for 6G. \n3:30pm\n\nPromises and Challenges of Digital Twin for Semiconductor Manufacturing\nAla Moradian\nApplied Materials\n\n  \nThe advancement of cutting-edge technologies like Artificial Intelligence (AI)\, Large Language Models (LLM)\, and Electric Vehicles (EV) demands sophisticated semiconductor devices with precise specifications. \nConcurrently\, the emergence of digital twins and AI stands as pivotal in facilitating the development and enablement of such technologies. \nThis talk delves into the vision and significance of AppliedTwin(tm)\, a proposed digital twin framework tailored for semiconductor manufacturing. \nAppliedTwin delineates various levels of abstractions ranging from digital fabrication facility down to digital twin of individual devices\, each characterized by distinct attributes governing their interaction with physical assets\, fidelity\, etc. \nApplied Materials has spearheaded the application of digital twins in semiconductor manufacturing with the introduction of EcoTwin(tm)\, a platform designed to promote sustainability. \nIn this talk the critical role of digital twins in propelling innovation and efficiency in semiconductor equipment manufacturing. \n4:05pm\n\nMaking Data Center Digital Twins a Reality\nPaul Harrison\nCadence\n\n  \nThis talk will discuss the application of Digital Twins to Data Centers. \nHistorically decisions for data center operations were made based on rules of thumb or the person who would most confidently put across their point of view. \nCabinet power densities continue to rise\, accelerated by AI\, increasing the need complex technologies like liquid cooling to be more widely implemented. This means data center operations have become more difficult to manage\, while the impact of their downtime can be catastrophic for companies. Fortunately\, data center operators are starting to adopt CFD-based Digital Twins to help inform their operational decisions\, improve their understanding\, and reduce the risks. This talk will explain how to create a Data Center Digital Twin\, some of the challenges with creating them\, how they integrate with data sources and existing processes\, and the benefits to operators this technology brings. \n4:40pm\n\nInnovating Semiconductor Manufacturing with ML-augmented Digital Twins\nNorman Chang\nElectronics\, Semiconductor\, and Optics BU\, Ansys\n\n  \nDeveloping each processing step in semiconductor manufacturing has heavily relied on in-situ sensors in the equipment and numerous try-outs in recipe generation. However\, with advancements in multiphysics simulation technologies\, an innovative ML-augmented hybrid simulation methodology has been developed. This methodology combines the strengths of multiphysics simulation and in-situ measurement in building semiconductor processing digital twins. In this talk\, we will review the current state-of-the-art digital twin technologies and identify the gaps that need to be addressed to fully utilize digital twins in developing new process recipes in semiconductor manufacturing. \n6:45pm\n\nSemiconductors and Artificial Intelligence:The Virtuous Cycle\nPushkar Apte\nSEMI\n\n  \nArtificial Intelligence (AI) has taken the world by storm\, and has become a strategic imperative for most industries. While the concept of AI is over half a century old\, it has accelerated rapidly just over the past decade\, in large part due to amazing advances in semiconductor chips. In turn\, AI is driving growth in semiconductor revenues and improvements in operational efficiency\, creating a virtuous cycle. \nHowever\, there are formidable roadblocks ahead. AI models and datasets are growing at an exponential rate\, far outpacing hardware advances – creating both performance and sustainability challenges. System-level innovation is required for continued progress in AI\, which requires meaningful collaboration and data-sharing – often difficult in an industry where IP is critical. \nThis presentation will focus on this virtuous cycle between semiconductors and AI\, highlighting the benefits\, challenges and solution paths for continued progress. \nDay 2\, Friday 9:00am; Session 1\n9:05am\n\nIs AI intelligent?\nRonjon Nag\nStanford Medicine\n\n  \nArtificial intelligence is in the news daily\, and people ask whether they are truly intelligent. \nMaybe it still lacks the depth of human intelligence today\, but where is already cleverer\, and what stops it from reaching the ultimate pinnacle of ”general intelligence” – could that ever be possible? We will consider the implications of creating truly intelligent machines and the potential consequences for human society. \n10:00am\n\nTrust Based Modeling for Improved Security\nNaresh Sehgal\nDeeply Human AI\n\n  \nThe present state of Edge Computing is an environment of different computing capabilities connected via various communication paths. Actors on the Edge may interact with each other and a central datacenter. An important part of information security is the evaluation of trust between actors\, whether those actors are people or machines. Although many distributed trust models exist\, our proposed model introduces three key concepts. The first concept is that trust is not bidirectional between two parties. The second concept is that trust is different between different actors\, based upon the nature of their relationships. The third concept is that trust depends on the content of a transaction. We will present some real-life examples to illustrate these concepts. \n10:35am\n\nAdvancing Hardware Security in the Post-Quantum Cryptography Landscape: Challenges and Solutions\nQian Wang\nU. Cal. Merced\n\n  \nHardware security in the era of post-quantum cryptography has become increasingly crucial due to the potential threat quantum computers pose to traditional cryptographic algorithms. Post-quantum cryptography aims to develop cryptographic algorithms that are resistant to attacks from quantum computers. However\, ensuring the security of these algorithms requires not only advancements in software but also robust hardware security measures. In this talk\, we will first discuss the implementation of quantum-resistant cryptographic modules on hardware platforms\, necessitating upgrades in both hardware and firmware to accommodate new algorithms efficiently. Moreover\, hardware implementations of cryptographic algorithms are vulnerable to side-channel attacks\, where an attacker exploits information leaked through physical characteristics such as power consumption or electromagnetic radiation. Post-quantum cryptographic hardware must incorporate countermeasures to mitigate these risks. \n11:20am\n\nScaling to Meet the Needs of AI\nPradeep Dubey\nIntel\n\n  \nArtificial intelligence (AI) is impacting not just what computing can do for us\, rather how computing gets done. Fast-evolving AI algorithms are driving demand for growing performance at an unprecedented rate and scale. This talk is about some of our research aimed at exploring technological and system-level opportunities for cost-effective scaling of emerging AI datacenters. \n1:00pm\n\nThe Future of Generative AI: Key Technology Trends and Innovations\nShiva Kintali\nR3AI\n\n  \nLLMs have emerged as powerful tools\, revolutionizing various domains from natural language processing to content generation\, but beneath their remarkable capabilities lie intricate challenges and perils that demand our attention. \nWhile they offer convenience and productivity\, we dissect how they can also be manipulated and weaponized by malicious actors\, raising concerns about inherent biases\, jailbreaking potential\, security concerns\, privacy issues\, misinformation\, deepfakes\, cyber threats and their unsettling societal consequences. We explore how biases present in training data\, historical injustices\, and societal prejudices can be perpetuated and even amplified by these models\, posing a significant threat to fairness\, equity\, and inclusivity. \nThis talk is aimed at raising awareness and engage the audience in a critical dialogue on these multifaceted challenges posed by LLMs. By understanding these challenges\, we can collectively work towards harnessing the power of these models for the betterment of society while safeguarding against their unintended consequences. \n1:35pm\n\nEmerging Technologies for Computing Paradigm Shift\nBrandon Wang\nSynopsys\n\n  \nThe explosive growth of AI has triggered a rapid increase in semiconductor demand\, leading to soaring power consumption and unsustainable water usage. This presentation will explore emerging technologies essential for driving a paradigm shift towards energy-efficient computing. Topics will include the “Shift Left” design methodology\, the impact of SLMs (Small Language Models) on computational efficiency in AI\, and the potential of neuromorphic and quantum computing as next-generation architectures. These advancements are poised to enable significant digital transformation and drive pervasive intelligence across various industries. The speaker will also provide insights into how organizations can stay at the cutting edge of these innovations\, offering a forward-looking perspective on the future of computational systems and the strategic steps needed to lead in this rapidly evolving landscape. \n2:10pm\n\nTBD\nChris Cheng\nHewlett-Packard Enterprise\n  \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/electronic-design-process-symposium-edps-2024/ LOCATION:SEMI\, 673 S. Milpitas Blvd\, Milpitas\, CA\, United States CATEGORIES:EDA,Symposium ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/edps-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241002T090000 DTEND;TZID=America/Los_Angeles:20241002T100000 DTSTAMP:20240906T215750Z CREATED:20240906T215750Z LAST-MODIFIED:20240906T215750Z UID:8307-1727859600-1727863200@marketingeda.com SUMMARY:Redefining Mobile Experiences with AI - Session 2 DESCRIPTION:The Arm platform is providing the foundation for the next wave of AI smartphones and laptops. As AI models rapidly evolve\, we’re seeing that software begins to outpace hardware\, requiring additional innovation at all levels of the compute stack. \nTo meet these growing demands\, the Arm platform offers a new compute solution for maximum performance and efficiency\, on leading process nodes. Join this webinar series to learn more about this solution\, including the latest Arm Armv9 CPUs and GPUs\, the benefits and opportunities of running AI on device\, and how to innovate and speed time to market. \nThe CPU Cluster on Wednesday\, Oct 2\, 2024\n\n9:00 a.m. BST / 4:00 p.m. Beijing\n5:00 p.m. BST / 9:00 a.m. PT\n\nThis webinar covers: \n\nAn overview of Arm’s most performant\, efficient\, and versatile CPU cluster based on the Armv9 architecture for maximum performance and power efficiency.\nFeatures\, benefits\, and performance enhancements of Arm Cortex-X925\, Cortex-A725 CPU\, Cortex-A520 CPU and Arm DSU-120.\nHow this CPU cluster can improve consumer experiences on mobile devices.\n\nSpeaker: Manish Pandey\, Senior Product Manager\, Arm \nFirst Session – September 18th \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/redefining-mobile-experiences-with-ai-session-2/ LOCATION:CA CATEGORIES:IP,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Arm-September-18-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Taipei:20241002T080000 DTEND;TZID=Asia/Taipei:20241002T170000 DTSTAMP:20240826T192110Z CREATED:20240826T192110Z LAST-MODIFIED:20240826T192110Z UID:8276-1727856000-1727888400@marketingeda.com SUMMARY:Memory Users Conference 2024 - China\, Taiwan DESCRIPTION:Advancements in memory technology are fueling rapid growth in big data applications across AI\, 5G\, Automotive\, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated\, while the latest technology nodes have introduced some new ones. At Synopsys\, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. \n  \nWhy Attend?\nMemory vendors are accelerating the shift to next-generation HBM and new memory architectures to cater to the insatiable demand for high bandwidth\, high performance memories driven by AI applications. \nThese next-generation designs pose many challenges for memory designers. Some long-standing challenges have been exacerbated\, and some new ones have been introduced. \nThe Synopsys Memory Users Conference aims to provide a forum for memory companies and Synopsys experts to share their perspectives on ways to address the industry’s most compelling and topical challenges. Drop in to learn more \n\n\n\n\n\nAgenda At-a-Glance\n\n\nLearn more about the themes we will explore during this virtual event. More information around sessions are being confirmed daily\, so be sure to check back often for new information. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nTime\nTopic\n\n\n08:00 am\nOpening Keynote\n\n\n08:30 am\nAccelerating the Path from Technology Development to High-Volume Manufacturing\nwith participation of Western Digital\n\n\n09:00 am\n\n\n09:30 am\nSolving “Unsolvable Problems” in Memory Design & Verification\nwith participation of Samsung\n\n\n10:00 am\n\n\n\n10 Minute Break\n\n\n10:40 am\nAccelerating SoC Development with Memory IP\nwith participation of STMicroelectronics and Weebit Nano\n\n\n11:10 am\n\n\n11:40 am\nEnsuring Memory Reliability for Mission Critical Applications\n\n\n12:10 pm\n\n\n12:40 pm\nIndustry Panel\n\n\n\n\nVirtual Event \n\nOctober 1st\, 8:00AM PST\nOctober 2nd\, 8:00AM GMT +8\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/memory-users-conference-2024-china-taiwan/ LOCATION:CA CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Synopsys-October-1-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241001T110000 DTEND;TZID=America/Los_Angeles:20241001T113000 DTSTAMP:20240930T220024Z CREATED:20240930T220024Z LAST-MODIFIED:20240930T220024Z UID:8361-1727780400-1727782200@marketingeda.com SUMMARY:Interactive SPICE Model Verification Platform ME-Pro DESCRIPTION:ME-Pro™ is a unified tool for designers\, process developers\, modeling engineers\, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. \nThis comprehensive platform supports evaluation across device\, circuit\, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise\, ME-Pro™ features pre-configured templates\, hundreds of verification data entries\, and the built-in NanoSpice parallel simulator that is all designed to streamline setup and reduce learning curves. \nPresenter\nErik Supnet is a Senior Application Engineer at Primarius for two years supporting pre-sales and post-sales activities for modeling and simulation products. He earned his B.S. in Computer Engineering and M.A in Education at the University of the Pacific. Prior to his current role\, he held design engineering positions as D.E.C\, SiByte\, Broadcom\, and Intel\, and has a background in custom circuit design\, automation\, methodologies\, and education. \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/interactive-spice-model-verification-platform-me-pro/ LOCATION:CA CATEGORIES:EDA,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/primarius-October-1-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20241001T080000 DTEND;TZID=America/Los_Angeles:20241001T120000 DTSTAMP:20240826T192125Z CREATED:20240826T191744Z LAST-MODIFIED:20240826T192125Z UID:8273-1727769600-1727784000@marketingeda.com SUMMARY:Memory Users Conference 2024 DESCRIPTION:Advancements in memory technology are fueling rapid growth in big data applications across AI\, 5G\, Automotive\, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated\, while the latest technology nodes have introduced some new ones. At Synopsys\, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. \n  \nWhy Attend?\nMemory vendors are accelerating the shift to next-generation HBM and new memory architectures to cater to the insatiable demand for high bandwidth\, high performance memories driven by AI applications. \nThese next-generation designs pose many challenges for memory designers. Some long-standing challenges have been exacerbated\, and some new ones have been introduced. \nThe Synopsys Memory Users Conference aims to provide a forum for memory companies and Synopsys experts to share their perspectives on ways to address the industry’s most compelling and topical challenges. Drop in to learn more \n\n\n\n\n\nAgenda At-a-Glance\n\n\nLearn more about the themes we will explore during this virtual event. More information around sessions are being confirmed daily\, so be sure to check back often for new information. \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nTime\nTopic\n\n\n08:00 am\nOpening Keynote\n\n\n08:30 am\nAccelerating the Path from Technology Development to High-Volume Manufacturing\nwith participation of Western Digital\n\n\n09:00 am\n\n\n09:30 am\nSolving “Unsolvable Problems” in Memory Design & Verification\nwith participation of Samsung\n\n\n10:00 am\n\n\n\n10 Minute Break\n\n\n10:40 am\nAccelerating SoC Development with Memory IP\nwith participation of STMicroelectronics and Weebit Nano\n\n\n11:10 am\n\n\n11:40 am\nEnsuring Memory Reliability for Mission Critical Applications\n\n\n12:10 pm\n\n\n12:40 pm\nIndustry Panel\n\n\n\n\nVirtual Event \n\nOctober 1st\, 8:00AM PST\nOctober 2nd\, 8:00AM GMT +8\n\n\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/memory-users-conference-2024/ LOCATION:CA CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Synopsys-October-1-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240926T100000 DTEND;TZID=America/Los_Angeles:20240926T110000 DTSTAMP:20240911T233717Z CREATED:20240911T233717Z LAST-MODIFIED:20240911T233717Z UID:8333-1727344800-1727348400@marketingeda.com SUMMARY:Learn How to Simulate 2D-TMD-Channel FETs with Atomistic Precision DESCRIPTION:Are 2D-TMD-channel transistors suitable candidates for the replacement of silicon ? Considering the extreme scaling down to a few atomic layers of the FET channel\, only an atomistic solution looks viable. In this context\, we show how the Victory Atomistic tool can answer this essential question thanks to quantum mechanics\, offering valuable support for the prototyping effort of a 2D transistor in a professional TCAD environment. \nWhat You Will Learn\n\nAn understanding of the physics and engineering of 2D TMD NR architectures at the atomic scale\nWhy to use Atomistic TCAD\nHow to simulate and prototype at the atomic level\nExample of a 2D-TMD TFET\n\n\n\n\n\n\nPresenter\n\n\n\n\nDr. Philippe Blaise\, Senior Application Engineer\, Silvaco\, Inc. \nDr. Philippe Blaise has been a senior application engineer in atomistic simulation at Silvaco’s TCAD Division for three years. Prior to joining Silvaco\, Dr. Blaise was a senior engineer specialized in atomistic simulation of new memory devices and transistors at CEA/LETI for 15 years. He is a former member of the IEEE IEDM Modelling and Simulation Committee. He is co-author of more than 50 papers in peer-review journals in the field and 30 contributions to conferences and workshops\, plus 5 patents and one book chapter.\nDr. Blaise holds a Master’s degree in applied mathematics from ENSIMAG engineering school and a Ph.D. in solid states physics from the Université Grenoble Alpes\, France. \n\n\n\n\n\nWHO SHOULD ATTEND:\n\n\n\n\nTCAD engineers\, device engineers\, process engineers\, product managers\, and engineering management. \n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/learn-how-to-simulate-2d-tmd-channel-fets-with-atomistic-precision/ LOCATION:CA CATEGORIES:EDA,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Silvaco-September-26-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240926T080000 DTEND;TZID=America/Los_Angeles:20240926T170000 DTSTAMP:20240710T165347Z CREATED:20240710T165347Z LAST-MODIFIED:20240710T165347Z UID:8121-1727337600-1727370000@marketingeda.com SUMMARY:GSA U.S. Executive Forum 2024 DESCRIPTION:THE JOURNEY TO A $1T GLOBAL INDUSTRY\n\n\n\n\n\n\n\nThe GSA US Executive Forum will delve into the semiconductor industry’s journey toward achieving the trillion-dollar milestone. The industry operates in a complex environment where global forces intersect with regional dynamics. Industry executives will explore the delicate balance between globalization and regionalization\, considering both opportunities and challenges while emphasizing sustainable growth\, innovation\, and strategic business practices. \nIndustry leaders will also provide thought leadership into the market forces and advancements that shape the industry’s growth trajectory and explore the key drivers propelling the industry for sustainable growth. \n\n\n\n\nThe US Executive Forum is GSA’s premier exclusive\, invitation-only event that brings together influential executives\, thought leaders\, and subject matter experts for thought exchange and collaborative dialogue on the dynamic landscape of the global semiconductor value chain. With technological advancements driving rapid change\, the US Executive Forum fosters a deep understanding of the industry’s future direction and identifies strategies for success in an era of innovation and collaboration.\n\n\n\n1:00 PM\n\nWelcome Remarks\n\nJodi Shelton // CEO // GSA\n \n\n\n\n\n\n\n1:10 PMPANEL\n\nFireside Chat\n\nJensen Huang // Co-founder\, President and CEO // Nvidia \n\n\n\n\n\n\n1:50 PMPRESENTATION\n\nGlobal Landscape Impacting the Industry\n\n\n\n\n\n2:10 PMKEYNOTE\n\nKeynote – Industry Outlook\n\nDave Mosley / CEO / Seagate\n\n\n\n\n\n\n2:40 PM\n\nNetworking Break\n\n\n\n\n\n3:10 PMPANEL\n\nDisruptors in AI\n\nJitendra Mohan / Co-founder and CEO / Astera Labs\nRodrigo Liang / Co-founder and CEO / SambaNova\n\n\n\n\n\n\n3:50 PMPRESENTATION\n\nAutomotive Supply Chain\n\n\n\n\n\n4:05 PMPANEL\n\nAutomotive Electrification Panel Discussion\n\nKarn Budhiraj / Vice President\, Supply Chain / Tesla\nSiva Sivaram / CEO / QuantumScape\n\n\n\n\n\n\n4:45 PM\n\nNetworking Break\n\n\n\n\n\n5:15 PMPANEL\n\nExecutive Panel Discussion\n\nTien Wu / CEO / ASE Group & USI\nSandra Rivera / CEO / Altera\, an Intel company\nRene Hass / CEO / Arm\n\n\n\n\n\n\n6:00 PMKEYNOTE\n\nClosing Keynote\n\n\n\n\n\n6:40 PM\n\nVIP Reception\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/gsa-u-s-executive-forum-2024/ LOCATION:Rosewood Sand Hill\, 2825 Sand Hill Road\, Menlo Park\, CA\, United States CATEGORIES:Forum,Semiconductor ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/GSA-US-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240925T093000 DTEND;TZID=America/Los_Angeles:20240925T180000 DTSTAMP:20240917T003907Z CREATED:20240917T003541Z LAST-MODIFIED:20240917T003907Z UID:8337-1727256600-1727287200@marketingeda.com SUMMARY:TSMC North America OIP Ecosystem Forum 2024 DESCRIPTION:Learn About:\n\nEmerging advanced node design challenges and corresponding design flows and methodologies for A16\, N2 and N3 processes\nLatest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes\, InFO\, CoWoS®\, and SoIC\, 3DFabric Alliance\, and 3Dblox™ standard\, plus innovative 3Dblox-based design enablement technologies and solutions\, targeting HPC\, AI/ML\, and mobile applications\nComprehensive design solutions for specialty technologies enabling ultra-low power\, ultra-low voltage\, analog migration\, RF\, mmWave\, and automotive designs targeting 5G\, automotive\, and IoT designs\nEcosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization\nSuccessful\, real-life applications of design technologies\, IP solutions\, and cloud-based designs from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.\n\nFor more information on the TSMC OIP Ecosystem Forum\, e-mail us at: tsmcevents@tsmc.com. \nWe look forward to seeing you at the 2024 TSMC OIP Ecosystem Forum! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/tsmc-north-america-oip-ecosystem-forum-2024/ LOCATION:Santa Clara Convention Center\, 5001 Great America Parkway\, Santa Clara\, CA\, 95054\, United States CATEGORIES:EDA,Forum,Foundry,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/TSMC-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240925T080000 DTEND;TZID=America/Los_Angeles:20240927T170000 DTSTAMP:20240612T170503Z CREATED:20240612T170425Z LAST-MODIFIED:20240612T170503Z UID:8093-1727251200-1727456400@marketingeda.com SUMMARY:SISPAD 2024 DESCRIPTION:The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures. \nSISPAD2024 will be held in person in San José\, USA from September 25-27\, 2024. A technical workshop will be offered on September 24\, 2024. Details on the invited speakers\, technical program and workshop will be posted here as soon as they are available. There are slots still available for tutorials or workshop sessions for September 24\, please reach out to us if you are interested in organizing one. \nLooking forward to seeing you all in San José! \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/sispad-2024/ LOCATION:The Westin San Jose\, 302 S Market Street\, San Jose\, CA\, United States CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/SISPAD-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Europe/London:20240924T094500 DTEND;TZID=Europe/London:20240924T143000 DTSTAMP:20240906T170817Z CREATED:20240906T170817Z LAST-MODIFIED:20240906T170817Z UID:8297-1727171100-1727188200@marketingeda.com SUMMARY:FPGA Front Runner: FPGA Verification Strategies DESCRIPTION:Time\nSpeaker\nDetails\n\n\n09.30\nArrival and Registration\n\n\n10.00\nDave Sanders\, Rolls-Royce\nOverview of Rolls Royce @ Solihull \nPresentation Title – Rolls-Royce… the past\, the present and the future \nAbstract – Rolls-Royce has come a long way since its inception as a car manufacturer at the start of the twentieth century\, for starters it doesn’t make cars anymore! This talk will provide an insight into Rolls-Royce’s past present and future with a focus on the pivotal role that electronics now plays in a company traditionally known for its mechanical engineering solutions.\n\n\n10.30\nEspen Tallaksen\, EmLogic\nPresentation Title – Modern VHDL testbenches – An AXI-stream example\, first dead simple\, then advanced \nAbstract – Do you want to see how easily you can verify your FPGA or ASIC? Join in to see this exemplified with a testbench for an AXI-stream based data flow design – using UVVM\, which is currently used by more than one third of all European FPGA designers. \nMost testbenches verifying a complex DUT are relatively unstructured and difficult to understand\, modify\, extend\, maintain and reuse. You can often easily reduce the verification time by at least a factor of two by having a well structured and easy to understand test harness\, and writing commands at a higher abstraction level – allowing a good and complete testcase overview by just looking at a simple test sequencer with easy to understand high-level commands. \nThis presentation will first show how interface handling procedures (BFMs) can be applied in a very simple way to verify a DUT. Then we will show how a more advanced testbench using verification components\, models\, scoreboards and high-level transactions will allow more thorough verification of more complex DUT scenarios in a very structured and simple way.\n\n\n11.00\nJim Lewis\, SynthWorks Design Inc\nPresentation Title – Why Should Our Team be Using VHDL + OSVVM for Verification? \nAbstract – Developing and deploying a verification methodology can be costly and time consuming. Going without one will be even more costly due to bugs escaping into production hardware systems. \nOpen Source VHDL Verification Methodology (OSVVM) provides the VHDL community with an already developed\, open-source solution. OSVVM implements all of the capabilities of a modern verification methodology: transaction-based testing\, a verification framework\, verification components\, self-checking tests\, messaging handling\, error tracking\, requirements tracking\, constrained random testing\, scoreboards\, functional coverage\, co simulation with software\, test automation\, and a comprehensive set of test reports. \nThis presentation examines how these capabilities will benefit your projects. \nSystemVerilog+UVM also provides a similar set of capabilities. Unfortunately\, SV+UVM ended up absurdly complex to use – instead of using a module (entity/architecture in VHDL) with its built-in concurrency\, SV+UVM uses OO\, sequential code\, and fork and join (to get concurrency). As a result\, SV has failed to unify the design and verification communities. \nVHDL+OSVVM on the other hand uses entity/architectures to create verification components and libraries of subprograms (procedures and functions) to extend VHDL into a complete verification language. In doing this\, OSVVM creates verification capabilities that rival SystemVerilog+UVM while at the same time it uses VHDL language elements that are familiar to VHDL design engineers. \nAs a result\, with VHDL+OSVVM and a good verification lead\, any VHDL engineer can do verification as well as RTL design.\n\n\n11.30\nRefreshment break\n\n\n12.00\nPhilipp Wagner\, FOSSi Foundation\nPresentation Title – cocotb is making verification fun! \nAbstract – cocotb lets you verify chips like software: productive\, simulator-agnostic\, in Python. In this talk\, you’ll learn what cocotb is and how using Python for verification can make your next verification job more productive. There’s even something in there for those of you who already know cocotb: a look at cocotb 2.0 and tips and tricks how to update your testbenches to make best use of the new features.\n\n\n12.30\nChristian Tchilikov\, semify GmbH\nPresentation Title – Utilizing the Cocotb Python Framework for Efficient Functional Verification \nAbstract – Cocotb is a framework that allows for verification test cases written in Python to interact with DUTs being simulated in common simulation tools. Compared to classical approaches for verification\, Cocotb has very low upfront engineering costs. With access to the full functionality of the Python programming language\, the complexity of testbenches can scale up as required. \nCocotb comes with built-in functionalities for many of the tasks required of a modern testbench\, like constrained random input generation\, coverage tracking\, and assertions. \nCocotb’s foundation being the Python language means that software models of the design can be written in a high-level Object-Oriented language. Additionally\, higher-level objects such as drivers or monitors can be designed for the bit-wiggling of DUT input signals\, providing a higher level of abstraction\, similar to UVM sequences. The software model can then be easily scoreboarded with the DUT through Cocotb. \nAdditionally\, Cocotb provides high-level abstractions for interfacing with the simulated design. This comes in the form of hierarchical signal reading and assignment\, event triggers\, and parallel execution of coroutines similar to SystemVerilog’s forks. Leveraging these tools\, it becomes simple to launch verification modules like drivers and monitors\, running and interfacing with the DUT in parallel. \nThird-party verification IP modules for many standard interfaces are available via the cocotb extensions packages hosted on PyPi\, so devices using SPI or AXI\, amongst others\, can be verified with minimal effort. In addition\, engineers can write and reuse their own verification IP\, such as bus monitors\, drivers\, etc\, similar to the UVM approach of verification. \nA special emphasis is on using cocotb alongside an open-source toolchain like Icarus Verilog\, acheiving a similar quality of results compared to commercial offerings. This combination of tools provides features that are otherwise hidden behind expensive licence paywalls\, and makes digital verification accessible to a wider audience. \nCocotb serves as a great alternative to traditional SystemVerilog Object-Oriented verification by working around the limitations of the simulators that do not support the full feature set of SystemVerilog by providing similar functionality in the Python language instead.\n\n\n13.00\nDave Amor\, Ultra Maritime\nPresentation Title – Integration of Atlassian Bamboo with MathWorks Tools for FPGA Development \nAbstract – In safety critical FPGA development\, the need for efficiency\, reliability\, and predictability while maintaining agility is vital. \nUltra Maritime has embraced these demands by integrating Continuous Integration (CI) practices with MathWorks tools and Agile methodologies\, creating a streamlined and robust development process that ensures high-quality outcomes in mission-critical applications. \nThis presentation will explore the strategies and technologies we use to achieve consistent\, and resilient FPGA development\, focusing on how these practices contribute to the success of our projects. \nAtlassian Bamboo allows us to automate testing\, code generation\, and the bitstream creation processes. \nThis integration ensures that every change in our FPGA designs can be automatically validated through rigorous testing\, significantly reducing the risk of errors and accelerating the development lifecycle. \nBy automating these processes\, a higher standard of code quality is possible while freeing up our engineers to focus on innovation and problem-solving. \nThis presentation will touch on the adoption of Agile Scrum practices within our FPGA development teams. \nAgile Scrum provides a flexible framework that allows us to adapt to changing requirements\, prioritise tasks effectively\, and deliver incremental improvements throughout the project lifecycle. Key ceremonies such as sprint planning\, daily stand-ups\, and retrospectives are essential to maintaining focus and ensuring continuous improvement. We will discuss how these practices have enhanced our ability to respond to challenges\, manage complexity\, and maintain alignment across our teams. \nA crucial aspect of our development process is the integration of Jira with Bamboo and Simulink. This connection enables seamless tracking of tasks\, test results\, and code changes. Automated reporting of test failures and direct linking to Jira tasks ensure that issues are identified\, prioritised and resolved. \nThe presentation will also address the advantages of CI in ensuring resilience against the turnover of key personnel. By standardising workflows and maintaining consistent environments\, we reduce the dependency on individual knowledge and ensure that our processes are sustainable. \nLooking to the future\, we will explore potential enhancements to our current setup\, by leveraging developments in Large Language Models. \nUltra Maritime’s approach to FPGA processes evolving over the last 25 years has created a environment that is effective\, adaptable and resilient\, ensuring the delivery of high-quality\, reliable products.\n\n\n13.30\nLunch\n\n\n14.00\nTour\n\n\n14.30\nFinish refreshments/networking\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/fpga-front-runner-fpga-verification-strategies/ LOCATION:Rolls Royce Control Systems\, 5000 Solihull Parkway\, Birmingham\, B37\, United Kingdom CATEGORIES:EDA,Forum ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Tessolve-September-24-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/New_York:20240918T100000 DTEND;TZID=America/New_York:20240918T110000 DTSTAMP:20240820T165235Z CREATED:20240820T165149Z LAST-MODIFIED:20240820T165235Z UID:8255-1726653600-1726657200@marketingeda.com SUMMARY:A Beginner's Guide to RTL-to-GDSII Front-End Flow DESCRIPTION:In this Training Webinar\, explore the concepts of RTL design\, design verification\, and coverage analysis while unveiling the exciting world of front-end design flow. Walk through the essential steps in creating integrated circuits\, the building blocks of modern electronics. \nThis webinar provides practical knowledge\, making it your gateway to understanding the magic behind RTL-to-GDSII front-end design flow. \nWe’ll break down the process into manageable stages\, from defining the chip’s functionality to its physical realization. We’ll investigate the front-end part of the RTL-to-GDSII flow—from specification to functional verification and design coverage—and explore: \n\nKey concepts of specifying chip behavior and performance\nHow to translate ideas into a digital blueprint and transform that into a design\nHow to ensure your design is free of errors\n\nWebinar: A Beginner’s Guide to RTL-to-GDSII Front-End Flow\nDate: Wednesday\, September 18\, 2024\nTime: 07:00 PDT San Jose / 10:00 EDT New York / 15:00 BST London / 16:00 CEST Munich / 17:00 IDT Jerusalem / 19:30 IST Bangalore / 22:00 CST Beijing \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/beginners-guide-rtl-gdsii-front-end-flow/ LOCATION:CA CATEGORIES:EDA,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-September-18-2024-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240918T090000 DTEND;TZID=America/Los_Angeles:20240918T100000 DTSTAMP:20240906T215837Z CREATED:20240906T215234Z LAST-MODIFIED:20240906T215837Z UID:8304-1726650000-1726653600@marketingeda.com SUMMARY:Redefining Mobile Experiences with AI DESCRIPTION:The Arm platform is providing the foundation for the next wave of AI smartphones and laptops. As AI models rapidly evolve\, we’re seeing that software begins to outpace hardware\, requiring additional innovation at all levels of the compute stack. \nTo meet these growing demands\, the Arm platform offers a new compute solution for maximum performance and efficiency\, on leading process nodes. Join this webinar series to learn more about this solution\, including the latest Arm Armv9 CPUs and GPUs\, the benefits and opportunities of running AI on device\, and how to innovate and speed time to market. \nSession 1: The Arm Platform on Wednesday\, Sept 18\, 2024\n\n9:00 a.m. BST / 4:00 p.m. Beijing\n5:00 p.m. BST / 9:00 a.m. PT\n\nThis webinar covers: \n\nThe latest Arm technology\, Arm Compute Subsystems (CSS) for Client\, which helps push the boundaries of premium mobile experiences.\nFeatures\, benefits\, and performance enhancements of Armv9 based Arm Cortex CPUs and Immortalis and Mali GPUs.\nHow Arm partners can rapidly innovate and speed time to market.\nPerformance and efficiency enhancements that increase the responsiveness of GenAI.\nHow to unlock 3 nm PPA benefits with physical implementations.\n\nSpeaker: Kinjal Dave\, Senior Director Product Management\, Arm \nSecond Session – October 2nd \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/redefining-mobile-experiences-with-ai/ LOCATION:CA CATEGORIES:IP,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Arm-September-18-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Kolkata:20240918T080000 DTEND;TZID=Asia/Kolkata:20240919T170000 DTSTAMP:20240807T162934Z CREATED:20240807T162703Z LAST-MODIFIED:20240807T162934Z UID:8215-1726646400-1726765200@marketingeda.com SUMMARY:DVCon India 2024 DESCRIPTION:On behalf of the DVCon India 2024 steering committee\, it is my pleasure to welcome you all to the 9th edition of the Design and Verification Conference in India planned from 18- 19th September 2024 in Bangalore\, India. The theme of this year’s conference is “Architecture to Analytics – A2A“. \nWe want to carry forward the momentum\, excitement and the enthusiasm witnessed during last year’s edition into DVCon India 2024. The conference would be following the contemporary Indian version of a two-day conference with in-depth technical content spreading across both the days and will have an Awards Night\, which saw an amazing response last year. \nOn behalf of the DVCon India 2024 steering committee\, it gives me immense pleasure to extend a warm welcome to each and every one of you to the 9th edition of the Design and Verification Conference in India. Set to unfold from the 18th to 19th of September 2024 in the vibrant city of Bangalore\, India\, this conference promises to be a pinnacle of innovation\, collaboration and insight. \nAs we embark on this journey\, we are fuelled by the electrifying momentum\, the techno-genius excitement and the enthusiasm that characterized last year’s edition of DVCon India. Our goal for DVCon India 2024 is clear: to build upon the successes of the past and propel the conference to even greater heights. \nThis year\, our focus is laser-sharp: we aim to demystify the essence of DVCon. While some may perceive it solely as a Digital Verification Conference\, DVCon embodies much more—it encapsulates the entire spectrum of Design and Verification\, spanning from Architecture and Design to Post Silicon Validation. \nTo ensure that this message resonates loud and clear across our community\, we have formed dedicated focus groups in pivotal areas: \n\nSystem and IP level modelling\, Virtual Prototyping & ESL\nArchitecture and Design\nRISC-V and its ecosystem\nAnalog and Mixed-Signal Design and Verification and\nPost Silicon Validation.\n\nThrough these specialized groups\, we seek to foster deeper understanding\, facilitate meaningful dialogue and foster inclusive participation. \nFurthermore\, in our relentless pursuit of excellence\, we are expanding our Technical Program Committee and implementing structural enhancements to optimize the participant experience. These changes underscore our commitment to delivering value-driven content and enriching interactions. \nWe extend an open invitation to the entire technical fraternity to actively engage\, collaborate and share insights at DVCon India 2024. Your collective expertise\, passion\, and dedication are instrumental in shaping the success of this conference\, and we eagerly anticipate your invaluable contributions. \nTogether\, let us ignite the spirit of Designnovation\, celebrate the power of collaboration and chart a path towards a future defined by excellence. \nWelcome to DVCon India 2024—a platform where ideas converge\, innovations thrive\, and possibilities abound. \nHere’s to a resounding success! \n\n \nPradeep Salla\nSiemens EDA\nGeneral Chair\, DVCon India 2024 \n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/dvcon-india-2024/ LOCATION:Hotel Radission Blu\, Marathalli ORR\, 90/4 Outer Ring Road\, Bengaluru\, India CATEGORIES:Conference,EDA ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/DVCon-India-2024-1.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=America/Los_Angeles:20240918T080000 DTEND;TZID=America/Los_Angeles:20240918T090000 DTSTAMP:20240813T192856Z CREATED:20240813T192856Z LAST-MODIFIED:20240813T192856Z UID:8231-1726646400-1726650000@marketingeda.com SUMMARY:Managing Constraints Like a Pro in OrCAD X DESCRIPTION:Join us in this constraint-focused webinar to learn all the best practices for managing constraints in your design with OrCAD X Presto PCB Editor. \nWe’ll cover everything from the basics of setting up spacing and physical constraints to advanced electrical constraints\, which are critical for HDI designs. \nThe webinar will feature a brief presentation\, a live demonstration using the NVIDIA Jetson Xavier Developer Kit Carrier Board\, and a Q&A session. \nTopics Covered:\n\nNavigating the constraint manager and reusing constraints\nCreating constraint sets\nSetting up physical and spacing constraints\nSetting up advanced constraints for HDI\nElectrical constraints (Propagation Delay\, Net Scheduling\, Differential Pairs)\nSetting up blind\, buried\, and microvias\nAnalysis setup\nPreview of the new constraints panel in OrCAD X Presto PCB Editor\n\n\nWe welcome PCB designers of all experience levels to join us. Enhance your expertise in managing basic and advanced constraints in your OrCAD X Presto designs! \n\nSPEAKERS: \nAdam Fuchs\, Principal Product Engineer\, Cadence \nHOST: \nSupreeth Mannava\, Senior Principal Product Manager\, Cadence \nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/managing-constraints-like-a-pro-in-orcad-x/ LOCATION:CA CATEGORIES:EDA,Webinar ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Cadence-September-18-2024.jpg END:VEVENT BEGIN:VEVENT DTSTART;TZID=Asia/Tokyo:20240917T080000 DTEND;TZID=Asia/Tokyo:20240917T170000 DTSTAMP:20240823T182503Z CREATED:20240823T182145Z LAST-MODIFIED:20240823T182503Z UID:8269-1726560000-1726592400@marketingeda.com SUMMARY:IP-SoC Japan 24 DESCRIPTION:A worldwide connected Event !! \nD&R IP-SoC Japan 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. \nIP-SoC providers\, the seed of innovation in Electronic Industry\, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry. \nIP consumers can view at a glance the latest Technology trends and exciting Innovative IP/SoC products. Through a global view\, Electronic systems leaders may identify disruptive innovation leading to new market segment growth. \nAny question? Please contact us \n\n\n\n\n\n\n\n\n\n9:00 am\nWelcome\n\n\n\nWelcome to the IP-SoC community \nGabrièle Saucier\nCEO\nDesign And Reuse \nAbout me\n\n\n\n\nAdding Intelligence in Green Technology \nPhilippe Flatresse\nProduct Marketing\nSoitec \nAbout me\n\n\n\n\n9:40 am\nBreak\n\n\n\n10:00 am\nAnalog and Memory IP\n \nChairperson: Gabrièle Saucier\, D&R\n\n\n\n\nHigh-performance PLL frequency synthesizers for wireless and wireline communications \nM. Annamalai Arasu\nDirector\, R&D\nCM Engineering Labs Singapore Pte. Ltd \nAbout me\n\n\n\n\nThe Uniquely Suitable eNVM Ip for Auto Grade MCU from Floadia \nYasuhiro Taniguchi\nCTO and COO\nFloadia Corporation \nAbout me\n\n\n\n\nSemiconductor IPs for Memory\, Flash storage and wireless applications \nRavi Thummarukudy\nCEO\nMobiveil Inc. \nAbout me\n\n\n\n\n11:00 am\nBreak\n\n\n\n11:20 am\nInterface IP\n \nChairperson: Gabrièle Saucier\, D&R\n\n\n\n\nHigh Speed Interface\, keys and Trend \nJunzoh Shimizu\nCEO & President\nSilicon Library Inc. \nAbout me\n\n\n\n\nScaling Hyperscale Data Centers for AI Workloads with High-Speed Interface IP \nHiroyuki Hasegawa\nApplication Engineering Manager\nSynopsys\, Inc. \nAbout me\n\n\n\n\n12:00 pm\nLunch Break\n\n\n\n1:00 pm\nDesign Platform\n \nChairperson: Philippe Flatresse\, Soitec\n\n\n\n\nThe Critical Role of Embedded Monitor IP in Enabling Silicon Lifecycle Management Use Cases \nYuya Suzuki\nApplications Engineering\, Staff Engineer\nSynopsys\, Inc. \nAbout me\n\n\n\n\nArchitecture challenges in meeting power\, thermal and performance needs in partitioning Chiplets for rapid deployment \nDeepak Shankar and Shuzo Tanaka\nFounder\nMirabilis Design Inc. \nAbout me\n\n\n\n\nCurious’ latest High Performance IP Introduction \nKen ichi Shimomura\nDirector of Design department\nCurious Corp. \nAbout me\n\n\n\n\nEmbedded Programmable Logic – A risk insurance for your next chip design \nYoan Dupret\nMenta \nAbout me\nOnline Only\n\n\n\n\n2:00 pm\nBreak\n\n\n\n2:20 pm\nArtificial Intelligence\n \nChairperson: Philippe Flatresse\, Soitec\n\n\n\n\nMeeting the Needs of AI Training with HBM3E \nMotoyasu Kobayashi\nDirector of Sales\nRambus\, Inc. \nAbout me\n\n\n\n\nScalable\, Flexible Edge AI accelerator: Silicon-Proven IP for Consumer Electronics \nChangSoo Kim\nCEO\nAiM Future\, Inc. \nAbout me\n\n\n\n\nEnabling Multimodal AI on Edge Devices \nShanghung Lin\nVP\, Vision and Image Product\nVerisilicon \nAbout me\n\n\n\n\n3:20 pm\nBreak\n\n\n\n3:40 pm\nSecurity and high safety Solutions\n \nChairperson: Philippe Flatresse\, Soitec\n\n\n\n\nQuantum Safe Cryptography: Protecting Devices and Data in the Quantum Era \nToru Furukawa\nSenior Field Application Engineer\nRambus\, Inc. \nAbout me\n\n\n\n\nFuture-Proof Your Design with Hardware-Based Post-Quantum Cryptographic IP Cores \nDr. Matti Tommiska\nXiphera Ltd \nAbout me\n\n\n\n\nSecurity From Chip-To-Cloud with PQC (Post Quantum Cryptography) \nAhmed BOUGRIANE\nPre-Sales Engineer North Asia\nSecure-IC \nAbout me\n\n\n\n\nHow SafeIP(TM) enables fail operational vehicles\, robotics and drones \nBenjamin Weinhardt\nHead of Business & Collaboration\nSiliconally GmbH \nAbout me\n\n\n\n\n5:00 pm\nVideo IP\n \nChairperson: Philippe Flatresse\, Soitec\n\n\n\n\nVideo Codecs Landscape and Challenges Ahead \nYujing Wei\nVP\, APAC Business Development\nAllegro DVT \nAbout me\n\n\n\n\n6:00 pm\nEvent Closure\n\n\n\n\n\n\n\n\nShare this:\n Share on LinkedIn (Opens in new window)\n LinkedIn\n \n Share on X (Opens in new window)\n X\n \n Share on Facebook (Opens in new window)\n Facebook\n Like this:Like Loading… URL:https://marketingeda.com/event/ip-soc-japan-24/ LOCATION:Tokyo Convention Hall\, 3 Chome-1-1 Kyobashi\, Toyo\, Japan CATEGORIES:Conference,IP ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/IP-SoC-Japan-24.jpg END:VEVENT END:VCALENDAR