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Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems

With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the IPs required to build such a platform and recommend applications that can benefit from it. This webinar will be useful to designers, architects, and application… Read More »Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems