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SUMMARY:Thermal Integrity Challenges and Solutions of Silicon Interposer Design
DESCRIPTION:In this latest installment of the year-long 3D-IC webinar series\, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots\, mechanical stresses induced by thermal issues\, and methods for capturing these problems with simulation and virtual prototyping\, with a focus on designs that utilize silicon interposers. \n\n\n\n\nTIME:\nMARCH 23\, 2023\n11AM EDT / 3 PM GMT / 8:30 PM IST \n\n\n\n\nVenue:\nVirtual \nAbout this Webinar\nThermal integrity and thermal-induced mechanical issues are becoming essential for the new generation of 2.5D/3D-IC with closely packed chiplets on an interposer\, package\, and board due to strong cross-die thermal coupling. Traditionally\, on-chip thermal sensors are placed on potential hotspots to detect real-time temperature to avoid thermal throttling via the Dynamic Thermal Management (DTM) technique. However\, it is challenging to cover all hotspot locations of a complicated stacked-die system to place the sensors. This presentation will introduce the key technologies from Ansys to address pre-silicon thermal integrity simulation and mechanical stress analysis. \nWhat You Will Learn\n\nWhy do emerging 2.5D/3D-ICs with silicon interposer pose thermal integrity challenges?\nWhat are the available technologies and methodologies in thermal integrity simulation?\nPresentation of several actual case studies using Ansys multi-physics tools\nNew research regarding EDA solutions for thermal integrity\n\nWho Should Attend\nAll 3D-IC designers \nSpeaker\nLang Lin \nDr. Lang Lin is a principal product manager of Ansys\, based in San Jose\, California. He develops 3D-IC multi-physics simulation and security verification methodologies for worldwide semiconductor customers. Before joining Ansys\, Dr. Lin worked for Intel Corp. as a design engineer. He has published 50+ technical papers and patents and served as a reviewer\, program committee\, or tutorial speaker at IEEE conferences such as HOST\, ICCAD\, DAC\, and ASPDAC. \n\n\nShare this:\n				Share on LinkedIn (Opens in new window)\n				LinkedIn\n			\n				Share on X (Opens in new window)\n				X\n			\n				Share on Facebook (Opens in new window)\n				Facebook\n			Like this:Like Loading...\n\n	Related
URL:https://marketingeda.com/event/thermal-integrity-challenges-and-solutions-of-silicon-interposer-design/
CATEGORIES:EDA,Webinar
ATTACH;FMTTYPE=image/jpeg:https://marketingeda.com/wp-content/uploads/Ansys-March-23-2023.jpg
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