Latest Past Events
Learn About Advanced TFT-Based Flat Panel Design with SmartSpice
In this webinar, we will present the benefits of adopting SmartSpice’s unique 4-terminal TFT compact model, and we will also describe how SmartSpice Flex Modeling technology can be used to simulate image retention issues. Many TFT technologies in the market today are based on 4-terminal devices, while SPICE simulators from other vendors can only support… Learn About Advanced TFT-Based Flat Panel Design with SmartSpice
Thermal Integrity Challenges and Solutions of Silicon Interposer Design
In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues, and methods for capturing these problems with simulation and virtual prototyping, with a focus on designs that utilize silicon interposers.… Thermal Integrity Challenges and Solutions of Silicon Interposer Design
Electronic Design Automation for Emerging Technologies
Presenter: Anupam Chattopadhyay Title: Electronic Design Automation for Emerging Technologies Abstract: The continued scaling of horizontal and vertical physical features of silicon-based complementary metal-oxide-semiconductor (CMOS) transistors, termed as “More Moore”, has a limited runway and would eventually be replaced with “Beyond CMOS” technologies. There has been a tremendous effort to follow Moore’s law but it is currently… Electronic Design Automation for Emerging Technologies