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TSMC 2024 China Technology Symposium

Shanghai International Convention Center No. 2727, Riverside Avenue, Shanghai, China

Get the latest on: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and TSMC-SoIC® TSMC’s manufacturing excellence,… Read More »TSMC 2024 China Technology Symposium

FV-Israel, Summit 2024

Connect with industry experts, academics, and enthusiasts for discussions on FV in Israel. Explore new developments from top semiconductor firms, advanced EDA tools, and academic research. Engage with leaders, exchange insights, and help shape the future of FV in Israel and globally. Distinguished Speaker Dadi Perlmutter Technology and social entrepreneur and former VP at Intel

Reimagining Synopsys SLM PVT Monitoring IP for Advanced Node GAA Process

Synopsys' SLM PVT Monitor (process detector, voltage monitor, temperature sensor) IP can collect voltage, temperature, and process parameters from different blocks within the IC in real time. These data can be analyzed and used to take meaningful action to optimize the performance of the chip at any stage of silicon lifecycle. This webinar focuses on… Read More »Reimagining Synopsys SLM PVT Monitoring IP for Advanced Node GAA Process

Optimizing connectivity between Xpedition and HFSS for RF systems design

In today's fast-paced technological landscape, seamless integration between design and simulation tools is crucial for accelerating product development cycles and ensuring optimal performance of electronics, especially RF systems. Siemens Xpedition and Ansys HFSS stand as pillars in their respective domains, offering powerful capabilities for electronic design and electromagnetic simulation. In this live conversation, Sara Louie… Read More »Optimizing connectivity between Xpedition and HFSS for RF systems design

Addressing Real-Time Workloads in Automotive Applications with Efficient ARC-V Processors

Many automotive applications require processing workloads with minimum latency and precise timing budgets.  This is especially true for safety-critical applications like adaptive cruise control and anti-lock braking, where human life may be jeopardized.  These systems require processing elements that can respond to events within specific (predictable) time constraints. System reliability and availability depend on the… Read More »Addressing Real-Time Workloads in Automotive Applications with Efficient ARC-V Processors

Advantest VOICE 2024

Hilton La Jolla Torrey Pines 10950 N Torrey Pines Rd, La Jolla, CA, United States

VOICE is a developer conference, created by test engineers for test engineers. Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world's leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements, express new ideas, share best… Read More »Advantest VOICE 2024

Verification Academy Live: Westford (Boston Area)

Westford Regency Inn and Conference Center 219 Littleton Rd, Westford, MA, United States

Westford Regency Inn and Conference Center 219 Littleton Rd Westford, MA 01886 +1 (978) 692-8200 This event is in-person only -- there is no support for remote participation. Agenda 9:30 – 10:00 Registration and Check-in  Coffee and networking with your peers. 10:00 – 10:05 Welcome / Intro Todd Holbrook | Sr. Application Engineering Manager, Functional… Read More »Verification Academy Live: Westford (Boston Area)

Silicon.da: The First Integrated SLM Analytics Solution from Design Through Manufacturing

Today’s advanced node chip designs are faced with many new complexities which require more verification, more validation and more analysis. The resulting data from these added steps has also grown exponentially and engineers need a way to efficiently analyze this information. The result is a new paradigm shift which has led to data overload requiring… Read More »Silicon.da: The First Integrated SLM Analytics Solution from Design Through Manufacturing

Verification Academy Live: Huntsville

Siemens Training Center 360E Quality Circle, Suite 500, Huntsville, AL, United States

Siemens Training Center 360E Quality Circle, Suite 500 Huntsville, AL 35806 +1 (256) 705-2501 This event is in-person only -- there is no support for remote participation. Agenda 9:30 – 10:00 Registration and Check-in  Coffee and networking with your peers. 10:00 – 10:05 Welcome / Intro Todd Holbrook | Sr. Application Engineering Manager, Functional Verification… Read More »Verification Academy Live: Huntsville

International Workshop on Logic and Synthesis – IWLS 2024

ETH Zurich Rämistrasse 101, Zurich, Switzerland

The International Workshop on Logic and Synthesis is the premier forum for research in synthesis, optimization, and verification of integrated circuits and systems. Research on logic synthesis for emerging technologies and for novel computing platforms, such as nanoscale systems and biological systems, is also strongly encouraged. The workshop encourages the early dissemination of ideas and… Read More »International Workshop on Logic and Synthesis – IWLS 2024

Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs

Thermal stress analysis plays a crucial role in the design and performance optimization of packaging materials and boards, especially in industries where temperature variations are significant. This webinar presents a comprehensive overview of recent developments in the newly-introduced Cadence Celsius Studio AI-enabled multiphysics thermal platform to solve today’s thermal stress and warpage analysis in 3D-ICs.… Read More »Addressing Thermal Stress and Warpage Challenges in 3D-IC Designs

SNUG Europe 2024

Hilton Munich Airport Terminalstraße Mitte 20, 85356 München-Flughafen, Munich, Germany

Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Software. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical… Read More »SNUG Europe 2024