46th Annual EOS/ESD Symposium & Exhibits
Peppermill Resort and Casino 2707 South Virginia Street, Reno, NV, United StatesThe EOS/ESD Symposium is dedicated to the understanding of issues related to electrostatic discharge and electrical transients/overstress, and the application of this knowledge to the solution of problems in consumer, industrial, and automotive applications, including electronic components, as well as in systems, subsystems, and equipment.
DVCon India 2024
Hotel Radission Blu, Marathalli ORR 90/4 Outer Ring Road, Bengaluru, IndiaOn behalf of the DVCon India 2024 steering committee, it is my pleasure to welcome you all to the 9th edition of the Design and Verification Conference in India planned from 18- 19th September 2024 in Bangalore, India. The theme of this year’s conference is “Architecture to Analytics – A2A“. We want to carry forward… Read More »DVCon India 2024
FPGA Front Runner: FPGA Verification Strategies
Rolls Royce Control Systems 5000 Solihull Parkway, Birmingham, United KingdomTime Speaker Details 09.30 Arrival and Registration 10.00 Dave Sanders, Rolls-Royce Overview of Rolls Royce @ Solihull Presentation Title - Rolls-Royce… the past, the present and the future Abstract - Rolls-Royce has come a long way since its inception as a car manufacturer at the start of the twentieth century, for starters it doesn’t make cars anymore!… Read More »FPGA Front Runner: FPGA Verification Strategies
SISPAD 2024
The Westin San Jose 302 S Market Street, San Jose, CA, United StatesThe International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.… Read More »SISPAD 2024
TSMC North America OIP Ecosystem Forum 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… Read More »TSMC North America OIP Ecosystem Forum 2024
GSA U.S. Executive Forum 2024
Rosewood Sand Hill 2825 Sand Hill Road, Menlo Park, CA, United StatesTHE JOURNEY TO A $1T GLOBAL INDUSTRY The GSA US Executive Forum will delve into the semiconductor industry’s journey toward achieving the trillion-dollar milestone. The industry operates in a complex environment where global forces intersect with regional dynamics. Industry executives will explore the delicate balance between globalization and regionalization, considering both opportunities and challenges while… Read More »GSA U.S. Executive Forum 2024
Learn How to Simulate 2D-TMD-Channel FETs with Atomistic Precision
Are 2D-TMD-channel transistors suitable candidates for the replacement of silicon ? Considering the extreme scaling down to a few atomic layers of the FET channel, only an atomistic solution looks viable. In this context, we show how the Victory Atomistic tool can answer this essential question thanks to quantum mechanics, offering valuable support for the… Read More »Learn How to Simulate 2D-TMD-Channel FETs with Atomistic Precision
Memory Users Conference 2024
Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. … Read More »Memory Users Conference 2024
Memory Users Conference 2024 – China, Taiwan
Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. … Read More »Memory Users Conference 2024 – China, Taiwan
Redefining Mobile Experiences with AI – Session 2
The Arm platform is providing the foundation for the next wave of AI smartphones and laptops. As AI models rapidly evolve, we’re seeing that software begins to outpace hardware, requiring additional innovation at all levels of the compute stack. To meet these growing demands, the Arm platform offers a new compute solution for maximum performance… Read More »Redefining Mobile Experiences with AI – Session 2
VC Formal Special Interest Group
Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United StatesRegister for the Synopsys VC Formal Special Interest Group (SIG) event today. This event provides an opportunity for users, managers, and enthusiasts to stay connected with the latest formal verification innovations, techniques and methodologies. Industry leaders such as Amazon, Black Sesame, Microsoft, NVIDIA, Samsung, and Untether AI will share their experiences with the latest formal… Read More »VC Formal Special Interest Group
Signoff Special Interest Group
Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United StatesJoin us at this year’s Synopsys Signoff SIG (Special Interest Group) event. Signoff is a critical quality control checkpoint in the chip development process, but design complexity and advance process nodes are pushing the boundaries of what is expected of signoff solutions. Meeting these scaling challenges is becoming more difficult. At this year’s Synopsys Signoff… Read More »Signoff Special Interest Group