ANSYS
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CICC 2024
DoubleTree by Hilton Denver 3203 Quebec Street, Denver, CO, United StatesThe IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design… CICC 2024
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The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build "software-defined solutions" that are differentiated in their respective markets. Sign up and save your spot for this special presentation. Overview With the advent of 3D ICs and heterogeneous semiconductor integration, mapping a system on a customized chip/hardware is accessible to "everyone.”… The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
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Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions
Ansys Semiconductor Manufacturing Webinar Series: Part 1 of 3. Join us on Thursday, April 25th for an in-depth view of multi-physics simulation in the semiconductor fabrication process. Overview Accurate design and optimization of the semiconductor fabrication process/equipment for yield improvements and faster time-to-market require multiphysics simulation, which can address various physical interactions and phenomena. By… Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions
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ChipEx 2024
Tel Aviv Convention Center Rokach Boulevard 101, Tel Aviv, IsraelChipEx2024, the largest annual event of the Israeli semiconductor industry, will be held on May 7-8, 2024 in Tel Aviv, Israel. ChipEx2024 showcases companies including manufacturers, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world's leading experts address the industry's most relevant issues. The event is… ChipEx 2024
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Ansys – Simulation World 2024
Did you know that simulation helped Pratt & Whitney design a game-changing engine architecture that has saved aircraft operators over a million gallons in fuel? Or that sustainable energy start-up Amogy is using simulation to build a novel, portable, carbon-free energy system to convert ammonia into renewable fuel that will power green transportation solutions of the future? Or that… Ansys – Simulation World 2024
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5 New Ways to Maximize Your Hardware Security Resilience
Be sure to register for this high tech security webinar. You’ll learn how to identify threat scenarios quickly and why a model-based, system-oriented solution is needed to protect your hardware. Overview Connected vehicles offer a range of benefits, such as real-time data sharing, app-to-car connectivity, advanced driver assistance systems (ADAS), and critical safety features like… 5 New Ways to Maximize Your Hardware Security Resilience
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Optimizing connectivity between Xpedition and HFSS for RF systems design
In today's fast-paced technological landscape, seamless integration between design and simulation tools is crucial for accelerating product development cycles and ensuring optimal performance of electronics, especially RF systems. Siemens Xpedition and Ansys HFSS stand as pillars in their respective domains, offering powerful capabilities for electronic design and electromagnetic simulation. In this live conversation, Sara Louie… Optimizing connectivity between Xpedition and HFSS for RF systems design
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International Microwave Symposium – IMS 2024
Walter E. Washington Convention Center 801 Allen Y. Lew Place, Washington, DC, United StatesWe welcome you to IMS2024 in Washington D.C. The last time D.C. hosted IMS was in 1980. Our industry, IMS and the city had a lot of changes in the last 44 years! D.C. is a kaleidoscope of tastes, flavors, sounds and sights. From Georgetown's cobblestone streets and historic houses to the Wharf's sleek new restaurants… International Microwave Symposium – IMS 2024
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DAC 2024
Moscone West San Francisco, CA, United StatesThe premier event for the design and design automation of electronic chips to systems. Autonomous Systems Electronics content in modern autonomous systems (e.g., automotive, robotics, drones, etc.) is growing at an increasingly rapid pace. Nearly every aspect of these complex systems uses smart electronics and embedded software to make our experiences safer, more energy-efficient and enjoyable. For… DAC 2024
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Mastering EMC Simulations for Electronic Designs
Overview Electromagnetic Compatibility (EMC) simulation is critical for ensuring that electronic devices comply with regulatory standards and perform optimally in their intended environments. As the complexity of electronic systems increases, the importance of EMC simulation grows, allowing engineers to predict and mitigate potential electromagnetic interference (EMI) issues before physical prototypes are built. For EMC and… Mastering EMC Simulations for Electronic Designs
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Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
About this webinar Digital engineering is ramping up across the CPG, healthcare and wider packaging sector. Packaging engineers are tasked with producing fit-for-purpose packaging that is optimised for customer-use, transportation, storage and for production-line filling/handling. In addition, manufacturing the packaging containers as optimally as possible to avoid defects is vitally important. All in the landscape… Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
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TSMC North America OIP Ecosystem Forum 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… TSMC North America OIP Ecosystem Forum 2024