Broadcom
Mobile World Conference, MWC 2023
Fira Gran Via 08038, Barcelona, SpainMWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator, device manufacturer, technology provider, vendor, content owner, or are simply interested in the future of tech, you need to be here. Why? Because it’s the one time of year where everyone who’s anyone comes together under… Mobile World Conference, MWC 2023
Automotive Ethernet Congress
Hilton Munich Airport Terminalstraße Mitte 20, 85356 München-Flughafen, Munich, GermanyThe ninth Automotive Ethernet Congress to be held on March 21 - 23, 2023 at the Hilton Munich Airport will look to address the following questions: Does the selected transmission technology support the transformation of the E/E architecture from hardware-based to software-centric? Does it offer the necessary flexibility and self-learning capability to be able to continuously… Automotive Ethernet Congress
Intel Foundry Services (IFS) Direct Connect
San Jose Convention Center 150 W San Carlos Street, San Jose, CA, United StatesJoin us virtually to hear Pat Gelsinger and Stu Pann discuss progress in delivering the world's first Systems Foundry for the AI Era to meet the ever-expanding demands of the Siliconomy. The keynote will feature special appearances by U.S. Secretary of Commerce Gina M. Raimondo and Microsoft Chairman and CEO Satya Nadella. Be sure to stick… Intel Foundry Services (IFS) Direct Connect
Hot Chips 2024
Memorial Auditorium 551 Jane Stanford Way, Stanford, CA, United StatesHot Chips 2024 will be held as a hybrid conference with in-person attendance at Memorial Auditorium, Stanford University from August 25 to 27, 2024. Conference Format Hot Chips 2024 is a hybrid conference. You may register to attend Virtually or In-Person. The In-Person conference is held at Memorial Auditorium, Stanford University. Tutorials: Sunday, August 25… Hot Chips 2024
TSMC North America OIP Ecosystem Forum 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… TSMC North America OIP Ecosystem Forum 2024