HPC
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Ansys IDEAS Digital Forum
September 22-23, 2021 Ansys is at the forefront of electronic design enablement in partnership with the world’s leading companies for AI and machine learning, high-performance computing, 5G, telecommunications, aerospace and autonomous vehicles. Join us for the IDEAS Digital Forum — a place to catch up on industry best practices and the latest advances in semiconductor,… Ansys IDEAS Digital Forum
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Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems
With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the IPs required to build such a platform and recommend applications that can benefit from it. This webinar will be useful to designers, architects, and application… Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems
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Digital Design Technology Symposium
A Must-Attend Event HPC, 5G, AI, Automotive: market segments like these are presenting new challenges to ASIC and SoC designers. Synopsys is focused on delivering a continuous stream of innovative solutions with future-proof technologies to address issues such as greater energy efficiency, improved power-performance-area, faster time to market, functional safety, security, and yield optimization. The… Digital Design Technology Symposium
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Defending the Cloud: PCIe and CXL Data Security for High-Performance Computing
Cloud computing is going through a significant overhaul and continues to grow globally with increasing presence of hyperscale cloud providers for big data, high-performance computing (HPC), and analytics. In-house data centers are increasingly going off-premise, resulting in the co-location of data centers that manage and store data for companies and application developers to improve scalability… Defending the Cloud: PCIe and CXL Data Security for High-Performance Computing
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Speed Up Your Electronic Component Design with HPC
About this Webinar Electronic components design and their integration on PCBs involve complex simulations to predict EM fields and forces accurately. These simulations can be computationally intensive and time-consuming. High-Performance Computing (HPC) capability built into Ansys Maxwell core technology significantly accelerates the electronic component design process, enabling quick iteration, optimization, and validation. The ECAD capability… Speed Up Your Electronic Component Design with HPC
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TSMC 2024 Technology Symposium – Europe
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsAgenda Europe Technology Symposium *The agenda is subject to change 08:30 – 09:30 Registration & Ecosystem Pavilion 09:30 – 09:40 Welcome & Opening Remarks 09:40 – 10:20 CEO Perspectives 10:20 – 10:40 Market Update and Outlook 10:40 – 11:10 Technology Leadership 11:10 – 11:30 Coffee Break & Ecosystem Pavilion 11:30 – 11:55 Manufacturing Excellence 11:55… TSMC 2024 Technology Symposium – Europe