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OpenFive

Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems

With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the IPs required to build such a platform and recommend applications that can benefit from it. This webinar will be useful to designers, architects, and application… Read More »Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems

Embedded Vision Summit

Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

The premier event for practical, deployable computer vision and visual AI, for product creators who want to bring visual intelligence to products. The Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems, cloud solutions and mobile applications. Why attend? It's a First-Rate Program with… Read More »Embedded Vision Summit

IP-SOC China 22

The semiconductor world has to face a worldwide accelerated evolution, never seen before, both in terms of technology evolution (3D Packaging, advanced nodes) as well as new applications (IoT, Artificial Intelligence, Automotive, Security, etc) triggering an increasing demand of Semiconductor resources. D&R IP SoC Event Series is fully dedicated to IP (Silicon Intellectual property) and… Read More »IP-SOC China 22