ProteanTecs
AI Hardware Summit
Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United StatesThe AI Hardware Summit is the premier commercial event focused on systems-first machine learning. Our community’s goal is to reduce time-to-value in the ML lifecycle, and to unlock new possibilities for AI development. This involves a full-stack effort of efficient operationalization of AI in organizations, productionization of models, tight hw/sw co-design and best-in-class microarchitectures.… Read More »AI Hardware Summit
International Test Conference
Disneyland Hotel 1150 West Magic Way, Anaheim, CA, United StatesWe are back live and what a grand place to have our first live event in three years; Disneyland! We have a fantastic program that addresses new test technology challenges that significantly affect today’s electronic products! ITC is the world’s premier conference dedicated to electronics test. This year’s ITC continues with its mission to play… Read More »International Test Conference
Linley Fall Processor Conference 2022
Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara, CA, United StatesTechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights - a Hybrid Event, will be held in Santa Clara, California on November 1-2, 2022. If you cannot attend in person, tune in to our virtual livestream or watch the presentations OnDemand at your convenience. Presentations will address processors and IP… Read More »Linley Fall Processor Conference 2022
TSMC 2022 EU OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration,… Read More »TSMC 2022 EU OIP Ecosystem Forum
The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16 at 9:00 a.m. PST for an informative webinar on The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions… Read More »The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
Chiplet Summit
DoubleTree Hotel 2050 Gateway Place, San Jose, CA, United StatesThe First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts,… Read More »Chiplet Summit
THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION
The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production. Join us on Tuesday, March 7, 2023, for this 1-hour panel discussion with industry experts from Qualcomm, Microsoft Azure and Advantest as we discuss… Read More »THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION
How Deep Data Analytics Accelerates SoC Time-To-Market by 6 Months
This webinar will cover how using deep data analytics: Accelerates time-to-market by 20-25% (equivalent to six months in this example), ensuring the product is first to market and able to capitalize on this advantage. Reduces design and development costs by nearly $25M, amounting to a 9% cost savings. Leads to a higher quality product by improving performance by… Read More »How Deep Data Analytics Accelerates SoC Time-To-Market by 6 Months
Addressing Silent Data Errors for Resilient Data Centers
Mark your calendar to join us on Thursday, May 18 at 11 a.m. EDT for an Open Compute Project (OCP) Foundation educational webinar on Addressing Silent Data Errors for Resilient Data Centers. During the webinar, you will learn: What is the magnitude of silent data errors (SDE) How does SDE impact end users What is… Read More »Addressing Silent Data Errors for Resilient Data Centers
GSA 2023 European Executive Forum
Sofitel Munich Bayerpost Bayerstrasse 12, Munich, GermanyDealing with Uncertainty The global economy is sending mixed messages, and with every new data release comes a new batch of upbeat or defeatist headlines. Uncertainty remains if inflation is fully under control and how quickly economic growth will pick up strongly again. On one side the labor market seems healthier than it’s been in… Read More »GSA 2023 European Executive Forum
AI Hardware & Edge AI Summit
Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United StatesThe combined AI Hardware & Edge AI Summit comprehensively covers the design and deployment of ML hardware and software infrastructure across the cloud-edge continuum. For Enterprise ML Experts: Attend a unique AI systems event that will give you both hardware and software tools and techniques for training, deploying, and serving machine learning – the program contains… Read More »AI Hardware & Edge AI Summit
TSMC 2023 North America OIP Ecosystem Forum
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile… Read More »TSMC 2023 North America OIP Ecosystem Forum