SoCs and SiPs for Edge Intelligence and Accelerated Computing System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such systems will provide solutions in communication, entertainment, medical and smart mobility technologies underpinning emerging “Digital Societies”. Recent advances in systems, packaging and process technologies are… Read More »IEEE SOCC 2023