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Ansys-Synopsys, November 19, 2024

Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early… Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

Tessent, February 9, 2023

Implementing DFT in 2.5/3D designs using Tessent Multi-die software

In the era of more-than-Moore’s law, chip makers are scaling by adopting complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D). There has been progress throughout the semiconductor ecosystem in bringing 2.5D and… Implementing DFT in 2.5/3D designs using Tessent Multi-die software