The semiconductor world has to face a worldwide accelerated evolution, never seen before, both in terms of technology evolution (3D Packaging, advanced nodes) as well as new applications (IoT, Artificial Intelligence, Automotive, Security, etc) triggering… IP-SOC China 22
The premier event for practical, deployable computer vision and visual AI, for product creators who want to bring visual intelligence to products. The Summit attracts a global audience of technology professionals from companies developing computer… Embedded Vision Summit
It’s time for my annual Christmas and Holiday greetings from Semiconductor, #SemiEDA and #SemiIP companies. Send me your favorites. Past years: 2020 2019 2018 2017 2016 Happy holidays from all of us at Rambus! pic.twitter.com/ZfzZVgA3V9 — Rambus Inc.… Merry Christmas 2021
With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the IPs required to build such… Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystems