Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2025 will once again provide a place where users and technical experts can meet, network, and share…
The China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has always played an important role in promoting industrial agglomeration, connecting industrial resources, and mastering industry trends.
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric…
Our workshop will feature content including, but not limited to, the following areas: Artificial Intelligence & Machine Learning (AI / ML) Continuing Education & Workforce Development Designing with Field Programmable Gate Arrays (FPGAs) / Systems…
Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2024 will once again provide a place where users and technical experts can meet, network, and share…
Leadership in the RISC-V Era: India’s Exciting New Opportunity Join SiFive for an informative afternoon session, featuring key thought leaders in the fast -growing global RISC-V ecosystem. Krste Asanovic, inventor of RISC-V and SiFive founder will…
GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies…
We’re inviting global partners and customers to our upcoming Samsung Foundry Forum (SFF) and Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2023. The events will provide opportunities to share insights and innovative technologies to build a…
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®,…
RTL engineering change order (ECO) is vital to ensuring proper functionality of integrated circuits (ICs). Retiming and auto ungrouping optimize RTL implementation and enhance PPA. However, aggressive optimizations in CPU RTL designs present challenges due…