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TSMC OIP Ecosystem Forum Japan 2024

October 25, 2024 @ 9:30 am - 5:30 pm JST

TSMC OIP 2024

Learn About:

  • Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
  • Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
  • Ecosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization
  • Successful, real-life applications of design technologies, IP solutions, and cloud-based designs from TSMC’s Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.

Details

Date:
October 25, 2024
Time:
9:30 am - 5:30 pm JST
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Website:
Event Website

Organizer

TSMC
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Venue

Grand Hyatt Tokyo
6-10-3, Roppongi, Minato-ku
Tokyo, Japan
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