2 events found.
2024 TSMC Europe OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, AmsterdamLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes,… 2024 TSMC Europe OIP Ecosystem Forum
Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has… Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design