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	  2024 TSMC Europe OIP Ecosystem ForumHilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes,… 2024 TSMC Europe OIP Ecosystem Forum 
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	  Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die DesignThe semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has… Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design 
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	  Fast Track RTL Debug with the Verisium Debug Python App StoreWorking with debugging scripts locally and manually can be challenging, as can reusing and organizing them. What if there was a way to create your own app with the required… Fast Track RTL Debug with the Verisium Debug Python App Store 
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	  Ansys IDEAS User Conference India 2024Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future… Ansys IDEAS User Conference India 2024 
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	  Tower Semiconductor – Technical Global Symposium 2024Hyatt Regency Santa Clara 5101 Great America Parkway, Santa Clara, CA, United StatesTGS offers a wonderful opportunity for networking, learning, and sharing the latest technology developments with our community, as well as meeting with Tower’s executives and team of experts. We invite… Tower Semiconductor – Technical Global Symposium 2024 
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	  Webinar 2: Tessolve AI assisted DV FlowWith the increasing importance of AI in engineering and the exciting potential for it’s use in Design Verification, Tessolve has been working on improving internal DV processes, with impressive reductions… Webinar 2: Tessolve AI assisted DV Flow 
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	  Boost your verification productivity with Questa Verification IQThis session will explore Questa Verification IQ (VIQ), Siemens EDA’s next-generation collaborative and data-driven verification solution. VIQ revolutionizes the verification process by providing advanced analytics, enhanced collaboration, and comprehensive traceability.… Boost your verification productivity with Questa Verification IQ 
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	  Accelerating Electric Vehicle Development: Integrated design flow for power modules with functional safety and reliability focusThis webinar to delve into the integrated design flow for power modules for electric vehicles (EVs) for enhanced functional safety and reliability. The power modules are distinguished by their high… Accelerating Electric Vehicle Development: Integrated design flow for power modules with functional safety and reliability focus 
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	  FPGA Front Runner: FPGA Safety and SecurityThe Cass Centre Shaftesbury Road, Cambridge, United KingdomThis event covers the challenges in ensuring an FPGA is secure and demonstrably safe as per the relevant industry safety standards. This includes supply chains, FPGA hardware and the IP… FPGA Front Runner: FPGA Safety and Security 
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	  DVClub Europe – AI/ML in VerificationThis DVClub will consider how we can save time and effort whilst improving time-to-market through the application of AI/ML to design verification. Agenda (GMT): Time Session Description Slides Videos 12.00… DVClub Europe – AI/ML in Verification 
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	  Webinar 3: Tessolve AI assisted advanced DV Flow and Use casesWebinar 3: Tessolve AI assisted advanced DV Flow and Use cases With the increasing importance of AI in engineering and the exciting potential for it’s use in Design Verification, Tessolve has… Webinar 3: Tessolve AI assisted advanced DV Flow and Use cases 
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	  Keysight EDA 2025 Launch eventNew EDA Tools for 5G and AI Infrastructure Design We are ready to share the latest release of our electronic design automation (EDA) software suites. This update will help you… Keysight EDA 2025 Launch event 
	
		12 events found.