EDAPS 2024
Taj Yeshawantpur 2275 Tumkur Road, Yeshwantpur, BangaloreThe IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the… EDAPS 2024
IEEE Asian Test Symposium 2024
Courtyard by Marriott, Ahmedabad Sindhu Bhawan Roa, AhmedabadThe Asian Test Symposium provides an international forum for engineers and researchers from all countries of the world, not just from Asia, to present and discuss various aspects of system,… IEEE Asian Test Symposium 2024
Advantages of using IP-XACT and TGI for SoC Development
Are you looking for ways to simplify your SoC development process, reduce rework, and accelerate time-to-market? Join us for an insightful webinar, "Advantages of using IP-XACT and TGI for SoC… Advantages of using IP-XACT and TGI for SoC Development
Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration