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Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Advantages of using IP-XACT and TGI for SoC Development
Are you looking for ways to simplify your SoC development process, reduce rework, and accelerate time-to-market? Join us for an insightful webinar, "Advantages of using IP-XACT and TGI for SoC… Advantages of using IP-XACT and TGI for SoC Development