Foundry
3D-IC Foundry Frameworks
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks. About this Webinar Semiconductor applications such as Mobile (5G), Automotive, and Datacenter (HPC, AI) demand better scaling, performance, and lower… Read More »3D-IC Foundry Frameworks
GlobalFoundries Technology Summit 2023
San Jose Marriott 301 S Market Street, San Jose, CA, United StatesRegister now and join us at GlobalFoundries Technology Summit 2023! GF Technology Summit (GTS) 2023 is our worldwide, annual series of technology-focused events. GTS brings together leaders from the commercial, business and research worlds to understand the latest technology challenges and opportunities, and partner to create the most innovative applications and solutions. GTS 2023 Highlights This year's… Read More »GlobalFoundries Technology Summit 2023
GTS 2023 – Munich
Sofitel Munich Bayerpost Bayerstrasse 12, Munich, GermanyRegister now and join us at GlobalFoundries Technology Summit 2023! GF Technology Summit (GTS) 2023 is our worldwide, annual series of technology-focused events. GTS brings together leaders from the commercial, business and research worlds to understand the latest technology challenges and opportunities, and partner to create the most innovative applications and solutions. GTS 2023 Highlights This year's… Read More »GTS 2023 – Munich
TSMC 2023 North America OIP Ecosystem Forum
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile… Read More »TSMC 2023 North America OIP Ecosystem Forum
TSMC 2023 Europe OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile… Read More »TSMC 2023 Europe OIP Ecosystem Forum
Samsung Foundry Forum 2023 Tokyo, Japan
Belle Salle Tokyo Nihonbashi 2-7-1 Nihombashi, Chuo-ku, Tokyo, JapanWelcoming Remarks Seishu Arai VP, Head of Japan Office, Samsung Electronics Samsung Keynote Siyoung Choi President and GM, Foundry Business, Samsung Electronics Guest Speech I Junichiro Makino Professor, Kobe University Guest Speech II Sumiko Kanamori Automotive HPC, Analog & Power Solutions Gr. Digital Head of H/W Unit, VP, Renesas Electronics Corporation Guest Speech III Kazuoki… Read More »Samsung Foundry Forum 2023 Tokyo, Japan
Samsung Foundry Forum 2023 EMEA
Sofitel Munich Bayerpost Bayerstrasse 12, Munich, GermanyWe're inviting global partners and customers to our upcoming Samsung Foundry Forum (SFF) and Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2023. The events will provide opportunities to share insights and innovative technologies to build a strong foundry ecosystem to accelerate innovation beyond boundaries. Join us to experience the spirit and power of innovation. SFF &… Read More »Samsung Foundry Forum 2023 EMEA
TSMC 2023 Taiwan OIP Ecosystem Forum
Ambassador Hotel Hsinchu 0F, No.188, Sec. 2, Zhonghua Rd., Hsinchu City, TaiwanLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22 Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile… Read More »TSMC 2023 Taiwan OIP Ecosystem Forum
TSMC 2023 Open Innovation Platform Ecosystem Forum – China
Shangri-La Nanjing Hotel 29 Zhongyang Road, Gulou District, Nanjing, ChinaJoin us at the TSMC 2023 China OIP Ecosystem Forum! China OIP Ecosystem Forum (In-Person Event) Date: November 15, 2023 (Wednesday) Time: 9:30a.m. - 5:45p.m. Venue: Shangri-La Nanjing Hotel 329 Zhongyang Road, Gulou District, Nanjing, Jiangsu Province, 210037 China China OIP Ecosystem Forum (Online VOD Event) Date: November 22, 2023 (Wednesday) Website link to be provided in November.… Read More »TSMC 2023 Open Innovation Platform Ecosystem Forum – China
Intel Foundry Services (IFS) Direct Connect
San Jose Convention Center 150 W San Carlos Street, San Jose, CA, United StatesJoin us virtually to hear Pat Gelsinger and Stu Pann discuss progress in delivering the world's first Systems Foundry for the AI Era to meet the ever-expanding demands of the Siliconomy. The keynote will feature special appearances by U.S. Secretary of Commerce Gina M. Raimondo and Microsoft Chairman and CEO Satya Nadella. Be sure to stick… Read More »Intel Foundry Services (IFS) Direct Connect
CICC 2024
DoubleTree by Hilton Denver 3203 Quebec Street, Denver, CO, United StatesThe IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design… Read More »CICC 2024
TSMC 2024 Technology Symposium – North America
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn about: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and TSMC-SoIC® TSMC’s manufacturing excellence, capacity expansion… Read More »TSMC 2024 Technology Symposium – North America