IP
AutoSens Brussels 2023
Autoworld Museum 1000 Brussels, Brussels, BelgiumWe’re bringing AutoSens to Autoworld in Brussels once again to meet and shape the future of ADAS and AV. You can look forward to the freshest agenda of over 60 speakers across expert panels, technical case studies, and sessions covering 12 key themes. You will experience an exhibition full of demos from technology companies at… Read More »AutoSens Brussels 2023
SNUG Singapore 2023
ParkRoyal on Beach Road 7500 Beach Rd, Singapore, SingaporeSince 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Software. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical presentations and insightful keynotes from… Read More »SNUG Singapore 2023
Unleashing Innovation with UCIe
Exploring the Next Frontier in Chip Integration Webinar Agenda : Introduction to all UCIe layers Decrypting FLITs, PHY Trainings, Bring up flows FDI-RDI , main band and side band FLIT transfers etc. Implementation of Stacks-Arbiter, Retry mechanism & Retimer implementations Showcasing UCie FLIT transfer flow between multidies Enhancements done in UCIe 1.1 Who Should Attend:… Read More »Unleashing Innovation with UCIe
Proactively Address Thermal Concerns in Advanced IC Packages
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find that IC packages may overheat if they do not carefully plan for heat dissipation. This webinar will show how design… Read More »Proactively Address Thermal Concerns in Advanced IC Packages
The UCIe™ 1.1 Specification: Future Applications of Chiplets
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable improvements to the chiplet ecosystem, extending reliability mechanisms to more protocols and supporting broader usage models. This webinar will provide… Read More »The UCIe™ 1.1 Specification: Future Applications of Chiplets
RISC-V Summit US
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesEach day, thousands of engineers around the world collaborate and contribute to advance RISC-V, the open-standard instruction set architecture that is defining the future of open computing. The RISC-V community shares the technical investment and helps shape the architecture’s strategic future so everyone may create more rapidly, enjoy unprecedented design freedom, and substantially reduce the… Read More »RISC-V Summit US