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SecuryzrTM integrated Security Services Platform (iSSP): Services for lifecycle security management
Nowadays, fleets of connected devices have operational needs to maintain over time a relevant level of security. To mitigate the growing threats and vulnerabilities in the field and protect end-user devices from cyberattacks at both the network and device levels, a new strategy is needed to filter attacks in real time and implement a centralized… SecuryzrTM integrated Security Services Platform (iSSP): Services for lifecycle security management
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CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis
A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a major power integrity (PI) and thermal integrity challenge. Early analysis is extremely critical in 3D-ICs, since changing the die stack up later in the design process… CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis
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Synopsys CAD Navigation Users Group Meeting: Avalon & SysNav FA Solutions
Synopsys would like to invite you to the 4th annual, and 2nd virtual, Synopsys CAD Navigation Users Group to be held in March 2022. Date & Time: Thursday, March 24, 2022. 07:00 a.m. – 09:00 a.m. PT Venue Details: Virtual Conference We have planned an exciting event with presentations from a diverse group of CADNav… Synopsys CAD Navigation Users Group Meeting: Avalon & SysNav FA Solutions
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Learn How mqSemi AG Developed 3D Power Devices Proof of Concept with Silvaco TCAD Simulations
Silicon IGBT and SiC MOSFETs are today's key power semiconductor switches for many power electronics converters such as those in automotive, renewables and industrial applications. Both device concepts continue to evolve, and development trends are continuously targeting improved overall electrical and reliability performance at lower costs. In addition to established power device manufacturers, many start-up… Learn How mqSemi AG Developed 3D Power Devices Proof of Concept with Silvaco TCAD Simulations
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IRPS 2022
Hilton DFW Lakes Executive Conference Center 1800 Highway 26E, Grapevine, TX, United StatesFor 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world. The 2022 IEEE IRPS will be presented as an in-person conference with a virtual component.… IRPS 2022
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tinyML Summit 2022
Hyatt Regecy San Francisco Airport 1333 Bayshore Highway, Burlingame, CA, United StatesRegistration will open by January 31 What seemed like a dream a few years ago is quickly turning into reality. Problems which used to require Gigabytes to solve, became Megabytes and then Kilobytes. Join us at the tinyML Summit 2022 to take part in the sharing, learning, and celebrating tinyML. With ever more pervasive advances… tinyML Summit 2022
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Secure Your Devices with PUF Plus Hardware Root of Trust
Technology experts from Rambus and Intrinsic ID will discuss how combining PUF technology with a hardware Root of Trust can provide robust security for data and devices. The session will start with the fundamentals of PUFs and example use cases. Then we will discuss how the characteristics of PUFs and a hardware Root of Trust… Secure Your Devices with PUF Plus Hardware Root of Trust
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SNUG – Silicon Valley
SNUG brings together users and technical experts to network and share best practices for tackling design and verification challenges. By attending SNUG, attendees gain knowledge to use on current projects and discover ideas to spark future innovations. SNUG Silicon Valley will be conducted in a virtual format due to recent COVID-19 developments that have raised concerns among attendees… SNUG – Silicon Valley
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DVClub Austin – March 30, 2022, Rahul Peddi (Arm) & Vaibhav Agrawal (Arm)
Norris Conference Center 2525 W Anderson Ln, #365, Austin, TX, United StatesPlease join us on March 30, 2022 at the Norris Conference Center for a catered lunch and networking. Rahul Peddi, a Senior Design Engineer at Arm, and Vaibhav Agrawal, a member of the CPU formal verification team at Arm, will be our guest speakers. 11:30am — Doors Open / Networking 12:00pm — Lunch / Presentations by Rahul Peddi… DVClub Austin – March 30, 2022, Rahul Peddi (Arm) & Vaibhav Agrawal (Arm)
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Imperas RISC-V simulation technology with eSol Trinity and NSITEXE
Imperas Software Ltd., the leader in RISC-V simulation solutions, today announced with eSol Trinity the webinar event on RISC-V reference models and simulation technology for the growing adoption of RISC-V in Japan. This webinar will feature a guest speaker - Mr. Marume of NSITEXE Co., Ltd., a group company of the DENSO Corporation that develops and sells… Imperas RISC-V simulation technology with eSol Trinity and NSITEXE
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2022 European Executive Forum
We have all been waiting for this… THE EEF IS BACK AS AN IN-PERSON EVENT! 2022 EUROPEAN EXECUTIVE FORUM: Facing New Realities This in-person EEF will feature an elite line-up of expert speakers exploring themes such as blockchain and the Metaverse, the supply chain crisis and the geopolitics of tech, the future of quantum, photonics… 2022 European Executive Forum
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DesignCon 2022
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.
12 events found.