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Signal & Power Integrity Special Interest Group
Hilton Santa Clara 4949 Great America Parkway, Santa Clara, CA, United StatesDear SIPI Engineer, As a member of the engineering community, you are invited to attend Synopsys Signal & Power Integrity Special Interest Group event taking place at Hilton Santa Clara. This event is conveniently located across the street from the DesignCon 2024 Conference allowing you to participate in both. The Synopsys SIPI SIG event will… Signal & Power Integrity Special Interest Group
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Chiplet Summit
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe Second Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts,… Chiplet Summit
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Canada’s Semiconductor Summit
Brookstreet Hotel 525 Leggett Drive, Ottawa, CanadaHelp build Canada's role in North America's integrated semiconductor supply chain. Featuring key industry and government decision-makers from Canada, the United States, and international jurisdictions, your insights at this by-invitation-only event will help us build an effective action plan. The summit will establish priorities and define opportunities to accelerate the growth, development, and competitiveness of… Canada’s Semiconductor Summit
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Functional Verification workflow for Trusted and Assured Microelectronics
In a world of increasing trust and assurance challenges for microelectronic devices, emerging industry standards and defense policy demand early and advanced functional verification methods before ICs may be deployed in critical end products and systems. Questa technologies, built upon a foundation of world-class simulation and formal engines, provide the results desired for raising and meeting higher levels… Functional Verification workflow for Trusted and Assured Microelectronics
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DVClub Europe: Verifying Safety in Automotive
Hardware designs intended for the automotive domain need to implement safety mechanisms to minimize the risk of accidents and injuries caused by hardware-related issues in vehicles. In this DVClub we will cover how those safety mechanisms need to be verified to be compliant with ISO26262, the international standard covering automotive safety. Agenda (GMT) 12:00 Welcome… DVClub Europe: Verifying Safety in Automotive
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Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic simulation and verification while integrating… Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
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CadenceCONNECT – Photonics Event
Cadence Design Systems, Bldg 10 2655 Seeley Avenue, San Jose, CA, United StatesJoin Cadence in person for the 8th annual CadenceCONNECT Photonics event and workshop on February 7 – 8, 2024, to discuss the increasingly important role of photonics in enabling AI transformation. We all know photonics is essential for communication, but how about computing? What are its advantages and challenges? Which applications are best suited? How… CadenceCONNECT – Photonics Event
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Power Devices SPICE Modeling for Si, GaN and SiC Technologies
We start by examining the different technologies used in the manufacturing of power devices, including Si, GaN, and SiC, considering their respective particularities and advantages. We will then analyze various approaches to the SPICE modeling of power devices, including compact models and macromodels. A significant portion of our presentation will be dedicated to the topic… Power Devices SPICE Modeling for Si, GaN and SiC Technologies
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Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment uncovers SI/PI issues early in the design process, leading to faster signoff of designs. With analysis shifting left in the design cycle, design teams can achieve efficient signoff of… Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
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Power Innovations in Consumer Electronics Using LF EM Solutions
This webinar will cover how the Ansys simulation tools are now widely used in many low-frequency (LF) EM applications, such as wireless charging, power supplies, transformers, magnetic latches and actuators, PCB/ECAD, and more. Discover how Ansys Maxwell enables rapid and accurate simulation of EM fields in electronic and consumer devices to reduce design iterations, component… Power Innovations in Consumer Electronics Using LF EM Solutions
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Introducing Ansys AI: A New Chapter in Engineering Simulation
Join us to learn more about the AI and Simulation Revolution in this upcoming webinar. We're revolutionizing engineering simulation with the power of Artificial Intelligence with SimAI, AnsysGPT, and Ansys AI+. Overview At Ansys, we are revolutionizing engineering simulation with the power of Artificial Intelligence. Our AI-augmented simulation technology is a game-changer, bringing unprecedented speed,… Introducing Ansys AI: A New Chapter in Engineering Simulation
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FPGA Forum 2024 – Norway
Royal Garden Trondheim, NorwayFPGA-forum is a yearly event for the Norwegian FPGA community. FPGA-designers, project managers, technical managers, researchers, final year students and the major vendors gather for a two-day focus on FPGA. There will be presentations from the Norwegian industry about methodology and practical experience, – the universities will present new and exciting projects, and the vendors… FPGA Forum 2024 – Norway
12 events found.