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Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
February 7 @ 9:00 am - 10:00 am EST
Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic simulation and verification while integrating packaging and thermal effects co-simulation to analyze a complete packaged system. Discover how this comprehensive approach yields innovative solutions, important design insights, and their potential impact on packaged performance.
Time:
February 7, 2024
9 AM EST / 3 PM CET / 7:30 PM IST
Venue:
Digital