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Dealing with Inconclusive Formal Proofs
Formal proofs of end-to-end properties can be a very valuable contribution to RTL sign-off and yet are often the most difficult to achieve. In this webinar Doulos Senior Member Technical Staff, Doug Smith will explore some practical ways of dealing with inconclusive formal proofs when using the Jasper Formal Verification Platform by Cadence. This includes the use of… Dealing with Inconclusive Formal Proofs
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IEDM
Moscone Center 747 Howard Street, San Francisco, CA, United StatesEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for… IEDM
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The 26262 Club – Technical Conference
Holiday Inn Munich - City Centre Hochstraße 3, Munich, GermanyMEET US AT THE 26262 CLUB TECHNICAL CONFERENCE THIS COMING DECEMBER 5, 2022 In this edition, the 26262 club continues the discussion on the anticipated third edition and the emerging role of ISO 26262 within the evolving standards ecosystem. We bring on stage key global players from WG8 alongside authors of the most prominent upcoming standards and share must-have insights from the global standardisation… The 26262 Club – Technical Conference
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DVCon Europe 2022
Holiday Inn Munich - City Centre Hochstraße 3, Munich, GermanyThe Design and Verification Conference & Exhibition Europe (DVCon Europe) is the premier European technical conference on system, software, design, verification, validation or integration. It is a place where the latest methodologies and technologies for the industrial use of tools, languages, and standards for integrated and embedded systems and products are shared and discussed. The… DVCon Europe 2022
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Target Optimal PPA and Faster Time-to-Market Using Synopsys Cloud Digital SaaS Instance
Historically, the digital design process requires in-depth knowledge of each tool in the cycle. Getting up and running involves writing hundreds of lines of script. Many companies lack the resources or in-house expertise. This is where a cloud-based, expert-built digital design flow can deliver a big productivity lift. By designing with a prescribed, tailored flow… Target Optimal PPA and Faster Time-to-Market Using Synopsys Cloud Digital SaaS Instance
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Successful Management of Semiconductor Intellectual Property
Do you develop, procure or distribute semiconductor intellectual property (IP) within your enterprise? If so, how is the IP managed? In this 30 minute presentation, we will show you a solution, which has been adopted by large institutions, by creating a catalog of all your IP and aid you through the process of publishing the… Successful Management of Semiconductor Intellectual Property
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osmosis 2022 – Formal Verification
Holiday Inn City Center Hochstraße 3, Munich, GermanyAttention anyone interested in Formal Verification: after a hiatus due to you-know-what, osmosis is back in-person this coming December 8 in Munich! (Yes, the day after DVCon Europe, and in the exact same hotel to make it easy for you to extend your week of gathering verification knowledge.) What is osmosis? It stands for Open Siemens Meeting on Solutions, Innovation &… osmosis 2022 – Formal Verification
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SystemC Evolution Day
Holiday Inn Munich - City Centre Hochstraße 3, Munich, GermanyThe seventh SystemC Evolution Day is a full-day, technical workshop on the evolution of SystemC standards to advance the SystemC ecosystem. In several in-depth sessions, selected current and future standardization topics around SystemC will be discussed in order to accelerate their progress for inclusion in Accellera/IEEE standards. SystemC Evolution Day is intended as a lean,… SystemC Evolution Day
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GSA Awards Celebration
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesGSA recognizes semiconductor companies that have demonstrated excellence through their success, vision, strategy and future opportunities in the industry at its annual Awards Dinner Celebration. It is an honor to be selected as a nominee and an even more distinguished achievement to win a GSA Award.
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IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on… IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)
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RISC-V Summit
San Jose Convention Center 150 W San Carlos Street, San Jose, CA, United StatesEach day, thousands of engineers around the world collaborate and contribute to advance the most prolific open, license and royalty-free computing architecture. They share technical investment and help shape the architecture’s strategic future so everyone may create more rapidly, enjoy unprecedented design freedom, and substantially reduce the cost of innovation. Anyone, anywhere can benefit from the open intellectual… RISC-V Summit
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EE Times – AI Everywhere Forum
Artificial intelligence (AI) is pervading almost every area of electronics today: from data centers, through edge accelerators to endpoint devices. Applications range from large scale analysis of medical data and online retail recommendation engines, to robotics and computer vision, to sensor fusion in the tiniest sensor nodes. The infusion of AI techniques into so many… EE Times – AI Everywhere Forum
12 events found.