IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization. This symposium consists of technical paper presentation, poster sessions, industry exhibits, workshops and tutorials.

EDAPS is sponsored by the IEEE Electronic Packaging Society.

EDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop, to be held during December 12-14 in virtual mode. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform.