3DIC Compiler
3DIC Design from Concept to Silicon
For some high-performance computing (HPC) designs, monolithic SoCs aren’t producing the scalability and yield that designers are looking for. New trends towards 3DIC design are emerging introducing new design challenges, such as reliable die-to-die connectivity, high bandwidth memory, integration, and 2.5D or 3D packaging options. This webinar will outline the different market trends for 3DIC… 3DIC Design from Concept to Silicon
Signal & Power Integrity Special Interest Group
Hilton Santa Clara 4949 Great America Parkway, Santa Clara, CA, United StatesDear SIPI Engineer, As a member of the engineering community, you are invited to attend Synopsys Signal & Power Integrity Special Interest Group event taking place at Hilton Santa Clara. This event is conveniently located across the street from the DesignCon 2024 Conference allowing you to participate in both. The Synopsys SIPI SIG event will… Signal & Power Integrity Special Interest Group
The Next Generation of 3DIC Interposer/InFO Design
In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and capacity for our highest tiers of compute. But for all the adulation we heap upon the 3DIC paradigm, we seemingly… The Next Generation of 3DIC Interposer/InFO Design